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WO1999045755A1 - Shielding an electronic card with printed circuit mounted on a metal substrate - Google Patents

Shielding an electronic card with printed circuit mounted on a metal substrate Download PDF

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Publication number
WO1999045755A1
WO1999045755A1 PCT/FR1999/000462 FR9900462W WO9945755A1 WO 1999045755 A1 WO1999045755 A1 WO 1999045755A1 FR 9900462 W FR9900462 W FR 9900462W WO 9945755 A1 WO9945755 A1 WO 9945755A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
gutter
cover
edge
electronic card
Prior art date
Application number
PCT/FR1999/000462
Other languages
French (fr)
Inventor
Dung Kong A Siou
Jean-Marc Nicolai
Marc Duarte
Original Assignee
Valeo Vision
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Vision filed Critical Valeo Vision
Priority to DE19980533T priority Critical patent/DE19980533B4/en
Priority to JP54432299A priority patent/JP4160130B2/en
Priority to US09/423,075 priority patent/US6925708B1/en
Publication of WO1999045755A1 publication Critical patent/WO1999045755A1/en
Priority to US11/080,276 priority patent/US7219420B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming

Definitions

  • the present invention relates to the electromagnetic shielding of a printed circuit electronic card mounted on a metal substrate.
  • Such electromagnetic shielding is generally carried out by means of a metal cover closed over the substrate.
  • the electrical connection of the metal cover to the ground that constitutes the metal substrate is carried out independently of the mechanical fixing of said cover relative to said substrate and to the electronic card.
  • the electrical connection to ground can then be made by means such as riveting, screwing, welding or even a welded wire connection.
  • the metal cover 5 is mechanically fixed to the substrate by means of an adhesive which is made of an electrically conductive material and which performs the function of electrical connection.
  • An object of the invention is to provide a shielding solution which does not have these drawbacks.
  • the invention provides an assembly comprising an electronic printed circuit board mounted on a metal substrate, as well as a metal shielding cover electrically connected to the substrate, the substrate having a hollow gutter in which the edge of the cover is received, said edge being crimped onto said substrate in the gutter.
  • the invention also provides a method for producing such an assembly, characterized by the following steps: the substrate is stamped to make a gutter, - the electronic card is assembled on said substrate, the cover is positioned on the assembly as well obtained, by placing the edge of said cover in said gutter, - said edge is crimped onto said substrate.
  • FIG. 1 is a schematic representation in sectional view illustrating a fixing of a shielding cover according to a possible embodiment for one invention
  • FIGs 2a and 2b are schematic representations in top view illustrating two possible crimping modes
  • Figures 3 and 4 are schematic representations in sectional view similar to that of Figure 1 illustrating a possible implementation for crimping the metal cover on the substrate.
  • FIG. 1 there is shown a metal substrate 1, a printed circuit electronic card 2 and a metal shielding cover 3.
  • the substrate 1 has a hollow gutter 4 produced by stamping the material. This gutter 4 extends over said substrate along a contour which corresponds to that of the edge of the metal cover 3.
  • This gutter 4 is intended to receive the edge of the metal cover 3.
  • the edge of the metal cover 3 is fixed in the gutter 4 by crimping.
  • said edge is extended by one or more tabs 5, which form an L-shaped return extending towards the outside of the cover 3.
  • Such a tab 5 is received in an area of the gutter 4 which is shaped with a width which coincides with that of said tab 5.
  • said tab 5 fits exactly into the hollow shape of the gutter 4.
  • the length of such a tab 5 is for example 3 mm, while that of a recessed pattern which receives it is 4 mm.
  • the mounting of the cover 3 on the substrate 1 is done as follows. 4
  • the substrate 1 is first stamped, so as to produce the gutter 4. There is thereby obtained an excess of material which in this case constitutes the edge of the gutter 4. Then, the electronic card 2 is assembled on the substrate 1.
  • the cover 3 is then placed in the gutter 4.
  • crimping can be carried out by crushing a fairly short part of the substrate which covers fairly long tabs 5 (FIG. 2a); alternatively, it can be achieved by simultaneously crushing two parts of the substrate covering fairly short tabs 5 (FIG. 2b).
  • the mold in which the substrate 1 is stamped can be shaped so that said stamped substrate 1 has at the edge of the gutter 4 a protrusion 7 which constitutes the excess material to be moved during crimping;
  • the altitude of this protuberance is adjusted to remain below the upper level of the electronic card 2, so as not to prevent the screen printing of the solder paste for the assembly of the components prior to the installation of the cover 3. 5
  • the depth of the gutter 4 is adjusted so that the bottom of said gutter 4 and the return
  • the metal substrate remains perfectly waterproof, since it is free of perforations;
  • the mechanical rigidity of one assembly is increased; in particular, the gutter made on the entire periphery of the metal substrate constitutes a rib which contributes to this rigidity; this rigidity is also increased by stamping the cover when it is crimped onto the metal substrate; it will be noted that the increase in rigidity obtained makes it possible to reduce the thickness of the metal substrate; also, with the proposed technique, it is possible to dismantle and then reassemble the hood.
  • the shielding which has just been described can be used in all fields of electronics where 6 used insulated metal substrates and in particular advantageously in automotive electronics, energy conversion, power supply, power multiplexer, electric motor supply, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The invention concerns an assembly comprising an electronic card (2) with printed circuit mounted on a metal substrate (1), and a shielding metal package cap (3) electrically connected to the substrate (1). The substrate (1) has a hollow groove (4) wherein the package cap (3) edge is set on said substrate (1) in the groove. The invention also concerns a method for making such an assembly.

Description

1 "BLINDAGE D'UNE CARTE ÉLECTRONIQUE À CIRCUIT IMPRIMÉ 1 "SHIELDING OF A PRINTED CIRCUIT BOARD
MONTÉE SUR UN SUBSTRAT MÉTALLIQUE"MOUNTED ON A METAL SUBSTRATE "
5 La présente invention est relative au blindage électromagnétique d'une carte électronique à circuit imprimé montée sur un substrat métallique.The present invention relates to the electromagnetic shielding of a printed circuit electronic card mounted on a metal substrate.
Elle trouve avantageusement - mais non limitâtivement - application pour la protection des circuits de commande 0 de lampes à décharge .It finds advantageously - but not limitatively - application for the protection of control circuits 0 of discharge lamps.
Un tel blindage électromagnétique est généralement réalisé au moyen d'un capot métallique refermé sur le substrat .Such electromagnetic shielding is generally carried out by means of a metal cover closed over the substrate.
À ce jour, on utilise principalement deux types de 5 techniques pour le montage d'un tel capot.To date, two types of techniques are mainly used for mounting such a cover.
Selon un premier type de solution, la connexion électrique du capot métallique à la masse que constitue le substrat métallique est réalisée de façon indépendante de la fixation mécanique dudit capot par rapport audit o substrat et à la carte électronique. Par exemple, la connexion électrique à la masse peut être alors réalisée par des moyens tels qu'un rivetage, un vissage, une soudure ou encore une liaison filaire soudée.According to a first type of solution, the electrical connection of the metal cover to the ground that constitutes the metal substrate is carried out independently of the mechanical fixing of said cover relative to said substrate and to the electronic card. For example, the electrical connection to ground can then be made by means such as riveting, screwing, welding or even a welded wire connection.
Dans un deuxième type de solution, le capot 5 métallique est fixé mécaniquement sur le substrat par l'intermédiaire d'un collage qui est en un matériau électriquement conducteur et qui assure la fonction de connexion électrique.In a second type of solution, the metal cover 5 is mechanically fixed to the substrate by means of an adhesive which is made of an electrically conductive material and which performs the function of electrical connection.
Toutefois , ces deux types de solutions présentent o l'une et l'autre des inconvénients.However, these two types of solutions both have disadvantages.
Notamment, les solutions dans lesquelles la fixation mécanique et la connexion électrique sont réalisées par des moyens différents nécessitent des opérations supplémentaires lors de la fabrication et sont d'un coût 5 élevé. 2In particular, the solutions in which the mechanical fixing and the electrical connection are carried out by different means require additional operations during manufacture and are of high cost. 2
En outre, avec ces solutions, 1 ' étanchéité entre le capot métallique et le substrat n'est généralement pas assurée.In addition, with these solutions, the seal between the metal cover and the substrate is generally not ensured.
Également, les solutions dans lesquelles on utilise un collage conducteur sont également d'un coût important et ce notamment du fait de l'opération de report d'un cordon de colle.Also, the solutions in which a conductive bonding is used are also of great cost, and this in particular because of the operation of transferring a bead of adhesive.
En outre, avec ces solutions, les joints de colle posent des problèmes de tenue dans le temps, ainsi que de tenue en température et aux vibrations .In addition, with these solutions, the adhesive joints pose problems of resistance over time, as well as resistance to temperature and to vibrations.
Un but de 1 ' invention est de proposer une solution de blindage qui ne présente pas ces inconvénients.An object of the invention is to provide a shielding solution which does not have these drawbacks.
À cet effet, l'invention propose un ensemble comportant une carte électronique à circuit imprimé montée sur un substrat métallique, ainsi qu'un capot métallique de blindage électriquement connecté au substrat, le substrat présentant une gouttière en creux dans laquelle le bord du capot est reçu, ledit bord étant serti sur ledit substrat dans la gouttière. L ' invention propose également un procédé pour la réalisation d'un tel ensemble caractérisé par les étapes suivantes : on emboutit le substrat pour y réaliser une gouttière, - on assemble la carte électronique sur ledit substrat, on positionne le capot sur l'ensemble ainsi obtenu, en disposant le bord dudit capot dans ladite gouttière, - on sertit ledit bord sur ledit substrat.To this end, the invention provides an assembly comprising an electronic printed circuit board mounted on a metal substrate, as well as a metal shielding cover electrically connected to the substrate, the substrate having a hollow gutter in which the edge of the cover is received, said edge being crimped onto said substrate in the gutter. The invention also provides a method for producing such an assembly, characterized by the following steps: the substrate is stamped to make a gutter, - the electronic card is assembled on said substrate, the cover is positioned on the assembly as well obtained, by placing the edge of said cover in said gutter, - said edge is crimped onto said substrate.
D'autres caractéristiques de l'invention ressortiront encore de la description qui suit. Cette description est purement illustratrice et non limitative.Other characteristics of the invention will emerge from the description which follows. This description is purely illustrative and not limiting.
Elle doit être lue en regard des dessins annexés sur lesquels : 3It must be read in conjunction with the appended drawings in which: 3
- la figure 1 est une représentation schématique en vue en coupe illustrant une fixation d'un capot de blindage conforme à un mode de réalisation possible pour 1 ' invention ; - les figures 2a et 2b sont des représentations schématiques en vue de dessus illustrant deux modes de sertissage possibles ; les figures 3 et 4 sont des représentations schématiques en vue en coupe semblables à celle de la figure 1 illustrant un mode de mise en œuvre possible pour le sertissage du capot métallique sur le substrat.- Figure 1 is a schematic representation in sectional view illustrating a fixing of a shielding cover according to a possible embodiment for one invention; - Figures 2a and 2b are schematic representations in top view illustrating two possible crimping modes; Figures 3 and 4 are schematic representations in sectional view similar to that of Figure 1 illustrating a possible implementation for crimping the metal cover on the substrate.
Sur la figure 1, on a représenté un substrat métallique 1, une carte électronique à circuit imprimé 2 et un capot métallique de blindage 3. Le substrat 1 présente une gouttière en creux 4 réalisée par emboutissage de la matière. Cette gouttière 4 s ' étend sur ledit substrat selon un contour qui correspond à celui du bord du capot métallique 3.In Figure 1, there is shown a metal substrate 1, a printed circuit electronic card 2 and a metal shielding cover 3. The substrate 1 has a hollow gutter 4 produced by stamping the material. This gutter 4 extends over said substrate along a contour which corresponds to that of the edge of the metal cover 3.
Cette gouttière 4 est destinée à recevoir le bord du capot métallique 3.This gutter 4 is intended to receive the edge of the metal cover 3.
La fixation du bord du capot métallique 3 dans la gouttière 4 est réalisée par sertissage.The edge of the metal cover 3 is fixed in the gutter 4 by crimping.
À cet effet, ledit bord se prolonge par une ou plusieurs pattes 5, qui forment un retour en L s 'étendant vers l'extérieur du capot 3.To this end, said edge is extended by one or more tabs 5, which form an L-shaped return extending towards the outside of the cover 3.
Une telle patte 5 est reçue dans une zone de la gouttière 4 qui est conformée avec une largeur qui coïncide avec celle de ladite patte 5. Ainsi, ladite patte 5 s ' insère exactement dans la forme en creux de la gouttière 4.Such a tab 5 is received in an area of the gutter 4 which is shaped with a width which coincides with that of said tab 5. Thus, said tab 5 fits exactly into the hollow shape of the gutter 4.
La longueur d'une telle patte 5 est par exemple de 3 mm, tandis que celle d'un motif en creux qui la reçoit est de 4 mm.The length of such a tab 5 is for example 3 mm, while that of a recessed pattern which receives it is 4 mm.
Le montage du capot 3 sur le substrat 1 se fait de la façon suivante. 4The mounting of the cover 3 on the substrate 1 is done as follows. 4
Le substrat 1 est d'abord embouti, de façon à réaliser la gouttière 4. On obtient par là même un excédent de matière qui constitue en l'occurrence le bord de la gouttière 4. Puis, la carte électronique 2 est assemblée sur le substrat 1.The substrate 1 is first stamped, so as to produce the gutter 4. There is thereby obtained an excess of material which in this case constitutes the edge of the gutter 4. Then, the electronic card 2 is assembled on the substrate 1.
Le capot 3 est alors mis en place dans la gouttière 4.The cover 3 is then placed in the gutter 4.
Lorsque le capot 3 est correctement positionné, on réalise un sertissage localisé, par déplacement latéral de la matière du substrat au-dessus de coins des pattes 5 du capot 3. La matière déplacée lors du sertissage est celle qui forme les bords de la gouttière issue de l'emboutissage. Plus particulièrement, ainsi que l'illustrent les figures 2a et 2b, la matière repoussée par 1 ' emboutissage lors de la formation de la gouttière vient exercer après sertissage sur les pattes 5 des efforts parallèles se compensant. La matière déplacée lors du sertissage est référencée par 6. Deux modes de réalisation sont possibles : le sertissage peut être réalisé par un écrasement d'une partie assez courte du substrat venant recouvrir des pattes 5 assez longues (figure 2a) ; en variante, il peut être réalisé par un écrasement simultané de deux parties du substrat venant recouvrir des pattes 5 assez courtes (figure 2b) .When the cover 3 is correctly positioned, a localized crimping is carried out, by lateral displacement of the material of the substrate above the corners of the tabs 5 of the cover 3. The material displaced during the crimping is that which forms the edges of the gutter issuing stamping. More particularly, as illustrated in FIGS. 2a and 2b, the material repelled by stamping during the formation of the gutter exerts after crimping on the legs 5 parallel forces compensating each other. The material displaced during crimping is referenced by 6. Two embodiments are possible: crimping can be carried out by crushing a fairly short part of the substrate which covers fairly long tabs 5 (FIG. 2a); alternatively, it can be achieved by simultaneously crushing two parts of the substrate covering fairly short tabs 5 (FIG. 2b).
Ainsi que l'illustrent les figures 3 et 4, le moule dans lequel le substrat 1 est embouti peut être conformé de façon que ledit substrat 1 embouti présente au bord de la gouttière 4 une protubérance 7 qui constitue l'excédent de matière à déplacer lors du sertissage ; 1 ' altitude de cette protubérance est ajustée pour rester inférieure au niveau supérieur de la carte électronique 2 , de façon à ne pas empêcher la sérigraphie de la pâte à braser pour le montage des composants préalablement à la mise en place du capot 3. 5As illustrated in Figures 3 and 4, the mold in which the substrate 1 is stamped can be shaped so that said stamped substrate 1 has at the edge of the gutter 4 a protrusion 7 which constitutes the excess material to be moved during crimping; The altitude of this protuberance is adjusted to remain below the upper level of the electronic card 2, so as not to prevent the screen printing of the solder paste for the assembly of the components prior to the installation of the cover 3. 5
Par ailleurs, la profondeur de la gouttière 4 est ajustée pour que le fond de ladite gouttière 4 et le retourFurthermore, the depth of the gutter 4 is adjusted so that the bottom of said gutter 4 and the return
5 soient en dessous de la carte électronique 2. Ceci permet de prévenir tout risque de fuite d'ondes électromagnétiques .5 are below the electronic card 2. This makes it possible to prevent any risk of leakage of electromagnetic waves.
Avantageusement, lors du sertissage initial, seule une partie des pattes du capot 5 est utilisée, ce qui permet de se réserver la possibilité d'utiliser les autres pattes pour, dans l'hypothèse d'un démontage ultérieur, un deuxième sertissage.Advantageously, during the initial crimping, only part of the tabs of the cover 5 is used, which makes it possible to reserve the possibility of using the other tabs for, in the event of a subsequent disassembly, a second crimping.
Par conséquent, le procédé qui vient d'être décrit est compatible avec un démontage du capot.Consequently, the process which has just been described is compatible with dismantling the cover.
La technique qui vient d'être décrite présente de nombreux avantages : - elle est d'une plus grande simplicité que les techniques antérieures, puisque le montage mécanique du capot, le positionnement de celui-ci et la mise en contact électrique du capot et du substrat métallique sont réalisés en une seule opération ; - le montage réalisé permet une absence de fuites d'ondes électromagnétiques ;The technique which has just been described has many advantages: - it is of greater simplicity than the prior techniques, since the mechanical mounting of the cover, the positioning of the latter and the electrical contacting of the cover and the metal substrate are made in a single operation; - the assembly carried out allows an absence of electromagnetic wave leaks;
- le substrat métallique reste parfaitement étanche, puisqu'il est dépourvu de perforations ;- The metal substrate remains perfectly waterproof, since it is free of perforations;
- la rigidité mécanique de 1 ' ensemble du montage est augmentée ; en particulier, la gouttière réalisée sur l'ensemble du pourtour du substrat métallique constitue une nervure qui contribue à cette rigidité ; cette rigidité est également augmentée par 1 ' emboutissage du capot lors de son sertissage sur le substrat métallique ; on notera que l'augmentation de la rigidité obtenue permet de réduire l'épaisseur du substrat métallique ; également, avec la technique proposée, il est possible de démonter puis de remonter le capot.- The mechanical rigidity of one assembly is increased; in particular, the gutter made on the entire periphery of the metal substrate constitutes a rib which contributes to this rigidity; this rigidity is also increased by stamping the cover when it is crimped onto the metal substrate; it will be noted that the increase in rigidity obtained makes it possible to reduce the thickness of the metal substrate; also, with the proposed technique, it is possible to dismantle and then reassemble the hood.
Le blindage qui, vient d'être décrit peut être utilisé dans tous les domaines de 1 ' électronique où sont 6 utilisés les substrats métalliques isolés et notamment de façon avantageuse en électronique automobile, conversion d'énergie, alimentation de puissance, multiplexeur de puissance, alimentation de moteur électrique, etc.The shielding which has just been described can be used in all fields of electronics where 6 used insulated metal substrates and in particular advantageously in automotive electronics, energy conversion, power supply, power multiplexer, electric motor supply, etc.
En particulier il peut être mis en oeuvre dans le blindage du circuit de commande ("ballast" selon la terminologie de l' Homme du Métier) d'une lampe à décharge où le problème des fuites d'ondes électromagnétiques n'était jusqu'à présent pas totalement résolu. In particular it can be implemented in the shielding of the control circuit ("ballast" according to the terminology of the skilled person) of a discharge lamp where the problem of leakage of electromagnetic waves was only up to present not fully resolved.

Claims

7 REVENDICATIONS 7 CLAIMS
1. Ensemble comportant une carte électronique (2) à circuit imprimé montée sur un substrat (1) métallique, ainsi qu'un capot (3) métallique de blindage électriquement connecté au substrat (1) , le substrat (1) présentant une gouttière en creux (4) dans laquelle le bord du capot (3) est reçu, caractérisé en ce que ledit bord est serti sur ledit substrat (1) dans la gouttière (4).1. Assembly comprising an electronic card (2) with printed circuit mounted on a metallic substrate (1), as well as a metallic shielding cover (3) electrically connected to the substrate (1), the substrate (1) having a gutter in hollow (4) in which the edge of the cover (3) is received, characterized in that said edge is crimped onto said substrate (1) in the gutter (4).
2. Ensemble selon la revendication 1, caractérisé en ce que le bord du capot (3) se termine par au moins une patte (5) en retour qui est sertie dans la gouttière (4) .2. Assembly according to claim 1, characterized in that the edge of the cover (3) ends with at least one tab (5) in return which is crimped in the gutter (4).
3. Ensemble selon la revendication 2 , caractérisé en ce que le fond de ladite gouttière (4) et ladite patte (5) sont en dessous de la carte électronique (2) .3. An assembly according to claim 2, characterized in that the bottom of said gutter (4) and said tab (5) are below the electronic card (2).
4. Procédé pour la réalisation d'un ensemble selon l'une des revendications précédentes, caractérisé par les différentes étapes suivantes : - on emboutit le substrat (1) pour y réaliser une gouttière (4) ,4. Method for producing an assembly according to one of the preceding claims, characterized by the following different stages: - the substrate (1) is stamped to make a gutter (4) therein,
- on assemble la carte électronique (2) sur ledit substrat,- the electronic card (2) is assembled on said substrate,
- on positionne le capot (3) sur l'ensemble ainsi obtenu, en disposant le bord dudit capot (3) dans ladite gouttière (4) ,the hood (3) is positioned on the assembly thus obtained, by placing the edge of said hood (3) in said gutter (4),
- on sertit ledit bord sur ledit substrat (1) .- said edge is crimped onto said substrate (1).
5. Procédé selon la revendication précédente, caractérisé en ce que le sertissage se fait par écrasement localisé de matière du substrat (1) sur une ou plusieurs pattes qui terminent le bord du capot (3), de façon à exercer sur la ou lesdites pattes (5) des efforts opposés qui se compensent .5. Method according to the preceding claim, characterized in that the crimping is done by localized crushing of material of the substrate (1) on one or more tabs which terminate the edge of the cover (3), so as to exert on the said tab or tabs (5) opposite efforts which compensate each other.
6. Procédé selon l'une des revendications 4 et 5, caractérisé en ce que 1 ' emboutissage forme au bord de la 8 gouttière une protubérance destinée à constituer la matière à déplacer lors du sertissage.6. Method according to one of claims 4 and 5, characterized in that the stamping forms at the edge of the 8 gutter a protuberance intended to constitute the material to be displaced during crimping.
7. Procédé selon l'une des revendications 4 à 6, caractérisé en ce que seule une partie des pattes du capot (3) est sertie. 7. Method according to one of claims 4 to 6, characterized in that only a part of the tabs of the cover (3) is crimped.
PCT/FR1999/000462 1998-03-02 1999-03-02 Shielding an electronic card with printed circuit mounted on a metal substrate WO1999045755A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19980533T DE19980533B4 (en) 1998-03-02 1999-03-02 Shielding a printed circuit printed circuit board mounted on a metallic substrate
JP54432299A JP4160130B2 (en) 1998-03-02 1999-03-02 Shielding assembly and method of manufacturing the same
US09/423,075 US6925708B1 (en) 1998-03-02 1999-05-02 Method of shielding a printed circuit electronics card mounted on a metal substrate
US11/080,276 US7219420B2 (en) 1998-03-02 2005-03-15 Screening of a printed-circuit electronics card mounted on a metal substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9802478A FR2775554B1 (en) 1998-03-02 1998-03-02 SHIELDING OF AN ELECTRONIC BOARD WITH A PRINTED CIRCUIT MOUNTED ON A METAL SUBSTRATE
FR98/02478 1998-03-02

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/080,276 Division US7219420B2 (en) 1998-03-02 2005-03-15 Screening of a printed-circuit electronics card mounted on a metal substrate

Publications (1)

Publication Number Publication Date
WO1999045755A1 true WO1999045755A1 (en) 1999-09-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR1999/000462 WO1999045755A1 (en) 1998-03-02 1999-03-02 Shielding an electronic card with printed circuit mounted on a metal substrate

Country Status (4)

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JP (1) JP4160130B2 (en)
DE (1) DE19980533B4 (en)
FR (1) FR2775554B1 (en)
WO (1) WO1999045755A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1445999B1 (en) * 2003-02-07 2007-10-03 Sony Ericsson Mobile Communications AB A method of providing a PWB with a shield can and a PWB therefor
FR2870060B1 (en) * 2004-05-06 2008-09-05 Valeo Electronique Sys Liaison VEHICLE WITH ELECTRONIC FUNCTIONS PROTECTED AGAINST HYPERFREQUENCIES

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPS6449300A (en) * 1987-08-19 1989-02-23 Mitsubishi Electric Corp Coupling of shielding case
US5559676A (en) * 1995-06-07 1996-09-24 Gessaman; Martin J. Self-contained drop-in component
JPH1022679A (en) * 1996-07-05 1998-01-23 Saitama Nippon Denki Kk Shielding structure for multilayered printed board

Family Cites Families (1)

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Publication number Priority date Publication date Assignee Title
DE19602637C1 (en) * 1996-01-25 1997-07-24 Siemens Ag Control device, esp. for motor vehicle

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6449300A (en) * 1987-08-19 1989-02-23 Mitsubishi Electric Corp Coupling of shielding case
US5559676A (en) * 1995-06-07 1996-09-24 Gessaman; Martin J. Self-contained drop-in component
JPH1022679A (en) * 1996-07-05 1998-01-23 Saitama Nippon Denki Kk Shielding structure for multilayered printed board

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 248 (E - 770) 9 June 1989 (1989-06-09) *
PATENT ABSTRACTS OF JAPAN vol. 098, no. 005 30 April 1998 (1998-04-30) *

Also Published As

Publication number Publication date
FR2775554A1 (en) 1999-09-03
FR2775554B1 (en) 2000-05-19
DE19980533B4 (en) 2008-11-20
DE19980533T1 (en) 2000-05-31
JP2001523399A (en) 2001-11-20
JP4160130B2 (en) 2008-10-01

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