[go: up one dir, main page]

WO1998052218A1 - Connector and probing system - Google Patents

Connector and probing system Download PDF

Info

Publication number
WO1998052218A1
WO1998052218A1 PCT/JP1998/001722 JP9801722W WO9852218A1 WO 1998052218 A1 WO1998052218 A1 WO 1998052218A1 JP 9801722 W JP9801722 W JP 9801722W WO 9852218 A1 WO9852218 A1 WO 9852218A1
Authority
WO
WIPO (PCT)
Prior art keywords
probing
contact
multilayered film
tip
bringing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP1998/001722
Other languages
French (fr)
Japanese (ja)
Inventor
Susumu Kasukabe
Terutaka Mori
Akihiko Ariga
Hidetaka Shigi
Takayoshi Watanabe
Ryuji Kohno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to US09/423,385 priority Critical patent/US6305230B1/en
Publication of WO1998052218A1 publication Critical patent/WO1998052218A1/en
Anticipated expiration legal-status Critical
Priority to US11/853,979 priority patent/US7541202B2/en
Priority to US12/408,000 priority patent/US20090209053A1/en
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

A probing system which can realize the probing of a narrow-pitch multipin object stably under low-load conditions without giving any damage to the object and, at the same time, can transmit the results of probing at a high speed, namely, in the form of high-frequency electric signals. The system comprises: a supporting member for a connector; a multilayered film provided with contact terminals each having a sharpened tip and arranged in a probing-side area, lead-out wirings each being electrically connected to the respective terminal, and a grounding layer formed on the wiring with an insulating layer in between; a frame fixed to the rear side of the multilayered film; a pressing member which attaches the frame to the multilayered film with a section for projecting the probing-side area so as to eliminate the looseness of the area in the multilayered film; a contact pressure imparting means which imparts a contact pressure to the pressing member through the supporting member for bringing the tip of each contact terminal into contact with each electrode; and a compliance mechanism which parallels the tip faces of the contact terminals in compliance with the surfaces of the electrodes for bringing the tip faces of the contact terminals into contact with the surfaces of the electrodes.
PCT/JP1998/001722 1997-05-09 1998-04-15 Connector and probing system Ceased WO1998052218A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US09/423,385 US6305230B1 (en) 1997-05-09 1998-05-14 Connector and probing system
US11/853,979 US7541202B2 (en) 1997-05-09 2007-09-12 Connection device and test system
US12/408,000 US20090209053A1 (en) 1997-05-09 2009-03-20 Connection device and test system

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP9/119107 1997-05-09
JP11910797 1997-05-09
JP10049912A JPH1123615A (en) 1997-05-09 1998-03-03 Connection device and inspection system
JP10/49912 1998-03-03

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US09423385 A-371-Of-International 1998-04-14
US09/971,606 Continuation US6759258B2 (en) 1997-05-09 2001-10-09 Connection device and test system

Publications (1)

Publication Number Publication Date
WO1998052218A1 true WO1998052218A1 (en) 1998-11-19

Family

ID=26390358

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1998/001722 Ceased WO1998052218A1 (en) 1997-05-09 1998-04-15 Connector and probing system

Country Status (4)

Country Link
US (5) US6305230B1 (en)
JP (1) JPH1123615A (en)
KR (2) KR100375116B1 (en)
WO (1) WO1998052218A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2812400A1 (en) * 2000-07-28 2002-02-01 Mesatronic METHOD FOR MANUFACTURING A MULTIPLE CONTACT POINT CARD FOR TESTING MICROBALL INTEGRATED CIRCUITS, AND TEST DEVICE USING THE CARD
US7688086B2 (en) 2005-11-11 2010-03-30 Renesas Technology Corp. Fabrication method of semiconductor integrated circuit device and probe card
TWI480974B (en) * 2012-05-31 2015-04-11 Mitsubishi Electric Corp Method for manufacturing semiconductor device and semiconductor manufacturing system
WO2019021749A1 (en) * 2017-07-24 2019-01-31 株式会社ヨコオ Inspection jig
CN115184650A (en) * 2022-09-14 2022-10-14 江苏玄博智能标识科技有限公司 Multi-functional intelligent sign control detection device

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
JPH1123615A (en) * 1997-05-09 1999-01-29 Hitachi Ltd Connection device and inspection system
DE19952943C2 (en) * 1999-11-03 2003-07-03 Infineon Technologies Ag Needle card adjustment device for the planarization of needle sets of a needle card
US7262611B2 (en) 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
JP4591902B2 (en) * 2000-07-14 2010-12-01 Ｈｏｙａ株式会社 Wafer batch contact board and manufacturing method thereof
JP2002110751A (en) * 2000-10-03 2002-04-12 Hitachi Ltd Inspection apparatus and manufacturing method for semiconductor integrated circuit device
US6677771B2 (en) 2001-06-20 2004-01-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
US6762612B2 (en) 2001-06-20 2004-07-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
JP2003066066A (en) * 2001-08-30 2003-03-05 Yamaha Fine Technologies Co Ltd Bump-shaped probe card
JP2003078310A (en) * 2001-09-04 2003-03-14 Murata Mfg Co Ltd High-frequency line converter, component, module and communication device
US6653825B2 (en) * 2001-11-29 2003-11-25 Theodore G. Munniksma Meter lead holder device
JP2003287553A (en) * 2002-03-28 2003-10-10 Fujitsu Ltd Probe card and substrate for manufacturing the same
US6767817B2 (en) * 2002-07-11 2004-07-27 Micron Technology, Inc. Asymmetric plating
US20040051541A1 (en) * 2002-09-04 2004-03-18 Yu Zhou Contact structure with flexible cable and probe contact assembly using same
JP3649239B2 (en) * 2002-10-28 2005-05-18 Ｊｓｒ株式会社 Manufacturing method of sheet-like connector
JP4099412B2 (en) 2003-03-19 2008-06-11 株式会社ルネサステクノロジ Manufacturing method of semiconductor integrated circuit device
JP4465995B2 (en) 2003-07-02 2010-05-26 株式会社日立製作所 Probe sheet, probe card, semiconductor inspection apparatus, and semiconductor device manufacturing method
WO2006017078A2 (en) 2004-07-07 2006-02-16 Cascade Microtech, Inc. Probe head having a membrane suspended probe
JP4571133B2 (en) * 2003-07-28 2010-10-27 ネクステスト システムズ コーポレイション Device for flattening probe cards
US6859054B1 (en) * 2003-08-13 2005-02-22 Advantest Corp. Probe contact system using flexible printed circuit board
US6900649B1 (en) * 2003-09-23 2005-05-31 Keithley Instruments, Inc. High frequency RF interconnect for semiconductor automatic test equipment
JP2005136246A (en) * 2003-10-31 2005-05-26 Renesas Technology Corp Manufacturing method of semiconductor integrated circuit device
JP4723195B2 (en) * 2004-03-05 2011-07-13 株式会社オクテック Probe manufacturing method
US7446544B2 (en) * 2004-03-31 2008-11-04 Jsr Corporation Probe apparatus, wafer inspecting apparatus provided with the probe apparatus and wafer inspecting method
JP4521611B2 (en) * 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor integrated circuit device
US6810752B1 (en) * 2004-04-23 2004-11-02 Jia-Yih Yen Block test stand
TW200602642A (en) * 2004-04-27 2006-01-16 Jsr Corp Sheet-like probe, method of producing the same, and application thereof
JP4372785B2 (en) 2004-06-09 2009-11-25 株式会社ルネサステクノロジ Manufacturing method of semiconductor integrated circuit device
JP2006071486A (en) * 2004-09-02 2006-03-16 Renesas Technology Corp Connecting device, semiconductor chip inspection device, and manufacturing method of semiconductor device
JP4535494B2 (en) * 2004-10-20 2010-09-01 ルネサスエレクトロニクス株式会社 Thin film probe sheet manufacturing method and semiconductor chip inspection method
JP4438601B2 (en) * 2004-10-28 2010-03-24 株式会社ヨコオ Inspection unit manufacturing method
JP4755597B2 (en) 2004-11-18 2011-08-24 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor integrated circuit device
CN100348983C (en) * 2005-02-07 2007-11-14 董玟昌 A microelectromechanical probe circuit thin film and its preparation method
WO2006097982A1 (en) 2005-03-11 2006-09-21 Renesas Technology Corp. Method for manufacturing semiconductor integrated circuit device
US7030636B1 (en) 2005-05-02 2006-04-18 Fargo Assembly Company Low pin testing system
JP2006343182A (en) 2005-06-08 2006-12-21 Renesas Technology Corp Manufacturing method of semiconductor integrated circuit device
JP4825457B2 (en) * 2005-06-21 2011-11-30 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor integrated circuit device
JP2007012810A (en) * 2005-06-29 2007-01-18 Renesas Technology Corp Method of manufacturing semiconductor integrated circuit device
US7498825B2 (en) * 2005-07-08 2009-03-03 Formfactor, Inc. Probe card assembly with an interchangeable probe insert
WO2007057944A1 (en) * 2005-11-15 2007-05-24 Advantest Corporation Electronic component test equipment and method for loading performance board on the electronic component test equipment
JP5191646B2 (en) 2006-10-24 2013-05-08 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor integrated circuit device
JP5065674B2 (en) * 2006-12-28 2012-11-07 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor integrated circuit device
US7791361B2 (en) * 2007-12-10 2010-09-07 Touchdown Technologies, Inc. Planarizing probe card
DE202008010533U1 (en) * 2008-08-07 2008-10-30 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Contactless loop probe
US8030957B2 (en) * 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
JP5557547B2 (en) * 2010-02-10 2014-07-23 株式会社アドバンテスト Test head and semiconductor wafer test apparatus provided with the same
TWI395366B (en) * 2010-03-12 2013-05-01 Iner Aec Executive Yuan Measurement process for determination of the optimum contact pressure among components of a solid oxide fuel cell stack in the packaging process and its measurement apparatus
JP2011196934A (en) * 2010-03-23 2011-10-06 Hitachi Ltd Testing method and interposer used for the same
AT12317U1 (en) * 2010-04-13 2012-03-15 Austria Tech & System Tech METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PCB AND A PCB WITH AN INTEGRATED ELECTRONIC COMPONENT
JP2011242377A (en) * 2010-05-19 2011-12-01 Kimoto Gunsei Probe
US9244099B2 (en) 2011-05-09 2016-01-26 Cascade Microtech, Inc. Probe head assemblies, components thereof, test systems including the same, and methods of operating the same
US20120286818A1 (en) * 2011-05-11 2012-11-15 Qualcomm Incorporated Assembly for optical backside failure analysis of wire-bonded device during electrical testing
CN103454571B (en) * 2012-05-30 2017-10-27 富泰华工业（深圳）有限公司 Test system, method of testing and the test equipment using the test system
TWI522621B (en) * 2013-12-13 2016-02-21 Mpi Corp Test fixture
JP6525831B2 (en) * 2015-09-15 2019-06-05 株式会社ヨコオ Contact unit and inspection jig
US10361099B2 (en) * 2017-06-23 2019-07-23 Applied Materials, Inc. Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems
US10705134B2 (en) * 2017-12-04 2020-07-07 International Business Machines Corporation High speed chip substrate test fixture
CN108672311B (en) * 2018-05-09 2020-06-05 信丰达诚科技有限公司 An automatic test device for finished products used in the production of electrical circuit boards
KR102066678B1 (en) * 2019-10-30 2020-01-15 김재길 Bump film type probe card
CN117397024A (en) * 2021-06-09 2024-01-12 三菱电机株式会社 Inspection equipment for optical semiconductor devices
CN113406461A (en) * 2021-08-02 2021-09-17 广东电网有限责任公司湛江供电局 Distribution lines insulation detection device
US12019097B2 (en) * 2021-08-30 2024-06-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method for forming probe head structure
CN114200278B (en) * 2021-11-29 2022-12-27 强一半导体（苏州）有限公司 Film probe card and probe head thereof
IT202200012032A1 (en) * 2022-06-07 2023-12-07 Technoprobe Spa Improved measuring system for testing high-frequency devices
KR102830441B1 (en) * 2023-05-04 2025-07-08 (주) 지엘피 Film-type probe unit and manufacturing method thereof
US12306243B2 (en) 2023-06-12 2025-05-20 Formfactor, Inc. Space transformers configured to be utilized in a probe system, probe systems that include the space transformers, and related methods
KR102820676B1 (en) * 2023-06-15 2025-06-16 주식회사 프로이천 Film-type probe unit and manufacturing method thereof
TWI868842B (en) * 2023-08-04 2025-01-01 漢民測試系統股份有限公司 Adjustable supporting device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6439559A (en) * 1987-08-06 1989-02-09 Nec Corp Probe card
JPH02210269A (en) * 1988-10-25 1990-08-21 Tokyo Electron Ltd Probe device
JPH03120474A (en) * 1989-10-02 1991-05-22 Nippon Denshi Zairyo Kk Probe card
JPH0529406A (en) * 1991-07-18 1993-02-05 Mitsubishi Electric Corp Semiconductor inspection equipment
JPH0758165A (en) * 1991-12-28 1995-03-03 Hoya Corp Circuit inspecting element with probe, and manufacture thereof
JPH07288271A (en) * 1994-04-19 1995-10-31 Aging Tesuta Kaihatsu Kyodo Kumiai Measuring electrodes for integrated circuits

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4743029Y1 (en) 1969-07-25 1972-12-26
US3902003A (en) * 1974-05-20 1975-08-26 Rca Corp Electrical device with electrode connections
JPS60260861A (en) 1984-06-08 1985-12-24 Hitachi Ltd probe
US4747784A (en) * 1986-05-16 1988-05-31 Daymarc Corporation Contactor for integrated circuits
US4954875A (en) * 1986-07-17 1990-09-04 Laser Dynamics, Inc. Semiconductor wafer array with electrically conductive compliant material
JPH0657476B2 (en) * 1987-03-27 1994-08-03 三菱電機株式会社 IC card external device connector
JP2702507B2 (en) 1988-05-31 1998-01-21 キヤノン株式会社 Electrical connection member and method of manufacturing the same
JPH02126160A (en) 1988-09-28 1990-05-15 Hewlett Packard Co <Hp> Test probe
US4906920A (en) 1988-10-11 1990-03-06 Hewlett-Packard Company Self-leveling membrane probe
US5055778A (en) 1989-10-02 1991-10-08 Nihon Denshizairyo Kabushiki Kaisha Probe card in which contact pressure and relative position of each probe end are correctly maintained
JPH04297050A (en) 1991-03-12 1992-10-21 Mitsubishi Electric Corp Semiconductor inspection apparatus and preparation of its plane substrate
JPH05226430A (en) 1992-02-10 1993-09-03 Nitto Denko Corp Probe card body structure and manufacturing method thereof
EP0544305A3 (en) 1991-11-28 1993-10-06 Nitto Denko Corporation Method of forming a contact bump using a composite film
US5180977A (en) 1991-12-02 1993-01-19 Hoya Corporation Usa Membrane probe contact bump compliancy system
JP3113089B2 (en) * 1992-09-14 2000-11-27 株式会社東芝 Wiring board
JPH06291239A (en) 1993-04-06 1994-10-18 Fujitsu Ltd Manufacture of semiconductor device
JPH0737935A (en) 1993-07-16 1995-02-07 Matsushita Electric Ind Co Ltd Flip chip mounting method
KR0140034B1 (en) 1993-12-16 1998-07-15 모리시다 요이치 Semiconductor wafer storage device, connection method between integrated circuit terminal and probe terminal for inspection of semiconductor wafer and apparatus therefor, inspection method for semiconductor integrated circuit, probe card and manufacturing method thereof
JP3658029B2 (en) 1994-02-21 2005-06-08 株式会社ルネサステクノロジ Connection apparatus and manufacturing method thereof
JP2978720B2 (en) 1994-09-09 1999-11-15 東京エレクトロン株式会社 Probe device
EP0779989A4 (en) 1994-09-09 1998-01-07 Micromodule Systems Inc Membrane probing of circuits
JP2689938B2 (en) 1995-02-14 1997-12-10 日本電気株式会社 Probe card
JP2691875B2 (en) 1995-02-14 1997-12-17 日本電子材料株式会社 Probe card and method of manufacturing probe used therein
JPH08316641A (en) 1995-05-12 1996-11-29 Hitachi Ltd Multi-layer wiring board by batch connection method
JP3838381B2 (en) * 1995-11-22 2006-10-25 株式会社アドバンテスト Probe card
US5707881A (en) * 1996-09-03 1998-01-13 Motorola, Inc. Test structure and method for performing burn-in testing of a semiconductor product wafer
JPH1123615A (en) * 1997-05-09 1999-01-29 Hitachi Ltd Connection device and inspection system
JP3315339B2 (en) * 1997-05-09 2002-08-19 株式会社日立製作所 Method for manufacturing semiconductor device, method for probing to semiconductor device, and apparatus therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6439559A (en) * 1987-08-06 1989-02-09 Nec Corp Probe card
JPH02210269A (en) * 1988-10-25 1990-08-21 Tokyo Electron Ltd Probe device
JPH03120474A (en) * 1989-10-02 1991-05-22 Nippon Denshi Zairyo Kk Probe card
JPH0529406A (en) * 1991-07-18 1993-02-05 Mitsubishi Electric Corp Semiconductor inspection equipment
JPH0758165A (en) * 1991-12-28 1995-03-03 Hoya Corp Circuit inspecting element with probe, and manufacture thereof
JPH07288271A (en) * 1994-04-19 1995-10-31 Aging Tesuta Kaihatsu Kyodo Kumiai Measuring electrodes for integrated circuits

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2812400A1 (en) * 2000-07-28 2002-02-01 Mesatronic METHOD FOR MANUFACTURING A MULTIPLE CONTACT POINT CARD FOR TESTING MICROBALL INTEGRATED CIRCUITS, AND TEST DEVICE USING THE CARD
WO2002010779A1 (en) * 2000-07-28 2002-02-07 Mesatronic Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card
US6873145B2 (en) 2000-07-28 2005-03-29 Mesatronic Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card
KR100798669B1 (en) * 2000-07-28 2008-01-28 메사트로닉 How to manufacture a card with multiple contact tips for testing microsphere integrated circuits and how to test the device using the card
US7688086B2 (en) 2005-11-11 2010-03-30 Renesas Technology Corp. Fabrication method of semiconductor integrated circuit device and probe card
TWI480974B (en) * 2012-05-31 2015-04-11 Mitsubishi Electric Corp Method for manufacturing semiconductor device and semiconductor manufacturing system
WO2019021749A1 (en) * 2017-07-24 2019-01-31 株式会社ヨコオ Inspection jig
JPWO2019021749A1 (en) * 2017-07-24 2020-05-28 株式会社ヨコオ Inspection jig
JP7240317B2 (en) 2017-07-24 2023-03-15 株式会社ヨコオ Inspection jig
CN115184650A (en) * 2022-09-14 2022-10-14 江苏玄博智能标识科技有限公司 Multi-functional intelligent sign control detection device
CN115184650B (en) * 2022-09-14 2022-12-02 江苏玄博智能标识科技有限公司 Multi-functional intelligent sign control detection device

Also Published As

Publication number Publication date
US20090209053A1 (en) 2009-08-20
US20040235207A1 (en) 2004-11-25
US20080009082A1 (en) 2008-01-10
KR100375116B1 (en) 2003-03-08
KR20010012353A (en) 2001-02-15
JPH1123615A (en) 1999-01-29
US7285430B2 (en) 2007-10-23
US7541202B2 (en) 2009-06-02
US20020129323A1 (en) 2002-09-12
US6305230B1 (en) 2001-10-23
US6759258B2 (en) 2004-07-06
KR100416675B1 (en) 2004-01-31

Similar Documents

Publication Publication Date Title
WO1998052218A1 (en) Connector and probing system
AUPO581397A0 (en) Sensor connection means
CA2197143A1 (en) Printed circuit board connector
CA2173827A1 (en) Electrosurgical hemostatic device with adaptive electrodes
ATE262775T1 (en) PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING THE SAME
DE50015101D1 (en) electrode assembly
WO2002089260A3 (en) Separable power delivery connector
EP1063733A3 (en) Apparatus for providing controlled impedance in an electrical contact
CA2224519A1 (en) Low cross talk and impedance controlled electrical connector and electrical cable assembly
JPH09130125A5 (en)
EP1031840A3 (en) Electric resistance measuring apparatus and method for circuit board
AU2001294958A1 (en) Floating electrode
CA2226445A1 (en) Method and assembly of member and terminal
EP0374648A3 (en) Device for the connexion of an electric cable
EP0413335A3 (en) Method of mutually connecting electrode terminals
AU2176801A (en) Electrical test of the interconnection of conductors on a substrate
EP0735623A3 (en) Electrical connector
EP0213046A3 (en) Electronic card connecting circuit
WO2005004977A3 (en) Multi-configuration defibrillation connector
EP1479274A2 (en) Laminated socket contacts
US4643497A (en) Device and method for connecting a printed circuit film
CA2176294A1 (en) Method and apparatus to sense changes in the state of a resin bed
WO2003085783A3 (en) Rolling electrical transfer coupling improvements
ATE348428T1 (en) ELECTRICAL CONNECTION ARRANGEMENT OF AN ELECTRICAL APPARATUS WITH A MODULAR CONNECTION CAME OR SIMILAR
WO1998029157A3 (en) Device for the delivery of a substance to a subject and improved electrode assembly

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN KR SG US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 09423385

Country of ref document: US

Ref document number: 1019997010305

Country of ref document: KR

122 Ep: pct application non-entry in european phase
WWP Wipo information: published in national office

Ref document number: 1019997010305

Country of ref document: KR

WWG Wipo information: grant in national office

Ref document number: 1019997010305

Country of ref document: KR