[go: up one dir, main page]

WO1997027625A1 - Process for fitting a frame on a substrate and device for implementing it - Google Patents

Process for fitting a frame on a substrate and device for implementing it Download PDF

Info

Publication number
WO1997027625A1
WO1997027625A1 PCT/DE1997/000079 DE9700079W WO9727625A1 WO 1997027625 A1 WO1997027625 A1 WO 1997027625A1 DE 9700079 W DE9700079 W DE 9700079W WO 9727625 A1 WO9727625 A1 WO 9727625A1
Authority
WO
WIPO (PCT)
Prior art keywords
frame
carrier material
carrier
station
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1997/000079
Other languages
German (de)
French (fr)
Inventor
Helmut Graf
Jürgen Fischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO1997027625A1 publication Critical patent/WO1997027625A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/474—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially non-flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4835—Heat curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a method for mounting a frame on a carrier material according to the preamble of claim 1, i.e. a method for mounting a frame on a carrier material by gluing the frame to the carrier material by means of an adhesive having a curing time, and a device for mounting a frame on a carrier material according to the preamble of patent claim 3, i.e. a device for mounting a frame on a carrier material by gluing the frame to the carrier material by means of an adhesive having a curing time.
  • the frames mentioned are, for example, stiffening frames as are used to protect a chip in a chip card.
  • the chip and the stiffening frame protecting it are components of a chip module shown in cross section in FIG.
  • the chip module 10 shown in FIG. 4 has a carrier element 11 consisting or emerging from said carrier material, a chip 12 and a stiffening frame 13 which protects the chip.
  • the area enclosed by the stiffening frame 13 can be poured out by a casting compound, not shown in FIG. 4, for holding and / or additionally protecting the chip 12.
  • the chip module 10 is intended to be mounted (implanted) in a chip card body having a corresponding recess.
  • the carrier element 11 and the stiffening frame 13 are usually attached to one another by gluing. Various requirements meet here, the simultaneous fulfillment of which has not yet been achieved.
  • the frames must assume exactly predetermined positions and orientations on the carrier material, and, on the other hand, that the gluing should be able to be carried out at a high speed suitable for mass production.
  • the present invention is therefore based on the object of developing the method according to the preamble of patent claim 1 or the device according to the preamble of patent claim 3 in such a way that one exact and fast bonding of a carrier material with a frame to be mounted thereon is made possible.
  • the frame and the carrier material are pressed together during the curing time of the adhesive using heatable pressing elements, and that the frame and / or the carrier material are heated by the pressing elements during pressing against one another (claim 1) or at least partially heatable pressing elements are provided, which are designed in such a way that the frame and the carrier material can be pressed against one another by the pressing elements while heating the frame and / or carrier material (claim 3).
  • the curing time of the adhesive used is shortened, so that even if a high throughput is provided during production, it is not necessary to interrupt the pressing of the frame and carrier material before the adhesive has fully hardened.
  • a method and a device for carrying out the same have therefore been created, which make it possible to carry out an equally precise and rapid bonding of a carrier material with a frame to be mounted thereon.
  • FIG. 1 shows the schematic structure of an assembly system designed to carry out the method according to the invention
  • FIG. 2 shows a carrier tape frame arrangement to be produced by the assembly system according to FIG. 1,
  • FIG. 3 shows a schematic partial view of a frame assembly station of the assembly system shown in FIG. 1, and
  • FIG. 4 shows a chip module in which a (stiffening) frame bonded to a carrier element is used.
  • a carrier material in the form of a carrier tape is identified in each case by the reference number 20, and frames to be mounted thereon are designated by the reference number 25.
  • the carrier tape 20 not yet equipped with the frame 25 is available in a form rolled onto an input roller 21.
  • the carrier tape is unrolled from the input roller, passes through various work stations of the assembly system 30 shown in FIG. 1 and is finally rolled onto an output roller 22.
  • the carrier tape 20 leaving the assembly system 30 (rolled up onto the output roll 22) is equipped with a frame 25 as shown in FIG.
  • two superimposed rows of frames 25 are mounted on the carrier tape 20; the number of frame rows depends primarily on the carrier bandwidth and can of course be varied as desired.
  • the carrier tape 20 On its way through the assembly system 30, the carrier tape 20 successively passes through an adhesive application layer. tion 31, a frame assembly station 32, a position control station 33 and a reject marking station 34.
  • adhesive is stamped onto the carrier tape 20 by means of a doctor system 31a.
  • the frames 25 are correctly aligned and positioned on the carrier tape 20 and pressed together.
  • the pressing process in the frame assembly station 32 is illustrated in FIG. 3.
  • the carrier tape 20 lies on a table 40 or is moved over a table 40.
  • one or more frames 25 to be mounted on the carrier tape 20 are pressed straight onto the carrier tape 20 by a mounting head 41.
  • the table 40 and the mounting head 41 act as pressing elements which clamp the carrier tape 20 and one or more frames 25 between them and thereby press them against one another.
  • the table 40 and / or the mounting head 41 can be heated.
  • the heating devices assigned to these elements are preferably integrated in them or arranged in the immediate vicinity of the same.
  • the provision of the heatable pressing elements also makes it possible to restrict the heating of the carrier tape and / or frame selectively in terms of time and location to the respective carrier tape and / or frame sections to be heated, so that it is also very economical to use the energy is guaranteed.
  • the pressing of the carrier tape and frame shown in FIG. 3 is ended after a predetermined time, preferably after the adhesive has completely hardened.
  • the carrier tape and frame be aligned precisely in the X and Y directions, but also - regardless of any curvature of the carrier tape and / or fluctuating amounts of adhesive or adhesive distribution - the achievement of a constant Total thickness of the carrier tape-frame combination and an exact alignment in the Z direction can be achieved.
  • the carrier tape As a result of the further transport of the carrier tape, it arrives in the position control station 33, where the position of the frames on the carrier tape is checked in the X and Y directions by an image recognition system or the like.
  • the corresponding carrier tape section is specially marked in the reject marking station 33 following the position control station 33, for example by punching a so-called bad hole.
  • the carrier tape 20 provided with the frame is rolled up onto the exit roller 22 already mentioned above.
  • the frames 25 to be mounted on the carrier belt 20 are fed into the assembly plant 30 as bulk material and, by means of an oscillating conveyor 50 and a linear conveyor 51, are conveyed at the same time and to a removal station 52, where they can be picked up individually or in a matrix-like arrangement
  • Mounting head 41 already mentioned above can be provided, for example, in a matrix or the like.
  • the assembly head 41 removes one or more of the frames 25 provided in the removal station 52 and brings them to the carrier belt 20, where it can be positioned at given storage positions using an automatic detection system and, as already described above, a press Subjects operation.
  • the frames 25 can be heated or heated by the mounting head 41 as soon as they come into contact when they are removed from the removal station.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Credit Cards Or The Like (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The description relates to a process for fitting a frame (25) on a substrate (20), adhesively securing the frame to the substrate by means of an adhesive with a curing time. The process is characterised in that the frame and the substrate are pressed together during the adhesive curing time by heatable pressure devices (40, 41) and during the pressing period the frame and/or the substrate is/are heated by said pressure devices. The description also relates to a device for implementing the process.

Description

Beschreibungdescription

Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des VerfahrensMethod for mounting a frame on a carrier material and device for carrying out the method

Die vorliegende Erfindung betrifft ein Verfahren zur Montage eines Rahmens auf ein Trägermaterial gemäß dem Oberbegriff des Patentanspruchs l, d.h. ein Verfahren zur Montage eines Rahmens auf ein Trägermaterial unter Verkleben des Rahmens mit dem Trägermaterial mittels eines eine Aushärtezeit auf¬ weisenden Klebstoffes sowie eine Vorrichtung zur Montage eines Rahmens auf ein Trägermaterial gemäß dem Oberbegriff des Patentanspruchs 3, d.h. eine Vorrichtung zur Montage eines Rahmens auf ein Trägermaterial unter Verkleben des Rahmens mit dem Trägermaterial mittels eines eine Aushärte¬ zeit aufweisenden Klebstoffes.The present invention relates to a method for mounting a frame on a carrier material according to the preamble of claim 1, i.e. a method for mounting a frame on a carrier material by gluing the frame to the carrier material by means of an adhesive having a curing time, and a device for mounting a frame on a carrier material according to the preamble of patent claim 3, i.e. a device for mounting a frame on a carrier material by gluing the frame to the carrier material by means of an adhesive having a curing time.

Die genannten Rahmen sind beispielsweise Versteifungsrahmen wie sie zum Schutz eines Chips in einer Chipkarte verwendet werden.The frames mentioned are, for example, stiffening frames as are used to protect a chip in a chip card.

Der Chip und der diesen schützende Versteifungsrahmen sind Bestandteile eines in Figur 4 im Querschnitt gezeigten Chip- Moduls.The chip and the stiffening frame protecting it are components of a chip module shown in cross section in FIG.

Das in der Figur 4 gezeigte Chip-Modul 10 weist ein aus dem besagten Trägermaterial bestehendes oder hervorgehendes Trä¬ gerelement 11, einen Chip 12 und einen den Chip schützend umgebenden Versteifungsrahmen 13 auf. Der vom Versteifungs- rahmen 13 umschlossene Bereich kann zum Halten und/oder zu¬ sätzlichen Schützen des Chips 12 durch eine in der Figur 4 nicht gezeigte Vergußmasse ausgegossen sein. Das Chip-Modul 10 ist dafür vorgesehen, in einen eine entsprechende Ausspa¬ rung aufweisenden Chipkartenkörper montiert (implantiert) zu werden. Das Trägerelement 11 und der Versteifungsrahmen 13 werden üblicher Weise durch Verkleben aneinander befestigt. Hierbei treffen verschiedene Anforderungen aufeinander, deren gleich¬ zeitige Erfüllung bislang noch nicht erreicht werden konnte.The chip module 10 shown in FIG. 4 has a carrier element 11 consisting or emerging from said carrier material, a chip 12 and a stiffening frame 13 which protects the chip. The area enclosed by the stiffening frame 13 can be poured out by a casting compound, not shown in FIG. 4, for holding and / or additionally protecting the chip 12. The chip module 10 is intended to be mounted (implanted) in a chip card body having a corresponding recess. The carrier element 11 and the stiffening frame 13 are usually attached to one another by gluing. Various requirements meet here, the simultaneous fulfillment of which has not yet been achieved.

Die Anforderungen bestehen darin, daß einerseits die Rahmen exakt vorgegebene Positionen und Ausrichtungen auf dem Trä¬ germaterial einnehmen müssen, und daß andererseits das Ver¬ kleben in einer für eine Massenproduktion geeigneten hohen Geschwindigkeit durchführbar sein soll.The requirements are that, on the one hand, the frames must assume exactly predetermined positions and orientations on the carrier material, and, on the other hand, that the gluing should be able to be carried out at a high speed suitable for mass production.

Hierbei erweist sich bislang insbesondere der zum Kleben ver¬ wendbare Klebstoff, genauer gesagt dessen Aushärtezeit als nicht überwindbares Hindernis.So far, the adhesive that can be used for bonding, more precisely its curing time, has so far proven to be an obstacle that cannot be overcome.

Die exakte Einhaltung vorgegebener Positionen und Ausrichtun¬ gen der Rahmen auf dem Trägermaterial erfordert unter anderem wegen des Bestrebens des Trägermaterials, sich zu wölben, ein Aneinanderpressen von Rahmen und Trägermaterial bis zum voll- ständigen Aushärten des Klebstoffes. Dies ist ein langwieri¬ ger Prozeß und steht einer hohen Herstellungsgeschwindigkeit hindernd entgegen.The exact adherence to predetermined positions and alignments of the frames on the carrier material requires, among other things, because of the efforts of the carrier material to bulge, pressing the frame and carrier material together until the adhesive has completely hardened. This is a lengthy process and prevents a high production speed.

Die Erzielung einer hohen Herstellungsgeschwindigkeit würde - sofern sich der hierfür zu treibende Aufwand in vernünfigen Grenzen halten soll - erfordern, daß das Aneinanderpressen von Rahmen und Trägermaterial unter Umständen bereits vor dem vollständigen Aushärten des Klebstoffes beendet wird. Hieraus erwächst jedoch die Gefahr, daß sich die Rahmen aus ihrer auf dem Trägermaterial zunächst ordnungsgemäß eingenommenen Posi¬ tion und Ausrichtung verschieben.Achieving a high production speed would - provided that the effort to be made for this should be kept within reasonable limits - would require that the pressing of the frame and the carrier material under certain circumstances be stopped before the adhesive has fully hardened. From this, however, there arises the danger that the frames will shift out of their position and orientation, which they initially duly assumed on the carrier material.

Der vorliegenden Erfindung liegt daher die Aufgabe zugrunde, das Verfahren gemäß dem Oberbegriff des Patentanspruchs 1 bzw. die Vorrichtung gemäß dem Oberbegriff des Patentan¬ spruchs 3 derart weiterzubilden, daß eine gleichermaßen exakte und schnelle Verklebung eines Trägermaterials mit dar¬ auf zu montierenden Rahmen ermöglicht wird.The present invention is therefore based on the object of developing the method according to the preamble of patent claim 1 or the device according to the preamble of patent claim 3 in such a way that one exact and fast bonding of a carrier material with a frame to be mounted thereon is made possible.

Diese Aufgabe wird erfindungsgemaß durch die im kennzeichnen- den Teil des Patentanspruchs l bzw. die im kennzeichnenden Teil des Patentanspruchs 3 beanspruchten Merkmale gelöst.This object is achieved according to the invention by the features claimed in the characterizing part of patent claim 1 or in the characterizing part of patent claim 3.

Demnach ist vorgesehen, daß der Rahmen und das Trägermaterial während der Aushärtezeit des Klebstoffes unter Verwendung von beheizbaren Preßelementen aneinandergepreßt werden, und daß der Rahmen und/oder das Trägermaterial während des Aneinan- derpressens durch die Preßelemente erhitzt werden (Patentanspruch l) bzw. daß zumindest teilweise beheizbare Preßelemente vorgesehen sind, die derart ausgebildet sind, daß durch diese der Rahmen und das Trägermaterial unter gleichzeitiger Erhitzung von Rahmen und/oder Trägermaterial durch die Preßelemente aneinanderpreßbar sind (Patentanspruch 3) .Accordingly, it is provided that the frame and the carrier material are pressed together during the curing time of the adhesive using heatable pressing elements, and that the frame and / or the carrier material are heated by the pressing elements during pressing against one another (claim 1) or at least partially heatable pressing elements are provided, which are designed in such a way that the frame and the carrier material can be pressed against one another by the pressing elements while heating the frame and / or carrier material (claim 3).

Das Vorsehen dieser Merkmale bewirkt auf äußerst einfacheThe provision of these features results in extremely simple

Weise eine Verkürzung der Aushärtezeit des verwendeten Kleb¬ stoffes, so daß es selbst bei Vorsehen eines hohen Durchsat¬ zes bei der Herstellung nicht erforderlich ist, das Aneinan¬ derpressen von Rahmen und Trägermaterial vor dem vollständi- gen Aushärten des Klebstoffes zu unterbrechen.In this way, the curing time of the adhesive used is shortened, so that even if a high throughput is provided during production, it is not necessary to interrupt the pressing of the frame and carrier material before the adhesive has fully hardened.

Es wurden mithin ein Verfahren und eine Vorrichtung zur Durchführung desselben geschaffen, die es ermöglichen, eine gleichermaßen exakte und schnelle Verklebung eines Träger- materials mit darauf zu montierenden Rahmen zu durchzuführen.A method and a device for carrying out the same have therefore been created, which make it possible to carry out an equally precise and rapid bonding of a carrier material with a frame to be mounted thereon.

Vorteilhafte Weiterbildungen der Erfindung sind Gegenstand der Unteransprüche.Advantageous developments of the invention are the subject of the dependent claims.

Die Erfindung wird nachfolgend anhand eines Ausführungsbei¬ spiels unter Bezugnahme auf die Zeichnung näher erläutert. Es zeigenThe invention is explained in more detail below using an exemplary embodiment with reference to the drawing. Show it

Figur 1 den schematischen Aufbau einer zur Durchführung des erfindungsgemäßen Verfahrens ausgelegten Montageanlage,FIG. 1 shows the schematic structure of an assembly system designed to carry out the method according to the invention,

Figur 2 eine durch die Montageanlage gemäß Figur 1 herzustel¬ lende Trägerband-Rahmen-Anordnung,FIG. 2 shows a carrier tape frame arrangement to be produced by the assembly system according to FIG. 1,

Figur 3 eine schematische Teilansicht einer Rahmenmontagesta- tion der in Figur l gezeigten Montageanlage, undFIG. 3 shows a schematic partial view of a frame assembly station of the assembly system shown in FIG. 1, and

Figur 4 ein Chip-Modul, bei dem ein mit einem Trägerelement verklebter (Versteifungs-)Rahmen zum Einsatz kommt.4 shows a chip module in which a (stiffening) frame bonded to a carrier element is used.

In den Figuren 1 bis 3 ist ein Trägermaterial in Form eines Trägerbandes jeweils mit dem Bezugszeichen 20 bezeichnet, und darauf zu montierende Rahmen sind mit dem Bezugszeichen 25 bezeichnet.1 to 3, a carrier material in the form of a carrier tape is identified in each case by the reference number 20, and frames to be mounted thereon are designated by the reference number 25.

Das noch nicht mit Rahmen 25 bestückte Trägerband 20 steht in auf eine Eingangsrolle 21 gerollte Form zur Verfügung. Zur Montage der Rahmen 25 auf das Trägerband 20 wird daε Träger¬ band von der Eingangsrolle abgerollt, durchläuft verschiedene Arbeitsstationen der in der Figur l gezeigten Montageanlage 30 und wird schließlich auf eine Ausgangsrolle 22 aufgerollt. Das die Montageanlage 30 verlassende (auf die Ausgangsrolle 22 aufgerollte) Trägerband 20 ist wie in Figur 2 gezeigt mit Rahmen 25 bestückt.The carrier tape 20 not yet equipped with the frame 25 is available in a form rolled onto an input roller 21. To mount the frames 25 on the carrier tape 20, the carrier tape is unrolled from the input roller, passes through various work stations of the assembly system 30 shown in FIG. 1 and is finally rolled onto an output roller 22. The carrier tape 20 leaving the assembly system 30 (rolled up onto the output roll 22) is equipped with a frame 25 as shown in FIG.

Gemäß Figur 2 sind auf dem Trägerband 20 zwei übereinander liegende Reihen von Rahmen 25 montiert; die Anzahl der Rah¬ men-Reihen hängt in erster Linie von der Trägerbandbreite ab und kann selbstverständlich beliebig variiert werden.According to Figure 2, two superimposed rows of frames 25 are mounted on the carrier tape 20; the number of frame rows depends primarily on the carrier bandwidth and can of course be varied as desired.

Auf seinem Weg durch die Montageanlage 30 passiert daε Trä¬ gerband 20 aufeinanderfolgend eine Klebstoffaufbringungssta- tion 31, eine Rahmenmontagestation 32, eine Lagekontrollsta¬ tion 33 und eine Ausschußkennzeichnungsstation 34.On its way through the assembly system 30, the carrier tape 20 successively passes through an adhesive application layer. tion 31, a frame assembly station 32, a position control station 33 and a reject marking station 34.

In der Klebstoffaufbringungsstation 31 wird mittels eines Ra¬ kelsystems 31a Klebstoff auf das Trägerband 20 gestempelt.In the adhesive application station 31, adhesive is stamped onto the carrier tape 20 by means of a doctor system 31a.

In der Rahmenmontagestation 32 werden die Rahmen 25 richtig ausgerichtet und positioniert auf das Trägerband 20 aufge¬ bracht und aneinandergepreßt.In the frame assembly station 32, the frames 25 are correctly aligned and positioned on the carrier tape 20 and pressed together.

Der Aneinanderpreßvorgang in der Rahmenmontagestation 32 ist in Figur 3 veranschaulicht.The pressing process in the frame assembly station 32 is illustrated in FIG. 3.

Wie aus der Figur 3 ersichtlich ist, liegt das Trägerband 20 auf einem Tisch 40 auf bzw. wird über einen Tisch 40 bewegt. Ein oder mehrere auf das Trägerband 20 zu montierende Rahmen 25 werden im in der Figur 3 gezeigten Zustand durch einen Montagekopf 41 gerade auf des Trägerband 20 gepreßt.As can be seen from FIG. 3, the carrier tape 20 lies on a table 40 or is moved over a table 40. In the state shown in FIG. 3, one or more frames 25 to be mounted on the carrier tape 20 are pressed straight onto the carrier tape 20 by a mounting head 41.

Der Tisch 40 und der Montagekopf 41 wirken als Preßelemente, die das Trägerband 20 und einen oder mehrere Rahmen 25 zwi¬ schen sich einklemmen und dabei aneinanderpresεen.The table 40 and the mounting head 41 act as pressing elements which clamp the carrier tape 20 and one or more frames 25 between them and thereby press them against one another.

Der Tisch 40 und/oder der Montagekopf 41 sind beheizbar. Die diesen Elementen zugeordneten Heizeinrichtungen sind vorzugs¬ weise in diesen integriert oder in unmittelbarer Nähe dersel¬ ben angeordnet.The table 40 and / or the mounting head 41 can be heated. The heating devices assigned to these elements are preferably integrated in them or arranged in the immediate vicinity of the same.

Durch das Beheizen des Tisches 40 und/oder des Montagekopfes 41 kann sehr schnell und effektiv ein Wärmeübergang auf das Trägerband 20 und/oder die Rahmen 25 und damit auch auf die Klebestelle zwischen Trägerband und Rahmen erfolgen. Eine derartige gezielte Erwärmung der Klebestelle trägt - insbe¬ sondere wenn sie von beiden Seiten erfolgt - dazu bei, daß die Aushärtezeit des Klebstoffes erheblich verkürzt wird und ermöglicht dadurch das Vorsehen einer deutlich verringerten Verweildauer jeweiliger Trägerbandabschnitte in der Montage- anläge 30, ohne jedoch die Qualität der hergestellten Träger¬ band-Rahmenverbindungen herabzusetzen.By heating the table 40 and / or the mounting head 41, heat can be transferred very quickly and effectively to the carrier tape 20 and / or the frame 25 and thus also to the adhesive point between the carrier tape and the frame. Such targeted heating of the glue point - especially if it is carried out from both sides - contributes to the fact that the curing time of the glue is considerably shortened and thereby enables the provision of a significantly reduced dwell time of the respective carrier tape sections in the assembly plant 30, but without reducing the quality of the carrier tape frame connections produced.

Das Vorsehen der beheizbaren Preßelemente ermöglicht es dar¬ über hinaus, das Beheizen von Trägerband und/oder Rahmen zeitlich und örtlich selektiv äußerst genau auf die jeweilε zu beheizenden Trägerband- und/oder Rahmenabschnitte zu be¬ schränken, so daß auch ein sehr wirtschaftlicher Umgang mit der Energie gewährleistet ist.The provision of the heatable pressing elements also makes it possible to restrict the heating of the carrier tape and / or frame selectively in terms of time and location to the respective carrier tape and / or frame sections to be heated, so that it is also very economical to use the energy is guaranteed.

Das in Figur 3 gezeigte Aneinanderpressen von Trägerband und Rahmen wird nach einer vorbestimmten Zeit, vorzugsweise nach dem vollständigen Aushärten des Klebstoffes beendet.The pressing of the carrier tape and frame shown in FIG. 3 is ended after a predetermined time, preferably after the adhesive has completely hardened.

Dadurch kann in der Regel nicht nur eine genaue Ausrichtung von Trägerband und Rahmen in X- und Y-Richtung, sondern auch - und zwar unabhängig von einer ggf. vorhandenen Wölbung des Trägerbandes und/oder schwankender Klebstoffmengen oder Kleb¬ stoffverteilung - die Erzielung einer konstanten Gesamtdicke der Trägerband-Rahmen-Kombination und eine exakte Ausrichtung in Z-Richtung erreicht werden.As a result, not only can the carrier tape and frame be aligned precisely in the X and Y directions, but also - regardless of any curvature of the carrier tape and / or fluctuating amounts of adhesive or adhesive distribution - the achievement of a constant Total thickness of the carrier tape-frame combination and an exact alignment in the Z direction can be achieved.

Durch den Weitertransport des Trägerbandes gelangt dieses in die Lagekontrollstation 33, wo durch ein Bilderkennungssystem oder dergleichen die Lage der Rahmen auf dem Trägerband in X- und Y-Richtung kontrolliert wird.As a result of the further transport of the carrier tape, it arrives in the position control station 33, where the position of the frames on the carrier tape is checked in the X and Y directions by an image recognition system or the like.

Falls bei der Kontrolle eine Abweichung von einer Sollposi¬ tion festgestellt wird, die außerhalb einer vorgegebenen Toleranz liegt, wird der entsprechende Trägerbandabschnitt in der der Lagekontrollstation 33 folgenden Ausschußkennzeich¬ nungsstation 33 besonders gekennzeichnet, beispielsweise durch Stanzen eines sogenannten Schlechtlochs.If, during the check, a deviation from a target position is found that lies outside a predetermined tolerance, the corresponding carrier tape section is specially marked in the reject marking station 33 following the position control station 33, for example by punching a so-called bad hole.

Nach Passieren der Ausschußkennzeichnungsstation 33 wird das mit den Rahmen versehene Trägerband 20 auf die vorstehend be¬ reits erwähnte Ausgangsrolle 22 aufgerollt. Die auf dem Trägerband 20 zu montierenden Rahmen 25 werden in die Montageanlage 30 als Schüttgut eingegeben und mittels ei¬ nes Schwingförderers 50 und eines Linearfördererε 51 verein- zeit und zu einer Abnahmestation 52 gefördert, wo sie einzeln oder in einer matrixartigen Anordnung zur Abholung durch den vorstehend bereits erwähnten Montagekopf 41 beispielsweise in einer Matrix oder dergleichen bereitgestellt werden.After passing the reject marking station 33, the carrier tape 20 provided with the frame is rolled up onto the exit roller 22 already mentioned above. The frames 25 to be mounted on the carrier belt 20 are fed into the assembly plant 30 as bulk material and, by means of an oscillating conveyor 50 and a linear conveyor 51, are conveyed at the same time and to a removal station 52, where they can be picked up individually or in a matrix-like arrangement Mounting head 41 already mentioned above can be provided, for example, in a matrix or the like.

Der Montagekopf 41 entnimmt einen oder mehrere der in der Ab¬ nahmestation 52 bereitgestellten Rahmen 25 und bringt sie zum Trägerband 20, wo er sie ggf. unter Verwendung eines automa¬ tischen Erkennungssystems auf gegebene Ablagepositionen posi¬ tioniert und wie vorstehend bereits beschrieben einem Preß- Vorgang unterwirft.The assembly head 41 removes one or more of the frames 25 provided in the removal station 52 and brings them to the carrier belt 20, where it can be positioned at given storage positions using an automatic detection system and, as already described above, a press Subjects operation.

Die Rahmen 25 können durch den Montagekopf 41 bereits ab de¬ ren Inkontakttreten bei der Herausnahme aus der Abnahmesta¬ tion erwärmt bzw. erhitzt werden. The frames 25 can be heated or heated by the mounting head 41 as soon as they come into contact when they are removed from the removal station.

Claims

Patentansprüche claims 1. Verfahren zur Montage eines Rahmens (25) auf ein Träger¬ material (20) unter Verkleben des Rahmens mit dem Träger- material mittelε eines eine Aushärtezeit aufweisenden Kleb¬ stoffes, d a d u r c h g e k e n n z e i c h n e t , daß der Rahmen und das Trägermaterial während der Aus- härtezeit des Klebstoffeε unter Verwendung von beheizbaren Preßelementen (41, 41) aneinandergepreßt werden, und daß der Rahmen und/oder das Trägermaterial während des Aneinanderpressenε durch die Preßelemente erhitzt werden.1. A method for mounting a frame (25) on a carrier material (20) by gluing the frame to the carrier material by means of an adhesive having a curing time, characterized in that the frame and the carrier material during the curing time of the Adhesives are pressed together using heatable pressing elements (41, 41), and that the frame and / or the carrier material are heated by the pressing elements during the pressing together. 2. Verfahren nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß das Aneinanderpresεen und Erhitzen von Rahmen (25) und Trägermaterial (20) bis zur vollständigen Aushärtung des Klebstoffes erfolgen.2. The method of claim 1, d a d u r c h g e k e n n z e i c h n e t that the pressing together and heating of the frame (25) and carrier material (20) take place until the adhesive has completely hardened. 3. Vorrichtung zur Montage eines Rahmens (25) auf ein Trä¬ germaterial (20) unter Verkleben deε Rahmenε mit dem Träger¬ material mittels eines eine Auεhärtezeit aufweisenden Kleb¬ stoffeε, g e k e n n z e i c h n e t d u r c h zumindeεt teilweise beheizbare Preßelemente (40. 41), die derart ausgebildet sind, daß durch diese der Rahmen und das Trägermaterial unter gleichzeitiger Erhitzung von Rahmen und/oder Trägermaterial durch die Preßelemente aneinander- preßbar εind.3. Device for mounting a frame (25) on a carrier material (20) by gluing the frame to the carrier material by means of an adhesive having a hardening time, characterized by at least partially heatable pressing elements (40, 41) which are designed in this way are that the frame and the carrier material can be pressed together by the pressing elements while the frame and / or carrier material are heated at the same time. 4. Vorrichtung nach Anεpruch 3, d a d u r c h g e k e n n z e i c h n e t , daß der Rahmen (25) ein Versteifungsrahmen (13) zum Schutz eines Chipε (12) in einem Chip-Modul (10) ist, welches in einen Chipkartenkörper implantierbar ist.4. Device according to claim 3, so that the frame (25) is a stiffening frame (13) for protecting a chip (12) in a chip module (10) which can be implanted in a chip card body. 5. Vorrichtung nach Anspruch 4, d a d u r c h g e k e n n z e i c h n e t , daß das Trägermaterial (20) ein Material ist, das sich zur Verwendung für ein den Chip (12) und den Versteifungsrahmen (13) tragendes Trägerelement (11) des Chip-Moduls (10) eig- net.5. The device according to claim 4, characterized in that the carrier material (20) is a material which is suitable for use for a carrier element (11) of the chip module (10) carrying the chip (12) and the stiffening frame (13). 6. Vorrichtung nach einem der Ansprüche 3 biε 5, d a d u r c h g e k e n n z e i c h n e t , daß das Trägermaterial (20) ein Trägerband ist.6. Device according to one of claims 3 to 5, so that the carrier material (20) is a carrier tape. 7. Vorrichtung nach Anspruch 6 , d a d u r c h g e k e n n z e i c h n e t , daß eine Eingangsrolle (21) vorgesehen ist, auf welcher das Trägerband (20) vor der Rahmenmontage aufgerollt sein kann.7. The device according to claim 6, d a d u r c h g e k e n n z e i c h n e t that an input roller (21) is provided on which the carrier tape (20) can be rolled up before the frame assembly. 8. Vorrichtung nach Anspruch 6 oder 7 , d a d u r c h g e k e n n z e i c h n e t , daß eine Ausgangsrolle (22) vorgesehen ist, auf welcher das Trägerband (20) nach der Rahmenmontage aufrollbar ist.8. Apparatus according to claim 6 or 7, d a d u r c h g e k e n n z e i c h n e t that an output roller (22) is provided on which the carrier tape (20) can be rolled up after the frame assembly. 9. Vorrichtung nach einem der Ansprüche 3 bis 8, d a d u r c h g e k e n n z e i c h n e t , daß die Preßelemente (40, 41) einen Tisch (40) umfassen, auf welchem das Trägermaterial (20) bei der Rahmenmontage auf- liegt.9. Device according to one of claims 3 to 8, so that the pressing elements (40, 41) comprise a table (40) on which the carrier material (20) rests during frame assembly. 10. Vorrichtung nach einem der Ansprüche 3 bis 9, d a d u r c h g e k e n n z e i c h n e t , daß die Preßelemente (40, 41) einen Montagekopf (41) umfas- sen, der in der Lage ist, eine oder mehrere Rahmen (25) zu halten und gegen das Trägermaterial (20) zu pressen.10. Device according to one of claims 3 to 9, characterized in that the pressing elements (40, 41) comprise a mounting head (41) which is able to hold one or more frames (25) and against the carrier material ( 20) to press. 11. Vorrichtung nach einem der Ansprüche 3 bis 10, d a d u r c h g e k e n n z e i c h n e t , daß die Preßelemente (40, 41) Bestandteil einer Rahmen- montageεtation (32) εind. 11. The device according to one of claims 3 to 10, characterized in that the pressing elements (40, 41) are part of a frame assembly station (32). 12. Vorrichtung nach Anspruch ll, d a d u r c h g e k e n n z e i c h n e t , daß der Rahmenmontagestation (32) eine Klebstoffaufbringungs- station (31) vorgeschaltet ist, in welcher auf das Träger- material (20) an den späteren Rahmenpositionen Klebstoff auf- tragbar ist.12. The device according to claim 11, so that the frame assembly station (32) is preceded by an adhesive application station (31), in which adhesive can be applied to the carrier material (20) at the later frame positions. 13. Vorrichtung nach Anspruch 11 oder 12, d a d u r c h g e k e n n z e i c h n e t , daß der Rahmenmontagestation (32) eine Lagekontrollstation13. The apparatus of claim 11 or 12, d a d u r c h g e k e n n z e i c h n e t that the frame assembly station (32) is a position control station (33) nachgeschaltet ist, in welcher die Lage der auf das Trä¬ germaterial (20) montierten Rahmen (25) kontrollierbar ist.(33) is connected downstream, in which the position of the frames (25) mounted on the carrier material (20) can be checked. 14. Vorrichtung nach einem der Ansprüche 3 bis 13 , d a d u r c h g e k e n n z e i c h n e t , daß ein Schwingförderer (50) vorgesehen ist, der als Schütt¬ gut in die Vorrichtung eingegebene Rahmen (25) unter Verein¬ zelung derselben in Richtung zu einer Abnahmestation (52) fördert.14. Device according to one of claims 3 to 13, so that a vibratory conveyor (50) is provided, which conveys frames (25) entered as bulk material into the device, singularly in the direction of a removal station (52). 15. Vorrichtung nach Anspruch 14, d a d u r c h g e k e n n z e i c h n e t , daß die Abnahmestation (52) und der Montagekopf (41) derart ausgebildet sind, daß der Montagekopf in der Abnahmestation bereitgestellte Rahmen (25) für die Montage derselben auf dem Trägermaterial (20) aufnehmen kann.15. The apparatus of claim 14, d a d u r c h g e k e n n z e i c h n e t that the removal station (52) and the mounting head (41) are designed such that the mounting head in the removal station can accommodate frames (25) provided for mounting the same on the carrier material (20). 16. Vorrichtung nach Anspruch 11 und 13, d a d u r c h g e k e n n z e i c h n e t , daß die Rahmenmontagestation (32) und die Lagekontrollstation (33) ErkennungsSysteme aufweisen, mittels derer das Aufsetzen der Rahmen (25) auf das Trägermaterial (20) bzw. der Sitz der Rahmen auf dem Trägermaterial Steuer- bzw. kontrollierbar sind. 16. The apparatus according to claim 11 and 13, characterized in that the frame assembly station (32) and the position control station (33) have detection systems by means of which the mounting of the frame (25) on the carrier material (20) or the seat of the frame on the carrier material Are controllable or controllable.
PCT/DE1997/000079 1996-01-24 1997-01-17 Process for fitting a frame on a substrate and device for implementing it Ceased WO1997027625A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1996102436 DE19602436B4 (en) 1996-01-24 1996-01-24 Method for mounting a frame on a carrier material and device for carrying out the method
DE19602436.6 1996-01-24

Publications (1)

Publication Number Publication Date
WO1997027625A1 true WO1997027625A1 (en) 1997-07-31

Family

ID=7783535

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/000079 Ceased WO1997027625A1 (en) 1996-01-24 1997-01-17 Process for fitting a frame on a substrate and device for implementing it

Country Status (3)

Country Link
DE (1) DE19602436B4 (en)
IN (1) IN191873B (en)
WO (1) WO1997027625A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29818829U1 (en) 1998-10-22 1999-03-25 Lohn, Silke, 65346 Eltville Protection device for chip cards
DE10134989B4 (en) * 2001-07-18 2006-03-23 Infineon Technologies Ag Chip card with a card body

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989004552A1 (en) * 1987-10-30 1989-05-18 Lsi Logic Corporation Method and means of fabricating a semiconductor device package
US5057679A (en) * 1988-03-22 1991-10-15 Schlumberger Industries Technique for attaching an electronic module to a card body to form an electronic memory card
DE4344297A1 (en) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Process for the production of identity cards
JPH07214958A (en) * 1994-02-07 1995-08-15 Ibiden Co Ltd Printed circuit board for ic card
WO1996032696A1 (en) * 1995-04-13 1996-10-17 Dai Nippon Printing Co., Ltd. Ic card and ic module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2645680B1 (en) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg ENCAPSULATION OF ELECTRONIC MODULES AND MANUFACTURING METHOD
DE3924439A1 (en) * 1989-07-24 1991-04-18 Edgar Schneider CARRIER ELEMENT WITH AT LEAST ONE INTEGRATED CIRCUIT, ESPECIALLY FOR INSTALLATION IN CHIP CARDS, AND METHOD FOR THE PRODUCTION OF THESE CARRIER ELEMENTS
DE4325458A1 (en) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Support element for an IC module
DE19535989C3 (en) * 1995-09-27 2003-03-27 Siemens Ag chip module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989004552A1 (en) * 1987-10-30 1989-05-18 Lsi Logic Corporation Method and means of fabricating a semiconductor device package
US5057679A (en) * 1988-03-22 1991-10-15 Schlumberger Industries Technique for attaching an electronic module to a card body to form an electronic memory card
DE4344297A1 (en) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Process for the production of identity cards
JPH07214958A (en) * 1994-02-07 1995-08-15 Ibiden Co Ltd Printed circuit board for ic card
WO1996032696A1 (en) * 1995-04-13 1996-10-17 Dai Nippon Printing Co., Ltd. Ic card and ic module
EP0766197A1 (en) * 1995-04-13 1997-04-02 Dai Nippon Printing Co., Ltd. Ic card and ic module

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 095, no. 011 26 December 1995 (1995-12-26) *
SADAO WATAHIKI ET AL: "NEW PACKAGING TECHNOLOGY OF SUPER SMART CARD", PROCEEDINGS OF THE INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOG SYMPOSIUM, NARA, JAPAN, APRIL 26 - 28, 1989, no. SYMP. 6, 26 April 1989 (1989-04-26), INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, pages 101 - 104, XP000077902 *

Also Published As

Publication number Publication date
IN191873B (en) 2004-01-10
DE19602436B4 (en) 2006-09-14
DE19602436A1 (en) 1997-07-31

Similar Documents

Publication Publication Date Title
EP1869701B1 (en) Method and device for transferring a chip to a contact substrate
DE102007063383B4 (en) Device and method for removing pellicles from masks
DE102021201752B4 (en) Application device, robot, production system and method for joining adhesive tape sections
DE102008018491B3 (en) Method and device for implanting a chip module in a chip card body
WO1997027625A1 (en) Process for fitting a frame on a substrate and device for implementing it
EP1156884B1 (en) Device and method for applying adhesive material onto planar components and the use thereof
DE102004015994B4 (en) Device for separating and positioning module bridges
DE19819054B4 (en) Method and device for mounting and adjusting components on a mounting base
DE102005006978B3 (en) Method for joining semiconductor components with a flexible support band comprises moving an endless band parallel to the running direction of the support band between heating elements and the components
EP0714765B1 (en) Method of making laminated sheets
DE102021119429A1 (en) Device and method for manufacturing RFID transponders
DD158076A1 (en) METHOD FOR GLUING SEMICONDUCTOR CHIPS ON CARRIER BOLTS
DE102021102869B4 (en) Methods of aligning optical fibers and apparatus for use in the methods
EP3365151B1 (en) Welded assembly and process for manufacturing a welded assembly
DE102005016930A1 (en) RFID chip and strip substrate contact surfaces electrical and mechanical connection establishing method for transponder, involves hooking chip surfaces having hooks/lugs with substrate surfaces having hooks/lugs with size in nanometer range
DE4444812C1 (en) Method for capping a chip card module and device for carrying out the method
EP0047045B1 (en) Device for the transport of electric components mounted on a tape carrier
EP4261159A1 (en) Method and device for equipping a belt with components
EP1639528B1 (en) Method for fixing a coating to a carrier strip
DE4017542A1 (en) THERMODE FOR AN ELECTRICALLY HEATED SOLDER HEAD
AT410499B (en) DEVICE FOR GUIDING A LINEAR MOVABLE TOOL
DE69937784T2 (en) Means for aligning an ink jet drop generator
EP2108591B1 (en) Device for applying self-adhesive labels to containers
WO1997029513A1 (en) Method of connecting semiconductor chips to a lead frame and assembly carrier for such a method
DD228327A1 (en) DEVICE FOR SECURING HOLE PARTS ON SCREWS

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN JP KR RU UA US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: JP

Ref document number: 97526417

Format of ref document f/p: F

122 Ep: pct application non-entry in european phase