[go: up one dir, main page]

WO1998049646A3 - Dynamically reconfigurable assembly line for electronic products - Google Patents

Dynamically reconfigurable assembly line for electronic products Download PDF

Info

Publication number
WO1998049646A3
WO1998049646A3 PCT/US1998/008811 US9808811W WO9849646A3 WO 1998049646 A3 WO1998049646 A3 WO 1998049646A3 US 9808811 W US9808811 W US 9808811W WO 9849646 A3 WO9849646 A3 WO 9849646A3
Authority
WO
WIPO (PCT)
Prior art keywords
controller
conveyor
production line
reflow oven
stations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1998/008811
Other languages
French (fr)
Other versions
WO1998049646A2 (en
Inventor
Ka Tiek Lim
Hun Chiang Lim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/846,451 external-priority patent/US6104965A/en
Priority claimed from US08/933,319 external-priority patent/US6378200B1/en
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to AU72731/98A priority Critical patent/AU7273198A/en
Publication of WO1998049646A2 publication Critical patent/WO1998049646A2/en
Publication of WO1998049646A3 publication Critical patent/WO1998049646A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/085Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32019Dynamic reconfiguration to maintain optimal design, fabrication, assembly
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32297Adaptive scheduling, feedback of actual proces progress to adapt schedule
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32305Fastest interrupt time, change jobs dynamically to fastest machine
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45035Printed circuit boards, also holes to be drilled in a plate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Operations Research (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A method of reconfiguring a production line for fabricating printed circuit board assemblies to achieve maximum efficiency and maximum flexibility is disclosed. The production line has one or more placement stations (16, 18, 20), a reflow oven (22), a conveyor (24) and a controller (30). The controller communicates with the various components (placement stations, reflow oven, conveyor) of the production line to transfer information related to the state of assembly of some of the printed circuit board assemblies (15, 17, 19) that are being processed. The controller also communicates information related to the status of the various other stations. The operational functionality of one or more of the placement stations, the reflow oven, or the conveyor is altered in response to the communication by the controller. Other remaining modules continue operation unaltered during this step of dynamic reconfiguration.
PCT/US1998/008811 1997-05-01 1998-05-01 Dynamically reconfigurable assembly line for electronic products Ceased WO1998049646A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU72731/98A AU7273198A (en) 1997-05-01 1998-05-01 Dynamically reconfigurable assembly line for electronic products

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/846,451 US6104965A (en) 1997-05-01 1997-05-01 Control of workstations in assembly lines
US08/846,451 1997-05-01
US08/933,319 1997-09-18
US08/933,319 US6378200B1 (en) 1997-09-18 1997-09-18 Dynamically reconfigurable assembly line for electronic products

Publications (2)

Publication Number Publication Date
WO1998049646A2 WO1998049646A2 (en) 1998-11-05
WO1998049646A3 true WO1998049646A3 (en) 1999-02-04

Family

ID=27126639

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/008811 Ceased WO1998049646A2 (en) 1997-05-01 1998-05-01 Dynamically reconfigurable assembly line for electronic products

Country Status (2)

Country Link
AU (1) AU7273198A (en)
WO (1) WO1998049646A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020143423A1 (en) * 2000-07-06 2002-10-03 Robert Huber Scheduling system for an electronics manufacturing plant
GB2372884B (en) * 2001-02-28 2005-01-05 Speedprint Ltd Multifunction machine and method of forming a control interface
US7043321B2 (en) * 2004-05-27 2006-05-09 Palo Alto Research Center Incorporated Exception handling in manufacturing systems combining on-line planning and predetermined rules
WO2006080366A2 (en) * 2005-01-27 2006-08-03 Matsushita Electric Industrial Co., Ltd. Monitoring method, monitoring apparatus, and mounter
EP1842116A1 (en) * 2005-01-27 2007-10-10 Siemens Aktiengesellschaft System for the rapid adjustment of industrial processes
DE102008019102A1 (en) * 2008-04-16 2009-10-29 Siemens Aktiengesellschaft Arrangement for transporting substrates, arrangement for handling substrates, arrangement for producing electronic assemblies and methods for handling substrates
WO2011121779A1 (en) * 2010-03-31 2011-10-06 富士通株式会社 Multichip module, printed wiring board unit, method for manufacturing multichip module, and method for manufacturing printed wiring board unit
EP2840600B1 (en) * 2013-08-22 2023-04-12 Robert Bosch GmbH Process station for a machine as well as control device and control method for controlling a movement in a process of a machine
DE102018133183B4 (en) * 2018-12-20 2020-07-09 Asm Assembly Systems Gmbh & Co. Kg Process for controlling an assembly process of automatic placement machines, electronic control of automatic placement machines, automatic placement machine and system for controlling a production line in the circuit board production
CN110827652B (en) * 2019-11-29 2021-06-01 无锡职业技术学院 Practical training platform for technical application of multifunctional industrial robot
CN117525694B (en) * 2023-10-12 2024-07-09 惠州久久犇科技有限公司 Automatic packaging equipment for fireproof heat-insulating sheet of battery

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5104621A (en) * 1986-03-26 1992-04-14 Beckman Instruments, Inc. Automated multi-purpose analytical chemistry processing center and laboratory work station
US5170554A (en) * 1990-09-28 1992-12-15 Hewlett-Packard Company High mix printed circuit assembly technique
US5258915A (en) * 1990-09-28 1993-11-02 Hewlett-Packard Company System and method for optimum operation assignments in printed circuit board manufacturing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5104621A (en) * 1986-03-26 1992-04-14 Beckman Instruments, Inc. Automated multi-purpose analytical chemistry processing center and laboratory work station
US5170554A (en) * 1990-09-28 1992-12-15 Hewlett-Packard Company High mix printed circuit assembly technique
US5258915A (en) * 1990-09-28 1993-11-02 Hewlett-Packard Company System and method for optimum operation assignments in printed circuit board manufacturing

Also Published As

Publication number Publication date
WO1998049646A2 (en) 1998-11-05
AU7273198A (en) 1998-11-24

Similar Documents

Publication Publication Date Title
WO2001033927A8 (en) Inter-circuit encapsulated packaging for power delivery
AU5495998A (en) Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
WO1998049646A3 (en) Dynamically reconfigurable assembly line for electronic products
AU2003229558A1 (en) Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method
AU1926900A (en) Printed circuit boards with integrated passive components and method for making same
AU1687300A (en) Semiconductor chip, semiconductor device, circuit board and electronic equipmentand production methods for them
AU7374787A (en) Process for making substrates for printed circuit boards
WO2001065344A3 (en) Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
MY131914A (en) Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
HUP9700597A1 (en) Printed circut board and method for the precise assembly and soldering of electronic componets on the surface of the printed circuit board
EP0914029A3 (en) Modular automation apparatus and unit for a modular automation apparatus
CA2252866A1 (en) Surface mount assembly for electronic components
WO1998057357A3 (en) Multiple board package employing solder balls and fabrication method and apparatus
TW360899B (en) Method for mounting terminal on circuit board and circuit board
EP0681418A3 (en) Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere.
AU5332098A (en) Method of making a printed circuit board having a tin/lead coating
AU4237197A (en) Pattern plating method for fabricating printed circuit boards
WO1999034413A3 (en) Integrated bus controller and terminating chip
CN210183797U (en) Material frame PCB temporary storage mechanism in middle of both sides lift track
EP1094692A3 (en) Printed circuit board and manufacturing process thereof
DE50110454D1 (en) MANUFACTURING LINE FOR ONE-SIDED AND DOUBLE-SIDED FITTING OF PCB
AU6420598A (en) Circuit board and production method thereof
EP0676914A3 (en) Method of constructing high yield, fine line, multilayer printed wiring board panel.
AU3192201A (en) Radiocommunication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard
GB9904255D0 (en) A method for tracking printed circuit boards on multi-board panels through a production process

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GE GH GM GW HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK TJ TM TR TT UA UG UZ VN YU

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN ML MR NE SN TD TG

AK Designated states

Kind code of ref document: A3

Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GE GH GM GW HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK TJ TM TR TT UA UG UZ VN YU

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

NENP Non-entry into the national phase

Ref country code: JP

Ref document number: 1998547422

Format of ref document f/p: F

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: CA