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WO1999044172A1 - Electronic device with contactless electronic memory, and method for making same - Google Patents

Electronic device with contactless electronic memory, and method for making same Download PDF

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Publication number
WO1999044172A1
WO1999044172A1 PCT/FR1999/000291 FR9900291W WO9944172A1 WO 1999044172 A1 WO1999044172 A1 WO 1999044172A1 FR 9900291 W FR9900291 W FR 9900291W WO 9944172 A1 WO9944172 A1 WO 9944172A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheet
electronic
sheets
electronic device
protective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/FR1999/000291
Other languages
French (fr)
Inventor
Laurent Oddou
Ray Freeman
Stéphane AYALA
Michael Zafrany
Philippe Patrice
Gérard BOURNEIX
David Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SCA
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus SCA, Gemplus Card International SA, Gemplus SA filed Critical Gemplus SCA
Priority to AU24286/99A priority Critical patent/AU2428699A/en
Priority to BR9907751-5A priority patent/BR9907751A/en
Priority to JP2000533853A priority patent/JP2002505488A/en
Priority to CA002321893A priority patent/CA2321893A1/en
Priority to EP99903730A priority patent/EP1057139A1/en
Publication of WO1999044172A1 publication Critical patent/WO1999044172A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Definitions

  • the present invention relates to a method for manufacturing a thin and flexible flexible and foldable contactless electronic device (10), such as a card, a label, a ticket or a token, comprising at least one electronic microcircuit (20) which is arranged in the thickness of a support and which has studs connected to an interface antenna (24) arranged in the thickness of the support, the latter comprising at least two opposite sheets, lower (12) and upper (16 ), protective, said method comprising the following consecutive steps
  • a thin and flexible flexible and foldable contactless electronic device such as a card, a label, a ticket or a token
  • a thin and flexible flexible and foldable contactless electronic device comprising at least one electronic microcircuit (20) which is arranged in the thickness of a support and which has studs connected to an interface antenna (24) arranged in the thickness of the support, the latter comprising at least two opposite sheets, lower (12) and upper (16 ), protective, said method comprising the following consecutive steps
  • smart cards which are either rigid cards whose support is made of plastic, or labels
  • an electronic device of the type mentioned above for example a thin contactless smart card (thickness less than, for example, about 400 ⁇ m, even 280 ⁇ m) and flexible or even foldable in two, which can be used several times, the cost of which is particularly reduced as well as its thickness in order to be able to be used in numerous applications using an electronic memory chip for which it is today impossible, for reasons of cost and / or thickness support, using cards, 2 labels, tickets or contactless electronic memory tokens.
  • the invention provides a method of manufacturing an electronic device of the type mentioned above, comprising the following consecutive steps: a) producing a lower protective sheet by: ai) placing at least one electronic microcircuit on the internal face from the bottom sheet; a2) producing at least one interface antenna on the internal face of the lower sheet, in particular by screen printing; a3) electrically connecting pads of the electronic microcircuit to the interface antenna; b) making a stack by superimposing the lower protective sheet, an intermediate bonding sheet whose two opposite lower and upper faces are provided with adhesive, and an upper protective sheet; c) assemble the three overlapping sheets by compressing them.
  • step c) of assembly consists of a hot rolling operation
  • the intermediate bonding sheet has a recess in line with the electronic microcircuit
  • the intermediate bonding sheet is a sheet of hot-melt adhesive;
  • the intermediate bonding sheet is a sheet of paper, the two opposite lower and upper faces of which are provided with a layer of hot-melt adhesive;
  • step a) of making the lower protective sheet the operations ai), a2) and a3) are carried out successively;
  • At least one of the protective sheets is based on paper.
  • the method includes an additional printing step on one and / or the other of the outer faces of the two upper and lower sheets for protecting the support.
  • the printing is carried out before the postponement of the antenna and / or the chip.
  • the invention also relates to a contactless electronic device of the type mentioned above, characterized in that it comprises a stack:
  • the intermediate bonding sheet has a recess in line with the electronic microcircuit
  • the intermediate bonding sheet is a sheet of hot-melt adhesive
  • the intermediate bonding sheet is a sheet of paper, the two opposite lower and upper faces of which are provided with a layer of hot-melt adhesive;
  • At least one of the protective sheets is based on paper.
  • the device has a thickness of less than 400 ⁇ m, or even 280 ⁇ m.
  • the sheet supporting the antenna and the microcircuit (the chip) has a thickness less than or equal to 75 ⁇ m.
  • FIG. 1 is a schematic view in longitudinal section of a first embodiment of a smart card produced in accordance with the teachings of the invention and on which the stacking of the three sheets which constitute it is illustrated before the operation hot rolling;
  • Figure 2 is a view similar to that of Figure 1 which illustrates a second embodiment of a smart card produced in accordance with the teachings of the invention
  • FIG. 4 is a schematic view illustrating the production of stacking by superposition of the three sheets constituting the support of a smart card produced in accordance with the teachings of the invention.
  • identical, similar or analogous elements will be designated by the same reference numerals, and in the description and the claims, the terms lower, upper, vertical, etc. will be used without limitation with reference to the figures to facilitate explanations.
  • flexible means a mechanical property identical to that of playing cards.
  • the product of the invention is designed so that it can be handled like a metro ticket, rolled up or even folded by hand without altering its transceiver operation.
  • FIG. 1 a smart card 10 which is constituted by a vertical stack of three sheets 12, 14 and 16.
  • the bottom sheet 1 2 is a first sheet of paper whose thickness is for example equal to 75 microns made of “Maine” paper sold by the company Arjo-Wiggins.
  • the lower sheet of paper 12 constitutes a lower protective sheet of the card 10 while the upper sheet 16, of the same constitution and the same thickness as the lower sheet 12 constitutes an upper protective sheet of paper of the card 10.
  • the intermediate sheet 14 is a sheet for mutual bonding of the two lower 12 and upper 16 sheets which, in this first embodiment, is a sheet or film of hot-melt adhesive, also called a "Hot Melt" sheet of a 6 thickness of 100 microns marketed by the company Polyconcept.
  • This hot melt sheet has the advantage of being soft at room temperature and of not damaging the chip during stacking.
  • the intermediate bonding sheet 14 when it is hard like paper, it may optionally include a recess or window 18 which is arranged vertically in line with an electronic microcircuit 20, or chip, placed on the internal upper face 22 of the lower sheet 12.
  • the electronic microcircuit 20 is connected to an interface antenna 24 which, according to a known technique, is for example produced by screen printing on the upper face 22 by means of a conductive silver-based ink which is for example the ink E520 sold by Dupont de Nemours.
  • the electronic microcircuit 20 is for example a "Chip Mifare Amtel AT 8100" whose thickness is reduced to for example 70 microns. It can be fixed on the face 22 for example by gluing.
  • the electrical connection of the pad of the electronic microcircuit or electronic module 20 to the interface antenna 24 is carried out, according to a known technique, preferably by cords 26 of conductive glue which is for example glue sold under the name "Ablestick Silver Glue ”.
  • the second embodiment illustrated in FIG. 2 differs from the first embodiment which has just been described by the structure of the intermediate bonding sheet 14.
  • the bonding sheet 14 is here constituted by an intermediate sheet of paper 14A, the two opposite external faces of which are coated with a layer of adhesive 7
  • FIG. 3A we start from a sheet of paper 12 on the upper face 22 from which we glue, for each electronic device to be produced, an electronic microcircuit or module 20.
  • the antennas 24 are produced, preferably by screen printing on the upper face 22. Alternatively, the antenna can be produced before the module is fixed and connected. Finally, as illustrated in FIG. 3C, electrical connections or connections are made to the electronic microcircuits 20 to the antennas 24 by depositing cords 26 of conductive adhesive.
  • FIG. 4 This next step is illustrated in FIG. 4 in which the stacking of the lower sheet 12 previously produced, of an intermediate bonding sheet 14 in which there is, if necessary, previously produced, has been shown schematically in exploded perspective. windows or cutouts 1 8, and an upper sheet 16 of paper protection.
  • the stack or sandwich thus produced is then, during a following step, not shown in the figures, assembled by hot pressing the three superimposed sheets 12, 14 and 16, for example during a rolling operation with hot, that is to say at a temperature making it possible to cause the melting of the hot-melt adhesive constituting in itself the intermediate sheet 14 (FIG. 1) or constituting the layers 14B of glue of the intermediate bonding sheet 14 (FIG.
  • This laminating operation also called lamination, makes it possible to permanently associate the three sheets of the stack and to reduce the total thickness of the electronic device thus produced to a value less than or equal to 260 microns.
  • the invention thus makes it possible to have electronic devices with electronic memory without contact of reduced cost and of reduced thickness making it possible to replace other products comprising means of identification, such as for example the flexible tickets with magnetic strip or with code bar, these new electronic devices being more biodegradable.
  • the invention is not limited to the embodiments and to the method which have just been described.
  • the various operations making it possible in particular to achieve the production of the bottom protective sheet of paper 12 provided with the electronic microcircuit 20 and the antenna 24 can be carried out according to other known technologies, the antenna being able for example to be produced in firstly and the connection of the electronic microcircuit being carried out automatically when the latter is installed with its conductive contact pads turned towards the upper face 22 and placed directly on conductive sections of the antenna 24 (“Flip Chip”).
  • connection of an electronic microcircuit 20 to the antenna 24 could be carried out according to a technique of micro-wiring or welding of the connections (“Wire Bonding”) but would be more fragile and more bulky in thickness. 10
  • Hot-melt adhesive whatever the structure of the intermediate bonding sheet 14, makes it possible to avoid resorting to a housing coating (“Potting”) consisting in protecting the electronic microcircuit 20 and its connections using a resin .
  • Potting housing coating
  • the nature of the hot-melt adhesive used can also be such that it is slightly tacky on cold contact so as to ensure pre-assembly of the stack of three sheets prior to the hot rolling operation.
  • the protective paper sheet (12, 16) as well as the sheet 14 can also be made of a polymer in particular from those commonly used in the field of smart cards (PVC, PE, PP).
  • These sheets can also be made from cellulose-laden polymer to improve some of its properties (sealing, mechanical strength, etc.).
  • the invention required to combine several parameters. Beyond the use of small chips (less than 70 ⁇ m), and thin protective sheets, it was preferable to use a heat-fusible or fusible intermediate layer called "hot melt" for the assembly of the together. This layer due to its cold ductility has the advantage of not damaging the silicon chip coming directly into contact with it during rolling. In this regard, obviously in the intermediate layer is not essential.
  • Screen printing according to the above request has the advantage of producing antenna tracks with a precise contour, of good conduction quality (silver particles).
  • the ink being polymer-based and being partially dried according to the method described in the above application, the device can be folded several times by hand, 5 times for example without damaging the antenna.
  • a screen-printed antenna loaded with silver makes it easier to connect the antenna to the chip by a connection element below compared to the use of an antenna produced by etching.
  • connection element is preferably either a bead of conductive adhesive charged with silver, the chip being fixed. 12 in the place is a point of conductive adhesive, the chip being fixed upside down (flip-chip).
  • connections have the advantage, compared to the type of welded wire (wire-bonding) connections, of being thin and better able to withstand mechanical stresses.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)

Abstract

The invention concerns a contactless electronic device (10) such as a card, a label, a ticket or a token, comprising at least an electronic microcircuit (20) arranged in the thickness of a rigid or semirigid support and comprising pads (26) connected to an interface antenna (24) arranged in the thickness of the support, the latter comprising at least two opposite, lower (12) and upper (14), protective sheets. The invention is characterised in that it comprises a stack: of a lower protective sheet (12) whereof the inner face (22) bears at least one electronic microcircuit and at least one interface antenna (24); of an intermediate bonding sheet (14) whereof the two opposite faces lower and upper are provided with adhesive; and of an upper protective sheet (16).

Description

Dispositif électronique à mémoire électronique sans contact, et procédé de fabrication d'un tel dispositif Electronic device with contactless electronic memory, and method of manufacturing such a device

La présente invention concerne un procédé de fabrication d'un dispositif électronique sans contact flexible et pliable de fine épaisseur (10), tel qu'une carte, une étiquette, un ticket ou un jeton , comportant au moins un microcircuit électronique (20) qui est agencé dans l'épaisseur d'un support et qui comporte des plots reliés à une antenne (24) d'interface agencée dans l'épaisseur du support, ce dernier comportant au moins deux feuilles opposées, inférieure (12) et supérieure (16), de protection, ledit procédé comprenant les étapes consécutives suivantes On connaît de nombreux exemples de tels dispositifs électroniques, couramment appelés cartes à puce, qui sont soit des cartes rigides dont le support est réalisé en matière plastique, soit des étiquettes, dites « étiquettes électroniques », pour l'étiquetage de produits de grande consommation qui sont à usage unique, c'est-à-dire qui ont pour but d'être collées une fois sur un produit et qui sont constituées essentiellement par une feuille de papier.The present invention relates to a method for manufacturing a thin and flexible flexible and foldable contactless electronic device (10), such as a card, a label, a ticket or a token, comprising at least one electronic microcircuit (20) which is arranged in the thickness of a support and which has studs connected to an interface antenna (24) arranged in the thickness of the support, the latter comprising at least two opposite sheets, lower (12) and upper (16 ), protective, said method comprising the following consecutive steps Many examples of such electronic devices are known, commonly called smart cards, which are either rigid cards whose support is made of plastic, or labels, called "labels electronic ”, for the labeling of consumer products which are for single use, that is to say which are intended to be stuck once on a product and which t consist essentially of a sheet of paper.

Il existe ainsi un besoin pour un dispositif électronique du type mentionné précédemment, par exemple une carte à puce sans contact de fine épaisseur (épaisseur inférieure par exemple à environ 400 μm, voire 280 μm) et flexible voire pliable en deux, qui puisse être utilisée plusieurs fois, dont le coût soit particulièrement réduit de même que son épaisseur pour pouvoir être utilisé dans de nombreuses applications faisant appel à une puce à mémoire électronique pour lesquelles il est aujourd'hui impossible, pour des raisons de coût et/ou d'épaisseur du support, de faire appel à des cartes, 2 des étiquettes, des tickets ou des jetons à mémoire électronique sans contact.There is thus a need for an electronic device of the type mentioned above, for example a thin contactless smart card (thickness less than, for example, about 400 μm, even 280 μm) and flexible or even foldable in two, which can be used several times, the cost of which is particularly reduced as well as its thickness in order to be able to be used in numerous applications using an electronic memory chip for which it is today impossible, for reasons of cost and / or thickness support, using cards, 2 labels, tickets or contactless electronic memory tokens.

Il existe également un besoin pour des dispositifs plus résistants autorisant une manipulation sans précaution voire quelques pliages en deux sans altération de leur fonctionnement. C'est le cas par exemple de tickets de métro.There is also a need for more resistant devices allowing careless handling or even some folding in half without altering their operation. This is the case, for example, with metro tickets.

Alternativement, il existe un besoin pour des dispositifs sans contact très fins et d'excellente qualité de surface pouvant servir de support à une impression de haute qualité. C'est le cas notamment de carte à jouer ou de carte d'identité.Alternatively, there is a need for very fine contactless devices of excellent surface quality which can serve as a support for high quality printing. This is particularly the case for playing cards or identity cards.

Dans ce but, l'invention propose un procédé de fabrication d'un dispositif électronique du type mentionné précédemment, comprenant les étapes consécutives suivantes: a) réaliser une feuille inférieure de protection en : ai ) posant au moins un microcircuit électronique sur la face interne de la feuille inférieure; a2) réalisant au moins une antenne d'interface sur la face interne de la feuille inférieure, notamment par sérigraphie ; a3) raccordant électriquement des plots du microcircuit électronique à l'antenne d'interface ; b) réaliser un empilage en superposant la feuille inférieure de protection, une feuille intermédiaire de collage dont les deux faces opposées inférieure et supérieure sont munies de colle, et une feuille supérieure de protection; c) assembler les trois feuilles superposées en les comprimant.To this end, the invention provides a method of manufacturing an electronic device of the type mentioned above, comprising the following consecutive steps: a) producing a lower protective sheet by: ai) placing at least one electronic microcircuit on the internal face from the bottom sheet; a2) producing at least one interface antenna on the internal face of the lower sheet, in particular by screen printing; a3) electrically connecting pads of the electronic microcircuit to the interface antenna; b) making a stack by superimposing the lower protective sheet, an intermediate bonding sheet whose two opposite lower and upper faces are provided with adhesive, and an upper protective sheet; c) assemble the three overlapping sheets by compressing them.

Selon d'autres caractéristiques du procédé selon l'invention : - l'étape c) d'assemblage consiste en une opération de laminage à chaud ; 3According to other characteristics of the method according to the invention: - step c) of assembly consists of a hot rolling operation; 3

- la feuille intermédiaire de collage comporte un évidement au droit du microcircuit électronique ;- The intermediate bonding sheet has a recess in line with the electronic microcircuit;

- la feuille intermédiaire de collage est une feuille de colle thermofusible ; - la feuille intermédiaire de collage est une feuille de papier dont les deux faces opposées inférieure et supérieure sont munies d'une couche de colle thermofusible ;the intermediate bonding sheet is a sheet of hot-melt adhesive; the intermediate bonding sheet is a sheet of paper, the two opposite lower and upper faces of which are provided with a layer of hot-melt adhesive;

- lors de l'étape a) de réalisation de la feuille inférieure de protection, les opérations ai ), a2) et a3) sont réalisées successivement ;- During step a) of making the lower protective sheet, the operations ai), a2) and a3) are carried out successively;

- l'une au moins des feuilles de protection est à base de papier.- at least one of the protective sheets is based on paper.

- le procédé comporte une étape supplémentaire d'impression sur l'une et/ou l'autre des faces externes des deux feuilles inférieure et supérieure de protection du support. De préférence l'impression est réalisée avant le report de l'antenne et/ ou la puce.- The method includes an additional printing step on one and / or the other of the outer faces of the two upper and lower sheets for protecting the support. Preferably the printing is carried out before the postponement of the antenna and / or the chip.

- il comporte une étape supplémentaire de découpe du dispositif électronique, selon un contour déterminé de carte, d'étiquette, de ticket ou de jeton ; on réalise simultanément plusieurs dispositifs électroniques à partir de feuilles de protection et d'une feuille de collage en rouleaux, et on sépare les dispositifs électroniques lors de l'étape supplémentaire de découpe. L'invention concerne aussi un dispositif électronique sans contact du type mentionné précédemment, caractérisé en ce qu'il comprend un empilage :- It includes an additional step of cutting the electronic device, according to a determined outline of card, label, ticket or token; several electronic devices are produced simultaneously from protective sheets and a gluing sheet in rolls, and the electronic devices are separated during the additional cutting step. The invention also relates to a contactless electronic device of the type mentioned above, characterized in that it comprises a stack:

- d'une feuille inférieure de protection dont ia face interne porte au moins un microcircuit électronique et au moins une antenne d'interface ;- a lower protective sheet, the internal face of which carries at least one electronic microcircuit and at least one interface antenna;

- d'une feuille intermédiaire de collage dont les deux faces opposées inférieure et supérieure sont munies de colle ; 4- an intermediate bonding sheet, the two opposite lower and upper faces of which are provided with adhesive; 4

- et d'une feuille supérieure de protection .- and a protective top sheet.

Selon d'autres caractéristiques du dispositif selon l'invention :According to other characteristics of the device according to the invention:

- la feuille intermédiaire de collage comporte un évidement au droit du microcircuit électronique ;- The intermediate bonding sheet has a recess in line with the electronic microcircuit;

- la feuille intermédiaire de collage est une feuille de colle thermofusible ;the intermediate bonding sheet is a sheet of hot-melt adhesive;

- la feuille intermédiaire de collage est une feuille de papier dont les deux faces opposées inférieure et supérieure sont munies d'une couche de colle thermofusible ;the intermediate bonding sheet is a sheet of paper, the two opposite lower and upper faces of which are provided with a layer of hot-melt adhesive;

- l'une au moins des feuilles de protection est à base de papier.- at least one of the protective sheets is based on paper.

- Le dispositif a une épaisseur inférieure à 400 μm, voire 280 μm . - la feuille supportant l'antenne et le microcircuit (la puce) a une épaisseur inférieure ou égale à 75 μm.- The device has a thickness of less than 400 μm, or even 280 μm. - the sheet supporting the antenna and the microcircuit (the chip) has a thickness less than or equal to 75 μm.

D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description détaillée qui va suivre pour la compréhension de laquelle on se reportera aux dessins annexés dans lesquels :Other characteristics and advantages of the invention will appear on reading the detailed description which follows for the understanding of which reference will be made to the appended drawings in which:

- la figure 1 est une vue schématique en section longitudinale d'un premier mode de réalisation d'une carte à puce réalisée conformément aux enseignements de l'invention et sur laquelle l'empilage des trois feuilles qui la constituent est illustré avant l'opération de laminage à chaud ;- Figure 1 is a schematic view in longitudinal section of a first embodiment of a smart card produced in accordance with the teachings of the invention and on which the stacking of the three sheets which constitute it is illustrated before the operation hot rolling;

- la figure 2 est une vue similaire à celle de la figure 1 qui illustre un deuxième mode de réalisation d'une carte à puce réalisée conformément aux enseignements de l'invention ;- Figure 2 is a view similar to that of Figure 1 which illustrates a second embodiment of a smart card produced in accordance with the teachings of the invention;

- les figures 3A à 3C illustrent de manière schématique les trois opérations permettant de réaliser une feuille inférieure de protection en papier pour un dispositif électronique conforme aux enseignements de l'invention ; et 5- Figures 3A to 3C schematically illustrate the three operations for producing a lower protective sheet of paper for an electronic device according to the teachings of the invention; and 5

- la figure 4 est une vue schématique illustrant la réalisation de l'empilage par superposition des trois feuilles constitutives du support d'une carte à puce réalisée conformément aux enseignements de l'invention . Dans la description qui va suivre, des éléments identiques, similaires ou analogues seront désignés par les mêmes chiffres de référence, et dans la description et les revendications, les termes inférieur, supérieur, vertical, etc. seront utilisés à titre non limitatif en référence aux figures pour faciliter les explications.- Figure 4 is a schematic view illustrating the production of stacking by superposition of the three sheets constituting the support of a smart card produced in accordance with the teachings of the invention. In the following description, identical, similar or analogous elements will be designated by the same reference numerals, and in the description and the claims, the terms lower, upper, vertical, etc. will be used without limitation with reference to the figures to facilitate explanations.

Par définition, on entend par flexible, une propriété mécanique identique à celle des cartes à jouer.By definition, flexible means a mechanical property identical to that of playing cards.

Le cas échéant, le produit de l'invention est conçu de manière à pouvoir être manipulé comme un ticket de métro, enroulé voire plié à la main sans altération de son fonctionnement émetteur récepteur.Where appropriate, the product of the invention is designed so that it can be handled like a metro ticket, rolled up or even folded by hand without altering its transceiver operation.

On a représenté à la figure 1 une carte à puce 10 qui est constituée par un empilage vertical de trois feuilles 12, 14 et 16. La feuille inférieure 1 2 est une première feuille de papier dont l'épaisseur est par exemple égale à 75 microns réalisée en papier « Maine » commercialisé par la société Arjo-Wiggins.There is shown in Figure 1 a smart card 10 which is constituted by a vertical stack of three sheets 12, 14 and 16. The bottom sheet 1 2 is a first sheet of paper whose thickness is for example equal to 75 microns made of “Maine” paper sold by the company Arjo-Wiggins.

La feuille inférieure de papier 12 constitue une feuille inférieure de protection de la carte 10 tandis que la feuille supérieure 16, de même constitution et de même épaisseur que la feuille inférieure 12 constitue une feuille supérieure de protection en papier de la carte 10.The lower sheet of paper 12 constitutes a lower protective sheet of the card 10 while the upper sheet 16, of the same constitution and the same thickness as the lower sheet 12 constitutes an upper protective sheet of paper of the card 10.

La feuille intermédiaire 14 est une feuille de collage mutuel des deux feuilles inférieure 12 et supérieure 16 qui , dans ce premier mode de réalisation, est une feuille ou film de colle thermofusible, aussi appelée feuille « Hot Melt » d'une 6 épaisseur de 100 microns commercialisée par la société Polyconcept. Cette feuille hot melt a l'avantage d'être molle à température ambiante et de ne pas endommager la puce lors de l'empilage. Conformément à une caractéristique de l'invention, lorsque la feuille intermédiaire de collage 14 est dure comme du papier, elle peut comporter éventuellement un évidement ou fenêtre 18 qui est agencé verticalement au droit d'un microcircuit électronique 20, ou puce, posé sur la face supérieure interne 22 de la feuille inférieure 12.The intermediate sheet 14 is a sheet for mutual bonding of the two lower 12 and upper 16 sheets which, in this first embodiment, is a sheet or film of hot-melt adhesive, also called a "Hot Melt" sheet of a 6 thickness of 100 microns marketed by the company Polyconcept. This hot melt sheet has the advantage of being soft at room temperature and of not damaging the chip during stacking. According to a characteristic of the invention, when the intermediate bonding sheet 14 is hard like paper, it may optionally include a recess or window 18 which is arranged vertically in line with an electronic microcircuit 20, or chip, placed on the internal upper face 22 of the lower sheet 12.

Le microcircuit électronique 20 est relié à une antenne d'interface 24 qui, selon une technique connue, est par exemple réalisée par sérigraphie sur la face supérieure 22 au moyen d'une encre conductrice à base d'argent qui est par exemple l'encre E520 commercialisée par la société Dupont de Nemours.The electronic microcircuit 20 is connected to an interface antenna 24 which, according to a known technique, is for example produced by screen printing on the upper face 22 by means of a conductive silver-based ink which is for example the ink E520 sold by Dupont de Nemours.

Le microcircuit électronique 20 est par exemple un « Chip Mifare Amtel AT 8100 » dont l'épaisseur est réduite à par exemple 70 microns. Il peut être fixé sur la face 22 par exemple par collage.The electronic microcircuit 20 is for example a "Chip Mifare Amtel AT 8100" whose thickness is reduced to for example 70 microns. It can be fixed on the face 22 for example by gluing.

Le raccordement électrique de plot du microcircuit électronique ou module électronique 20 à l'antenne d'interface 24 est réalisé, selon une technique connue, de préférence par des cordons 26 de colle conductrice qui est par exemple de la colle commercialisée sous la dénomination « Ablestick Silver Glue » .The electrical connection of the pad of the electronic microcircuit or electronic module 20 to the interface antenna 24 is carried out, according to a known technique, preferably by cords 26 of conductive glue which is for example glue sold under the name "Ablestick Silver Glue ”.

Le second mode de réalisation illustré à la figure 2 diffère du premier mode de réalisation qui vient d'être décrit par la structure de la feuille intermédiaire de collage 14. En effet, la feuille de collage 14 est ici constituée par une feuille intermédiaire de papier 14A dont les deux faces externes opposées sont revêtues d'une couche de colle 7The second embodiment illustrated in FIG. 2 differs from the first embodiment which has just been described by the structure of the intermediate bonding sheet 14. In fact, the bonding sheet 14 is here constituted by an intermediate sheet of paper 14A, the two opposite external faces of which are coated with a layer of adhesive 7

thermofusible 14B, le composite qui constitue ainsi la feuille intermédiaire de collage 14 étant interposé entre les feuilles inférieure 12 et supérieure 1 6 de protection en papier de la même manière que la feuille de collage 14 de la figure 1 qui est constituée uniquement par un film de colle thermofusible. On décrira maintenant un exemple d'un procédé de fabrication des cartes 1 0 illustrées à la figure 1 ou à la figure 2.hot-melt 14B, the composite which thus constitutes the intermediate bonding sheet 14 being interposed between the lower 12 and upper sheets 1 6 of paper protection in the same manner as the bonding sheet 14 of FIG. 1 which is constituted solely by a film hot melt glue. An example of a method for manufacturing the cards 1 0 illustrated in FIG. 1 or in FIG. 2 will now be described.

Afin de proposer un procédé industriel permettant de fabriquer en grande série des dispositifs électroniques, tels que les cartes 10, plusieurs dispositifs sont réalisés simultanément et/ou à la file en faisant notamment appel pour les trois feuilles 12, 14 et 16 à des bandes ou rouleaux continus. II faut tout d'abord réaliser les feuilles inférieures 12 de protection en papier.In order to propose an industrial process making it possible to mass-produce electronic devices, such as cards 10, several devices are produced simultaneously and / or in a row, in particular using bands or strips for the three sheets 12, 14 and 16. continuous rollers. It is first necessary to make the lower sheets 12 of paper protection.

Dans ce but, comme cela est illustré à la figure 3A, on part d'une feuille de papier 12 sur la face supérieure 22 de laquelle on colle, pour chaque dispositif électronique à réaliser, un microcircuit électronique ou module 20.For this purpose, as illustrated in FIG. 3A, we start from a sheet of paper 12 on the upper face 22 from which we glue, for each electronic device to be produced, an electronic microcircuit or module 20.

Ensuite, comme cela est illustré à la figure 3B, on réalise les antennes 24, de préférence par sérigraphie sur la face supérieure 22. Alternativement, on peut réaliser l'antenne préalablement à la fixation et connexion du module. Enfin, comme cela est illustré à la figure 3C, on réalise les connexions ou raccordements électriques des microcircuits électroniques 20 aux antennes 24 par dépôt de cordons 26 de colle conductrice.Then, as illustrated in FIG. 3B, the antennas 24 are produced, preferably by screen printing on the upper face 22. Alternatively, the antenna can be produced before the module is fixed and connected. Finally, as illustrated in FIG. 3C, electrical connections or connections are made to the electronic microcircuits 20 to the antennas 24 by depositing cords 26 of conductive adhesive.

Ainsi, à la fin de l'opération illustrée à la figure 3C, on dispose d'une bande ou d'un rouleau d'une feuille de papier inférieure 12 qui doit ensuite être associée par empilage aux autres feuilles 14 et 16. 8Thus, at the end of the operation illustrated in FIG. 3C, there is a strip or a roll of a lower sheet of paper 12 which must then be combined by stacking with the other sheets 14 and 16. 8

Cette étape suivante est illustrée à la figure 4 sur laquelle on a représenté de manière schématique en perspective éclatée l'empilage de la feuille inférieure 12 préalablement réalisée, d'une feuille intermédiaire de collage 14 dans laquelle on a, le cas échéant, préalablement réalisé les fenêtres ou découpes 1 8, et d'une feuille supérieure 16 de protection en papier.This next step is illustrated in FIG. 4 in which the stacking of the lower sheet 12 previously produced, of an intermediate bonding sheet 14 in which there is, if necessary, previously produced, has been shown schematically in exploded perspective. windows or cutouts 1 8, and an upper sheet 16 of paper protection.

L'empilage ou sandwich ainsi réalisé est ensuite, lors d'une étape suivante, non représenté sur les figures, assemblé en comprimant à chaud les trois feuilles superposées 12, 14 et 1 6, par exemple au cours d'une opération de laminage à chaud, c'est-à-dire à une température permettant de provoquer la fusion de la colle thermofusible constituant en elle-même la feuille intermédiaire 14 (figure 1 ) ou constituant les couches 14B de colle de la feuille intermédiaire de collage 14 (figureThe stack or sandwich thus produced is then, during a following step, not shown in the figures, assembled by hot pressing the three superimposed sheets 12, 14 and 16, for example during a rolling operation with hot, that is to say at a temperature making it possible to cause the melting of the hot-melt adhesive constituting in itself the intermediate sheet 14 (FIG. 1) or constituting the layers 14B of glue of the intermediate bonding sheet 14 (FIG.

2).2).

Cette opération de laminage, aussi appelée lamifiage, permet d'associer définitivement les trois feuilles de l'empilage et de réduire l'épaisseur totale du dispositif électronique ainsi réalisé à une valeur inférieure ou égale à 260 microns.This laminating operation, also called lamination, makes it possible to permanently associate the three sheets of the stack and to reduce the total thickness of the electronic device thus produced to a value less than or equal to 260 microns.

Au cours de l'opération de laminage, la présence d'une fenêtre 18 au droit de chaque microcircuit électronique 20 permet d'éviter d'endommager ceux-ci.During the rolling operation, the presence of a window 18 in line with each electronic microcircuit 20 makes it possible to avoid damaging them.

Afin d'assurer la mise en correspondance des fenêtres 18 avec les microcircuits électroniques 20, il est bien entendu nécessaire de prévoir des moyens d'indexation des rouleaux ou bandes des feuilles 12 et 14.In order to ensure the matching of the windows 18 with the electronic microcircuits 20, it is of course necessary to provide means for indexing the rolls or strips of the sheets 12 and 14.

A l'issue de l'étape d'assemblage par laminage à chaud, on dispose d'une bande ou d'un rouleau dans laquelle les dispositifs électroniques, qu'il s'agisse de cartes, d'étiquettes, de tickets ou de jetons, doivent ensuite être découpés par des 9 moyens connus, par exemple selon une technique à l'emporte- pièce.At the end of the assembly stage by hot rolling, there is a strip or a roll in which the electronic devices, whether cards, labels, tickets or tokens, must then be cut by 9 known means, for example according to a cookie-cutter technique.

Lors d'une étape supplémentaire, préalable ou postérieure à la découpe des dispositifs électroniques, il est bien entendu possible d'imprimer l'une et/ou l'autre des faces externes des feuilles inférieure 12 et supérieure 16 de protection en papier.During an additional step, prior to or after cutting the electronic devices, it is of course possible to print one and / or the other of the external faces of the lower 12 and upper 16 sheets of paper protection.

L'invention permet ainsi de disposer de dispositifs électroniques à mémoire électronique sans contact de coût réduit et d'épaisseur réduite permettant de remplacer d'autres produits comportant des moyens d'identification , tels que par exemple les tickets souples à piste magnétique ou a code barre, ces nouveaux dispositifs électroniques étant de plus biodégradables. L'invention n'est pas limitée aux modes de réalisation et au procédé qui viennent d'être décrits.The invention thus makes it possible to have electronic devices with electronic memory without contact of reduced cost and of reduced thickness making it possible to replace other products comprising means of identification, such as for example the flexible tickets with magnetic strip or with code bar, these new electronic devices being more biodegradable. The invention is not limited to the embodiments and to the method which have just been described.

Les différentes opérations permettant notamment d'aboutir à la réalisation de la feuille inférieure de protection en papier 12 munie du microcircuit électronique 20 et de l'antenne 24 peuvent être réalisées selon d'autres technologies connues, l'antenne pouvant par exemple être réalisée dans un premier temps et le raccordement du microcircuit électronique étant réalisé automatiquement lors de la pose de ce dernier avec ses plots conducteurs de contact tournés vers la face supérieure 22 et posés directement sur des tronçons conducteurs de l'antenne 24(« Flip Chip »).The various operations making it possible in particular to achieve the production of the bottom protective sheet of paper 12 provided with the electronic microcircuit 20 and the antenna 24 can be carried out according to other known technologies, the antenna being able for example to be produced in firstly and the connection of the electronic microcircuit being carried out automatically when the latter is installed with its conductive contact pads turned towards the upper face 22 and placed directly on conductive sections of the antenna 24 (“Flip Chip”).

Le raccordement d'un microcircuit électronique 20 à l'antenne 24 pourrait être réalisé selon une technique de microcâblage ou de soudage des connexions (« Wire Bonding ») mais serait plus fragile et plus encombrante en épaisseur. 10The connection of an electronic microcircuit 20 to the antenna 24 could be carried out according to a technique of micro-wiring or welding of the connections (“Wire Bonding”) but would be more fragile and more bulky in thickness. 10

La présence de la colle thermofusible, quelle que soit la structure de la feuille intermédiaire de collage 14, permet d'éviter de recourir à un enrobage en boîtier (« Potting ») consistant à protéger le microcircuit électronique 20 et ses connexions en utilisant une résine.The presence of hot-melt adhesive, whatever the structure of the intermediate bonding sheet 14, makes it possible to avoid resorting to a housing coating (“Potting”) consisting in protecting the electronic microcircuit 20 and its connections using a resin .

La nature de la colle thermofusible utilisée peut aussi être telle qu'elle soit légèrement collante au contact à froid de manière à assurer un préassemblage de l'empilage des trois feuilles préalablement à l'opération de laminage à chaud . La feuille de protection en papier ( 12, 16) ainsi que la feuille 14 peuvent être réalisées également en un polymère notamment parmi ceux couramment utilisés dans le domaine des cartes à puce ( PVC, PE, PP).The nature of the hot-melt adhesive used can also be such that it is slightly tacky on cold contact so as to ensure pre-assembly of the stack of three sheets prior to the hot rolling operation. The protective paper sheet (12, 16) as well as the sheet 14 can also be made of a polymer in particular from those commonly used in the field of smart cards (PVC, PE, PP).

Ces feuilles peuvent également être constituée à base de cellulose chargée de polymère pour améliorer certaines de ses propriétés (étanchéité, tenue mécanique...).These sheets can also be made from cellulose-laden polymer to improve some of its properties (sealing, mechanical strength, etc.).

L'invention a nécessité de réunir plusieurs paramètres. Au delà du recours à des puces de petite taille (inférieures à 70μm), et à des feuilles de protection fines, il a fallu recourir de préférence à une couche intermédiaire thermofusible ou thermocollante dite de « hot melt » pour l'assemblage de l'ensemble. Cette couche du fait de sa ductilité à froid a l'avantage de ne pas endommager la puce de silicium venant directement à son contact pendant le laminage. A ce propos, un évidemment dans la couche intermédiaire n'est pas indispensable.The invention required to combine several parameters. Beyond the use of small chips (less than 70 μm), and thin protective sheets, it was preferable to use a heat-fusible or fusible intermediate layer called "hot melt" for the assembly of the together. This layer due to its cold ductility has the advantage of not damaging the silicon chip coming directly into contact with it during rolling. In this regard, obviously in the intermediate layer is not essential.

Le recours au laminage à chaud avec des plaques lisses permet d'améliorer l'état de surface initial des feuilles de protection. II est possible d'utiliser des feuilles de papier plus économiques que certaines feuilles en polymère précitées. 11The use of hot rolling with smooth plates improves the initial surface condition of the protective sheets. It is possible to use sheets of paper that are more economical than certain polymer sheets mentioned above. 11

Pour la réalisation de l'antenne, on a préféré recourir à la sérigraphie. En effet, de nombreux essais avec la gravure (aluminium, cuivre...) sur des feuilles en papier montrent des altérations chimiques du papier qui se traduisent par des ondulations et un jaunissement de ce dernier.For the realization of the antenna, we preferred to use screen printing. Indeed, many tests with engraving (aluminum, copper ...) on paper sheets show chemical alterations of the paper which result in ripples and yellowing of the latter.

D'autre part, il est impossible de pré-imprimer la feuille de protection avant la réalisation de l'antenne par sérigraphie, (l'avantage étant de pouvoir faire un contrôle de l'impression et d'éviter des rebuts après assemblage de la puce). Un autre problème peut se poser dans le recours à la technique de sérigraphie sur des feuilles de protection fines notamment en papier ou polymère en absence de précaution particulières. Il s'agit de l'apparition d'ondulations de surface résultant du séchage de l'encre. Ce problème et la solution apportée sont décrits dans la demande de brevet FR 97/1 3734 du 03/1 0/97. Ils sont inclus par référence dans le procédé de l'invention pour réaliser des dispositifs présentant une excellente qualité de surface (absence d'ondulations).On the other hand, it is impossible to pre-print the protective sheet before the antenna is produced by screen printing, (the advantage being being able to control the printing and avoid scrap after assembly of the chip). Another problem may arise in the use of the screen printing technique on thin protective sheets, in particular paper or polymer, in the absence of any particular precaution. This is the appearance of surface ripples resulting from the drying of the ink. This problem and the solution provided are described in patent application FR 97/1 3734 of 03/1 0/97. They are included by reference in the method of the invention for producing devices having an excellent surface quality (absence of undulations).

La sérigraphie selon la demande ci-dessus a l'avantage de réaliser des pistes d'antenne au contour précis, de bonne qualité de conduction (particules d'argent). L'encre étant à base polymère et étant séchée partiellement selon le procédé décrit dans la demande ci-dessus, le dispositif peut être plié plusieurs fois à la main, 5 fois par exemple sans endommagement de l'antenne.Screen printing according to the above request has the advantage of producing antenna tracks with a precise contour, of good conduction quality (silver particles). The ink being polymer-based and being partially dried according to the method described in the above application, the device can be folded several times by hand, 5 times for example without damaging the antenna.

En outre, le recours à une antenne sérigraphiée chargée argent facilite à moindre coût la connexion antenne à la puce par un élément de connexion ci-après comparativement au recours d'une antenne réalisée par gravure.In addition, the use of a screen-printed antenna loaded with silver makes it easier to connect the antenna to the chip by a connection element below compared to the use of an antenna produced by etching.

L'élément de connexion est de préférence soit un cordon de colle conductrice chargée argent la puce étant fixée 12 à l'endroit soit un point de colle conductrice, la puce étant fixée à l'envers (flip-chip).The connection element is preferably either a bead of conductive adhesive charged with silver, the chip being fixed. 12 in the place is a point of conductive adhesive, the chip being fixed upside down (flip-chip).

Ces connexions ont comparativement aux connexions du type à fils soudés (wire-bonding), l'avantage d'être de faible épaisseur et de mieux résister à des contraintes mécaniques. These connections have the advantage, compared to the type of welded wire (wire-bonding) connections, of being thin and better able to withstand mechanical stresses.

Claims

REVENDICATIONS 1. Procédé de fabrication d'un dispositif électronique sans contact flexible et pliable de fine épaisseur (10), tel qu'une carte, une étiquette, un ticket ou un jeton, comportant au moins un microcircuit électronique (20) qui est agencé dans l'épaisseur d'un support et qui comporte des plots reliés à une antenne (24) d'interface agencée dans l'épaisseur du support, ce dernier comportant au moins deux feuilles opposées, inférieure (12) et supérieure (16), de protection, ledit procédé comprenant les étapes consécutives suivantes : a) réaliser une feuille inférieure (12) de protection en : ai ) posant au moins un microcircuit électronique (20) sur la face interne (22) de la feuille inférieure; a2) réalisant au moins une antenne d'interface (24) sur la face interne (22) de la feuille inférieure (12), notamment par sérigraphie ; a3) raccordant électriquement (26) des plots du microcircuit électronique (20) à l'antenne d'interface (24) ; b) réaliser un empilage en superposant la feuille inférieure (12) de protection, une feuille intermédiaire (14, 14A, 14B) de collage dont les deux faces opposées inférieure et supérieure sont munies de colle, et une feuille supérieure (16) de protection ; c) assembler les trois feuilles superposées (12, 14, 16) en les comprimant.1. Method for manufacturing a thin and flexible flexible and foldable contactless electronic device (10), such as a card, a label, a ticket or a token, comprising at least one electronic microcircuit (20) which is arranged in the thickness of a support and which has studs connected to an interface antenna (24) arranged in the thickness of the support, the latter comprising at least two opposite sheets, lower (12) and upper (16), protection, said method comprising the following consecutive steps: a) producing a lower protection sheet (12) by: ai) placing at least one electronic microcircuit (20) on the internal face (22) of the lower sheet; a2) producing at least one interface antenna (24) on the internal face (22) of the lower sheet (12), in particular by screen printing; a3) electrically connecting (26) pads of the electronic microcircuit (20) to the interface antenna (24); b) making a stack by superimposing the lower protective sheet (12), an intermediate sheet (14, 14A, 14B) of bonding, the two opposite lower and upper faces of which are provided with adhesive, and an upper protective sheet (16) ; c) assemble the three superimposed sheets (12, 14, 16) by compressing them. 2. Procédé selon la revendication 1 , caractérisé en ce que l'étape c) d'assemblage consiste en une opération de laminage à chaud.2. Method according to claim 1, characterized in that step c) of assembly consists of a hot rolling operation. 3. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que la feuille intermédiaire de collage (14) comporte un évidement (18) au droit du microcircuit électronique (20). 143. Method according to any one of the preceding claims, characterized in that the intermediate bonding sheet (14) has a recess (18) in line with the electronic microcircuit (20). 14 4. Procédé selon l'une quelconque des revendications 1 à 3, caractérisé en ce que la feuille intermédiaire de collage (14) est une feuille de colle thermofusible.4. Method according to any one of claims 1 to 3, characterized in that the intermediate bonding sheet (14) is a sheet of hot-melt adhesive. 5. Procédé selon l'une quelconque des revendications 1 à 3, caractérisé en ce que la feuille intermédiaire de collage5. Method according to any one of claims 1 to 3, characterized in that the intermediate bonding sheet (14) est une feuille de papier (14A) dont les deux faces opposées inférieure et supérieure sont munies d'une couche de colle thermofusible (14B).(14) is a sheet of paper (14A) whose two opposite lower and upper faces are provided with a layer of hot-melt adhesive (14B). 6. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que, lors de l'étape a) de réalisation de la feuille inférieure (12), les opérations a i ), a2) et a3) sont réalisées successivement.6. Method according to any one of the preceding claims, characterized in that, during step a) of producing the lower sheet (12), the operations a i), a2) and a3) are carried out successively. 7. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce qu'il comporte une étape supplémentaire d'impression sur l'une et/ou l'autre des faces externes des deux feuilles inférieure (12) et supérieure (16) de protection du support.7. Method according to any one of the preceding claims, characterized in that it comprises an additional printing step on one and / or the other of the external faces of the two lower (12) and upper (16) sheets. support protection. 8. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce qu'il comporte une étape supplémentaire de découpe du dispositif électronique (10), selon un contour déterminé de carte, d'étiquette, de ticket ou de jeton .8. Method according to any one of the preceding claims, characterized in that it comprises an additional step of cutting the electronic device (10), according to a determined outline of card, label, ticket or token. 9. Procédé selon la revendication précédente, caractérisé en ce que l'on réalise simultanément plusieurs dispositifs électroniques (10) à partir de feuilles de protection et d'une feuille de collage en rouleaux, et en ce que l'on sépare les dispositifs électroniques lors de ladite étape supplémentaire de découpe.9. Method according to the preceding claim, characterized in that several electronic devices (10) are produced simultaneously from protective sheets and a bonding sheet in rolls, and in that the electronic devices are separated during said additional cutting step. 10. Procédé selon la revendication précédente, caractérisé en ce que l'une au moins des feuilles de protection est en papier. 1510. Method according to the preceding claim, characterized in that at least one of the protective sheets is made of paper. 15 1 1 . Dispositif électronique sans contact (10), tel qu'une carte, une étiquette, un ticket ou un jeton, comportant au moins un microcircuit électronique (20) qui est agencé dans l'épaisseur d'un support flexible et qui comporte des plots reliés (26) à une antenne d'interface (24) agencée dans l'épaisseur du support, ce dernier comportant au moins deux feuilles opposées, inférieure (12) et supérieure (14), de protection, caractérisé en ce qu'il comprend un empilage pliable inférieur à 400 μm: - d'une feuille inférieure de protection (12) dont la face interne (22) porte au moins un microcircuit électronique et au moins une antenne d'interface (24);1 1. Contactless electronic device (10), such as a card, label, ticket or token, comprising at least one electronic microcircuit (20) which is arranged in the thickness of a flexible support and which has connected pads (26) to an interface antenna (24) arranged in the thickness of the support, the latter comprising at least two opposite sheets, lower (12) and upper (14), of protection, characterized in that it comprises a foldable stacking less than 400 μm: - of a lower protective sheet (12), the internal face (22) of which carries at least one electronic microcircuit and at least one interface antenna (24); - d'une feuille intermédiaire (14) de collage dont les deux faces opposées inférieure et supérieure sont munies de colle ;- An intermediate bonding sheet (14), the two opposite lower and upper faces of which are provided with adhesive; - et d'une feuille supérieure de protection (16).- And an upper protective sheet (16). 12. Dispositif électronique selon la revendication précédente, caractérisé en ce que la feuille intermédiaire de collage (14) comporte un évidement (18) au droit du microcircuit électronique (20).12. Electronic device according to the preceding claim, characterized in that the intermediate bonding sheet (14) has a recess (18) in line with the electronic microcircuit (20). 13. Dispositif électronique selon l'une des revendications 1 1 ou 12, caractérisé en ce que la feuille intermédiaire de collage (14) est une feuille de colle thermofusible. 13. Electronic device according to one of claims 1 1 or 12, characterized in that the intermediate bonding sheet (14) is a sheet of hot-melt adhesive. 14. Dispositif électronique selon l'une des revendications 1 1 ou 12, caractérisé en ce que la feuille intermédiaire de collage (14) est une feuille de papier (14A) dont les deux faces opposées inférieure et supérieure sont munies d'une couche de colle thermofusible (14B). 14. Electronic device according to one of claims 1 1 or 12, characterized in that the intermediate bonding sheet (14) is a sheet of paper (14A) whose two opposite lower and upper faces are provided with a layer of hot-melt adhesive (14B). 15. Dispositif électronique selon l'une des revendications 1 1 ou 12, caractérisé en ce que l'une au moins desdites feuilles de protection est en papier. 15. Electronic device according to one of claims 1 1 or 12, characterized in that at least one of said protective sheets is made of paper.
PCT/FR1999/000291 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same Ceased WO1999044172A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AU24286/99A AU2428699A (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same
BR9907751-5A BR9907751A (en) 1998-02-27 1999-02-10 Electronic device with non-contact electronic memory, and manufacturing process for that device.
JP2000533853A JP2002505488A (en) 1998-02-27 1999-02-10 Non-contact electronic memory electronic device and method of manufacturing such device
CA002321893A CA2321893A1 (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same
EP99903730A EP1057139A1 (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9802727A FR2775533B1 (en) 1998-02-27 1998-02-27 CONTACTLESS ELECTRONIC MEMORY DEVICE, AND METHOD FOR MANUFACTURED BY SUCH A DEVICE
FR98/02727 1998-02-27

Publications (1)

Publication Number Publication Date
WO1999044172A1 true WO1999044172A1 (en) 1999-09-02

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PCT/FR1999/000291 Ceased WO1999044172A1 (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same

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EP (1) EP1057139A1 (en)
JP (1) JP2002505488A (en)
CN (1) CN1292129A (en)
AU (1) AU2428699A (en)
BR (1) BR9907751A (en)
CA (1) CA2321893A1 (en)
FR (1) FR2775533B1 (en)
WO (1) WO1999044172A1 (en)

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CN1292129A (en) 2001-04-18
EP1057139A1 (en) 2000-12-06
FR2775533B1 (en) 2003-02-14
AU2428699A (en) 1999-09-15
JP2002505488A (en) 2002-02-19
BR9907751A (en) 2000-10-17
CA2321893A1 (en) 1999-09-02
FR2775533A1 (en) 1999-09-03

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