WO1997003175B1 - Composition de nettoyage des residus subsistant apres une attaque chimique contenant des reactifs redox - Google Patents
Composition de nettoyage des residus subsistant apres une attaque chimique contenant des reactifs redoxInfo
- Publication number
- WO1997003175B1 WO1997003175B1 PCT/US1996/010807 US9610807W WO9703175B1 WO 1997003175 B1 WO1997003175 B1 WO 1997003175B1 US 9610807 W US9610807 W US 9610807W WO 9703175 B1 WO9703175 B1 WO 9703175B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cleaner composition
- group
- weight
- redox reagent
- redox
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract 28
- 239000003153 chemical reaction reagent Substances 0.000 title claims abstract 13
- 238000004140 cleaning Methods 0.000 title abstract 2
- -1 amine compounds Chemical class 0.000 claims abstract 5
- 150000001413 amino acids Chemical class 0.000 claims abstract 4
- 238000009835 boiling Methods 0.000 claims abstract 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000002798 polar solvent Substances 0.000 claims abstract 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims 8
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims 8
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims 8
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 claims 8
- 150000005846 sugar alcohols Chemical class 0.000 claims 7
- 150000001875 compounds Chemical class 0.000 claims 5
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 claims 4
- SEQKRHFRPICQDD-UHFFFAOYSA-N N-tris(hydroxymethyl)methylglycine Chemical compound OCC(CO)(CO)[NH2+]CC([O-])=O SEQKRHFRPICQDD-UHFFFAOYSA-N 0.000 claims 4
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 claims 4
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 claims 4
- 229950010030 dl-alanine Drugs 0.000 claims 4
- 239000002904 solvent Substances 0.000 claims 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 3
- 229940024606 amino acid Drugs 0.000 claims 3
- 239000001257 hydrogen Substances 0.000 claims 3
- 229910052739 hydrogen Inorganic materials 0.000 claims 3
- HEBKCHPVOIAQTA-NGQZWQHPSA-N D-Arabitol Natural products OC[C@H](O)C(O)[C@H](O)CO HEBKCHPVOIAQTA-NGQZWQHPSA-N 0.000 claims 2
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 claims 2
- AYFVYJQAPQTCCC-GBXIJSLDSA-N L-threonine Chemical compound C[C@@H](O)[C@H](N)C(O)=O AYFVYJQAPQTCCC-GBXIJSLDSA-N 0.000 claims 2
- OUYCCCASQSFEME-QMMMGPOBSA-N L-tyrosine Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-QMMMGPOBSA-N 0.000 claims 2
- FSVCELGFZIQNCK-UHFFFAOYSA-N N,N-bis(2-hydroxyethyl)glycine Chemical compound OCCN(CCO)CC(O)=O FSVCELGFZIQNCK-UHFFFAOYSA-N 0.000 claims 2
- UZMAPBJVXOGOFT-UHFFFAOYSA-N Syringetin Natural products COC1=C(O)C(OC)=CC(C2=C(C(=O)C3=C(O)C=C(O)C=C3O2)O)=C1 UZMAPBJVXOGOFT-UHFFFAOYSA-N 0.000 claims 2
- 239000007997 Tricine buffer Substances 0.000 claims 2
- 125000003545 alkoxy group Chemical group 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 239000007998 bicine buffer Substances 0.000 claims 2
- 150000003950 cyclic amides Chemical class 0.000 claims 2
- KCFYHBSOLOXZIF-UHFFFAOYSA-N dihydrochrysin Natural products COC1=C(O)C(OC)=CC(C2OC3=CC(O)=CC(O)=C3C(=O)C2)=C1 KCFYHBSOLOXZIF-UHFFFAOYSA-N 0.000 claims 2
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 claims 2
- NHTGHBARYWONDQ-UHFFFAOYSA-N (+-)-α-methyl-tyrosine Chemical compound OC(=O)C(N)(C)CC1=CC=C(O)C=C1 NHTGHBARYWONDQ-UHFFFAOYSA-N 0.000 claims 1
- LGVJIYCMHMKTPB-BKLSDQPFSA-N (2s)-2-amino-3-hydroxypentanoic acid Chemical compound CCC(O)[C@H](N)C(O)=O LGVJIYCMHMKTPB-BKLSDQPFSA-N 0.000 claims 1
- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 claims 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims 1
- LJCWONGJFPCTTL-SSDOTTSWSA-N D-4-hydroxyphenylglycine Chemical compound [O-]C(=O)[C@H]([NH3+])C1=CC=C(O)C=C1 LJCWONGJFPCTTL-SSDOTTSWSA-N 0.000 claims 1
- AYFVYJQAPQTCCC-PWNYCUMCSA-N D-Allothreonine Chemical compound C[C@@H](O)[C@@H](N)C(O)=O AYFVYJQAPQTCCC-PWNYCUMCSA-N 0.000 claims 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims 1
- QNAYBMKLOCPYGJ-UHFFFAOYSA-N D-alpha-Ala Natural products CC([NH3+])C([O-])=O QNAYBMKLOCPYGJ-UHFFFAOYSA-N 0.000 claims 1
- HEBKCHPVOIAQTA-QWWZWVQMSA-N D-arabinitol Chemical compound OC[C@@H](O)C(O)[C@H](O)CO HEBKCHPVOIAQTA-QWWZWVQMSA-N 0.000 claims 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims 1
- UKAUYVFTDYCKQA-GSVOUGTGSA-N D-homoserine Chemical compound OC(=O)[C@H](N)CCO UKAUYVFTDYCKQA-GSVOUGTGSA-N 0.000 claims 1
- AYFVYJQAPQTCCC-STHAYSLISA-N D-threonine Chemical compound C[C@H](O)[C@@H](N)C(O)=O AYFVYJQAPQTCCC-STHAYSLISA-N 0.000 claims 1
- 229930182822 D-threonine Natural products 0.000 claims 1
- OUYCCCASQSFEME-MRVPVSSYSA-N D-tyrosine Chemical compound OC(=O)[C@H](N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-MRVPVSSYSA-N 0.000 claims 1
- 229930195709 D-tyrosine Natural products 0.000 claims 1
- QNAYBMKLOCPYGJ-UWTATZPHSA-N L-Alanine Natural products C[C@@H](N)C(O)=O QNAYBMKLOCPYGJ-UWTATZPHSA-N 0.000 claims 1
- NHTGHBARYWONDQ-JTQLQIEISA-N L-α-methyl-Tyrosine Chemical compound OC(=O)[C@](N)(C)CC1=CC=C(O)C=C1 NHTGHBARYWONDQ-JTQLQIEISA-N 0.000 claims 1
- AXDLCFOOGCNDST-UHFFFAOYSA-N N-methyl-DL-tyrosine Natural products CNC(C(O)=O)CC1=CC=C(O)C=C1 AXDLCFOOGCNDST-UHFFFAOYSA-N 0.000 claims 1
- AYFVYJQAPQTCCC-UHFFFAOYSA-N Threonine Natural products CC(O)C(N)C(O)=O AYFVYJQAPQTCCC-UHFFFAOYSA-N 0.000 claims 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims 1
- 229960003767 alanine Drugs 0.000 claims 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 claims 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims 1
- QXWYKJLNLSIPIN-JGVFFNPUSA-N droxidopa Chemical compound OC(=O)[C@@H](N)[C@H](O)C1=CC=C(O)C(O)=C1 QXWYKJLNLSIPIN-JGVFFNPUSA-N 0.000 claims 1
- 235000019414 erythritol Nutrition 0.000 claims 1
- FBPFZTCFMRRESA-UHFFFAOYSA-N hexane-1,2,3,4,5,6-hexol Chemical compound OCC(O)C(O)C(O)C(O)CO FBPFZTCFMRRESA-UHFFFAOYSA-N 0.000 claims 1
- UKAUYVFTDYCKQA-UHFFFAOYSA-N homoserine Chemical compound OC(=O)C(N)CCO UKAUYVFTDYCKQA-UHFFFAOYSA-N 0.000 claims 1
- 235000010355 mannitol Nutrition 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 229960002920 sorbitol Drugs 0.000 claims 1
- OUYCCCASQSFEME-UHFFFAOYSA-N tyrosine Chemical compound OC(=O)C(N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-UHFFFAOYSA-N 0.000 claims 1
- 229960004441 tyrosine Drugs 0.000 claims 1
- 230000009972 noncorrosive effect Effects 0.000 abstract 1
Abstract
L'invention porte sur une composition de nettoyage non corrosive des résidus subsistant après une attaque chimique comportant: (a) de 1 à 70 % en poids d'un solvant organique polaire présentant un moment dipolaire de plus de 3,5; (b) de 1 à 70 % en poids de composés amine sélectionnés présentant au moins un groupe hydroxyle et dont la température d'ébullition est de plus de 150 °C à la pression atmosphérique; (c) de 0,1 à 10 % en poids d'un acide aminé sélectionné présentant au moins un groupe hydroxyle; (d) de 1 à 20 % en poids d'un réactif redox sélectionné présentant un potentiel redox compris entre +1,0V et -2,0V par rapport à une électrode normale à hydrogène (pour un pH de 7); et: (e) de 0 à 90 % en poids d'eau.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU63392/96A AU6339296A (en) | 1995-07-07 | 1996-06-24 | Redox reagent-containing post-etch residue cleaning composition |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US499,355 | 1995-07-07 | ||
| US08/499,355 US5612304A (en) | 1995-07-07 | 1995-07-07 | Redox reagent-containing post-etch residue cleaning composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO1997003175A1 WO1997003175A1 (fr) | 1997-01-30 |
| WO1997003175B1 true WO1997003175B1 (fr) | 1997-02-13 |
Family
ID=23984951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US1996/010807 WO1997003175A1 (fr) | 1995-07-07 | 1996-06-24 | Composition de nettoyage des residus subsistant apres une attaque chimique contenant des reactifs redox |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5612304A (fr) |
| AU (1) | AU6339296A (fr) |
| WO (1) | WO1997003175A1 (fr) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5981454A (en) * | 1993-06-21 | 1999-11-09 | Ekc Technology, Inc. | Post clean treatment composition comprising an organic acid and hydroxylamine |
| US6546939B1 (en) | 1990-11-05 | 2003-04-15 | Ekc Technology, Inc. | Post clean treatment |
| JP3614242B2 (ja) * | 1996-04-12 | 2005-01-26 | 三菱瓦斯化学株式会社 | フォトレジスト剥離剤及び半導体集積回路の製造方法 |
| US7534752B2 (en) * | 1996-07-03 | 2009-05-19 | Advanced Technology Materials, Inc. | Post plasma ashing wafer cleaning formulation |
| US5759973A (en) * | 1996-09-06 | 1998-06-02 | Olin Microelectronic Chemicals, Inc. | Photoresist stripping and cleaning compositions |
| US5817610A (en) * | 1996-09-06 | 1998-10-06 | Olin Microelectronic Chemicals, Inc. | Non-corrosive cleaning composition for removing plasma etching residues |
| US5780406A (en) * | 1996-09-06 | 1998-07-14 | Honda; Kenji | Non-corrosive cleaning composition for removing plasma etching residues |
| US5989353A (en) * | 1996-10-11 | 1999-11-23 | Mallinckrodt Baker, Inc. | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
| WO1998022568A1 (fr) * | 1996-11-22 | 1998-05-28 | Advanced Chemical Systems International, Inc. | Formulation de decapage contenant catechol, hydroxylamine, eau et amines autres que alcanolamines, destinee au nettoyage des plaquettes ayant subi un brulage au plasma |
| US7264680B2 (en) * | 1997-05-09 | 2007-09-04 | Semitool, Inc. | Process and apparatus for treating a workpiece using ozone |
| US6033993A (en) * | 1997-09-23 | 2000-03-07 | Olin Microelectronic Chemicals, Inc. | Process for removing residues from a semiconductor substrate |
| US5977041A (en) * | 1997-09-23 | 1999-11-02 | Olin Microelectronic Chemicals | Aqueous rinsing composition |
| KR100630338B1 (ko) * | 1998-11-27 | 2006-09-29 | 쇼와 덴코 가부시키가이샤 | 사이드월 제거용 조성물 및 사이드월 제거방법 |
| US6103680A (en) * | 1998-12-31 | 2000-08-15 | Arch Specialty Chemicals, Inc. | Non-corrosive cleaning composition and method for removing photoresist and/or plasma etching residues |
| JP4224651B2 (ja) | 1999-02-25 | 2009-02-18 | 三菱瓦斯化学株式会社 | レジスト剥離剤およびそれを用いた半導体素子の製造方法 |
| US7521405B2 (en) * | 2002-08-12 | 2009-04-21 | Air Products And Chemicals, Inc. | Process solutions containing surfactants |
| US6413923B2 (en) * | 1999-11-15 | 2002-07-02 | Arch Specialty Chemicals, Inc. | Non-corrosive cleaning composition for removing plasma etching residues |
| US6506684B1 (en) * | 2000-05-24 | 2003-01-14 | Lsi Logic Corporation | Anti-corrosion system |
| WO2001097268A1 (fr) * | 2000-06-16 | 2001-12-20 | Kao Corporation | Composion detergente |
| US6455479B1 (en) * | 2000-08-03 | 2002-09-24 | Shipley Company, L.L.C. | Stripping composition |
| US20040011991A1 (en) * | 2001-06-13 | 2004-01-22 | Markle Richard J. | Use of a gettering agent in a chemical mechanical polishing and rinsing operation and apparatus therefor |
| US6916772B2 (en) * | 2001-07-13 | 2005-07-12 | Ekc Technology, Inc. | Sulfoxide pyrolid(in)one alkanolamine cleaner composition |
| JP3787085B2 (ja) * | 2001-12-04 | 2006-06-21 | 関東化学株式会社 | フォトレジスト残渣除去液組成物 |
| CN1261826C (zh) * | 2002-01-11 | 2006-06-28 | Az电子材料(日本)株式会社 | 一种用于正性或负性光刻胶的清洗剂组合物 |
| US8178482B2 (en) * | 2004-08-03 | 2012-05-15 | Avantor Performance Materials, Inc. | Cleaning compositions for microelectronic substrates |
| KR20060064441A (ko) * | 2004-12-08 | 2006-06-13 | 말린크로트 베이커, 인코포레이티드 | 비수성 비부식성 마이크로전자 세정 조성물 |
| US7922823B2 (en) * | 2005-01-27 | 2011-04-12 | Advanced Technology Materials, Inc. | Compositions for processing of semiconductor substrates |
| US7923423B2 (en) * | 2005-01-27 | 2011-04-12 | Advanced Technology Materials, Inc. | Compositions for processing of semiconductor substrates |
| KR101088568B1 (ko) * | 2005-04-19 | 2011-12-05 | 아반토르 퍼포먼스 머티리얼스, 인크. | 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼 |
| US7632796B2 (en) * | 2005-10-28 | 2009-12-15 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and method for its use |
| US9329486B2 (en) * | 2005-10-28 | 2016-05-03 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and method for its use |
| US8263539B2 (en) * | 2005-10-28 | 2012-09-11 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and methods for its use |
| US20080076688A1 (en) * | 2006-09-21 | 2008-03-27 | Barnes Jeffrey A | Copper passivating post-chemical mechanical polishing cleaning composition and method of use |
| US8685909B2 (en) * | 2006-09-21 | 2014-04-01 | Advanced Technology Materials, Inc. | Antioxidants for post-CMP cleaning formulations |
| TWI450052B (zh) * | 2008-06-24 | 2014-08-21 | Dynaloy Llc | 用於後段製程操作有效之剝離溶液 |
| JP5288144B2 (ja) * | 2008-12-25 | 2013-09-11 | ナガセケムテックス株式会社 | フォトレジスト剥離剤組成物、積層金属配線基板のフォトレジスト剥離方法及び製造方法 |
| EP2427803B1 (fr) * | 2009-05-07 | 2017-12-13 | Basf Se | Procédé de fabrication de dispositifs electriques utilisant des formulations pour le décapage de photoreserve |
| KR101746879B1 (ko) * | 2009-07-30 | 2017-06-14 | 바스프 에스이 | 고급 반도체 적용을 위한 이온 주입 후 스트리퍼 |
| TWI539493B (zh) | 2010-03-08 | 2016-06-21 | 黛納羅伊有限責任公司 | 用於摻雜具有分子單層之矽基材之方法及組合物 |
| US8987181B2 (en) | 2011-11-08 | 2015-03-24 | Dynaloy, Llc | Photoresist and post etch residue cleaning solution |
| US9029268B2 (en) | 2012-11-21 | 2015-05-12 | Dynaloy, Llc | Process for etching metals |
| US9158202B2 (en) | 2012-11-21 | 2015-10-13 | Dynaloy, Llc | Process and composition for removing substances from substrates |
| US20170060282A1 (en) * | 2014-03-25 | 2017-03-02 | 3M Innovative Properties Company | Method of selectively etching a metal layer from a microstructure |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4309300A (en) * | 1979-05-04 | 1982-01-05 | Mcdonnell Douglas Corporation | Cleaning solvent and method of cleaning a metal surface |
| US4306933A (en) * | 1980-02-11 | 1981-12-22 | Chemline Industries | Tin/tin-lead stripping solutions |
| JPS56115368A (en) * | 1980-02-15 | 1981-09-10 | San Ei Chem Ind Ltd | Releasing agent of photosensitive polymer |
| US4592787A (en) * | 1984-11-05 | 1986-06-03 | The Dow Chemical Company | Composition useful for stripping photoresist polymers and method |
| DE3501675A1 (de) * | 1985-01-19 | 1986-07-24 | Merck Patent Gmbh, 6100 Darmstadt | Mittel und verfahren zur entfernung von fotoresist- und stripperresten von halbleitersubstraten |
| US4617251A (en) * | 1985-04-11 | 1986-10-14 | Olin Hunt Specialty Products, Inc. | Stripping composition and method of using the same |
| US4720332A (en) * | 1986-04-21 | 1988-01-19 | Coffey Barry W | Nickel strip formulation |
| JPH0721638B2 (ja) * | 1986-07-18 | 1995-03-08 | 東京応化工業株式会社 | 基板の処理方法 |
| US4770713A (en) * | 1986-12-10 | 1988-09-13 | Advanced Chemical Technologies, Inc. | Stripping compositions containing an alkylamide and an alkanolamine and use thereof |
| JPS63208043A (ja) * | 1987-02-25 | 1988-08-29 | Kanto Kagaku Kk | ポジ型フオトレジスト用水溶性剥離液 |
| JP2553872B2 (ja) * | 1987-07-21 | 1996-11-13 | 東京応化工業株式会社 | ホトレジスト用剥離液 |
| US4824763A (en) * | 1987-07-30 | 1989-04-25 | Ekc Technology, Inc. | Triamine positive photoresist stripping composition and prebaking process |
| JP2591626B2 (ja) * | 1987-09-16 | 1997-03-19 | 東京応化工業株式会社 | レジスト用剥離液 |
| JPH0769618B2 (ja) * | 1987-09-25 | 1995-07-31 | 旭化成工業株式会社 | フオトレジスト用剥離剤 |
| JP2631849B2 (ja) * | 1987-09-30 | 1997-07-16 | ナガセ電子化学 株式会社 | 剥離剤組成物 |
| DE3828513A1 (de) * | 1988-08-23 | 1990-03-01 | Merck Patent Gmbh | Abloesemittel fuer fotoresists |
| DE3923426A1 (de) * | 1989-07-15 | 1991-01-17 | Hoechst Ag | Verfahren zur herstellung von novolak-harzen mit geringem metallionengehalt |
| JP2527268B2 (ja) * | 1990-09-17 | 1996-08-21 | 東京応化工業株式会社 | レジスト用剥離剤組成物 |
| US5279771A (en) * | 1990-11-05 | 1994-01-18 | Ekc Technology, Inc. | Stripping compositions comprising hydroxylamine and alkanolamine |
| JP3160344B2 (ja) * | 1991-01-25 | 2001-04-25 | アシュランド インコーポレーテッド | 有機ストリッピング組成物 |
| CA2062027C (fr) * | 1991-03-04 | 1998-05-19 | William Aldrich | Systeme de controle du liquide pour cartouches de diagnostic utilisees dans des instruments d'analyse |
| JPH04350660A (ja) * | 1991-05-28 | 1992-12-04 | Texas Instr Japan Ltd | 半導体装置製造用ポジ型フォトレジスト用剥離液および半導体装置の製造方法 |
| US5378802A (en) * | 1991-09-03 | 1995-01-03 | Ocg Microelectronic Materials, Inc. | Method for removing impurities from resist components and novolak resins |
| US5480585A (en) * | 1992-04-02 | 1996-01-02 | Nagase Electronic Chemicals, Ltd. | Stripping liquid compositions |
| US5419779A (en) * | 1993-12-02 | 1995-05-30 | Ashland Inc. | Stripping with aqueous composition containing hydroxylamine and an alkanolamine |
| US5472830A (en) * | 1994-04-18 | 1995-12-05 | Ocg Microelectronic Materials, Inc. | Non-corrosion photoresist stripping composition |
| US5507978A (en) * | 1995-05-08 | 1996-04-16 | Ocg Microelectronic Materials, Inc. | Novolak containing photoresist stripper composition |
-
1995
- 1995-07-07 US US08/499,355 patent/US5612304A/en not_active Expired - Fee Related
-
1996
- 1996-06-24 AU AU63392/96A patent/AU6339296A/en not_active Abandoned
- 1996-06-24 WO PCT/US1996/010807 patent/WO1997003175A1/fr active Application Filing
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