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WO1998032138A1 - Compositions electriques isolantes a base de resines hybrides contenant de l'epoxyde et du silicone - Google Patents

Compositions electriques isolantes a base de resines hybrides contenant de l'epoxyde et du silicone Download PDF

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Publication number
WO1998032138A1
WO1998032138A1 PCT/HU1998/000007 HU9800007W WO9832138A1 WO 1998032138 A1 WO1998032138 A1 WO 1998032138A1 HU 9800007 W HU9800007 W HU 9800007W WO 9832138 A1 WO9832138 A1 WO 9832138A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
epoxy
composition according
resin based
based composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/HU1998/000007
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English (en)
Inventor
György BÁNHEGYI
Szilveszter PINTÉR
Sándor CSECSO^'DY
Márton TÉGLÁS
Zoltán BORSOS
Ilona FÖLDESI NAGY
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURUKAWA ELECTRIC INSTITUTE OF TECHNOLOGY
Original Assignee
FURUKAWA ELECTRIC INSTITUTE OF TECHNOLOGY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURUKAWA ELECTRIC INSTITUTE OF TECHNOLOGY filed Critical FURUKAWA ELECTRIC INSTITUTE OF TECHNOLOGY
Priority to JP10534022A priority Critical patent/JP2001502470A/ja
Priority to EP98902143A priority patent/EP0896723A1/fr
Publication of WO1998032138A1 publication Critical patent/WO1998032138A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

Definitions

  • the invention relates to an insulating composition the resin component of which contains reactive silicone oligomers besides epoxy resin and other, known components, so it unites the advantageous properties of both insulating materials.
  • silicones and silicone rubber based composite insulators gradually gain leading role in outdoor insulation.
  • the main reason for this is the hydrophobicity of silicone rubber, which prevents the formation of a continuous water film on the insulator surface, thus reducing the leakage current, and the erosion caused by dry band arcing.
  • One of the advantages of silicone rubbers is that this hydrophobic property is stable for a long time, moreover, if it is destroyed temporally due to weather circumstances or to discharges, it gradually recovers afterwards.
  • the reason for this hydrophobic recovery is in part the migration (diffusion) of low molecular silicone oils to the surface, and in part the re-orientation of the silicone chains located at the surface.
  • JP 05271518 e.g. uses a mixture of alkyphenol-polysiloxane block copolymers with bisphenol- A type epoxy resins.
  • JP 05301931 proposes a mixture of siloxane grafted vinyl polymers in combination with cresol- or novolak type epoxy resins.
  • JP 05160173 reacts maleimide end-functionalized siloxane with epoxidized polybutadiene.
  • JP 05105778 combines carboxyl end functionalized nitrile rubber with amine end- functionalized siloxane and epoxy, and there are further examples. All these compositions use special, commercially not available components.
  • thermoset resins can unite the advantageous properties of both components (see e.g. the urethane - unsaturated polyester hybrids). These are not physical mixtures, as e.g. the blends of thermolpastics, but copolymers (block or statistical copolymers).
  • R' is a saturated hydrocarbon chain.
  • R' is a saturated hydrocarbon chain.
  • other structures can also be easily synthesized which contain the epoxy group in the side chain, such as: Q'-0-[SiR-0] n -[SiR 2 -0] m -Q"
  • R is an alkyl group
  • Q' and Q" can be trimethyl silyl group (-SiMe 3 ) or an -R'-X group, where R' is a saturated hydrocarbon chain and X is a glycidoxyl group:
  • the invention proposes a group of hybrid resins characterized by mixture of traditional epoxy resins with siloxane oligomers containing epoxy functional groups and with a calculated amount of crosslinker.
  • the invention relates to epoxy resin based insulating composition with improved hydrophobicity and electrical erosion resistance that comprises a cycloaliphatic or aliphatic (or aromatic) epoxy resin, a cycloalpihatic (or aromatic) anhydride (perhaps amine or poly amino-amide) crosslinker comprising a silicone additive containing epoxy groups, occasionally in combination with polymeric active diluent (flexibilizer), reinforcing (Aerosil, wollastonite, chopped glassfiber) and/or non-reinforcing (silica, ATH, calcium carbonate, baryte) fillers and a mobile silicone oil, not bound to the network.
  • a cycloaliphatic or aliphatic (or aromatic) epoxy resin a cycloalpihatic (or aromatic) anhydride (perhaps amine or poly amino-amide) crosslinker comprising a silicone additive containing epoxy groups, occasionally in combination with polymeric active diluent (flexibilizer), reinforcing (Aerosil, wo
  • the siloxane oligomer containing epoxy functional groups is preferably a polysiloxane (wherein R may be methyl or phenyl) with the glycidyl group attached in the following way:
  • R' is a saturated hydrocarbon chain with 1-10, preferably with 3- 4 carbon atoms and n, the degree of polymerization is between 1 and 50, preferably between 5 and 15, or a polysiloxane having the following formula:
  • R is methyl or phenyl, m+n, the degree of polymerization is between 1 and 50, preferably between 5 and 15, m is between 1 and 5, preferably 1 or 2,
  • Q' or Q" may be trimethyl silyl group (-SiMe 3 ) or an - R'-X group, where R' is a saturated hydrocarbon chain with 1-10, preferably with 3-4 carbon atoms and X is the glycidoxyl group: -0-CH 2 -CH-CH 2
  • the resin and the crosslinker components are miscible with the siloxane oligomer.
  • the selection of such components is by no means trivial, as, due to the extremely low cohesion energy density of polysiloxanes, they are not miscible with all organic liquids. If the siloxane oligomer is miscible with the crosslinker but not with the epoxy resin then the siloxane phase may crosslink separately from the epoxy matrix. This is called macroscopic phase separation (two layers of separated materials appear), which results in a technically unacceptable product. One has to distinguish this situation sharply from micro phase separation, which occurs during block copolymer synthesis.
  • the epoxy component is advantageously cycloaliphatic epoxy and the crosslinker is a cycloaliphatic anhydride (both low viscosity liquids at room temperature).
  • the crosslinker is a cycloaliphatic anhydride (both low viscosity liquids at room temperature). If the epoxidized siloxane is mixed with the cycloaliphatic epoxy in a ratio of 1 :9 and is crosslinked with a calculated amount of crosslinker, then a polymer with siloxane-like surface properties is obtained.
  • the electrical erosion resistance can be improved by the addition of aluminum oxide trihydrate (ATH) filler and the flexural modulus and the tensile strength can be substantially increased by anisometric fillers (chopped glassfiber, wollastonite or other, whiskerlike filler).
  • Cheap, extender fillers (as e.g.
  • silica or calcium carbonate can reduce the price.
  • This composition can be a competitor of traditional, silica filled cycloaliphatic casting resins.
  • the hybrid resin is a load-bearing component, which can be fixed onto the electrical network through embedded metal fittings.
  • the advantage of this composition over the traditional casting resins is the silicone rich, hydrophobic surface, which can recover its hydrophobicity after oxidation.
  • compositions containing both epoxidized silicone oligomer (immobile silicone component) and a low molecular silicone oil (mobile silicone component) are also possible.
  • the immobile silicone component by itself ensures the required surface properties and the hydrophobic recovery after surface oxidation, but, if a mobile silicone component is also present then the even the inorganic deposit (dust etc.) on the insulator surface becomes hydrophobic.
  • the immobile silicone component plays an important role even in such compositions for two reasons.
  • the mobile silicone component can be added to the epoxy resin only in a very limited amount, as, due to incompatibility problems it is easily exuded to the surface.
  • B.) mobile silicone can be gradually depleted in the sample due to migration, but the immobile silicone content is stable.
  • compositions which, in principle, could be used to replace silicone rubber in the manufacture of composite outdoor insulators.
  • rigidity of the epoxy resin component can be reduced by the addition of active diluents (advantageously polymeric active diluents).
  • Active diluents are special plasticizers, which are incorporated into the epoxy network and reduce its rigidity. Flexibilization is achieved either by reducing the degree of crosslinking (low molecular, monofunctional epoxy compounds) or by incorporating soft segments into the rigid network.
  • polymeric active diluents is a glycidoxyl end functionalized polyether oligomer.
  • polymeric active diluents are necessary for two reasons: a.) the siloxane network by itself is not too strong (although it can be considerably reinforced by the addition of silica gel of pyrolytic origin, e.g. Aerosil or Cab-O-Sil), therefore the increase of the siloxane/epoxy resin ratio does not yield a system of advantageous mechanical properties; b.) the siloxane oligomer is usually more expensive than the polymeric active diluent.
  • the active diluent shall be chosen so that it is miscible with the siloxane oligomer and the other initial, liquid components.
  • x is the weight of the epoxy resin
  • ei is the specific epoxy content of the resin (mole epoxy group/100 g resin, which can be calculated from the epoxy equivalent, E by the following formula: 100 E)
  • y is the weight of the epoxidized silicone
  • e 2 is its specific epoxy content
  • z is the weight of the active diluent
  • e 3 is its specific epoxy content
  • A is the specific functional group content of the crosslinker (e.g. anhydride) in mol/100 g units.
  • Attenuated total reflectance (ATR) IR spectra which probe the top 0.1 ⁇ m thick layer of the sample, the ratio of the band intensities (baseline corrected peak absorbance values) attributable to the ester (1740 cm “1 ) and to the Si-Me (1260 cm “1 ) groups is roughly identical for all three compositions (a change of 20-30% can be observed), while the molar ratio of the ester/dimethyl silicone groups changes almost tenfold. This proves the 12 -
  • composition of the 1 :1 mixture is identical with composition 3. of Example 2.
  • the table also indicates the mode of failure (overcurrent without carbonization /tracking/, overcurrent with carbonization, overcurrent with fire).
  • the basic, silica filled composition without silicone additive is not acceptable even at 3.5 kV. Dramatic improvement can be observed on addition of the silicone additive. The overcurrent appearing at 4.5 kV does not cause carbonization or fire, therefore it cannot be regarded as serious damage.
  • An improvement can be observed if no silicone additive is used but ATH is added instead of silica as filler. In this latter case the arc-suppression ability of ATH is observed, not the effect of surface hydrophobicity. Both additives together are also effective, but from these formulations No. 9 proved to be the best.
  • compositions described below contain the following components: CY184 cycloaliphatic epoxy resin (Ciba Geigy), HY1102 cycloaliphatic anhydride (Ciba Geigy), DY062 accelerator (Ciba Geigy), Tegomer ESi2130 epoxidized silicone (TH Goldschmidt AG), Eurepox RV-F polymeric active diluent (flexibilizer, Schering/WITCO), W12EST silica filler (Quarzwerke GmbH), ATH filler (methyl silane treated, Solem GmbH).
  • Table 5. a shows the compositions of the compounds, while Table 5.b shows some physical quantities.
  • Formulations 19 and 21 contain 0.1 wt% mobile silicone oil (polydimethyl siloxane with 100 cP viscosity). The 0.1 wt% is calculated for the organic components without mineral filler.
  • Formulation 17 is the reference, formulation 18 contains the same amount, but mixed filler, formulation 19 contains mobile silicone oil but no epoxidized silicone additive, formulation 20 contains the epoxidized additive but no mobile silicone oil, while formulation 21 contains both types of silicones.

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)

Abstract

La présente invention concerne une composition dont la particularité est la combinaison de matières présentant d'excellentes propriétés isolantes. Le coût plus faible et la facile transformabilité des résines d'époxyde s'associent à des propriétés de surface intéressantes (hydrophobie, récupération après la formation d'arcs électriques sur bande sèche) et à une bonne résistance aux intempéries des caoutchoucs silicone. La nouvelle composition peut être fabriquée par moulage à faible pression ou par gélification sous pression. En raison de sa faible viscosité, la résine de base peut supporter des charges importantes. Le composant silicone modifiant la résine d'époxyde n'est pas seulement un plastifiant, il est incorporé à l'intérieur de la structure en réseau et son effet est permanent. Les composants principaux de la composition sont de la résine d'époxyde cycloaliphatique, aliphatique (ou aromatique); un agent de réticulation cycloaliphatique (ou aromatique) anhydre (soit amine, soit polyamino-amide); un accélérateur, et un oligomère silicone contenant un groupe terminal époxy. Parmi les autres composants, on peut trouver un diluant (assouplissant) actif faiblement moléculaire ou macromoléculaire et une charge. En modifiant le rapport des composants, on peut produire plusieurs compositions allant d'une structure rigide et porteuse jusqu'à des structures molles à consistance de caoutchouc.
PCT/HU1998/000007 1997-01-21 1998-01-21 Compositions electriques isolantes a base de resines hybrides contenant de l'epoxyde et du silicone Ceased WO1998032138A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10534022A JP2001502470A (ja) 1997-01-21 1998-01-21 エポキシ―シリコーンハイブリッド樹脂ベース電気絶縁組成物
EP98902143A EP0896723A1 (fr) 1997-01-21 1998-01-21 Compositions electriques isolantes a base de resines hybrides contenant de l'epoxyde et du silicone

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
HU9700191A HU217112B (hu) 1997-01-21 1997-01-21 Epoxi-szilikon hibrid gyanta alapú villamos szigetelőkompozíciók
HUP9700191 1997-01-21

Publications (1)

Publication Number Publication Date
WO1998032138A1 true WO1998032138A1 (fr) 1998-07-23

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Country Link
EP (1) EP0896723A1 (fr)
JP (1) JP2001502470A (fr)
HU (1) HU217112B (fr)
WO (1) WO1998032138A1 (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1176611A4 (fr) * 2001-02-13 2002-09-25 Furukawa Electric Co Ltd Fil isole
US6734361B2 (en) 2000-02-10 2004-05-11 The Furukawa Electric Co., Ltd. Insulated wire
US6764616B1 (en) 1999-11-29 2004-07-20 Huntsman Advanced Materials Americas Inc. Hydrophobic epoxide resin system
EP1303567B2 (fr) † 2000-07-14 2007-09-05 Abb Research Ltd. Masse de remplissage a modification de volume a base de resine a matrice polymere
WO2008009560A1 (fr) * 2006-07-20 2008-01-24 Abb Research Ltd Composition de résine époxy durcissable
WO2010112272A1 (fr) * 2009-04-02 2010-10-07 Huntsman Advanced Materials (Switzerland) Gmbh Surmoulage direct
WO2010127693A1 (fr) * 2009-05-05 2010-11-11 Abb Research Ltd Composition sol-gel durcissable
CN103319925A (zh) * 2013-06-04 2013-09-25 常熟市九洲电器设备有限公司 一种高韧性和耐高低温电机用绝缘漆
DE102018202058A1 (de) * 2018-02-09 2019-08-14 Siemens Aktiengesellschaft Formulierung zur Herstellung eines Isolationssystems, elektrische Maschine und Verfahren zur Herstellung eines Isolationssystems
WO2019154933A1 (fr) * 2018-02-09 2019-08-15 Siemens Aktiengesellschaft Isolation, machine électrique et procédé de réalisation de l'isolation
FR3091406A1 (fr) * 2018-12-31 2020-07-03 Centre National De Recherche Scientifique (Cnrs) Matériau pour l’isolation électrique et procédé de fabrication

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PH12021552172A1 (en) * 2019-04-11 2022-09-12 Huntsman Adv Mat Licensing Switzerland Gmbh Curable two-component resin-based system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5306747A (en) * 1988-04-05 1994-04-26 Mitsubishi Denki Kabushiki Kaisha Flexibilizers of hydroxyphenyl silicone oil-epoxy resin product and epoxy silicone oil-phenol resin product
US5358904A (en) * 1988-09-20 1994-10-25 Hitachi, Ltd. Semiconductor device
EP0673957A2 (fr) * 1994-03-04 1995-09-27 Mitsubishi Denki Kabushiki Kaisha Masse à mouler de résine époxyde

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5306747A (en) * 1988-04-05 1994-04-26 Mitsubishi Denki Kabushiki Kaisha Flexibilizers of hydroxyphenyl silicone oil-epoxy resin product and epoxy silicone oil-phenol resin product
US5358904A (en) * 1988-09-20 1994-10-25 Hitachi, Ltd. Semiconductor device
EP0673957A2 (fr) * 1994-03-04 1995-09-27 Mitsubishi Denki Kabushiki Kaisha Masse à mouler de résine époxyde

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6764616B1 (en) 1999-11-29 2004-07-20 Huntsman Advanced Materials Americas Inc. Hydrophobic epoxide resin system
US6734361B2 (en) 2000-02-10 2004-05-11 The Furukawa Electric Co., Ltd. Insulated wire
EP1303567B2 (fr) † 2000-07-14 2007-09-05 Abb Research Ltd. Masse de remplissage a modification de volume a base de resine a matrice polymere
US7268181B2 (en) 2000-07-14 2007-09-11 Abb Research Ltd Volume-modified casting compounds based on polymeric matrix resins
EP1176611A4 (fr) * 2001-02-13 2002-09-25 Furukawa Electric Co Ltd Fil isole
WO2008009560A1 (fr) * 2006-07-20 2008-01-24 Abb Research Ltd Composition de résine époxy durcissable
US8999433B2 (en) 2009-04-02 2015-04-07 Huntsman International Llc Direct overmolding
CN102388096A (zh) * 2009-04-02 2012-03-21 亨斯迈先进材料（瑞士）有限公司 直接重叠注塑
WO2010112272A1 (fr) * 2009-04-02 2010-10-07 Huntsman Advanced Materials (Switzerland) Gmbh Surmoulage direct
WO2010127693A1 (fr) * 2009-05-05 2010-11-11 Abb Research Ltd Composition sol-gel durcissable
CN103319925A (zh) * 2013-06-04 2013-09-25 常熟市九洲电器设备有限公司 一种高韧性和耐高低温电机用绝缘漆
WO2019154932A1 (fr) * 2018-02-09 2019-08-15 Siemens Aktiengesellschaft Formulation pour la fabrication d'un système d'isolation, machine électrique et procédé de fabrication d'un système d'isolation
WO2019154933A1 (fr) * 2018-02-09 2019-08-15 Siemens Aktiengesellschaft Isolation, machine électrique et procédé de réalisation de l'isolation
DE102018202058A1 (de) * 2018-02-09 2019-08-14 Siemens Aktiengesellschaft Formulierung zur Herstellung eines Isolationssystems, elektrische Maschine und Verfahren zur Herstellung eines Isolationssystems
CN111684545A (zh) * 2018-02-09 2020-09-18 西门子股份公司 用于制造绝缘体系的配制物、电机和用于制造绝缘体系的方法
RU2756232C1 (ru) * 2018-02-09 2021-09-28 Сименс Акциенгезелльшафт Композиция для изготовления системы изоляции, электрическая машина и способ изготовления системы изоляции
US11424654B2 (en) 2018-02-09 2022-08-23 Siemens Aktiengesellschaft Insulation, electrical machine, and method for producing the insulation
US12131841B2 (en) 2018-02-09 2024-10-29 Innomotics Gmbh Formulation for producing an insulating system, electrical machine and method for producing an insulating system
FR3091406A1 (fr) * 2018-12-31 2020-07-03 Centre National De Recherche Scientifique (Cnrs) Matériau pour l’isolation électrique et procédé de fabrication
WO2020141280A1 (fr) 2018-12-31 2020-07-09 Supergrid Institute Matériau pour l'isolation électrique et procédé de fabrication
US12142394B2 (en) 2018-12-31 2024-11-12 Supergrid Institute Electrical insulation material and manufacturing process

Also Published As

Publication number Publication date
HU217112B (hu) 1999-11-29
HUP9700191A3 (en) 1999-04-28
HUP9700191A2 (hu) 1998-08-28
HU9700191D0 (en) 1997-03-28
EP0896723A1 (fr) 1999-02-17
JP2001502470A (ja) 2001-02-20

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