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WO1998007903A1 - Dispositif de galvanoplastie de cartes de circuits electroniques ou similaire - Google Patents

Dispositif de galvanoplastie de cartes de circuits electroniques ou similaire Download PDF

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Publication number
WO1998007903A1
WO1998007903A1 PCT/EP1997/003895 EP9703895W WO9807903A1 WO 1998007903 A1 WO1998007903 A1 WO 1998007903A1 EP 9703895 W EP9703895 W EP 9703895W WO 9807903 A1 WO9807903 A1 WO 9807903A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
circuit boards
electrolyte
transport rollers
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP1997/003895
Other languages
German (de)
English (en)
Inventor
Thomas Kosikowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hans Hollmueller Maschinenbau GmbH
Original Assignee
Hans Hollmueller Maschinenbau GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hans Hollmueller Maschinenbau GmbH filed Critical Hans Hollmueller Maschinenbau GmbH
Publication of WO1998007903A1 publication Critical patent/WO1998007903A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Definitions

  • the invention relates to a device for electroplating electronic printed circuit boards or the like, in particular those containing a plurality of bores
  • a container surrounding at least part of the path of movement and the anode (s) and having an inlet and an outlet slot for the electronic circuit boards; at least one pump which takes electrolyte from the sump and feeds it to the container in such a way that its interior is filled with electrolyte in the dynamic equilibrium between inflow and outflow.
  • the clips on the edges of the printed circuit boards are closed by suitable cam devices at the beginning of the part of the movement path in question and opened again by corresponding cam devices at the end of the part of the movement path, so that the printed circuit boards, which have in the meantime been galvanized, are released and in a different way Transport system can be handed over.
  • This known device has the advantage that the contact point between the contact clamps and the electronic circuit boards does not perform any relative movement, so that the coating on the circuit boards is protected.
  • the cam devices that are required to open and close the contact clips, as well as the endless chain, to which the individual contact clips are attached, and their drive are very complicated and expensive components.
  • This type of contacting and promotion of the electronic circuit boards presupposes that a corresponding metallic contacting plug is provided at the edge of the electronic circuit boards, which generally requires a special "design" of the circuit boards.
  • the object of the present invention is to design a device of the type mentioned at the outset in such a way that the means used for contacting and conveying are inexpensive and simple to use and that, moreover, the devices which are deposited on the electronic circuit boards which metallic layers have a more uniform thickness, especially in the bores.
  • the contact and transport means are designed as rotatably driven contact and transport rollers, which extend transversely to the direction of movement of the electronic printed circuit boards over the entire working width of the device, at least partially have a metallic coating on their outer surface, which is connected to the negative pole of the galvanizing power source, and which are each designed to bear against a main surface of the electronic circuit board, such that each contact and transport roller forms a dust barrier for the flowing electrolyte, as a result of which locally dynamically varying pressure differences occur on the circuit boards to adjust.
  • contact and transport means-driven rollers which extend across the entire working width of the device, transversely to the direction of movement of the printed circuit boards.
  • Such contact and transport rollers can be easily integrated into conveyor systems known per se, which work with driven rollers, and set in motion by the same mechanism that is usually used to drive the conveyor rollers.
  • the fact that these contact and transport rollers extend over the entire working width of the device results in jamming effects for the electrolyte flowing off. These congestion effects lead, partly due to the locally different flow velocities, to locally varying pressures which act on the printed circuit boards, whereby the electrolyte flow through the holes in the circuit boards is improved. These have locally varying prints not originated in the feed pump.
  • the contact and transport rollers serving as dust barriers mean local narrowing of the flow path for the electrolyte, at which relatively high flow velocities and consequently relatively low local static pressures occur.
  • the electronic circuit boards are to be galvanized on both opposite main surfaces.
  • the contact and transport rollers are provided in pairs, the partners of which are designed to bear against opposite main surfaces of the electronic circuit boards. The latter are thus pulled through the gap between the opposite contact and transport rollers; the partners of a pair of contact rollers and transport rollers rotate counterclockwise.
  • the contact and transport rollers are provided with a metallic coating over their entire axial dimension.
  • the most uniform thicknesses can be achieved in the layers deposited on the electronic circuit boards, since voltage drops across the direction of movement of the circuit boards cannot occur in their coatings at all.
  • contact and transport rollers can be relatively expensive if the material used for their metallic coating is itself expensive.
  • the contact and transport rollers are provided with a metallic coating in only a part of their outer surface in a certain geometric pattern.
  • the geometric pattern mentioned is determined experimentally in such a way that the desired uniform layer thickness results in the electroplated layers, but that unnecessarily much metal is not required in the production of the contact and transport rollers.
  • a plastic base body e.g. made of polypropylene, free.
  • contact and transport rollers can be combined with different geometric patterns of the metallic coating in a special embodiment of the device according to the invention
  • the electronic printed circuit boards are first moved by one or two contact and transport rollers with a first geometric pattern and by this or these transfer to one or two contact and transport rollers, the outer surface of which is provided with such a geometric pattern that the electronic circuit boards are now contacted at another location on their main surface.
  • the configuration is recommended in which the metallic coatings of the contact and transport rollers serve as auxiliary cathodes and their total area is selected so that the desired constant concentration of metal ions in the electrolyte results during the operating time.
  • the undesirable effect that metal is deposited on the contact and transport rollers from the electrolyte is turned into a positive: by a suitable choice of the total area of the metallic coatings (ie by a corresponding "design" of the geometrical used Patterns of these metallic coatings) can be achieved that the metallic coatings of the contact and transport rollers take over exactly the function of the auxiliary electrode, so that without special precautionary measures the desired constant concentration of metal ions in the electrolyte is ensured.
  • the embodiment in which the metallic coatings of the contact and transport rollers are provided with a coating of catalytically active metal has proven particularly advantageous.
  • the coating need only have a very small thickness (in the range of a few ⁇ m).
  • the efficiency of the decoupling electrolysis can be greatly improved by this coating: even at a fraction of the otherwise required current, the metallic coatings of the contact and transport rollers can be kept free of undesired metal deposits in the long run.
  • An advantageous side effect of this catalytically active metal is that the adhesion of the temporarily formed galvanic metal deposits is better and the deposits are not spongy, as is often the case on titanium surfaces. Spongy or porous deposits could loosen metal particles and get onto the circuit boards, which would become scrap in this way.
  • the catalytically active metal can e.g. gold, palladium, iridium or an alloy of these components.
  • a particularly preferred embodiment of the invention is characterized in that, viewed in the direction of movement of the printed circuit boards, several individual anodes are provided, between each of which a pair of contacts and transport rollers is provided.
  • the anodes can be arranged very close (with a distance that is smaller than the diameter of the contact and transport rollers) to the path of movement of the printed circuit boards. This improves the efficiency of the electrolysis and at the same time achieves a more uniform thickness of the electroplated layers.
  • the interruptions between the individual anodes are without disadvantage, since the anode regions above these contact and transport rollers would also be shaded and would therefore be essentially ineffective even in the case of an anode running in one piece above the contact and transport rollers.
  • Figure 1 a vertical section through a device for electroplating electronic circuit boards
  • Figures 2 and 3 side views of two contact and Transport rollers, as they can be used in the device of Figure 1.
  • a device in vertical section, in which electronic circuit boards, which are provided with holes, can be provided with a metallic coating by galvanic means.
  • This metallic coating should in particular also cover the lateral surfaces of the holes in the circuit board, so that e.g. an electrical over these lateral surfaces
  • connection between the wiring patterns on the upper and lower side (the “main surfaces") of the circuit board can be created.
  • the device shown in Figure 1 comprises a machine housing 1 with an inlet slot 2 and an outlet slot 3.
  • the electronic circuit boards are fed in a horizontal orientation in the direction of arrow 4 of the device and, after passing through the inlet slot 2, first meet four pairs of nip rollers 5, in which treatment liquid still adhering to the circuit boards and originating from previous processing operations is largely removed.
  • the printed circuit boards are transferred from the squeeze roller pairs 5 to a first contact and transport roller pair 6.
  • the exact design of these contact and transport rollers 6 will be discussed in more detail below.
  • the contact and transport rollers 6 advance the circuit board further in the conveying direction.
  • These pass between an upper anode 7 and a lower anode 8.
  • these anodes 7 and 8 are designed as anode baskets which can be pulled out laterally from the machine housing 1 in the manner of a drawer.
  • any other can be used Use types of anodes, such as inert anodes made of expanded titanium.
  • the printed circuit boards are in turn gripped by a pair of contact and transport rollers 6, which further advances the printed circuit boards so that they again pass between an upper anode basket 7 and a lower anode basket 8.
  • the circuit boards covering the distance between the latter anode baskets 7 and
  • Pass squeeze roller pairs 5 which largely remove the electrolyte in which they were located from the printed circuit boards (see the following description below).
  • the printed circuit boards are finally discharged from the device through the transport system, of which the contact and transport rollers 6 are part, via the outlet slot 15 and fed to a subsequent treatment station.
  • a pump 10 continuously removes electrolyte from the sump 9 and guides it through a filter 11, a valve 12 and lines 16a, 16b upwards into a container 13 which rolls the plane of movement of the printed circuit boards in the area of the contact and transport rollers 6 as well as the Anode baskets 7 and 8 surrounds.
  • the container 13 also has an inlet slot 17 and an outlet slot 18, which, however, are largely sealed off by the adjacent pinch roller pairs 5 serving as accumulation rollers and bulkheads sliding against them.
  • the electrolyte from the pump 10 is supplied via a first branch line 16a to distribution channels 17 in the area of the upper anode baskets 7 and via a second branch line 16b to distribution channels 18 in the area of the lower anode baskets 8.
  • a first branch line 16a to distribution channels 17 in the area of the upper anode baskets 7
  • a second branch line 16b to distribution channels 18 in the area of the lower anode baskets 8.
  • individual nozzle channels 19 lead down to nozzle openings 20, 21, which are located in the vicinity of the plane of movement of the printed circuit boards.
  • the electrolyte is ejected via the nozzle openings 20 at an angle deviating from 90 degrees against the surface of the printed circuit boards passing by, while the electrolyte flows vertically downwards from the nozzle openings 21, that is to say it strikes the printed circuit boards passing by at a right angle.
  • the obliquely directed nozzle openings 20 above the path of movement of the printed circuit boards are each opposed by a vertically oriented nozzle opening 21 below the path of movement of the printed circuit boards or vice versa. In this way it is avoided that the migrating circuit board is subjected to electrolyte on both sides under the same pressure, which would hinder the flow through the holes.
  • Each contact and transport roller 6 is a copper removal - assigned to cathode 22.
  • This can be a rod-like structure made of titanium, which extends parallel to the associated contact and transport roller 6 and is at (more) negative potential than the latter.
  • electrolyte is removed from the sump 9 in the machine housing 1 and fed in the manner already described to the interior of the container 13 such that it is filled with electrolyte in dynamic equilibrium.
  • the circuit boards to be electroplated are fed via the inlet slot 2 and the pinch roller pairs 5 to the contact and transport system which is formed by the contact and transport rollers 6.
  • the contact and transport rollers 6 extend over the full width of the machine, that is, they also capture the printed circuit boards over their entire transverse dimension.
  • the contact and transport rollers 6 are at least partially coated on their outer surface (see below for this).
  • This metallic coating is connected to the negative pole of the galvanizing current source (not shown in the drawing) via suitable brushes or grinders, the positive pole of which is in turn connected to the various anode baskets 7, 8.
  • the metallic coatings on the electronic circuit boards also receive negative potential.
  • An electrical field therefore builds up between these metallic coatings on the electronic printed circuit boards and the anode baskets 7, 8 as the electronic printed circuit boards pass through. This is where electrolysis takes place in a known manner, in the course of which the surfaces of the printed circuit boards, but in particular also the jacket surfaces of the holes contained in the printed circuit boards, be provided with a metallic (generally copper) coating.
  • the required layer thickness is built up on the electronic circuit boards in several stages.
  • the number of sections to be traversed one behind the other between opposite anode baskets 7, 8 can in principle be of any size; it depends exclusively on the required thickness of the metallic coatings desired on the printed circuit boards. In the case of the printed circuit boards passing through the contact and transport rollers 6 lying furthest to the left in FIG. 1, it can therefore be assumed that the desired layer thickness of the metallic coating has been reached.
  • These printed circuit boards can then leave the galvanizing module via the pinch roller pairs 5 and the outlet slot 3 and be fed to a further processing.
  • the electrical field causing the galvanization acts not only between the anode baskets 7, 8 and the printed circuit boards passing by in each case, but also between the anode baskets 7, 8 and the respectively adjacent contact and transport rollers 6.
  • This has the consequence that even those with negative galvanization - Potential metallic coatings of the contact and transport rollers 6 are galvanically provided with a metallic coating, which is not completely avoidable even with good mechanical shielding of the contact and transport rollers 6 against the electrolyte.
  • the decoupling electrodes 22 are provided, which are at an even more negative potential than the metallic coatings of the contact and transport rollers 6. Between the copper removal electrodes 22 and the metallic coating I
  • the contact and transport rollers 6 comprises a cylindrical base body 130 made of plastic material, e.g. Polypropylene, which carries only two ring-like lateral areas 131, 132 with a metallic coating.
  • the area ratio between the metallic coating and (unclad) plastic base body as well as the geometric pattern of the metallic coating can be changed as desired according to expediency.
  • half is axial
  • contact and transport rollers 6 which is in each case on the contact and transport rollers 6, is selected in accordance with the geometry of the conductor tracks applied to the printed circuit boards and the arrangement of the bores in such a way that a shadow-free, uniform formation of the galvanic precipitate results in particular on the lateral surfaces of the bores.
  • different contact and transport rollers 6 can be combined.
  • the contact and transport roller 206 of FIG. 3 could alternately be installed alternately in the device of FIG. 1 by 180. It would also be conceivable to combine contact and transport rollers, as shown in FIG. 106, with contact and transport rollers 206 according to FIG. 3 in the same device.
  • the electrolyte accumulates in the course of the operating time with ions of the metal to be deposited on the electronic printed circuit boards, that is to say generally of copper.
  • two countermeasures are known: either the electrolyte is regenerated by adding chemicals and water so that the desired metal ion concentration is restored.
  • the second countermeasure is preferred:
  • an auxiliary electrolysis is used which continuously removes metal ions from the electrolyte by means of electrodeposition withdrawn at an auxiliary cathode.
  • the inherently undesirable deposition of metal ions from the electrolyte on the metallic areas of the contact and transport rollers 6 can be used in the sense of this auxiliary electrolysis.
  • the total amount of metal which is deposited on the metallic coatings of the contact and transport rollers 6 depends on the total area of these metallic coatings. In general, it is always possible to determine the area of the metallic coatings on the contact and transport rollers 6 by means of appropriate tests for the respectively processed electrolytes and electronic printed circuit boards, in which the
  • the metal thus removed from the electrolyte does not remain on the metallic coatings of the contact and transport rollers 6, but is detached from them again by the auxiliary electrolysis mentioned above and finally deposited on the decoupling cathodes 22.
  • the metallic coatings of the contact and transport rollers 6 can consist of titanium, a metal which is anyway very widespread in electroplating devices of the type of interest here.
  • the efficiency of the decoupling electrolysis that is to say the amperage required to "keep bright" the metallic coatings of the contact and transport rollers 6, can be kept very much lower if the metallic coatings of the contact and transport rollers 6 are included 10
  • this catalytically active metal are coated with a catalytically active metal.
  • Gold, palladium, iridium and the like are particularly suitable.
  • the layer thickness of this catalytically active metal need not be greater than a few ⁇ m.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un dispositif de galvanoplastie de cartes de circuits électroniques, notamment de cartes de circuits comprenant une pluralité de trous. Ce dispositif comprend de manière connue en soi un boîtier de machine (1), dans la zone inférieure duquel se trouve une cuve (9) pour l'électrolyte. Les cartes de circuits à galvaniser sont déplacées en alignement horizontal à l'aide d'un système de transport le long d'une section de transport. Dans la zone de la section de déplacement, il est prévu au moins une anode (7, 8), ainsi qu'un récipient (13) qui l'entoure et comporte une fente d'entrée (14) et une fente de sortie (15). De l'électrolyte est acheminé depuis la cuve (9) jusqu'à l'intérieur du récipient (13) à l'aide d'une pompe (10), de manière que l'intérieur dudit récipient (13) soit rempli d'électrolyte, avec un équilibre dynamique entre l'alimentation et la décharge. Une partie du système de transport consiste en rouleaux de contact et de transport (6) qui s'étendent transversalement au sens de déplacement des cartes de circuits électroniques sur l'ensemble de la largeur de travail du dispositif et exercent de ce fait un effet de retenue sur le flux d'électrolyte. Cet effet de retenue entraîne des variations des taux de compression dans la zone des cartes de circuits électroniques, ce qui améliore l'écoulement à travers les trous que comprennent lesdites cartes de circuits. Les rouleaux de contact et de transport (6) sont munis sur au moins une partie de leur surface extérieure d'un revêtement métallique, relié au pôle négatif de la source de courant de galvanoplastie.
PCT/EP1997/003895 1996-08-22 1997-07-20 Dispositif de galvanoplastie de cartes de circuits electroniques ou similaire Ceased WO1998007903A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1996133797 DE19633797B4 (de) 1996-08-22 1996-08-22 Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen
DE19633797.6 1996-08-22

Publications (1)

Publication Number Publication Date
WO1998007903A1 true WO1998007903A1 (fr) 1998-02-26

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ID=7803298

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1997/003895 Ceased WO1998007903A1 (fr) 1996-08-22 1997-07-20 Dispositif de galvanoplastie de cartes de circuits electroniques ou similaire

Country Status (2)

Country Link
DE (1) DE19633797B4 (fr)
WO (1) WO1998007903A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10043815C2 (de) * 2000-09-06 2002-08-08 Egon Huebel Verfahren und Vorrichtung zur elektrischen Kontaktierung von zu behandelndem Gut in elektrolytischen Anlagen
DE10141056C2 (de) 2001-08-22 2003-12-24 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
WO2003064733A1 (fr) * 2002-01-28 2003-08-07 Huebel Egon Procede et dispositif de metallisation electrique de produit a traiter dans des installations electrolytiques
DE102005034419A1 (de) 2005-07-19 2007-01-25 Hübel, Egon, Dipl.-Ing. (FH) Verwendung einer Beschichtung zur elektrischen Kontaktierung
DE102007015641B4 (de) 2007-03-31 2011-07-14 Höllmüller Maschinenbau GmbH, 71083 Vorrichtung und Verfahren zum Galvanisieren von Gegenständen
DE102009023763A1 (de) * 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
WO1992018669A1 (fr) * 1991-04-12 1992-10-29 Siemens Aktiengesellschaft Installation de galvanisation pour pieces en forme de plaques, en particulier pour des plaquettes de circuits imprimes
DE4225961A1 (de) * 1992-08-06 1994-02-10 Hoellmueller Maschbau H Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher platten- oder bogenförmiger Gegenstände

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3603856C2 (de) * 1986-02-07 1994-05-05 Bosch Gmbh Robert Verfahren und Vorrichtung zur Galvanisierung von ebenen Werkstücken wie Leiterplatten

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
WO1992018669A1 (fr) * 1991-04-12 1992-10-29 Siemens Aktiengesellschaft Installation de galvanisation pour pieces en forme de plaques, en particulier pour des plaquettes de circuits imprimes
DE4225961A1 (de) * 1992-08-06 1994-02-10 Hoellmueller Maschbau H Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher platten- oder bogenförmiger Gegenstände

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating

Also Published As

Publication number Publication date
DE19633797B4 (de) 2005-08-04
DE19633797A1 (de) 1998-02-26

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