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WO1996039547A3 - Depot par sources multiples de films minces d'alliages a memoire de forme - Google Patents

Depot par sources multiples de films minces d'alliages a memoire de forme Download PDF

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Publication number
WO1996039547A3
WO1996039547A3 PCT/IB1996/000766 IB9600766W WO9639547A3 WO 1996039547 A3 WO1996039547 A3 WO 1996039547A3 IB 9600766 W IB9600766 W IB 9600766W WO 9639547 A3 WO9639547 A3 WO 9639547A3
Authority
WO
WIPO (PCT)
Prior art keywords
shape
films
alloy thin
actuation
thin films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB1996/000766
Other languages
English (en)
Other versions
WO1996039547A2 (fr
Inventor
Peter A Krulevitch
Philip B Ramsey
Daniel M Makowiecki
Abraham P Lee
George C Johnson
M Allen Northrup
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of California Berkeley
University of California San Diego UCSD
Original Assignee
University of California Berkeley
University of California San Diego UCSD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of California Berkeley, University of California San Diego UCSD filed Critical University of California Berkeley
Publication of WO1996039547A2 publication Critical patent/WO1996039547A2/fr
Publication of WO1996039547A3 publication Critical patent/WO1996039547A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00Electrothermal relays
    • H01H61/01Details
    • H01H61/0107Details making use of shape memory materials
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B34/00Computer-aided surgery; Manipulators or robots specially adapted for use in surgery
    • A61B34/70Manipulators specially adapted for use in surgery
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B34/00Computer-aided surgery; Manipulators or robots specially adapted for use in surgery
    • A61B34/70Manipulators specially adapted for use in surgery
    • A61B34/72Micromanipulators
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/006Resulting in heat recoverable alloys with a memory effect
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/16Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03GSPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • F03G7/061Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element
    • F03G7/0614Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element using shape memory elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03GSPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • F03G7/064Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by its use
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03GSPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • F03G7/061Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element
    • F03G7/0616Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element characterised by the material or the manufacturing process, e.g. the assembly
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/0036Switches making use of microelectromechanical systems [MEMS]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00Electrothermal relays
    • H01H2061/006Micromechanical thermal relay

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Surgery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Medical Informatics (AREA)
  • Veterinary Medicine (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Molecular Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Robotics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

La présente invention concerne un procédé permettant de déposer simultanément, et de manière contrôlée, plusieurs métaux pour former des alliages en films minces ayant des propriétés physiques uniques. En particulier, ce procédé comprend le dépôt de films minces d'alliages multiples ayant des effets de mémoire de forme, tels que le Ni-Ti-Cu. Les films de Ni-Ti-Cu ont été déposés par pulvérisation mixte sur des substrats de silicium (26) chauffés, depuis des cibles (29, 30, 31) de Ni, de Ti et de Cu alimentées individuellement en énergie, ce qui donne davantage de souplesse dans la st÷chiométrie des films et permet ainsi d'optimaliser les propriétés de mémoire de forme. Les films métalliques multiples trouvent des applications particulières dans les micro-actionneurs.
PCT/IB1996/000766 1995-06-01 1996-05-29 Depot par sources multiples de films minces d'alliages a memoire de forme Ceased WO1996039547A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45805195A 1995-06-01 1995-06-01
US08/458,051 1995-06-01

Publications (2)

Publication Number Publication Date
WO1996039547A2 WO1996039547A2 (fr) 1996-12-12
WO1996039547A3 true WO1996039547A3 (fr) 1997-02-20

Family

ID=23819160

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB1996/000766 Ceased WO1996039547A2 (fr) 1995-06-01 1996-05-29 Depot par sources multiples de films minces d'alliages a memoire de forme

Country Status (1)

Country Link
WO (1) WO1996039547A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11845081B2 (en) 2007-07-13 2023-12-19 Handylab, Inc. Integrated apparatus for performing nucleic acid extraction and diagnostic testing on multiple biological samples

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6596132B1 (en) * 1999-09-22 2003-07-22 Delphi Technologies, Inc. Production of ternary shape-memory alloy films by sputtering using a hot pressed target
US6592724B1 (en) 1999-09-22 2003-07-15 Delphi Technologies, Inc. Method for producing NiTiHf alloy films by sputtering
EP1239151A1 (fr) * 2001-03-05 2002-09-11 Abb Research Ltd. Actionneur
US7829025B2 (en) 2001-03-28 2010-11-09 Venture Lending & Leasing Iv, Inc. Systems and methods for thermal actuation of microfluidic devices
US6454913B1 (en) 2001-07-12 2002-09-24 Delphi Technologies, Inc. Process for deposition of sputtered shape memory alloy films
US6832478B2 (en) * 2003-04-09 2004-12-21 Medtronic, Inc. Shape memory alloy actuators
US7690621B2 (en) 2003-04-15 2010-04-06 Board Of Trustees Operating Michigan State University Prestrained thin-film shape memory actuator using polymeric substrates
JP4996248B2 (ja) 2003-07-31 2012-08-08 ハンディーラブ インコーポレイテッド 粒子含有サンプルの処理
US8852862B2 (en) 2004-05-03 2014-10-07 Handylab, Inc. Method for processing polynucleotide-containing samples
ES2587007T3 (es) 2006-03-24 2016-10-20 Handylab, Inc. Sistema integrado para procesar muestras microfluídicas, y métodos de uso del mismo
US11806718B2 (en) 2006-03-24 2023-11-07 Handylab, Inc. Fluorescence detector for microfluidic diagnostic system
US10900066B2 (en) 2006-03-24 2021-01-26 Handylab, Inc. Microfluidic system for amplifying and detecting polynucleotides in parallel
US7998708B2 (en) 2006-03-24 2011-08-16 Handylab, Inc. Microfluidic system for amplifying and detecting polynucleotides in parallel
US8709787B2 (en) 2006-11-14 2014-04-29 Handylab, Inc. Microfluidic cartridge and method of using same
WO2008060604A2 (fr) 2006-11-14 2008-05-22 Handylab, Inc. Système microfluidique utilisé pour amplifier et détecter des polynucléotides en parallèle
US8287820B2 (en) 2007-07-13 2012-10-16 Handylab, Inc. Automated pipetting apparatus having a combined liquid pump and pipette head system
US8105783B2 (en) 2007-07-13 2012-01-31 Handylab, Inc. Microfluidic cartridge
AU2008276211B2 (en) 2007-07-13 2015-01-22 Handylab, Inc. Polynucleotide capture materials, and methods of using same
US8182763B2 (en) 2007-07-13 2012-05-22 Handylab, Inc. Rack for sample tubes and reagent holders
ES2769028T3 (es) 2011-04-15 2020-06-24 Becton Dickinson Co Termociclador microfluídico de barrido en tiempo real
WO2013062221A1 (fr) * 2011-10-28 2013-05-02 한국기계연구원 Film mince d'alliage de titane-nickel et procédé de préparation d'un film mince d'alliage de titane-nickel à l'aide d'un procédé de pulvérisation cathodique multiple
CN104040238B (zh) 2011-11-04 2017-06-27 汉迪拉布公司 多核苷酸样品制备装置
CN103160707A (zh) * 2011-12-13 2013-06-19 西安赛特金属材料开发有限公司 一种消防自动温控元件用钛镍基形状记忆合金材料
RU2658773C2 (ru) 2012-02-03 2018-06-22 Бектон, Дикинсон Энд Компани Система и способ выполнения автоматизированных тестов над множеством биологических проб
CN103007361B (zh) * 2012-12-21 2015-07-01 先健科技(深圳)有限公司 一种医疗器械涂层及其制备方法与含有该涂层的医疗器械

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0230652A1 (fr) * 1985-12-30 1987-08-05 International Business Machines Corporation Appareil pour la production d'un alliage ou d'une composition déposé sous vide et application d'un tel appareil
US4922462A (en) * 1984-12-28 1990-05-01 Kabushiki Kaisha Toshiba Reversible memory structure for optical reading and writing and which is capable of erasure
US5061914A (en) * 1989-06-27 1991-10-29 Tini Alloy Company Shape-memory alloy micro-actuator

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4922462A (en) * 1984-12-28 1990-05-01 Kabushiki Kaisha Toshiba Reversible memory structure for optical reading and writing and which is capable of erasure
EP0230652A1 (fr) * 1985-12-30 1987-08-05 International Business Machines Corporation Appareil pour la production d'un alliage ou d'une composition déposé sous vide et application d'un tel appareil
US5061914A (en) * 1989-06-27 1991-10-29 Tini Alloy Company Shape-memory alloy micro-actuator

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
SCRIPTIA METALLURGICA, 1991, Vol. 25, CHANG et al., "Elevation of Premartensitic Transformation Temperature by (Ni+Cu)2Ti Precipitation in Sputtered Ni (1-x)TiCu(x) Thin Films", pages 2079-2084. *
SHAPE MEMORY & SUPERELASTIC TECHNOLOGIES, ASILOMAR CONFERENCE CENTER, PACIFIC GROVE, CA, 1994, HUMBEECK et al., "The Present State of Shape Memory Materials and Barriers Still to be Overcome", pages 1-6. *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11845081B2 (en) 2007-07-13 2023-12-19 Handylab, Inc. Integrated apparatus for performing nucleic acid extraction and diagnostic testing on multiple biological samples

Also Published As

Publication number Publication date
WO1996039547A2 (fr) 1996-12-12

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