[go: up one dir, main page]

WO1997002723A1 - Procede et dispositif de liaison de plaquettes pourvues de sources de chaleur, notamment des plaquettes de circuits imprimes, a des plaquettes metalliques de dissipation de chaleur - Google Patents

Procede et dispositif de liaison de plaquettes pourvues de sources de chaleur, notamment des plaquettes de circuits imprimes, a des plaquettes metalliques de dissipation de chaleur Download PDF

Info

Publication number
WO1997002723A1
WO1997002723A1 PCT/DE1996/001032 DE9601032W WO9702723A1 WO 1997002723 A1 WO1997002723 A1 WO 1997002723A1 DE 9601032 W DE9601032 W DE 9601032W WO 9702723 A1 WO9702723 A1 WO 9702723A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
station
adhesive
heat
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1996/001032
Other languages
German (de)
English (en)
Inventor
Manfred Ebisch
Richard Sabatier
Joseph Luchino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Laboratories Europe GmbH
Original Assignee
3M Laboratories Europe GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Laboratories Europe GmbH filed Critical 3M Laboratories Europe GmbH
Priority to DE19680517T priority Critical patent/DE19680517D2/de
Priority to AU59960/96A priority patent/AU5996096A/en
Publication of WO1997002723A1 publication Critical patent/WO1997002723A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material

Definitions

  • the invention relates to a method according to the preamble of
  • Claim 1 The invention further relates to a device according to the preamble of claim 13.
  • an electrical printed circuit board which can be in the form of a plastic plate integrated in an insulating material, for example, which is either rigid or also film-like flexible, with a metallic plate for heat dissipation
  • an intermediate layer consisting of glass fibers impregnated with epoxy resin is known. This intermediate layer as
  • Adhesive layer works.
  • the named intermediate layer must at the same time have a high insulation value and a high thermal conductivity, requirements that are technically only relatively incomplete. It is the object of the invention to provide a method and an apparatus for the production of plates provided with heat sinks and heat sources, which are simplified compared to the prior art set out at the beginning and enable a quasi-continuous production of such plates. This object is achieved in a generic method by the features of the characterizing part of claim 1.
  • a pressure-sensitive adhesive which enables a connection to be established only as a result of pressure being exerted, without additional heat having to be used. Due to the significantly simplified adhesive technology and the other properties of these adhesives, very short cycle times and thus a quasi-continuous mode of operation can be achieved. Insulation, adhesive strength, thermal resistance and thermal conductivity can be regarded as satisfactory in every respect. In particular, despite the high insulation strength, there are very low thermal contact resistances between the printed circuit board, for example in the form of a film, and the metallic heat sink. The method can also be integrated directly into the manufacturing process of the electrical circuit board.
  • claims 2 and 3 are directed to alternative forms of provision, in particular magazining of the metallic plates or other metallic surface elements which act as a heat sink.
  • these surface elements can be in the form of a wound film, thus a roll, from which surface elements of the desired shape are cut off, in particular cut out or also punched out.
  • the surface elements can also be in the form of prefabricated metallic plates or film elements provided in a transfer station and are connected to the heat-treated plates, in particular electrical circuit boards, by means of appropriately adapted handling devices.
  • claims 6 and 7 are directed to alternative forms of adhesive transfer.
  • a coating tape is used in any case, which is coated on at least one side with the adhesive to be transferred, either this adhesive being transferred directly from the tape in a continuous process to the metallic plate or the conductive plate, or with discrete surface elements from the coating tape cut out in a first step and pressed with their adhesive side either onto the metallic plate or the Leite ⁇ latte, in the latter case the protective film must be removed from the adhesive layer, which acts as a carrier of the adhesive layer in the context of the coating tape.
  • the latter procedure allows for greater flexibility when the surface elements mentioned above, in particular their user-definable shapes, are cut out, in that the conductive plate is only partially covered with a heat sink.
  • a further essential feature of the method according to the invention is, in accordance with the features of claim 11, a superordinate control which controls the conveying, feeding, punching or cutting and other devices or components used in the method with regard to a successive treatment the Leite ⁇ latten and thus controls a quasi-continuous process.
  • the essential feature of the device designed to carry out the above-described method according to the invention is a conveying device which extends from a feed station for the lead plates to be treated to an output station for the lead plates provided with heat sinks, at least one work station being arranged along this conveying device.
  • This workstation is used to apply the metallic plates or the metallic surface elements using a pressure-sensitive adhesive and is used with all
  • a higher-level control coordinates the movements and work steps of all components of the conveyor
  • Feed station, the delivery station and the work station with a view to a cyclical, quasi-continuous operation.
  • claims 13 to 23 are each directed to alternative embodiments of the device, which are described in more detail below.
  • the type of magazine or storage of the metallic surface elements and the adhesive to be applied is only to be understood as an example. It is essential for the first-mentioned variant that the place of application of the surface elements punched out of the metal foil rolls onto the conductor plate can be varied by controlling corresponding infeed movements. Further possible variations can relate to the shape of the surface elements punched out of the metal foil strip and the orientation relative to the conductive plate conveyed by the conveying device. Several metal foil rolls can also be used in the context of a single work station, in particular also those of different widths. By interchangeably arranging these rollers together with the associated conveying mechanism, the variability of the device increases accordingly. In the context of the second variant, the geometrical shape of the applied metallic surface elements can be varied practically as desired, only the corresponding surface of the conductive plate to be coated with adhesive having to be adapted.
  • the gluing process can be accelerated via a reprinting device according to the features of claim 22, which has already been initiated beforehand by pressing in the context of a work station. Only in order to further accelerate the gluing process can heat be used in the postpress station, depending on the properties of the adhesive used.
  • the invention will be explained in more detail below with reference to the exemplary embodiments shown schematically in the drawings. Show it:
  • Figure 1 is a perspective view of a first system diagram for the manufacture of Leite ⁇ latten provided with heat sinks.
  • Fig. 2 is a perspective view of a second system diagram for producing such Leite ⁇ latten.
  • Fig. 3 is a perspective view of a third system diagram for producing such Leite ⁇ latten.
  • Fig. 4 is a perspective view of a punch in the rest position.
  • Fig. 5 is a perspective view of a punch in a working position.
  • Fig. 6 is a perspective view of a fourth system diagram for the production of such Leite ⁇ latten.
  • the invention is not restricted to this, but relates to any manufacture of plates which is to be provided with at least one heat sink by means of dissipating the heat energy generated by heat sources located on the plate.
  • the essential feature of the system shown in Fig. 1 is a sequential arrangement of workstations which are passed through one after the other by the Leite ⁇ laten provided with heat sinks. These workstations are connected to one another by means of a suitable conveyor system, which is, however, only sketchily indicated by a conveyor belt 1.
  • handling devices are provided, which are used to handle the Leite ⁇ latten to be treated. However, these handling devices have not been shown.
  • the conveyor system, the handling devices and the named Workstations interact in a coordinated manner in connection with a higher-level controller. However, the design of such a control system will also not be discussed in more detail below.
  • the aim of the work steps to be carried out in the individual workstations is to equip and connect a single Leite ⁇ latte, which is in the initial state in a stack 2, the feed station, in a defined manner and in particular with metallic heat sinks, so that the finished Leite ⁇ latten finally in a stack 3, the output station are placed one after the other.
  • the storage devices 8, 9 each consist of a stack of a roll 11 for copper foil and a roll 12 for a coating tape, one
  • Laminating station 13 and a winding station 14 for winding the punched-out copper foil there is a protective film removal device, which consists, for example, of a knife 36 and a winding station 15 for receiving the removed protective film
  • the coating tape preferably consists of a layer of an electrically insulating but thermally conductive adhesive and a removable protective film laminated with the adhesive layer.
  • Such tapes are known from the US patents A-4 548 862, 4 606 962 and 5 143 785. Suitable labeling strips are 3M
  • Each functional unit consisting of a roller 11 and a winding station 14 or a roller 12 and a winding station 15, is equipped with drives, not shown in the drawing, which enable the copper foil to be fed step by step in accordance with the passage of the individual conductive plate in the direction of travel 7.
  • drives not shown in the drawing, which enable the copper foil to be fed step by step in accordance with the passage of the individual conductive plate in the direction of travel 7.
  • the design of this drive will also not be discussed in more detail below.
  • the strip of copper foil unwound step by step from the roll 11 is coated on the underside with an adhesive in the laminating station by means of the coating tape, and for this purpose the coating tape stored on the roll 12 is coated on one side with an adhesive which faces the facing one in the laminating station 13 Side of the copper tape is transferred.
  • the protective film of the coating tape is pulled off over the knife 36 and rolled up on the winding roll 15.
  • a segment is punched out of the laminated copper strip in the punching station 4 and at the same time pressed onto the lead plate which is also located within the punching station 4.
  • the copper strip is passed through the punching station 4 and, via a deflection roller 35, reaches the winding station 14, in which only a punched grid is thus wound up.
  • a pressure-sensitive adhesive is transferred to the copper element via the coating tape, so that additional heat is not required to produce an adhesive effect.
  • the punching station 5 following in the direction of passage 7, a practically identical work step is carried out, the surface element (s) of the copper strip punched out here being brought into an adhesive connection with the conductor plate only at another point.
  • the punching station 6 differs from the previous ones only in that the storage device 10 assigned to it consists of three rolls 11 arranged horizontally next to one another, below these in turn arranged horizontally next to each other rolls 12, each of which in turn is a copper or a Run coating tape.
  • the assigned laminating station 13 'corresponds in terms of basic structure and its mode of operation to the laminating station 13, with the only difference that within these three belt guides run parallel to one another.
  • the spatial arrangement of the punching station 6 relative to the conveyor belt 1 shown is designed differently than that of the punching stations 4, 5 - however, this is not essential.
  • a large number of planar copper elements are in turn applied to the Leite ⁇ latte at defined locations, so that in the context of a pressure device 16 essentially finished Leite ⁇ latten equipped with heat sinks in the desired arrangement and dimensioning merely be accelerated to accelerate the gluing process. Finished Leite ⁇ latten finally reach the stack 3 from the Nachdruck sensible 16.
  • the gaps formed in this way are placed at non-critical points on the conductor plate. For example, these columns should not be placed in the immediate vicinity of heat sources. This prevents the dissipation of heat from these heat sources from being negatively influenced by the gaps.
  • the system diagram shown in FIG. 1 is based on the equipment of only areas
  • Fig. 2 shows a second embodiment of such a system, in which the finished Leite ⁇ latten are equipped with at least one metallic heat sink, in which the adhesive layer can be slightly larger than the heat sink.
  • the adhesive layer can be slightly larger than the heat sink.
  • a punching station 8 with a punching station which consists of a roll 12 for a coating tape, which is guided through the punching station 4 through a guide roller 35 to a winding station 14.
  • a work station used to prepare the gluing with a metal foil is designated by 22, the mode of operation of which will be explained in more detail below.
  • At 9 is a work station with a roller 11 for the metal foil, e.g. Copper foil, and a winding station 14 for winding the punched copper foil.
  • a roller 11 for the metal foil e.g. Copper foil
  • a winding station 14 for winding the punched copper foil Each functional unit 8.9, consisting of a roller 12 or roller 11 and
  • Rewinding stations 14 are equipped with drives, not shown in the drawing, which enable a gradual advancement of the coating tape or the copper foil in accordance with the passage of the individual Leite ⁇ latte in the direction of passage 7.
  • drives not shown in the drawing, which enable a gradual advancement of the coating tape or the copper foil in accordance with the passage of the individual Leite ⁇ latte in the direction of passage 7.
  • the design of this drive will also not be discussed in more detail below.
  • the guide plates present in the stack 2 in the initial state are first provided with a piece of adhesive film, corresponding surface elements being punched out of the coating tape of the roll 12 in accordance with its step-by-step advance and glued to the guide plate.
  • the Leite ⁇ latte leaving the work station 4 is thus provided on the top with an adhesive element which is covered on the top by a protective film.
  • Essential feature of the workstation 22 is a roll 27, of which an adhesive tape over a
  • Guide roller 28 is guided to a take-up roller 29.
  • the work station 22 can advantageously have a gripper 39 for gripping the adhesive tape at one point
  • Adhesive tape section between the winding roller 29 and the guide roller 28 extends above the conveyor belt 1, in particular the Leite ⁇ latte conveyed on this and the purpose of this work station is to press the adhesive tape against the opposite side of the Leite ⁇ latte, namely the protective film covering the adhesive element, the protective film to lift off and in this way to expose the adhesive element located under the protective film and connected to the conductor plate. (The protective film is removed in a manner not shown.) The protective film sections received in this way adhere to the adhesive tape and are wound together with it on the take-up roll 29.
  • the gripping tongs 39 are first retracted in order to grip the adhesive tape at one point and then moved forward in order to apply the adhesive tape above the conveyor belt 1.
  • the adhesive tape is then pressed onto the protective film covering the adhesive element by lowering the printing device 37.
  • the gripping pliers are moved such that the protective film section is lifted off at an angle.
  • the gripper then releases from the adhesive tape and returns to the starting position.
  • the functions of the gripper 39, the take-up reel 29, the pressure device 37 and the actuating device 38 can advantageously be performed by a robot.
  • the strip of copper foil unwound step by step from the roll 11 is punched out of a segment in the punching station 4 and at the same time pressed onto the lead plate located within the punching station 5.
  • the copper element is preferably placed in the middle of the exposed adhesive element.
  • the copper strip is passed through the punching station 4 and, via a deflection roller 35, reaches the winding station 14, in which only a punched grid is thus wound up.
  • the adhesive element consists of a pressure sensitive adhesive with which the Copper element is attached to the Leite ⁇ latte, so that to produce a
  • the copper element can be punched out somewhat smaller than the adhesive element, so that after the copper element is placed on it, the copper element is framed by a free-standing edge made of Kieb ⁇ stoff.
  • Fig. 3 shows a third embodiment in which the finished Leite ⁇ latten be equipped with an essentially surface-covering metallic heat sink.
  • functional elements which correspond to those of FIGS. 1 and 2 are also numbered accordingly, so that a repetitive description in this regard can be dispensed with.
  • a work station serving to prepare the bond with a metal plate is the one whose effect mode of action has been explained in more detail.
  • the work station is designated, in which 24 metal plates, for example aluminum plates, are removed, and in the direction of the arrow 25 on the previously treated plate 22 pressed in the work station 22.
  • This work station 23 can be designed in the manner of an industrial robot and can be equipped with corresponding handling devices for removing individual plates from the stack 24 and for transferring them to the conveyor belt 26, which is necessary on the conveyor belt.
  • ⁇ in ⁇ r Nachv ⁇ r ⁇ ßstation 16 takes place ⁇ in the end of the clamping process, which takes place under pressure and if necessary, heat is slowed down.
  • a stack 3 complete, that is, heat plates provided with heat sinks are deposited.
  • the printed circuit boards present in the stack 2 are initially covered over their entire area with a cling film, which means that the surface area corresponding to the step-by-step feed and the corresponding area is removed.
  • the conductor plate leaving work station 17 is thus coated on the top side with a coating which consists of a adhesive which is covered on the top side by a protective film.
  • the feature of the work station 22 is a roll 27, from which an adhesive tape is guided over a guide roll 28 to a take-up roll 29.
  • the belt section between the winding roller 29 and the guide roller 28 extends above the conveyor belt 1, in particular the conveyor plate conveyed thereon and the purpose of this work station, in conjunction with a stamp 30, which can be actuated by pressure medium or is also adhesive, which means that it is also adhesive the side of the adhesive sheet, namely to press the protective film covering it, to lift off the protective film and, in this way, to release the adhesive layer located under the protective film.
  • the protective foils taken up on this knowledge are wound on the take-up roll 29.
  • a metal plate is placed on this now fresh adhesive layer by means of the handling device of the work station 23 and is pressed with it.
  • the ⁇ ing ⁇ s ⁇ tzt ⁇ adhesive is, in turn, a pressure-sensitive adhesive that is effective even without additional heat.
  • a punching tool 4,5 is shown in detail in FIGS. 4 and 5.
  • the spring 49 By pushing the column-guided plate 45, on which a punching die 44 is fastened, the spring 49 is used to act as a retaining retainer 43 on the punched material (coating tape or copper foil), thereby stamping the punching process is guaranteed.
  • the punch 44 When the punched material is touched, the punch 44 is subjected to a vacuum via the lines and guides 46 and holds the punched part 48 in place when penetrating the cutting plate 41 until the vacuum is interrupted after being placed on the part 47 to be sealed.
  • the punching tool 4, 5 then moves into the rest position and the material to be punched is brought into position for the next work step.
  • the surfaces of the punching tools 4, 5, 6, 17 shown in FIGS. 1 to 5, which can come into contact with the pressure-sensitive adhesive, are preferably provided with an anti-adhesive coating.
  • a "S ⁇ ries 900" coating from Plasma Coatings Inc., Memphis, USA has been suitable for this purpose.
  • the punching tool can be cooled to a temperature of up to -4 ° C. by means of an injecting coolant and guides.
  • FIG. 6 shows a fourth embodiment of our system, which can be seen as an alternative embodiment to the third embodiment.
  • Plates 64 are transported from ⁇ in ⁇ m to the vertically movable holding device 61 by plates 64 by ⁇ in ⁇ transport device 63 to ⁇ in ⁇ r shifter device 65, 83 and set down on their holding plate 83.
  • the plate 64 is pushed up to its laminating station 69-71 by being driven out by the shooting device 65, controlled by the optical sensor 66.
  • At least one with a coating tape containing ⁇ in ⁇ r on the bottom of the adhesive layer is taken from a roll 67 over a deflection roller 68 to the laminating station 69-71, wherein the
  • Laminate is guided further.
  • the protective film of the coating tape is then wound onto a take-up roll 73 via a deflection roll J2.
  • a gripper arm mounted on its head 84 is pivoted downwards by a visually controlled sensor of a slide 77, until the gripper arm grips the front end of the plate 64.
  • the head 84 is moved 5 to 15 mm in the conveying direction, so that a gap "x" is formed between the front plate 64 and the plate 64 following it.
  • the adhesive layer is stretched in this gap "x".
  • the tensioned adhesive layer is cut through with its hot wire measuring knife 74 in the middle, after which the ends of the adhesive layers formed by the cut spring back flush with the ends of the plates 64.
  • the conveyor belt 80 can be the conveyor belt 1 of the system shown in FIG. 3, and the plate 64 can be manufactured in the devices 23 and 16 present in this system.
  • a copper foil 82 can be applied to the long-lasting cladding layer by a further laminating station 80, 81 and thus connected to the plate 64.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

Ce dispositif de liaison de plaquettes de circuits imprimés à des plaquettes métalliques qui agissent comme des puits thermiques se caractérise par l'agencement successif dans le sens de passage (7) de trois stations de découpage (4, 5, 6) et d'une station de compression finale (16). Un dispositif d'emmagasinage (8, 9, 10) qui se caractérise par au moins un rouleau (11) d'alimentation faisant avancer une bande de cuivre et au moins un rouleau (12) d'alimentation faisant avancer une bande adhésive est associé à chaque station de découpage. Dans des stations de stratification correspondantes (13, 13'), un côté de la bande de cuivre est enduit d'une colle auto-adhésive et dans chaque station de découpage des éléments plats sont découpés dans la bande de cuivre et reliés par compression à la plaquette de circuits imprimés. Dans son état fini, la plaquette de circuits imprimés est collée à plusieurs plaquettes métalliques qui agissent comme des puits thermiques.
PCT/DE1996/001032 1995-06-30 1996-06-13 Procede et dispositif de liaison de plaquettes pourvues de sources de chaleur, notamment des plaquettes de circuits imprimes, a des plaquettes metalliques de dissipation de chaleur Ceased WO1997002723A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19680517T DE19680517D2 (de) 1995-06-30 1996-06-13 Verfahren und Vorrichtung zur Verbindung von mit Wärmequellen versehenen Platten, insbesondere elektrischen Leiterplatten, mit metallischen Wärmeableitplatten
AU59960/96A AU5996096A (en) 1995-06-30 1996-06-13 Process and device for joining electric, heat source-bearing printed circuit boards to metallic heat dissipating plates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19523871 1995-06-30
DE19523871.0 1995-06-30

Publications (1)

Publication Number Publication Date
WO1997002723A1 true WO1997002723A1 (fr) 1997-01-23

Family

ID=7765687

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/001032 Ceased WO1997002723A1 (fr) 1995-06-30 1996-06-13 Procede et dispositif de liaison de plaquettes pourvues de sources de chaleur, notamment des plaquettes de circuits imprimes, a des plaquettes metalliques de dissipation de chaleur

Country Status (3)

Country Link
AU (1) AU5996096A (fr)
DE (2) DE19549354A1 (fr)
WO (1) WO1997002723A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998005500A1 (fr) * 1996-08-07 1998-02-12 Meto International Gmbh Procede et dispositif pour appliquer des segments de materiau sur une bande de materiau

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6687969B1 (en) 1997-05-16 2004-02-10 Micron Technology, Inc. Methods of fixturing flexible substrates and methods of processing flexible substrates
US5972152A (en) 1997-05-16 1999-10-26 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
EP0902609A1 (fr) * 1997-09-05 1999-03-17 Ascom Hasler AG Procédé de fabrication d'un panneau à circuit, panneau à circuit et dispositif pour la mise en oeuvre de ce procédé
JPH11186003A (ja) * 1997-12-25 1999-07-09 Yazaki Corp Ｐｔｃ素子の放熱構造
DE19835127A1 (de) * 1998-08-04 2000-02-10 Wuerth Elektronik Gmbh Leiterplatte mit einem Heatsink und Verfahren zum Anbringen eines Heatsink
DE10102848B4 (de) * 2000-05-31 2004-04-15 Sebastian Erb Verfahren zum formschlüssigen und blasenfreien Verkleben von bestückten oder unbestückten gedruckten Schaltung mit planen Kühlkörpern unter Verwendung von Klebefolien
EP1305987A1 (fr) * 2000-08-03 2003-05-02 Hamilton Sundstrand Corporation Fixation par collage de cartes de circuit imprime sur des dissipateurs thermiques
FR2835689A1 (fr) * 2002-02-01 2003-08-08 Siemens Vdo Automotive Procede de collage d'un circuit imprime rigide sur une plaque d'aluminium

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2969300A (en) * 1956-03-29 1961-01-24 Bell Telephone Labor Inc Process for making printed circuits
GB1598554A (en) * 1978-05-30 1981-09-23 Ferranti Ltd Circuit assemblies
US4882000A (en) * 1985-05-23 1989-11-21 O. Key Printed Wiring Co., Ltc. Method of manufacturing printed circuit boards
DE4108667A1 (de) * 1991-03-16 1992-09-17 Bosch Gmbh Robert Verbundanordnung mit einer dickschichtleiterplatte sowie verfahren zu deren herstellung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4137936A1 (de) * 1991-11-18 1993-05-19 Pelikan Ag Transferklebeband

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2969300A (en) * 1956-03-29 1961-01-24 Bell Telephone Labor Inc Process for making printed circuits
GB1598554A (en) * 1978-05-30 1981-09-23 Ferranti Ltd Circuit assemblies
US4882000A (en) * 1985-05-23 1989-11-21 O. Key Printed Wiring Co., Ltc. Method of manufacturing printed circuit boards
DE4108667A1 (de) * 1991-03-16 1992-09-17 Bosch Gmbh Robert Verbundanordnung mit einer dickschichtleiterplatte sowie verfahren zu deren herstellung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
N.G. AAKALU ET AL.: "Integral heatsink printed circuit card", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 25, no. 7B, December 1982 (1982-12-01), NEW YORK US, pages 3606, XP002018123 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998005500A1 (fr) * 1996-08-07 1998-02-12 Meto International Gmbh Procede et dispositif pour appliquer des segments de materiau sur une bande de materiau
US6294037B1 (en) 1996-08-07 2001-09-25 Meto International Gmbh Process and device for applying sections of material on a material web

Also Published As

Publication number Publication date
DE19680517D2 (de) 1999-05-12
DE19549354A1 (de) 1997-01-09
AU5996096A (en) 1997-02-05

Similar Documents

Publication Publication Date Title
EP2969492B1 (fr) Procédé et systèmes servant à fabriquer des composants composites innovants
EP3316457A1 (fr) Dispositif et procédé de liaison de parties de tôles à un paquet de tôles
DE3416721A1 (de) Vorrichtung zum wickeln einer bahn
EP3414105B1 (fr) Dispositif et procédé d'usinage d'un substrat
DE19722327A1 (de) Verfahren zur Herstellung eines mehrlagigen Etiketts und Vorrichtung zur Durchführung des Verfahrens
EP0531251A2 (fr) Procédé et dispositif pour la fabrication d'un âme en nid d'abeilles à partir de feuilles en bandes, et utilisation de ladite âme comme âme pour des panneaus fabriqués en continu
EP3968425A2 (fr) Procédé et dispositif de fabrication d'un empilement de cellules pour batterie
WO1997002723A1 (fr) Procede et dispositif de liaison de plaquettes pourvues de sources de chaleur, notamment des plaquettes de circuits imprimes, a des plaquettes metalliques de dissipation de chaleur
DE69600379T2 (de) Verfahren und Vorrichtung zum Aufbringen eines Films auf eine Oberfläche
DE69507674T2 (de) Verfahren zum Herstellen eines flachen Kabelbaumes
EP3089335B1 (fr) Dispositif et procédé de liaison de parties de tôles à un paquet de tôles
DE68918823T2 (de) Vorrichtung zum Ausschneiden von Tab-Anordnungen und zum Formen von deren Anschlüssen.
DE3334009A1 (de) Vorrichtung zum auflaminieren eines folienstueckes auf einen plattenfoermigen gegenstand
EP0347729A1 (fr) Procédé et dispositif pour fabriquer un ruban à alvéoles sans fin
EP3968426A2 (fr) Procédé et dispositif de fabrication d'un empilement de cellules pour batterie
EP2029360B2 (fr) Procédé et dispositif de fabrication de films composites
DE3320078A1 (de) Anordnung und verfahren zur herstellung von geschichteten einheiten
DE69729180T2 (de) Vorrichtung und verfahren zur herstellung gedruckter leiterplatten
DE69210611T2 (de) Vorrichtung und verfahren zum verbinden von zwei dünnen materialbahnen
DE3503715C2 (fr)
WO1986003183A1 (fr) Procede et dispositif pour enlever des feuilles de protection
EP1014768B1 (fr) Procédé et dispositif pour la fabrication de multicouches
EP2265531A1 (fr) Procédé et dispositif pour retirer un film d'un support en forme de plaque ou d'un film
DE69207622T2 (de) Vorrichtung zur Herstellung von in leitender Folie gewickelten elektronischen Bauteilen
WO2000003919A1 (fr) Procede et dispositif pour la fabrication de produits adhesifs en surface, a partir d'un stratifie, leur transfert sur une feuille de recouvrement et leur presentation finale

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AL AM AT AU AZ BB BG BR BY CA CH CN CZ DE DK EE ES FI GB GE HU IS JP KE KG KP KR KZ LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK TJ TM TR TT UA UG US UZ VN AM AZ BY KG KZ MD RU TJ TM

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): KE LS MW SD SZ UG AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: CA

REF Corresponds to

Ref document number: 19680517

Country of ref document: DE

Date of ref document: 19990512

WWE Wipo information: entry into national phase

Ref document number: 19680517

Country of ref document: DE