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WO1998030351A1 - Procede de soudage et fer a souder - Google Patents

Procede de soudage et fer a souder Download PDF

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Publication number
WO1998030351A1
WO1998030351A1 PCT/JP1997/001528 JP9701528W WO9830351A1 WO 1998030351 A1 WO1998030351 A1 WO 1998030351A1 JP 9701528 W JP9701528 W JP 9701528W WO 9830351 A1 WO9830351 A1 WO 9830351A1
Authority
WO
WIPO (PCT)
Prior art keywords
gas flow
soldering
temperature
preheating
tip
Prior art date
Application number
PCT/JP1997/001528
Other languages
English (en)
Japanese (ja)
Inventor
Akio Mitumoto
Kensei Matubara
Original Assignee
Kabushikigaisha Taiseikaken
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushikigaisha Taiseikaken filed Critical Kabushikigaisha Taiseikaken
Priority to JP53073998A priority Critical patent/JP3345722B2/ja
Publication of WO1998030351A1 publication Critical patent/WO1998030351A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/03—Soldering irons; Bits electrically heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/03—Soldering irons; Bits electrically heated
    • B23K3/0338—Constructional features of electric soldering irons
    • B23K3/0353—Heating elements or heating element housings

Definitions

  • the present invention relates to a soldering method and a soldering iron, for example, which enable high-quality soldering of electronic components.
  • soldering iron For this type of soldering iron, a method is widely used in which the tip chip heated by heating or the like is brought into contact with the land of the electronic board to melt the solder, and the tip chip is separated to solidify the solder. .
  • the tip is brought into contact with the soldering part, so that the tip is subjected to thermal stress due to the heat cycle, and tin diffusion and erosion due to flux occur.
  • the life of the tip was short, and it was necessary to replace it about 40,000 to 50,000 times in order to secure soldering accuracy.
  • leakage current, noise, harmonics, static electricity, etc. are transmitted from the advanced chip to the electronic substrate and electronic components, and there is a concern that the electrical characteristics of the product may be degraded. I was
  • An object of the present invention is to provide a soldering method that can eliminate the need for replacement of a tip chip and that can perform high-quality soldering of electronic components and the like in view of such problems.
  • the non-contact soldering method uses a soldering iron, and melts and softens the solder from the tip of the soldering iron when soldering the work by blowing a high-temperature gas flow onto the soldering portion of the work. And a high-temperature main heating gas flow that is high enough to blow out the surroundings of the main heating gas flow.
  • the main heating gas flow is blown to the soldering portion of the preheated work while the preheating gas flow is sprayed to the soldering portion of the work to perform soldering in an atmosphere surrounded by the preheating gas flow. It is characterized by doing so.
  • the gas stream is preferably a high concentration of inert gas. This is because an inert gas such as nitrogen gas is preferable in consideration of the effect of O 2 in air on soldering quality.
  • the heating element only needs to generate heat, and a nichrome wire heater, a ceramic heater, a high-frequency heater, a medium-frequency heater, a low-frequency heater, an infrared heater, a plasma heating element, an ultrasonic heating element, an elema heating element, or the like can be used. .
  • One of the features of the present invention is that a high-temperature internal / external dual gas flow is formed, preheated by an external gas flow, and soldered by an internal gas flow in an atmosphere surrounded by an external gas flow. It is in.
  • the heat of the gas flow inside does not scatter to the surroundings, soldering can be performed in a short time in a non-contact manner, and the effects of leakage current, noise, and harmonics on products can be eliminated.
  • static electricity the friction of the gas flow, especially when the gas flow is ejected at high speed, charges the gas flow, and there is still concern about the electrical effects on the product.
  • the main ejection pressure of the heating gas flow and the preheating gas stream charged gas flow range such that the extent that no fear of electrical influence, specifically of 0. l ⁇ 2 kgf / cm 2 ⁇ G
  • the pressure is preferably set.
  • soldering should be performed in an atmosphere where the adhered molten solder can be slowly cooled with moderate temperature characteristics, and immediately cooled immediately before the start of solidification in an atmosphere below room temperature. Is essential.
  • the gas flow is made into an inner / outer double, preheated by the outer preheating gas flow, soldered by the inner main heating gas flow, and then slowly cooled to just before the start of solidification by the outer preheating gas flow to room temperature.
  • the temperature of the main heating gas flow is 100 to 100 ° C., preferably 250 to 600 ° C., and the temperature of the preheating gas flow is It is preferable to jet the gas at a lower temperature than the high-temperature gas flow, for example, at a flow rate of 100 to 20 (TC, 0.5 to 2 liters / minute).
  • Rapid cooling immediately before the start of solidification of the molten solder may be performed by exposing it to the atmosphere.However, the molten solder releases latent heat upon solidification, and simultaneously dissolves 0 2 , H 2 , CO, etc. in the atmosphere. Oxidation of the solder immediately before solidification causes oxidation and porosity, and is the largest factor in the generation of bridges, knuckles, and smears. Therefore, the ambient may be a low-temperature nitrogen gas atmosphere at room temperature or lower.
  • the low-temperature nitrogen gas atmosphere is set to room temperature, specifically, a temperature of 25 ° C. or lower, but it is preferable to secure a quenching effect. For example, it may be set to a temperature of from 120 ° C.
  • the non-contact type soldering iron according to the present invention is a non-contact type soldering iron for performing soldering by blowing a high-temperature gas flow to a soldering portion of a work.
  • a main heating gas flow generation chamber is formed in communication with the first nozzle, and a preheating gas flow generation chamber is formed around the main heating gas flow generation chamber.
  • a chamber is formed in communication with the two nozzles, and the iron body is provided with a gas supply passage for supplying gas to the main heating gas flow generation chamber and the preheating gas flow generation chamber.
  • the heating generates a high-temperature main heating gas flow high enough to melt-soften the solder and is ejected from the first nozzle, and heating by convection heat and / or radiant heat from the main heating gas flow generation chamber or a heating element.
  • a preheating gas flow having a lower temperature than the main heating gas flow and a temperature sufficient to preheat the solder is generated, and is ejected from the second nozzle around the main heating gas flow. It is characterized by.
  • the main heating gas flow generation chamber 1 is preferably formed around the heating element from the viewpoint of manufacturing simplicity, but may be formed inside the heating element.
  • the shape of the nozzle is not particularly limited, but it is preferable to use, for example, a diverge nozzle, since it is better to jet the gas stream at a higher speed.
  • the preheating gas flow may be ejected straight around the main heating gas flow, but a spiral fin and a spiral groove are formed on the inner surface of the preheating gas flow generation chamber 1 so that the preheating gas flow is formed in a spiral shape.
  • the positional relationship between the tips of the first and second nozzles may be such that the tip of the second nozzle projects beyond the tip of the first nozzle, or the positional relationship may be reversed.
  • the latter is preferable when the element of the work is small, especially when the element has an ultra fine pitch, for example, when soldering electronic components.
  • the main body of the trowel is grounded, and a negative charge is electrostatically induced inside the main heating gas flow generation chamber and the preheating gas flow generation chamber to remove the positive charges of the main heating gas flow and the preheating gas flow. It is better to be able to do it.
  • the soldering portion of the work is preheated by the preheating gas flow, even if the tip is brought into contact with the soldering portion, the temperature drop of the tip is small and the tip is preheated. As a result of being heated by the gas flow and quickly raising the temperature, Thermal stress of the chip can be reduced.
  • the temperature of the tip of the soldering iron is lower than that of the above-mentioned tip and sufficient for preheating the solder.
  • the preheated gas flow is blown around the above-mentioned tip, and the preheated gas flow is sprayed onto the soldering part of the work to preheat the work. Then, the soldering part of the preheated work is made into the preheated gas flow by the tip.
  • a contact type soldering method characterized in that the soldering is performed in an enclosed atmosphere.
  • the preheated gas flow reduces the heat cycle of the tip and quickly returns the temperature-reduced tip to a predetermined temperature. It is preferable to use a high temperature, but there is a concern about the thermal effect on the work and elements (for example, electronic elements) near the soldering site. Therefore, a low-temperature gas flow, which is lower than the preheating gas flow, is sprayed around the preheating gas flow from the tip of the soldering iron. May be protected from the heat of the preheated gas stream with a low temperature gas stream. Further, according to the present invention, it is possible to provide a soldering iron used in the above-mentioned contact-type soldering method.
  • the tip of the tip is placed around the heating element.
  • a preheating gas flow generation chamber is formed to open to the surroundings, and the heat generated by the heating element also generates a preheating gas flow at a low temperature and at a temperature sufficient to preheat the solder. It is possible to provide a contact-type soldering iron characterized in that it is ejected to the surroundings.
  • a low-temperature gas flow generation chamber 1 is formed around the preheating gas flow generation chamber and its front end is opened around the front end opening of the preheating gas flow, and the convection heat from the preheating gas flow generation chamber 1 is formed.
  • a structure may be adopted in which a low-temperature gas flow lower than the preheating gas flow is generated by heating with z or radiant heat and is ejected around the preheating gas flow.
  • the inert gas purging apparatus has a shape of a soldering iron as a whole, has a built-in heating element, and a heating element is attached to a tip portion of the heating element. While the heating element can be heated, a preheating gas flow generation chamber is formed around the heating element by opening its front end side around the front end of the heat holding element, and the preheating gas flow generation chamber is formed. High-temperature gas flow is generated by the radiant heat and is ejected forward.
  • FIG. 1 is a sectional view showing a principal part of a first embodiment of a soldering iron according to the present invention.
  • FIG. 2 is a sectional view taken along the line II.
  • FIG. 3 is a view for explaining a soldering method using the above-mentioned soldering iron.
  • FIG. 4 is a sectional view showing a first modified example of the soldering iron.
  • FIG. 5 is a sectional view showing a second modification of the above-mentioned soldering iron.
  • FIG. 6 is a sectional view showing a principal part of a second embodiment of the soldering iron according to the present invention.
  • FIG. 7 is a sectional view showing a principal part of a third embodiment of the soldering iron according to the present invention.
  • FIG. 1 is a sectional view showing a principal part of a first embodiment of a soldering iron according to the present invention.
  • FIG. 2 is a sectional view taken along the line II.
  • FIG. 3
  • FIG. 8 is a perspective view showing the holder 35 in the soldering iron of FIG.
  • FIG. 9 is a configuration diagram showing a conventional non-contact soldering iron.
  • FIG. 10 is a view showing a preferred embodiment of the inert gas purge apparatus according to the present invention.
  • FIG. 1 and 2 show a preferred embodiment of a non-contact soldering iron according to the present invention.
  • the rear end of the iron body 11 is attached to the tip of the iron base 10 by means of a screw or the like, and the iron body 11 is connected to the inner and outer double stainless steel cylinders 12 and 13.
  • the inner stainless steel tube 13 is supported by a spacer piece (not shown) on the inner surface of the outer stainless steel tube 12 including a central rod-shaped alumina ceramic heater (heating element) 14.
  • the heater 14 is supported on the inner surface of the inner stainless steel tube 13 by a metal cover 15, and a plate-shaped spacer 16 is formed at the rear end of the cover 15.
  • Main heating gas flow generation chamber 17 that generates a main heating gas flow high enough to melt and soften the solder by heating the heater between heater 5 and inner stainless steel cylinder 13, inner and outer stainless steel cylinders 12, 1 Between 3 is a preheating gas flow generation chamber 18 that generates a preheating gas flow at a temperature lower than the main heating gas flow and at a temperature sufficient to preheat the solder by heating by convection heat and / or radiant heat. .
  • a first nozzle 19 made of molybdenum is fitted to the tip of the inner stainless steel cylinder 13 with a force, and the first nozzle 19 is protruded from an insertion hole of the tip wall of the outer stainless steel cylinder 12, A second nozzle 20 that covers the entire outer periphery of the first nozzle 19 is externally fitted to the tip of the outer stainless steel cylinder 12.
  • the iron base 10 has a hollow shape and the inside is a gas supply passage 21.
  • a first gas flow port 22 is provided at the rear end of the iron body 11 with a cover 15.
  • a second gas flow port 23 is formed in the plate-shaped sensor part 16 of the second heat pump, and a third gas flow port 24 is formed at the tip of the cover 15 to form the main heating gas flow generation chamber 1 1.
  • the main heating gas flow generated in 7 is guided toward the first nozzle 19.
  • the gas supply passage 21 may be constituted by a hose or the like supported outside the iron base 10.
  • a fourth gas flow port 25 is formed in the inner stainless steel cylinder 13 behind the cover 15, and a fifth gas flow port 26 is formed at the tip of the outer stainless steel cylinder 12, and a preheat gas flow is generated.
  • the preheated gas stream generated in the chamber 18 is guided toward the second nozzle 20.
  • a sensor 17 for detecting the temperature of the main heating gas flow 30 and performing control is mounted, and although not shown, a stainless steel cylinder 1 2 And 13 are connected to ground.
  • the heater 14 is energized, and nitrogen gas is supplied to the gas supply passage 21 in the base 10.
  • This nitrogen gas has a predetermined temperature, for example, 4 It may be preheated to 0-50 ° C.
  • the nitrogen gas is guided to the main heating gas flow generation chamber 17 via the gas flow ports 22 and 23, and is heated to 250 to 600 ° C. by the heating heater 14 to be heated to the main heating gas.
  • a stream 30 is generated, and the main heated gas stream 30 is ejected from the first nozzle 19 via the gas flow port 24.
  • the ejection amount of the main heating gas stream 30 is set to 0.5 to 2.0 liters, and the ejection pressure is set to 0.1 to 2.0 kgf / cm 2 ⁇ G.
  • the preheated gas stream 31 is generated by being heated to 100 to 200 ° C by the radiant heat of the second nozzle 20 through the gas flow port 26 and flows around the main heated gas stream 30. Spouted over.
  • the ejection volume of the preheated gas stream 31 is set to 0.5 to 2.0 liters Z, and the ejection pressure is set to 0.1 to 2.0 kgf / cm 2 ⁇ G.
  • a preheating gas flow 31 is blown onto the soldering portion W of the substrate to preheat the soldering portion W, and then the main heating gas flow 30 is blown.
  • 0 is sprayed onto the soldering site W with its surroundings covered by the preheating gas flow 31 as shown in Fig. 3, and it does not scatter around as it is in the past, so the solder melts immediately .
  • the molten solder is slowly cooled by a preheating gas stream 31 until just before the start of solidification, and then rapidly cooled by being exposed to the atmosphere.
  • the non-contact soldering iron of the present example required 1 second. It was confirmed that the soldering could be completed in a certain degree. Therefore, the non-contact type soldering of the present embodiment can be practically adopted instead of the conventional soldering port bot / soldering in the automatic soldering machine.
  • the molten solder when the heat of the molten solder is rapidly absorbed into the surroundings, the molten solder is rapidly cooled as a whole, and fine quenched crystals, fine columnar crystals, and fine free crystals are formed. Grain boundaries containing impurities and gases are likely to be generated parallel to the columns, and free crystals are flux Gas and impurity gas are easy to contain.
  • the main heating gas flow 30 and the preheating gas flow 31 of appropriate pressure are blown to the molten solder, the solder and flux do not flow out of the soldering portion W, and the molten solder is applied. Pressurizes and releases gas, eliminating bubbles and gas holes.
  • the dendrite can be filled with the molten solder by the pressurization due to the pressurization, thereby preventing microporosity and macroporosity (porosity), resulting in a dense crystal structure.
  • the whole of the molten solder is rapidly cooled, so that the distance between the liquidus and solidus of the molten solder is substantially reduced, and a pressurizing effect is exerted, and macro-segregation (Pb, Sn, etc.)
  • the dendritic crystals, layered structure, nucleated structure, etc., of the birefringence are reduced, and a solidified solder having a fine crystal structure with few impurities and gas can be obtained.
  • the main heating gas flow generation chamber — 17 and the preheating gas flow generation chamber -electrostatically induce negative charges inside the chamber 18 to generate the main heating gas flow 30 and preheating gas
  • the positive charge of the flow 31 can be removed, so that the possibility of electrostatic breakdown at the soldering site W can be reliably eliminated.
  • FIG. 4 shows a first modification of the above embodiment.
  • the tip of the second nozzle 20 protrudes forward from the tip of the first nozzle 19, and the inner stainless steel tube 13 is made of beryllium copper, chromium copper, or another alloy having good heat conductivity.
  • the inner alloy tube 13 and the first nozzle 19 are formed integrally with the inner alloy tube 13, and the second nozzle 20 and the outer stainless steel tube 12 are formed integrally.
  • the first nozzle 19 employs a divergent nozzle structure whose inner surface expands in an arc shape in cross section.
  • the inner diameter of the tip of the first nozzle 19 is set to 0.1 to 0.5 mm
  • the inner diameter of the second nozzle 20 is set to 0.5 to 4.0 mm
  • a flat surface 20a of l to 2 mm is formed on the inner surface of the tip portion of the nozzle 20 to stabilize the preheating gas flow.
  • a divergent nozzle is used for the first nozzle 19, so that a high-speed main heating gas flow can be obtained by the structure, and the tip of the second nozzle 20 is Because it is more protruding than that of the first nozzle 19, the preheating gas flow and the high-speed main heating gas flow accelerate each other, and the higher-speed main heating gas flow and the higher-speed preheating gas flow can get.
  • the tip of the first and second nozzles 19 and 20 and the work soldering site Thermal decay of the main heating gas flow and the preheating gas flow until reaching the work soldering site is small, and the consumption of nitrogen gas (or air) can be suppressed.
  • FIG. 5 shows a second modification.
  • a hollow ceramic heater is used as the heater 14, and a main heating gas flow generation chamber 17 is formed inside the heater 14.
  • a coil-shaped material 17a made of a molybdenum-based alloy or a tungsten-based alloy is housed in the heater 14 to impart a swirl to the main heating gas flow to reduce heat unevenness of the main heating gas flow.
  • a spiral fin or a spiral groove is formed on at least one of the second nozzle 20 and / or the outer surface of the outer cylinder 12 and / or the first nozzle 19 and / or the outer surface of the inner cylinder 13 to impart a swirl to the preheating gas flow. You may do so.
  • FIG. 6 shows a second embodiment of the present invention.
  • the soldering iron main body 30 and the grip part (iron base) 31 and the force, and the iron body 30 are heated over night (for example, a round bar-shaped alumina nitride heater).
  • 3 2 is built in, the tip of the heater 3 2 is inserted into the hole of the tip holder 1 3 3, the tip 3 4 is fixed to the tip of the tip holder 3 3, and the heat generated by the heater 3 2 is the tip 3 The tip 4 is transmitted to the tip 4 and is heated.
  • the rear end of the heater 32 is inserted and held in the center hole of a holder 35 built in the tip of the grip portion 30, and a temperature sensor (not shown) is attached to the heater 32. Have been.
  • An auxiliary heater for adjusting the temperature of the preheating gas flow may be installed.
  • a plurality of nitrogen gas supply holes are formed in an annular shape in the holder 135, and a tip of a nitrogen gas supply pipe 36 passed through the grip portion 30 is connected to the holder 35, and a heater 3 is provided.
  • a power line 32 a extends rearward in the nitrogen gas supply pipe 36 from the rear end of 2.
  • a first protective cover 37 is fixed to the end of the grip portion 30.
  • the first protective cover 37 covers the periphery of the heater 32 and a predetermined space between the chip holder 33 and the heater.
  • a gap for example, a gap of l mm extends to the distal end side, and the distal end is opened around the distal end tip 34, thus forming a preheating gas flow generation chamber 38. It is preferable that the tip of the first protective cover 37 is extended to as close to the tip chip 34 as possible, so that it does not touch the work at the time of soldering.
  • the heater 32 is energized to heat the tip chip 34 to 280 ° C to 380 ° C, while the soldering iron 32 is heated.
  • the nitrogen gas supply pipe 36 is supplied with nitrogen gas having a pressure of 1.0 to 5.0 kg / cm 2 , a flow rate of 4 liter / min, and a purity of 99 to 99.9%.
  • the supply of nitrogen gas may be continuous supply or intermittent supply.
  • the nitrogen gas passing through the preheating gas flow generation chamber 1 38 is heated to 200 ° C. to 25.0 ° C. by the radiant heat of the tip 34 due to the heat generated by the heater 32, and the volume increases. And released as it is.
  • the flow rate and pressure of the nitrogen gas can be adjusted by setting the inner diameter and number of the nitrogen gas supply holes of the holder 35. It is also possible with an external pressure regulator or flow regulator.
  • a preheating gas flow is blown to the soldering part of the board for 2 to 5 seconds to preheat the soldering part (preheating), thereby activating a low residue flux at the soldering part.
  • the tip 34 may be brought into contact with the soldering portion at the same time as the preheating gas flow is sprayed. In the case under ⁇ 2 concentration 5 ppm or less can be fluxless soldering.
  • the tip 34 is brought into contact with the soldering area and heated to supply the low-residue flux-containing threaded solder, and the soldering area is heated in a preheated gas flow atmosphere. To form a pile of molten solder.
  • the tip 34 is separated from the soldering site, and the molten solder is exposed to the atmosphere of the preheated gas flow, while rapidly cooling by blowing nitrogen gas at room temperature from the back surface of the substrate.
  • the whole of the molten solder is rapidly cooled, so that the distance between the liquidus and solidus of the molten solder is substantially reduced, and a pressurizing effect is exerted, and macro-segregation (Pb, Sn, etc.)
  • the dendritic crystals, layered structure, nucleated structure, etc., of the birefringence are reduced, and a solidified solder having a fine crystal structure with few impurities and gas can be obtained.
  • solder flux is preheated to activate the flux and to prevent the flux / solder ball from scattering, so that a smooth and good soldering operation can be performed.
  • Preheating the electronic board before contacting the board mitigating local and rapid temperature rise (heat shock) of the electronic board and preventing thermal destruction of electronic components, as well as flux, electronic board and supplied solder
  • the wire can also be preheated, so that the hot brittleness of the solder layer can be prevented.
  • the solder and flux can be preheated with high-temperature nitrogen gas, the amount of heat stored in the tip of the soldering iron is small, and even if the tip of the chip is extremely fine, sufficient amount of heat can be used for soldering, resulting in low-temperature soldering. Can be achieved. Further, since the soldering iron chip is in a non-oxidizing atmosphere, the chip is prevented from being oxidized, the wettability of the molten solder can be improved, and the chip cleaning is almost unnecessary, so that the chip life can be greatly improved.
  • FIG. 7 shows a third embodiment of the present invention.
  • a second protective cover 39 is fixed to the end of the grip portion 30 outside the first protective cover 37, and the first protective bar 39 is a first protective cover 37.
  • a predetermined gap for example, a gap of 2 mm.
  • a low-temperature gas flow generation chamber 140 is thus configured.
  • a nitrogen gas supply hole is formed in the holder 135 in a double annular shape so that nitrogen gas is also supplied to the low-temperature gas flow generation chamber 140.
  • soldering is performed in substantially the same manner as in the above-described second embodiment.
  • the substrate and electronic components around the soldering site are removed from the low-temperature gas flow generation chamber. Since the substrate is exposed to a low temperature generated at 0, for example, a nitrogen gas atmosphere at room temperature, the surrounding substrates and electronic components can be prevented from being affected by heat.
  • FIG. 10 shows a preferred embodiment of an inert gas purging apparatus to which the concept of the present invention is applied.
  • the inert gas purging apparatus includes a main body 30 and a grip 31.
  • the main body 30 incorporates a heater (eg, a round bar-shaped alumina nitride heater) 32, and the tip of the heater 32 is Heat retaining member made of copper alloy with good thermal conductivity (heat retaining member) 33 Inserted into the hole of 33, heat generated by heater 32 is transmitted to heat retaining member 33, and heat retaining member 33 is heated. It is supposed to be.
  • a heater eg, a round bar-shaped alumina nitride heater
  • the rear end of the heater 32 is inserted and held in the center hole of a holder 35 built in the tip of the grip portion 30, and a temperature sensor 39 is attached to the heater 32.
  • a temperature sensor 39 is attached to the heater 32.
  • a plurality of nitrogen gas supply holes are formed in an annular shape in the holder 135, and a tip of a nitrogen gas supply pipe 36 passed through the grip portion 30 is connected to the holder 35, and a heater 3 is provided.
  • a power line 32 a extends rearward in the nitrogen gas supply pipe 36 from the rear end of 2.
  • a first protective cover 37 is fixed to the tip of the grip portion 30.
  • the first protective cover 37 covers the heater 32 and a space between the first protective cover 37 and the heat retaining member 33.
  • a predetermined gap for example, a gap of l mm is extended to the front end side, and the front end is opened to surround the front end of the heat retaining member 33, thereby forming a high temperature gas flow generation chamber 38.
  • the inert gas purging apparatus of this example is used to spray high-temperature inert gas to the soldering area when soldering with a soldering robot or an automatic soldering machine to protect the soldering area from air and preheat it.
  • the inner and outer dual gas flows ejected from the tip of the soldering iron are preheated by the outer preheating gas flow, and then the inner preheating gas is surrounded by the outer preheating gas flow. Since the soldering is performed with the main heating gas flow, the heat of the main heating gas flow blown to the work soldering part does not scatter around and is efficiently transmitted to the work soldering part. Soldering can be performed in a short time without contact, that is, without using a tip.
  • the molten solder since the soldering can be performed in an atmosphere in which the molten solder is slowly cooled, the molten solder has a substantially hemispherical shape which is a preferable bulging state due to its surface tension. Also, immediately before the start of solidification of the molten solder, it is rapidly cooled in an atmosphere at room temperature or lower, and it is possible to give the molten solder directional solidification in which the distance between its liquidus and solidus is substantially reduced. This allows the solder to have a finely solidified structure.
  • soldering can be performed.
  • a preheating gas flow is injected around the tip tip, a low-temperature gas flow is injected as necessary around the tip, and the soldering portion is preheated with the preheating gas flow. Since the tip is used for soldering, there is little change in temperature of the tip due to contact with the soldering area, and the tip is heated by the preheating gas flow, resulting in almost all thermal stress on the tip Without this, the life of the tip can be greatly improved.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Lors de l'exécution d'une soudure sur une pièce avec un fer à souder, un gaz à haute température est soufflé sur la portion de la pièce à souder. L'extrémité du fer à souder projette un flux de gaz de chauffage principal ayant une température suffisamment élevée pour ramollir et fondre le métal d'apport, et un flux de gaz de préchauffage, ayant une température inférieure à celle du gaz de chauffage principal, mais suffisante pour préchauffer le métal d'apport, est projeté autour du flux de gaz principal. Le gaz de préchauffage est projeté sur la portion de la pièce à souder, pour préchauffer cette portion et ensuite le flux de gaz principal est projeté sur cette portion de la pièce à souder qui a été préchauffée, pour réaliser la soudure dans une atmosphère entourée par le flux de gaz de préchauffage.
PCT/JP1997/001528 1997-01-07 1997-05-06 Procede de soudage et fer a souder WO1998030351A1 (fr)

Priority Applications (1)

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JP53073998A JP3345722B2 (ja) 1997-01-07 1998-01-07 間欠的半田付けが可能な非接触型半田ごて

Applications Claiming Priority (2)

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JP9/13122 1997-01-07
JP1312297A JP2000000657A (ja) 1997-01-07 1997-01-07 非接触による半田付け方法及びその半田ごて

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WO1998030351A1 true WO1998030351A1 (fr) 1998-07-16

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PCT/JP1997/001528 WO1998030351A1 (fr) 1997-01-07 1997-05-06 Procede de soudage et fer a souder
PCT/JP1998/000021 WO1998030352A1 (fr) 1997-01-07 1998-01-07 Fer a souder du type sans contact et pouvant effectuer une soudure discontinue

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PCT/JP1998/000021 WO1998030352A1 (fr) 1997-01-07 1998-01-07 Fer a souder du type sans contact et pouvant effectuer une soudure discontinue

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JP (1) JP2000000657A (fr)
WO (2) WO1998030351A1 (fr)

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JP2000263223A (ja) * 1999-03-18 2000-09-26 Japan Unix Co Ltd ガス噴射式はんだ付け方法
JP3541307B2 (ja) * 1999-05-26 2004-07-07 賢政 松原 半田ごて
JP3582833B2 (ja) * 2002-03-06 2004-10-27 中島銅工株式会社 半田ごて
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JP3754968B2 (ja) * 2003-04-04 2006-03-15 白光株式会社 半田ごて
CN1273256C (zh) * 2003-04-04 2006-09-06 白光株式会社 电连接器构造体及具有该电连接器构造体的钎焊烙铁手柄或钎焊烙铁
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JP4533077B2 (ja) * 2004-10-04 2010-08-25 白光株式会社 はんだごて、その組立て方法及びそのヒータカートリッジの交換方法
JP2006334598A (ja) * 2005-05-31 2006-12-14 Mitsubishi Electric Corp ガス噴射式はんだ鏝
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JP2008279473A (ja) * 2007-05-09 2008-11-20 Kazuto Fujimoto 半田ごて
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CN114769785A (zh) * 2022-04-18 2022-07-22 翼龙半导体设备(无锡)有限公司 高压气自冷热锡喷头
CN114769785B (zh) * 2022-04-18 2023-10-20 翼龙半导体设备(无锡)有限公司 高压气自冷热锡喷头

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JP2000000657A (ja) 2000-01-07

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