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WO1998049875A1 - Method of attaching metallic objects to a printed circuit board - Google Patents

Method of attaching metallic objects to a printed circuit board Download PDF

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Publication number
WO1998049875A1
WO1998049875A1 PCT/US1998/004013 US9804013W WO9849875A1 WO 1998049875 A1 WO1998049875 A1 WO 1998049875A1 US 9804013 W US9804013 W US 9804013W WO 9849875 A1 WO9849875 A1 WO 9849875A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
flange
solder paste
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1998/004013
Other languages
French (fr)
Inventor
Patrick Masterton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to JP54695498A priority Critical patent/JP2001522532A/en
Priority to BR9807963-8A priority patent/BR9807963A/en
Publication of WO1998049875A1 publication Critical patent/WO1998049875A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/042—Remote solder depot on the PCB, the solder flowing to the connections from this depot
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to soldering components, and more specifically, to soldering metallic objects to printed circuit boards.
  • PCB Printed Circuit Board
  • the soldering process of the prior art has at least two problems.
  • the first problem is that voids are created between the attaching surfaces of the metallic flange and the PCB.
  • the second problem is that, in order to properly solder the metallic flange and other components to the PCB, at least two steps of heating are required.
  • the first heating step only the flange is soldered to the PCB.
  • the second heating step other smaller components are soldered to the PCB with solder having a low melting temperature.
  • the low melting temperature of the solder in the second step allows application of heat to the PCB for a second time without reflowing the solder used in the first step. Nevertheless, the first application of heat at high temperature to the PCB burns a solder resist layer on the top layer of the PCB.
  • this second step is not only an excessive step, but is also inefficient and/or ineffective.
  • solder 1 is comprised of placing, between a flange 102 and a PCB 103, a thin layer of solder 101 which is performed to the actual shape and size of the flange. Next, heat is applied to flange 102 and PCB 103 until performed solder 101 is melted between the surfaces of PCB 103 and flange 102. When this soldering method is used, however, voids are created between PCB 103 and flange 102. Voids are created because a solder flux component of solder 101 converts to gas before a solder alloy in solder 101 melts. The created gas traps between the surfaces of PCB 103 and flange 102 and creates the voids. The end result is that a uniform solder attachment is prevented which gready compromises the electrical grounding properties and conduction of heat away from the power amplifier attached to flange 102.
  • FIG. 1 generally depicts the soldering process of the prior art.
  • FIG. 2 generally depicts attachment of a flange and a PCB having apertures, according to an embodiment of the present invention.
  • FIG. 3 generally depicts an aperture that has been filled with solder paste before the heating process, according to an embodiment of the present invention.
  • FIG. 4 generally depicts the aperture shown in FIG. 3 after the heating process, according to an embodiment of the present invention.
  • the Preferred Embodiment of the Present Invention is the Preferred Embodiment of the Present Invention
  • a single-step heating application for soldering a metallic flange and other components to a printed circuit board includes one or more through apertures where solder paste is dispensed, and is heated with the metallic flange and otiier components.
  • the apertures holding the solder paste have walls of non-metallic surfaces where solder is repelled during the heating process such that the solder flows to an area where die surfaces of the flange and the printed circuit board are being soldered.
  • a printed circuit board having a first and second side and at least one aperture for holding solder paste and a metallic flange coupled to the second side of the printed circuit board by the solder paste which is flushed out of die aperture during heating of the printed circuit board and die flange.
  • the aperture of d e printed circuit board is covered with a non-metallic surface which allows the solder paste to be flushed out during heating.
  • the first side of the printed circuit board includes a rim around the aperture, the rim being comprised of a non-metallic material which prevents die solder paste from attaching to a component near the rim.
  • printed circuit board has a plurality of apertures which are circular, the apertures can either have substantially die same diameter or substantially different diameters.
  • a mediod of soldering a metallic flange to a printed circuit board includes the steps of dispensing solder paste into an aperture located on the printed circuit board, where the printed circuit board has a first and second side.
  • the flange is coupled to the second side of the printed circuit board and the printed circuit board and d e attached flange are dien heated such that the solder paste within the aperture is melted and wicked between die second side of the printed circuit board and die metallic flange.
  • the method further includes the step of coupling, prior to die step of heating, components to the first side of the printed circuit board with die solder paste such that die components are also attached to die printed circuit board after d e step of heating.
  • An apparatus is manufactured utilizing die steps of dispensing solder paste into an aperture located on die printed circuit board, where die printed circuit board has a first and second side.
  • the flange is coupled to the second side of the printed circuit board, and die printed circuit board and die attached flange are ien heated such diat die solder paste within die aperture is melted and wicked between d e second side of die printed circuit board and die metallic flange.
  • FIG. 2 generally depicts attachment of a metallic flange 202 and a printed circuit board (PCB) 201 having apertures 203 in accordance with the invention.
  • PCB 201 has several apertures 203 in the area where flange 202 is attached.
  • apertures 203 are circular and each have substantially die same diameter.
  • die apertures can be of substantially different diameters or can also be in any particular shape.
  • Apertures 203 have no metallic surfaces at ti eir rim or d e walls of dieir cavity and are drilled to penetrate PCB 201 from a first side 204 to a second side 205 to which metallic flange 202 is attached.
  • a solder resist is applied such that die solder is not attached to die rim or surrounding area, or to otiier components near apertures 203, during the heating process.
  • the process of attaching metallic flange 202 to PCB 201 begins by coupling flange 202 to PCB 201 through any number of processes, for example, either a clamp, press fit or a chemical attachment such as glue. Then, with reference to FIG. 3, apertures 203 are filled with solder paste 305. Solder paste 305 can be put into apertures 203 first, then PCB 201 can be coupled to metallic flange 202 in an alternate embodiment. Solder paste 305 essentially comprises a solder alloy and solder flux which melts before die solder alloy in solder paste 305. Heat is then applied such tiiat solder paste 305 melts and wicks into a gap 306 between PCB 201 and metallic flange 202. As shown in FIG.
  • solder paste 305 is essentially flushed from apertures 203.
  • solder paste 305 dispensed in apertures 203 is melted to flow down apertures 203 and move to gap 306 between flange 202 and PCB 201.
  • Any gas generated from flux escapes via the sides of PCB 201 or first side 204 of PCB 201 at apertures 203. As such, the gas from die flux is not trapped, and a uniform solder attachment is formed between PCB 201 and flange 202 as shown in FIG. 4 in accordance with die invention.
  • solder resist 304 on first side 204 of PCB 201 is placed at the rim of apertures 203 and the apertures 203 tiiemselves are covered witii a non-metallic surface which allows solder paste 305 to be flushed out during die heating process.
  • the dispensing of solder paste 305 is done at normal temperature and die melting of solder paste 305 begins without excessive heat application, which prevents a substantial rise in temperature above the melting point of solder paste 305. Therefore, other components, for example component 309, can be attached to first side 204 of PCB 201 by attaching component 309 with solder paste 305 and heating component 309, PCB 201 and metallic flange 202 with a single step in accordance with invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A single-step heating application for soldering a metallic flange (202) and other components (309) to a printed circuit board (201) is disclosed. Printed circuit board (201) includes one or more through apertures (203) where a solder paste (305) is dispensed, and is heated with metallic flange (202) and other components (309). The apertures (203) holding solder paste (305) have walls of non-metallic surfaces where solder is repelled during the heating process such that the solder flows to an area where the surfaces of metallic flange (202) and printed circuit board (201) are being soldered.

Description

Method of Attaching Metallic Objects to a Printed Circuit Board
Field of the Invention
The present invention relates to soldering components, and more specifically, to soldering metallic objects to printed circuit boards.
Background of the Invention
Metallic objects, like metallic flanges, are soldered to a Printed Circuit Board (PCB) for a number of reasons. One of the reasons is for attaching a power amplifier to the metallic flange which then operates as a heat sink for the power amplifier, and provides circuit ground for the amplifier. Therefore, the flange must be soldered to the PCB in a manner which the circuit ground and conduction of heat away from the power amplifier are not compromised.
For soldering a metallic flange to a PCB, the soldering process of the prior art has at least two problems. The first problem is that voids are created between the attaching surfaces of the metallic flange and the PCB. The second problem is that, in order to properly solder the metallic flange and other components to the PCB, at least two steps of heating are required.
In the first heating step, only the flange is soldered to the PCB. In the second heating step, other smaller components are soldered to the PCB with solder having a low melting temperature. The low melting temperature of the solder in the second step allows application of heat to the PCB for a second time without reflowing the solder used in the first step. Nevertheless, the first application of heat at high temperature to the PCB burns a solder resist layer on the top layer of the PCB. As such, this second step is not only an excessive step, but is also inefficient and/or ineffective. The soldering process of the prior art, with reference to FIG. 1, is comprised of placing, between a flange 102 and a PCB 103, a thin layer of solder 101 which is performed to the actual shape and size of the flange. Next, heat is applied to flange 102 and PCB 103 until performed solder 101 is melted between the surfaces of PCB 103 and flange 102. When this soldering method is used, however, voids are created between PCB 103 and flange 102. Voids are created because a solder flux component of solder 101 converts to gas before a solder alloy in solder 101 melts. The created gas traps between the surfaces of PCB 103 and flange 102 and creates the voids. The end result is that a uniform solder attachment is prevented which gready compromises the electrical grounding properties and conduction of heat away from the power amplifier attached to flange 102.
Therefore, there is a need for a method of soldering a metallic flange and other components to a PCB which overcomes the deficiencies of the prior art method.
Brief Description of the Drawings
FIG. 1 generally depicts the soldering process of the prior art.
FIG. 2 generally depicts attachment of a flange and a PCB having apertures, according to an embodiment of the present invention.
FIG. 3 generally depicts an aperture that has been filled with solder paste before the heating process, according to an embodiment of the present invention.
FIG. 4 generally depicts the aperture shown in FIG. 3 after the heating process, according to an embodiment of the present invention. The Preferred Embodiment of the Present Invention
Stated generally, a single-step heating application for soldering a metallic flange and other components to a printed circuit board is disclosed. The printed circuit board includes one or more through apertures where solder paste is dispensed, and is heated with the metallic flange and otiier components. The apertures holding the solder paste have walls of non-metallic surfaces where solder is repelled during the heating process such that the solder flows to an area where die surfaces of the flange and the printed circuit board are being soldered.
Stated more specifically, a printed circuit board having a first and second side and at least one aperture for holding solder paste and a metallic flange coupled to the second side of the printed circuit board by the solder paste which is flushed out of die aperture during heating of the printed circuit board and die flange. The aperture of d e printed circuit board is covered with a non-metallic surface which allows the solder paste to be flushed out during heating. The first side of the printed circuit board includes a rim around the aperture, the rim being comprised of a non-metallic material which prevents die solder paste from attaching to a component near the rim. In the preferred embodiment, printed circuit board has a plurality of apertures which are circular, the apertures can either have substantially die same diameter or substantially different diameters.
A mediod of soldering a metallic flange to a printed circuit board includes the steps of dispensing solder paste into an aperture located on the printed circuit board, where the printed circuit board has a first and second side. Next, the flange is coupled to the second side of the printed circuit board and the printed circuit board and d e attached flange are dien heated such that the solder paste within the aperture is melted and wicked between die second side of the printed circuit board and die metallic flange. The method further includes the step of coupling, prior to die step of heating, components to the first side of the printed circuit board with die solder paste such that die components are also attached to die printed circuit board after d e step of heating.
An apparatus is manufactured utilizing die steps of dispensing solder paste into an aperture located on die printed circuit board, where die printed circuit board has a first and second side. Next, the flange is coupled to the second side of the printed circuit board, and die printed circuit board and die attached flange are ien heated such diat die solder paste within die aperture is melted and wicked between d e second side of die printed circuit board and die metallic flange.
FIG. 2 generally depicts attachment of a metallic flange 202 and a printed circuit board (PCB) 201 having apertures 203 in accordance with the invention. As shown in FIG. 2, PCB 201 has several apertures 203 in the area where flange 202 is attached. In d e preferred embodiment, apertures 203 are circular and each have substantially die same diameter. One skilled in the art will appreciate that die apertures can be of substantially different diameters or can also be in any particular shape. Apertures 203 have no metallic surfaces at ti eir rim or d e walls of dieir cavity and are drilled to penetrate PCB 201 from a first side 204 to a second side 205 to which metallic flange 202 is attached. At the rim of apertures 203, a solder resist is applied such that die solder is not attached to die rim or surrounding area, or to otiier components near apertures 203, during the heating process.
The process of attaching metallic flange 202 to PCB 201 begins by coupling flange 202 to PCB 201 through any number of processes, for example, either a clamp, press fit or a chemical attachment such as glue. Then, with reference to FIG. 3, apertures 203 are filled with solder paste 305. Solder paste 305 can be put into apertures 203 first, then PCB 201 can be coupled to metallic flange 202 in an alternate embodiment. Solder paste 305 essentially comprises a solder alloy and solder flux which melts before die solder alloy in solder paste 305. Heat is then applied such tiiat solder paste 305 melts and wicks into a gap 306 between PCB 201 and metallic flange 202. As shown in FIG. 4, solder paste 305 is essentially flushed from apertures 203. Using die apertures in accordance witii the invention, solder paste 305 dispensed in apertures 203 is melted to flow down apertures 203 and move to gap 306 between flange 202 and PCB 201. Any gas generated from flux escapes via the sides of PCB 201 or first side 204 of PCB 201 at apertures 203. As such, the gas from die flux is not trapped, and a uniform solder attachment is formed between PCB 201 and flange 202 as shown in FIG. 4 in accordance with die invention.
As shown in FIG. 3, solder resist 304 on first side 204 of PCB 201 is placed at the rim of apertures 203 and the apertures 203 tiiemselves are covered witii a non-metallic surface which allows solder paste 305 to be flushed out during die heating process. The dispensing of solder paste 305 is done at normal temperature and die melting of solder paste 305 begins without excessive heat application, which prevents a substantial rise in temperature above the melting point of solder paste 305. Therefore, other components, for example component 309, can be attached to first side 204 of PCB 201 by attaching component 309 with solder paste 305 and heating component 309, PCB 201 and metallic flange 202 with a single step in accordance with invention.
While die invention has been particularly shown and described with reference to a particular embodiment, it will be understood by diose skilled in d e art that various changes in form and details may be made dierein without departing from the spirit and scope of d e invention. The corresponding structures, materials, acts and equivalents of all means or step plus function elements in d e claims below are intended to include any structure, material, or acts for performing the functions in combination with otiier claimed elements as specifically claimed.

Claims

What is claimed is:Claims
1. An apparatus comprising:
printed circuit board having a first and second side and at least one aperture for holding solder paste; and a metallic flange coupled to said second side of the printed circuit board by said solder paste which is flushed out of said aperture during heating of die printed circuit board and the flange.
2. The apparatus of claim 1, wherein said aperture of said printed circuit board is covered witii a non-metallic surface which allows said solder paste to be flushed out during heating.
3. The apparatus of claim 1 , wherein said first side of said printed circuit board includes a rim around said aperture, said rim comprised of a non-metallic material which prevents said solder paste from attaching to a component near said rim.
4. The apparatus of claim 1 , wherein said printed circuit board has a plurality of said apertures.
5. The apparatus of claim 4, wherein said plurality of apertures are circular witii substantially the same diameter.
6. The apparatus of claim 4, wherein said plurality of apertures are circular with substantially different diameters.
7. A method of soldering a metallic flange to a printed circuit board, the mediod comprising the steps of:
dispensing solder paste into an aperture located on said printed circuit board, said printed circuit board having a first and second side; coupling said flange to said second side of said printed circuit board; and heating said printed circuit board and said attached flange such tiiat said solder paste within said aperture is melted and wicked between said second side of said printed circuit board and said metallic flange.
8. The method of claim 7, further comprising the step of coupling, prior to the step of heating, components to said first side of said printed circuit board with said solder paste such diat said components are also attached to said printed circuit board after the step of heating.
9. An apparatus manufactured utilizing the following steps:
dispensing solder paste into an aperture located on a printed circuit board, said printed circuit board having a first and second side; coupling a flange to said second side of said printed circuit board; and heating said printed circuit board and said attached flange such that said solder paste witiiin said aperture is melted and wicked between said second side of said printed circuit board and said metallic flange to produce said apparatus.
PCT/US1998/004013 1997-04-30 1998-03-02 Method of attaching metallic objects to a printed circuit board Ceased WO1998049875A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP54695498A JP2001522532A (en) 1997-04-30 1998-03-02 How to attach metal objects to a printed circuit board
BR9807963-8A BR9807963A (en) 1997-04-30 1998-03-02 Apparatus and method of welding a metal flange to a printed circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84636197A 1997-04-30 1997-04-30
US08/846,361 1997-04-30

Publications (1)

Publication Number Publication Date
WO1998049875A1 true WO1998049875A1 (en) 1998-11-05

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ID=25297695

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/004013 Ceased WO1998049875A1 (en) 1997-04-30 1998-03-02 Method of attaching metallic objects to a printed circuit board

Country Status (4)

Country Link
JP (1) JP2001522532A (en)
CN (1) CN1254493A (en)
BR (1) BR9807963A (en)
WO (1) WO1998049875A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1027632C2 (en) * 2004-12-01 2006-06-02 Electrische App Nfabriek Capax Support for electrical components with insulated heat sink.
EP1671524A4 (en) * 2003-10-02 2009-08-05 Motorola Inc Electrical circuit apparatus and method for assembling same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10126655A1 (en) * 2001-06-01 2002-12-05 Endress & Hauser Gmbh & Co Kg Circuit board for electronic equipment, has electronic component on first surface with first and second contact surfaces connected by solder or adhesive to first and second contact points with access to track
CN104741725B (en) * 2013-12-27 2017-03-22 博世汽车部件(苏州)有限公司 Welding tool

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0492311A (en) * 1990-08-06 1992-03-25 Fujikura Ltd Flat cable with extra solder embedded therein and manufacture thereof
JPH06152092A (en) * 1992-11-10 1994-05-31 Murata Mfg Co Ltd Surface-mount type printed circuit board assembly

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0492311A (en) * 1990-08-06 1992-03-25 Fujikura Ltd Flat cable with extra solder embedded therein and manufacture thereof
JPH06152092A (en) * 1992-11-10 1994-05-31 Murata Mfg Co Ltd Surface-mount type printed circuit board assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1671524A4 (en) * 2003-10-02 2009-08-05 Motorola Inc Electrical circuit apparatus and method for assembling same
NL1027632C2 (en) * 2004-12-01 2006-06-02 Electrische App Nfabriek Capax Support for electrical components with insulated heat sink.
WO2006059907A3 (en) * 2004-12-01 2006-11-30 Capax Bv Electrische Apparatenfabriek Carrier for electrical components with soldered-on cooling body

Also Published As

Publication number Publication date
CN1254493A (en) 2000-05-24
JP2001522532A (en) 2001-11-13
BR9807963A (en) 2000-03-08

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