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WO1998045740A1 - Dispositif de connexion d'elements optiques et procede correspondant - Google Patents

Dispositif de connexion d'elements optiques et procede correspondant Download PDF

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Publication number
WO1998045740A1
WO1998045740A1 PCT/CH1998/000090 CH9800090W WO9845740A1 WO 1998045740 A1 WO1998045740 A1 WO 1998045740A1 CH 9800090 W CH9800090 W CH 9800090W WO 9845740 A1 WO9845740 A1 WO 9845740A1
Authority
WO
WIPO (PCT)
Prior art keywords
elements
optical
insert
carrier unit
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CH1998/000090
Other languages
German (de)
English (en)
Inventor
Helmut Schift
Jürgen Soechtig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Scherrer Paul Institut
Original Assignee
Scherrer Paul Institut
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Scherrer Paul Institut filed Critical Scherrer Paul Institut
Publication of WO1998045740A1 publication Critical patent/WO1998045740A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps

Definitions

  • the present invention relates to a device according to the preamble of claim 1, the use thereof and a manufacturing method.
  • optical elements such as glass fibers, lenses, detectors and light sources is one of the main tasks in the manufacture of micro-optical units.
  • a known and frequently used coupling is that a glass fiber is butt-coupled with a laser and then cast with transparent polymer.
  • a resulting connection requires precise alignment of the elements involved with respect to several axes and is fixed with polymer after casting and can therefore no longer be changed. It is no longer possible to adapt the beam characteristic or multiply the beam by optical elements.
  • optical elements can be inserted into a space between the laser and the fiber, precise alignment must also be carried out here.
  • the present invention is therefore based on the object of specifying a device which does not have the disadvantages mentioned above. This object is achieved by the measures specified in the characterizing part of patent claim 1.
  • Advantageous embodiments of the invention, a use and a manufacturing method are specified in further claims.
  • Connecting elements that can be used for optical elements and that combine both positioning and optical functions offer significant advantages in terms of flexibility and in terms of the mutual alignment effort.
  • the device according to the invention is also particularly characterized by a repeatable alignment of the elements to be connected.
  • the manufacturing method according to the invention has the particular advantage that, once polymer replication techniques have been used, alignments that have been set can be easily reproduced.
  • Fig. 1 shows the device according to the invention in perspective view
  • Fig. 2 molded parts that are used for the production of insert elements according to the invention.
  • FIG. 1 shows a device according to the invention, consisting of a carrier unit TE with one inserted therein Fiber F and an insert element EE with an optical element OE, shown. Furthermore, an optical unit OET, for example a laser diode, can be seen on the carrier unit TE.
  • FIG. 1 The device according to the invention is shown twice in FIG. 1:
  • the left part of FIG. 1 shows a device according to the invention in which the insert element EE is not inserted into the carrier unit TE, while on the right side of FIG.
  • Insert elements EE provided support unit TE is shown. Last but not least, it is intended to clarify that the insert element EE and thus the optical element OE present on this are interchangeable.
  • a recess AN is provided transversely to an optical axis defined by the fiber F and receives the insert element EE.
  • the aforementioned optical unit OET is provided on the carrier unit TE, which also lies on the optical axis defined by the fiber F, but is located on the other side of the recess AN with respect to the fiber F.
  • the insert element EE provided with the optical element OE is used to focus the light emitted by the optical unit OET on the end face of the fiber F; designed recess AN can be optimally positioned accordingly.
  • Fig. 1 are positioning elements and corresponding counterparts that are used for the mutual alignment of
  • Insert element EE and carrier unit TE are required, not shown.
  • Such positioning elements or their counterparts consist, for example, of pins and grooves which engage one another and are used, for example, with the aid of an etching technique and / or with
  • Wire EDM technology manufactured.
  • metallic pins are produced on the one hand, preferably with the aid of the wire terion technology and grooves on the other hand with the aid of an etching technique.
  • Pins or inserted cylindrical pins or cylindrical rods can also be inserted glass fibers.
  • optical banks mentioned allow a number of so-called optical functions, which can in particular be the following:
  • Mapping functions Mapping fiber / laser / detector to fiber / laser / detector;
  • Modulation functions through z.
  • Blocking functions for example optical apertures, blackening.
  • Carrier unit TE can accommodate several fibers F and thus also several corresponding optical units OET or elements OE. In such applications it is often referred to as so-called optical banks, which are particularly useful for plug connections, e.g. Fiber connectors are used.
  • the base plate BP has surface structures OS on the side facing the intermediate plate ZP, which are used to produce optical elements OE in the insert elements EE.
  • the intermediate plate ZP preferably has the same thickness as the insert element EE to be produced and is laterally provided with the negative of further desired structures, for example positioning elements PE.
  • cover plate DP inlet holes EL through which an optically transparent plastic (for example PMMA or PC or polystyrene or polydiacetylene or BCB (benzocyclobutane) or polyurethane or transparent silicone elastomers or polysilane or polysiloxane or
  • an optically transparent plastic for example PMMA or PC or polystyrene or polydiacetylene or BCB (benzocyclobutane) or polyurethane or transparent silicone elastomers or polysilane or polysiloxane or
  • Polyimide or visible or UV or thermally curing epoxy or polyimide adhesives is filled.
  • the molded parts shown in FIG. 2, in particular the intermediate plate ZP are preferably produced using the known so-called LIGA (lithography, electroforming, molding) technology, which was developed by W. Menz and P. Bley in “Microsystem Technology for Engineers” (VCH Verlag Weinheim, 1993) or by W. Ehrfeld et. al. in "Deep x-ray lithography for the production of three-dimensional microstructures from metals, polymers and ceramics” (Radiat. Phys. Che. Vol. 45, No. 3, pages 349 to 365, 1995).
  • LIGA lithography, electroforming, molding
  • the first is the so-called diamond NC turning as a possibility of very fine mechanical
  • Laser writing is also an option for optical photolithography, electroforming and replication.
  • the article by M. T. Gale et. al. with the title “Fabrication of continuous-relief micro-optical elements by direct laser writing in photoresist” (Optical Engineering, Nov. 1994, Vol. 33, No. 11, pages 3556 to 3566).
  • the molded parts can also be produced by means of direct electron beam writing. Regarding the process, reference is made to the article by Parriaux with the title “E-beam machines write smooth optical curves" (Opto & Laser Europe, Issue 27, pages 26 to 28, March 1996).
  • optical and / or electron-optical lithography with subsequent dry etching can also be used
  • the production processes mentioned above can also be used to produce the cover plate DP deploy.
  • other fine or ultra-fine mechanical methods and / or wire erosion techniques can be used to produce ventilation nozzles or filling channels.
  • insert elements EE can now be produced with the molded parts, the required positioning elements PE and the optical elements OE, which can convey the optical functions mentioned, being produced simultaneously in the same operation.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un dispositif permettant de connecter des éléments optiques sur un substrat (TE), au moins un élément d'insertion (EE) pouvant être inséré dans le substrat (TE). Quant au substrat (TE), il présente au moins un élément de positionnement (PE). Le/les élément(s) d'insertion (EE) possède(nt) un élément correspondant (GS) pour chacun des éléments de positionnement (PE) du substrat (TE). Les éléments d'insertion (EE) présentant simultanément des éléments optiques (OE), le dispositif de l'invention convient particulièrement à la fabrication en série d'éléments optiques. L'invention concerne également un procédé de fabrication qui, basé sur la technologie LIGA (lithographie, électroformage, moulage), permet une fabrication simple et rentable des éléments d'insertion (EE).
PCT/CH1998/000090 1997-04-08 1998-03-05 Dispositif de connexion d'elements optiques et procede correspondant Ceased WO1998045740A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH811/97 1997-04-08
CH81197 1997-04-08

Publications (1)

Publication Number Publication Date
WO1998045740A1 true WO1998045740A1 (fr) 1998-10-15

Family

ID=4195737

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH1998/000090 Ceased WO1998045740A1 (fr) 1997-04-08 1998-03-05 Dispositif de connexion d'elements optiques et procede correspondant

Country Status (1)

Country Link
WO (1) WO1998045740A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004109498A (ja) * 2002-09-18 2004-04-08 Oki Electric Ind Co Ltd 光モジュール
EP1256830A3 (fr) * 2001-05-02 2005-02-09 Oki Electric Industry Company, Limited Membre optique avec dispositif de manipulation, procédé pour sa fabrication et fixation et module optique
JP2007086819A (ja) * 2007-01-05 2007-04-05 Oki Electric Ind Co Ltd 光モジュール
JP2009523264A (ja) * 2006-01-11 2009-06-18 シオプティカル インコーポレーテッド 薄型ｓｏｉｃｍｏｓ光電集積回路内への広帯域光学結合

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3227156A1 (de) * 1982-07-21 1984-01-26 ANT Nachrichtentechnik GmbH, 7150 Backnang Vorrichtung zum variablen einstellen der optischen uebertragungseigenschaften zwischen lichtwellenleitern
US4932745A (en) * 1989-07-25 1990-06-12 At&T Bell Laboratories Radiation switching arrangement with moving deflecting element
EP0565999A2 (fr) * 1992-04-16 1993-10-20 Siemens Aktiengesellschaft Dispositif de couplage optique entre deux groupes de guides d'ondes
WO1995013910A1 (fr) * 1993-11-19 1995-05-26 Donnelly Corporation Procede de reproduction d'hologrammes, de kinoformes, d'elements optiques diffractifs, de microstructures et element optique binaire plastique produit par un tel procede
WO1997002501A1 (fr) * 1995-06-30 1997-01-23 The Whitaker Corporation Chassis d'alignement passif utilisant un materiau monocristallin

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3227156A1 (de) * 1982-07-21 1984-01-26 ANT Nachrichtentechnik GmbH, 7150 Backnang Vorrichtung zum variablen einstellen der optischen uebertragungseigenschaften zwischen lichtwellenleitern
US4932745A (en) * 1989-07-25 1990-06-12 At&T Bell Laboratories Radiation switching arrangement with moving deflecting element
EP0565999A2 (fr) * 1992-04-16 1993-10-20 Siemens Aktiengesellschaft Dispositif de couplage optique entre deux groupes de guides d'ondes
WO1995013910A1 (fr) * 1993-11-19 1995-05-26 Donnelly Corporation Procede de reproduction d'hologrammes, de kinoformes, d'elements optiques diffractifs, de microstructures et element optique binaire plastique produit par un tel procede
WO1997002501A1 (fr) * 1995-06-30 1997-01-23 The Whitaker Corporation Chassis d'alignement passif utilisant un materiau monocristallin

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
WU M C ET AL: "FREE-SPACE INTEGRATED OPTICS ON A CHIP", PROCEEDINGS OF THE 22ND. INTERNATIONA SYMPOSIUM ON COMPOUND SEMICONDUCTORS, KOREA, 28 August 1995 (1995-08-28), JONG-CHUN WOO;YOON SOO PARK (EDS ), pages 1063 - 1068, XP000590399 *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1256830A3 (fr) * 2001-05-02 2005-02-09 Oki Electric Industry Company, Limited Membre optique avec dispositif de manipulation, procédé pour sa fabrication et fixation et module optique
US7016127B2 (en) 2001-05-02 2006-03-21 Oki Electric Industry Co., Ltd. Optical member with handling portion and method for manufacturing optical member and method for mounting optical member and optical module
EP1686399A1 (fr) 2001-05-02 2006-08-02 Oki Electric Industry Co., Ltd. Procédé de fabrication d'un élément optique
US7102835B2 (en) 2001-05-02 2006-09-05 Oki Electric Industry Co., Ltd. Optical member with handling portion and method for manufacturing optical member and method for mounting optical member and optical module
JP2004109498A (ja) * 2002-09-18 2004-04-08 Oki Electric Ind Co Ltd 光モジュール
JP2009523264A (ja) * 2006-01-11 2009-06-18 シオプティカル インコーポレーテッド 薄型ｓｏｉｃｍｏｓ光電集積回路内への広帯域光学結合
JP2007086819A (ja) * 2007-01-05 2007-04-05 Oki Electric Ind Co Ltd 光モジュール

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