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WO1998030075A2 - Procede et dispositif servant a rechauffer un composant - Google Patents

Procede et dispositif servant a rechauffer un composant Download PDF

Info

Publication number
WO1998030075A2
WO1998030075A2 PCT/FI1997/000834 FI9700834W WO9830075A2 WO 1998030075 A2 WO1998030075 A2 WO 1998030075A2 FI 9700834 W FI9700834 W FI 9700834W WO 9830075 A2 WO9830075 A2 WO 9830075A2
Authority
WO
WIPO (PCT)
Prior art keywords
heated
circuit board
components
heat
plural
Prior art date
Application number
PCT/FI1997/000834
Other languages
English (en)
Other versions
WO1998030075A3 (fr
Inventor
Ari Isteri
Original Assignee
Nokia Telecommunications Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Telecommunications Oy filed Critical Nokia Telecommunications Oy
Priority to AU53239/98A priority Critical patent/AU728378B2/en
Priority to EP97950212A priority patent/EP0983714A2/fr
Priority to JP52965898A priority patent/JP2001508942A/ja
Publication of WO1998030075A2 publication Critical patent/WO1998030075A2/fr
Publication of WO1998030075A3 publication Critical patent/WO1998030075A3/fr
Priority to NO993236A priority patent/NO993236L/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • the invention relates to a method for heating at least one component on a circuit board, said circuit board comprising one or plural layers.
  • the invention also relates to an arrangement for heating a component on a circuit board, which comprises at least one layer and which comprises one or plural components to be heated.
  • Circuit boards that are meant to be used within a broad temperature range, are usually designed to dissipate heat well. Heat is conducted or conveyed from components to cooling elements, to support structures and/or to the environment. This solution functions well in warm and hot conditions, but in cold conditions the cooling is often even too efficient and the temperature of the components falls to the extent that it can disturb the operation of the apparatus concerned.
  • an apparatus functioning in cold conditions can be secured by using components intended for military use, said components being designed to function within a broad temperature range, or by heating an apparatus comprising standard components. Since components intended for military use are expensive and each component usually has only one manufacturer, a prior art solution relies on heating the whole apparatus concerned, which typically involves heating the frame, the air space in the apparatus and its cooling fins, in addition to the circuit boards. This requires high heating power. Often a heating arrangement such as this also increases the size of the apparatus concerned, which is particularly disadvantageous when small size and high degree of integration are aimed at. In addition, all components are then subject to an equal amount of heating power, even if some of them would not need to be heated. The heating of components is also described in the US Patent
  • An object of the present invention is thus to provide a method and arrangement for heating components, in said method and arrangement heating power being reduced by heating only components that need to be heated, instead of the frame, air space and cooling fins of a whole apparatus.
  • This is achieved with a method described in the preamble, said method being characterized in that one or plural components to be heated are heated with at least one heat resistor associated with a circuit board and that the circuit board's own conduction material is used as the material of the heat resistor.
  • An arrangement of the invention is characterized in that a circuit board comprises at least one heat resistor arranged in connection with it, said heat resistor being arranged to heat at least one component on the circuit board and that the material of a heat resistor is the conduction material of the circuit board.
  • the amount of heating power needed is much smaller, because heating can be focused more carefully on the desired components, which enables avoiding the heating of elements that need not necessarily to be heated.
  • the degree of integration of the heating arrangement can also be increased.
  • Figure 1 illustrates a multi-layer circuit board and Figure 2 illustrates a layer of a circuit board comprising a heat resistor and
  • Figure 3 illustrates a layer of a circuit board comprising plural heat resistors.
  • a solution of the invention can be utilized in different circuit board solutions, particularly in multi-layer circuit boards comprising discrete components.
  • One or plural heatable components of a circuit board of one or plural layers are heated using at least one heat resistor associated with the circuit board.
  • the heat resistor is then in the immediate vicinity of or in contact with the component to be heated.
  • heating is preferably performed with a heat resistor integrated into a circuit board layer.
  • the components to be heated perform the actual desired operation of the circuit board, for instance signal processing in a transceiver of a digital radio system.
  • the heatable components can, in turn, be any components whatsoever, e.g. mechanical, electronic or optical components.
  • the stabilizing of the operating temperature of a processor used in signal processing is important.
  • Heating is performed by feeding direct current or alternating current power into the resistor, whereby the resistor warms up.
  • Any typically resistive prior art resistor material can be used as a resistor.
  • the resistor material used in the circuit board, such as copper, is preferably used as the material of the resistor.
  • the material of a heat resistor can, however, also be any other material conducting electricity reasonably well, of which metals are a typical example.
  • alternating current is being fed into a heat resistor, at least a partly capacitive or inductive load impedance can also function as a resistor.
  • FIG. 1 is an explosion view illustrating the circuit board.
  • a circuit board usually comprises an even number of layers, but for the sake of simplicity the structure of the circuit board in Figure 1 comprises three layers 10 and 11 , of which the bottommost and the topmost layers 10 are the switching circuit boards 10 of the components 14 performing the desired operation and between said layers 10 is a heat resistor layer 11 with a heat resistor 15.
  • Heating can thus be focused on the circuit board and its components, instead of the whole apparatus concerned.
  • the power source of the heat resistor is preferably the power, i.e. the operating voltage, used by the components 14 needed for the actual operation of the circuit board.
  • the heat resistor 15 can, however, also be heated by a separate power source 12.
  • the heating power of the heat resistor 15 can preferably be adjusted according to need, for which purpose the power source 12 is for instance controlled with a control means 13 monitoring the temperature of the components 14.
  • the control means 13 can monitor the temperature around the components, such as the temperature of the air, the temperature of the circuit 10 or the temperature of the heatable component 14 and, if the temperature is too low, heating is activated. If a predetermined variation in temperature is allowed for the components 14 responsible for the actual operation of the circuit board, then the control means 13 is, at its simplest, a switch which in cold conditions switches the heating on and in warm conditions turns it off.
  • the control means 13 can, however, preferably also control the power fed by the power source 12 to the resistor 15.
  • the control means 13 is an electronic thermometer conforming to prior art and furnished with at least one measuring head 131 , 132 and 133, which measure the temperature of the environment, the circuit board 10 or the component 14.
  • FIG. 2 shows the circuit board layer 11 in greater detail.
  • the layer 11 in this example comprises one heat resistor 15, which is used for heating all components in the layers 10.
  • the form of the heat resistor can differ quite considerably from the one shown in Figure 2, because the form is not essential to the invention. Since the heat resistor 15 is close to the components 14 of the layer 10, they heat effectively.
  • the heat resistor 15 can substantially cover the whole layer 11 of the circuit board, as shown in Figure 2, or the heat resistor 15 can be arranged on only a part of the surface of the layer 11.
  • FIG. 3 illustrates a more efficient embodiment of the inventive solution than the above.
  • the heat resistor layer 11 in this example comprises plural heat resistors 15.
  • the inventive solution thus allows heating different components 14 responsible for the actual operation of the circuit board in a different way. Components generating a lot of heat in their own operation are heated less than components generating little heat. Heating power can be varied for instance by using heat resistors 15 with impedances of a different magnitude. This allows the components 14 responsible for the actual desired operation in the different layers 10 of the circuit board to be heated independently, irrespective of each other.
  • control means 13 can preferably measure the temperature of each component 14 separately with measuring heads 131 , 132 and 133 and guide the heating power of the power source 12 to each component separately. Since each component 14 responsible for the actual operation of the circuit board has its own heat resistor 15, the resistors 15 can have small values, whereby a low operating voltage is sufficient for them. This enables using for instance the operating voltage meant for logic also as the power source for heat resistors 15.
  • the means 12, 13, 131 , 132 and 133 are not, however, essential to the invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • General Induction Heating (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Resistance Heating (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un procédé et un dispositif servant à réchauffer au moins un composant (14) d'une plaquette de circuit imprimé comprenant une ou plusieurs couches (10 et 11). On réchauffe au moins un composant (14) à réchauffer au moyen d'au moins une résistance thermique (15) associée à la plaquette de circuit imprimé.
PCT/FI1997/000834 1996-12-31 1997-12-30 Procede et dispositif servant a rechauffer un composant WO1998030075A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU53239/98A AU728378B2 (en) 1996-12-31 1997-12-30 Method and arrangement for heating a component
EP97950212A EP0983714A2 (fr) 1996-12-31 1997-12-30 Procede et dispositif servant a rechauffer un composant
JP52965898A JP2001508942A (ja) 1996-12-31 1997-12-30 部品を加熱する方法及び構成体
NO993236A NO993236L (no) 1996-12-31 1999-06-29 Fremgangsmåte og innretning for oppvarming av en komponent

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI965301A FI965301L (fi) 1996-12-31 1996-12-31 Menetelmä ja järjestely komponentin lämmittämiseksi
FI965301 1996-12-31

Publications (2)

Publication Number Publication Date
WO1998030075A2 true WO1998030075A2 (fr) 1998-07-09
WO1998030075A3 WO1998030075A3 (fr) 1998-08-27

Family

ID=8547390

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI1997/000834 WO1998030075A2 (fr) 1996-12-31 1997-12-30 Procede et dispositif servant a rechauffer un composant

Country Status (6)

Country Link
EP (1) EP0983714A2 (fr)
JP (1) JP2001508942A (fr)
AU (1) AU728378B2 (fr)
FI (1) FI965301L (fr)
NO (1) NO993236L (fr)
WO (1) WO1998030075A2 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999059387A1 (fr) * 1998-05-08 1999-11-18 Nokia Networks Oy Procede de chauffage pour une plaquette de circuit imprime et plaquette contenant un element chauffant
WO2001020957A1 (fr) * 1999-09-14 2001-03-22 Lee John Robinson Soudage par refusion de stratifie
EP0999725A3 (fr) * 1998-11-06 2002-01-16 Alcatel Dispositif de chauffage d'une carte à circuit imprimé
US8481897B2 (en) 2005-01-24 2013-07-09 Jumatech, Gmbh Printed circuit board or card comprising a heating wire
WO2018164752A1 (fr) * 2017-03-08 2018-09-13 Raytheon Company Régulation de température intégrée pour céramiques multicouches et procédé

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440407A (en) * 1966-12-29 1969-04-22 Rca Corp Temperature controlled circuit boards
US4769525A (en) * 1986-09-02 1988-09-06 Hughes Aircraft Company Circuit package attachment apparatus and method
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
FR2668876B1 (fr) * 1990-11-07 1992-12-24 Alcatel Espace Circuit electronique controle en temperature.
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
GB9508631D0 (en) * 1995-04-28 1995-06-14 Smiths Industries Ltd Electrical circuits

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999059387A1 (fr) * 1998-05-08 1999-11-18 Nokia Networks Oy Procede de chauffage pour une plaquette de circuit imprime et plaquette contenant un element chauffant
US6184494B1 (en) 1998-05-08 2001-02-06 Nokia Networks Oy Printed circuit board having a heating element and heating method thereof
EP0999725A3 (fr) * 1998-11-06 2002-01-16 Alcatel Dispositif de chauffage d'une carte à circuit imprimé
WO2001020957A1 (fr) * 1999-09-14 2001-03-22 Lee John Robinson Soudage par refusion de stratifie
US8481897B2 (en) 2005-01-24 2013-07-09 Jumatech, Gmbh Printed circuit board or card comprising a heating wire
WO2018164752A1 (fr) * 2017-03-08 2018-09-13 Raytheon Company Régulation de température intégrée pour céramiques multicouches et procédé
CN110366712A (zh) * 2017-03-08 2019-10-22 雷神公司 用于多层陶瓷的集成温度控制器及方法
US11350490B2 (en) 2017-03-08 2022-05-31 Raytheon Company Integrated temperature control for multi-layer ceramics and method

Also Published As

Publication number Publication date
FI965301A0 (fi) 1996-12-31
NO993236D0 (no) 1999-06-29
NO993236L (no) 1999-06-29
WO1998030075A3 (fr) 1998-08-27
EP0983714A2 (fr) 2000-03-08
JP2001508942A (ja) 2001-07-03
FI965301A7 (fi) 1998-07-01
AU5323998A (en) 1998-07-31
AU728378B2 (en) 2001-01-11
FI965301L (fi) 1998-07-01

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