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WO1996021750A1 - Magnetron a aimants d'extremites courbes ou segmentes - Google Patents

Magnetron a aimants d'extremites courbes ou segmentes Download PDF

Info

Publication number
WO1996021750A1
WO1996021750A1 PCT/US1996/000409 US9600409W WO9621750A1 WO 1996021750 A1 WO1996021750 A1 WO 1996021750A1 US 9600409 W US9600409 W US 9600409W WO 9621750 A1 WO9621750 A1 WO 9621750A1
Authority
WO
WIPO (PCT)
Prior art keywords
center
section
cylindrical
magnet section
magnetron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1996/000409
Other languages
English (en)
Inventor
John P. Lehan
Henry Byorum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Messer LLC
Original Assignee
BOC Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOC Group Inc filed Critical BOC Group Inc
Priority to AU48556/96A priority Critical patent/AU4855696A/en
Priority to EP96904456A priority patent/EP0805880A4/fr
Priority to JP8521825A priority patent/JPH10512326A/ja
Publication of WO1996021750A1 publication Critical patent/WO1996021750A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets

Definitions

  • the present invention concerns sputtering systems which use magnetrons to sputter off a target to form a coating on a substrate.
  • the present invention concerns sputtering systems that use cylindrical magnetrons.
  • Typical coatings that are formed with magnetron sputtering systems include thermal control coatings, architectural coatings and automotive glass coatings.
  • a plasma is formed in a partial vacuum of a sputtering chamber. Ions in the plasma are attracted to the target and cause some of the target material to "sputter" off the target.
  • the gases used in sputtering systems can include inert gases, such as argon, for non-reactive sputtering. Alternately, reactive gases, such as nitrogen or oxygen, or a mixture of reactive and inert gases are used in reactive sputtering to form nitride or oxide layers.
  • the target is typically a cathode with a high applied negative potential. Magnetrons are used to enhance the sputtering effect by containing the plasma near the target. Planar magnetron systems form "racetrack" erosion zones in which only about 25% of the target material is eroded before the target must be replaced. Cylindrical magnetron systems can improve this target material utilization.
  • Cylindrical magnetron systems use a cylindrical target that is rotated around the magnetron. The rotation of the cylindrical target causes the erosion zone to be positioned on different locations on the cylindrical target at different times. Cylindrical magnetron systems are described in Wolf, et al, U.S. Patent No. 5,047,131 and McKelvey, U.S. Patent No. 4,356,073. Currently, 60% is a typical utilization rate of the target material in a cylindrical magnetron system.
  • FIG. 1 is adapted from Figure 5 of Hartig et al. This figure shows the plasma loop racetrack 115 of the Hartig patent.
  • the width 118 of the end stretches 110 and 112 is made considerably wider than the width 120 of the strait stretches 114, 116. In order to do this, the magnetic field at the end stretches is reduced.
  • the theory behind the Hartig et al. patent is that by widening the racetrack at the ends, the plasma should become less dense at these ends and the effect of end grooving in the cylindrical target should be reduced.
  • the reduction of the magnetic field strength may be such that the system no longer works as a magnetron.
  • a magnetron which has a field strength of 300 gauss which is required for proper plasma containment at a working voltage of 400 V and a pressure of about 3 mTorr.
  • the Larmor radius of an electron under these conditions is about 2 mm which is less than the 'dark space' for an unmagnetized Townsend discharge, and the plasma is stable.
  • a reduction of the sputtering rate of less than one half would likely be necessary to result in an even groove after being integrated by the rotation of the cathode.
  • the field strength would have to be reduced to about 120 gauss.
  • the Larmor radius of the electron would be increased to about 6mm which is larger than the 'dark space' for an unmagnetized Townsend discharge, and the plasma is unstable in the regions of the reduced magnetic fields.
  • the magnetron would no longer work as a high rate sputtering source.
  • reducing the end-track field strength sufficiently to expand the end regions 39 and 40 can result in a sacrifice of plasma stability. It is desirable to increase the utilization rate of target material in cylindrical magnetrons in a manner that the magnetron device efficiency is maintained and the plasma remains stable.
  • the present invention uses a magnetron that narrows the plasma racetrack at the ends in the direction along the rotation of the cylindrical target. This is done by optimizing the the the shape of the racetrack at the end portions and reducing the spacing between the magnets while holding the field constant at the target surface. In this manner, the magnetic field need not be reduced in the manner required to produce the racetrack of Hartig et. al.
  • the invention preferably uses a field strength in the confining track which is kept constant over the length of the race track including the ends.
  • the end portion of the racetrack needs to be controlled so that the erosion groove is kept to a constant depth over the whole sputtered surface. Since the cathode is rotated, the erosion is in effect integrated over each segment of the cylindrical surface.
  • racetrack at the ends is longer than twice the width of the racetrack on the linear section then there will be more material sputtered off of the surface at the ends resulting in a deeper groove.
  • An end geometry in the form of a circle or rectangle forms a racetrack significantly longer than twice the width of the linear section and consequently more material is sputtered from this region than is desirable.
  • the best end shape for the race track ends would be that of a triangle. When a triangle end is integrated there will not be extra erosion due to the rotation of the cathode because the apex of the triangle is not longer than the sum of the widths of the two linear sections.
  • the apex of the end track becomes necessarily slightly rounded and there will be extra erosion at this end if not compensated by narrowing the racetrack width or reducing the field. Nonetheless, even if the racetrack width is not narrowed, the erosion will not be of the extent that occurs if the end track has a rectangular or circular shape. In practice, when the pole pieces are shaped according to the present invention, the end shape approximates a parabola or semi-ellipse.
  • the end portion of the racetrack be as "pointy" as possible.
  • a triangular shape would be most preferable, if it was practicable.
  • a parabolic shape is more preferable than semi-ellipse shape. With the approximately parabolic shape obtained in practice, the erosion of the end of the target in a end portions of the cylindrical target is barely greater than that found over the linear portion even before adjusting the width of the racetrack.
  • a way to produce a "pointy" end portion of the race track is to shape the magnet section of the magnetron such that the magnet portions taper closer together in the ends rather than having a rectangular shaped outer magnet. This can be done by arranging the outer magnet section to include multiple rectangular magnets arranged in a tapering fashion, such as in a triangular shape. Alternately, the outer magnet section can be formed of a single magnet shaped into a tapering shape, such as a parabola.
  • Figure 1 is a diagram of a prior art racetrack for use with a cylindrical magnetron.
  • Figure 2A is a diagram of a racetrack shape of the present invention with triangular end sections.
  • Figure 2B is a diagram of a racetrack shape of the present invention with parabolic end sections.
  • Figure 2C is a diagram of a racetrack shape of the present invention with semi-elliptical end sections.
  • Figure 3 is a diagram showing a cylindrical magnetron.
  • Figure 4 is a diagram of a preferred embodiment of the magnetron for the present invention.
  • Figure 5A-C are diagrams of cross-sectional views of the magnetron shown in Figure 4.
  • Figure 6 is a graph of the tube radius versus position showing the erosion pattern of an embodiment of the present invention.
  • Figure 7 is a graph showing the erosion of a cylindrical target of the present invention.
  • Figure 8 shows a embodiment of the present invention in which the outer magnet is a cylindrical section whose plane projection looks parabolic.
  • Figure 3 is a diagram showing the cylindrical magnetron 30, with a magnetron portion 32, and target portion 34.
  • a dotted line shows the position of a racetrack 36 which is defined by the magnetron 32.
  • the racetrack 36 includes legs 36a and 36b, and an end section ,or "turn around" portion, 36c.
  • the racetrack 36 is located at different portions of the target 34 as the target 34 rotates. Ions and electrons circulate along the racetrack 36 and the ions sputter off portions of the target 34.
  • FIG. 2A is a diagram of a racetrack shape 11 of the present invention with triangular end sections 12. The longest distance, D ⁇ , along the direction of rotation is given by the equation:
  • Figure 2B is a diagram of a racetrack shape 16 of the present invention with parabolic end sections 17 and 18.
  • the parabolic end sections 17 and 18 are more "pointy" than the circular end portions 20 ,21 shown in phantom.
  • the longest distance, D p along the direction of rotation for the parabolic shaped end section is less than the longest distance, D c , along the direction of rotation for the circular shaped end section shown in phantom.
  • Part of the reason for this inequality is that the parabolic end section extends more in the direction perpendicular to the rotation than the circular end section. That is T>S.
  • the longest distance of the racetrack in the direction of rotation at the end portions is less than the longest distance in the direction of rotation at the end portions of a circular end section. That is, the longest distance of the racetrack in the direction of rotation is less than twice the square root of the combination of the distance between legs, 2S, times the leg width, W L , plus the leg width squared. D ⁇ D C .
  • FIG. 2C is a diagram of a racetrack shape 23 of the present invention with semi-elliptical end sections 24, 25. Elliptical end portions are less pointy than parabolic end portions. An equation for the longest distance, D ⁇ U along the direction of rotation for the semi-elliptical shaped end section can be given by
  • a preferred embodiment of the magnet assembly for the present invention produces a plasma racetrack with end portions that are somewhat parabolic in shape.
  • Figure 4 is a top view of the preferred embodiment of the magnetron of the present invention.
  • the magnets 56, 59, 58, 60 and 48 are positioned in a tapered fashion about the center axis of the inner magnet section 50.
  • the arrangement of these end magnets is somewhat triangular. It is beneficial that the magnets or magnet in the end portion beyond the center magnet section slopes gradually toward the center axis of the center magnet. The gradual sloping of the magnets or magnet produces a more "pointy" racetrack shape.
  • shapes that are less blunt than a rectangular or circular shaped end section such as triangular, parabolic and semi-ellipse shapes, are defined as having a "gradual slope".
  • the outer magnets including side magnets 52 and 54 and end magnet 48 along with magnets 56, 58, 59, and 60 are of one orientation while the center magnet 50 is of another.
  • the preferred magnetic material for the magnet assembly is SAM-15.
  • the properties of SAM-15 is shown in the following table.
  • Figure 5A shows a cross sectional view through Line C-C' .
  • Figure 5B shows a cross sectional view through Line D-D' of Figure 4.
  • Figure 5C shows a cross sectional view through Line E-E' of Figure 4.
  • the distances on Figure 5A-C are shown in inches.
  • the outer diameter of the target in the preferred embodiment is six inches, although other diameters are easily accommodated.
  • the geometry of a cylindrical magnetron makes the design of the magnetron to maximize the material utilization slightly easier since it is in effect a one- dimension problem along the axial position since the rotation of the cylindrical target evens out the erosion for different angles. Maximizing the erosion for a planar magnetron is a two-dimensional problem.
  • the shunt 66 on which the magnets are placed is made of mild steel.
  • Figure 6 is a graph of the experimental results from an eroded target of tube radius versus axial position for a prototype of the present invention. Note that at end position 80 which corresponds to the "turn around" position 36c in Figure 3 the erosion is roughly the same as position 82 on Figure 6 which corresponds to the "leg" portion of the racetrack. Bump 84 may be caused by the use of multiple rectangular magnets as the outer magnet rather than a single continuous magnet.
  • Figure 7 shows the experimental results of the erosion of a prototype cylindrical tube showing over 80% utilization for a supported tube.
  • Point 90 is the point at which the tube erodes through to the backing tube.
  • Point 90 corresponds to the total erosion or "1" position on the graph's horizontal scale.
  • the "0" position on the graph's horizontal scale represents no erosion.
  • the measured utilization was significantly greater than the 60% utilization found with the background art system.
  • Figure 8 shows a less preferred embodiment of the present invention in which the outer magnet is a cylindrical section whose plane projection looks parabolic.
  • One possible, although currently impractical, embodiment would be to form outer magnet 102 and inner magnet 100 out of a cylinder or cylindrical tube of magnetic material.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Ensemble magnétique pour magnétron cylindrique dont la piste (11) présente une extrémité (12) parabolique, semi-elliptique ou triangulaire de manière à réduire l'érosion de la cible cylindrique à ses extrémités. De cette façon, il n'est pas nécessaire de réduire notablement le champ magnétique aux extrémités de la piste et le rendement du magnétron peut être maintenu.
PCT/US1996/000409 1995-01-12 1996-01-11 Magnetron a aimants d'extremites courbes ou segmentes Ceased WO1996021750A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU48556/96A AU4855696A (en) 1995-01-12 1996-01-11 Rotatable magnetron with curved or segmented end magnets
EP96904456A EP0805880A4 (fr) 1995-01-12 1996-01-11 Magnetron a aimants d'extremites courbes ou segmentes
JP8521825A JPH10512326A (ja) 1995-01-12 1996-01-11 曲面又は扇状エンド・マグネットを持つ回転式マグネトロン

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37202395A 1995-01-12 1995-01-12
US08/372,023 1995-01-12

Publications (1)

Publication Number Publication Date
WO1996021750A1 true WO1996021750A1 (fr) 1996-07-18

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ID=23466389

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1996/000409 Ceased WO1996021750A1 (fr) 1995-01-12 1996-01-11 Magnetron a aimants d'extremites courbes ou segmentes

Country Status (4)

Country Link
EP (1) EP0805880A4 (fr)
JP (1) JPH10512326A (fr)
AU (1) AU4855696A (fr)
WO (1) WO1996021750A1 (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999054911A1 (fr) * 1998-04-16 1999-10-28 Sinvaco N.V. Dispositif de commande d'erosion et de pulverisation de cible dans un magnetron
GB2353294A (en) * 1999-08-19 2001-02-21 Praxair Technology Inc Low permeability non-planar ferromagnetic sputter targets
US6416639B1 (en) 1999-06-21 2002-07-09 Sinvaco N.V. Erosion compensated magnetron with moving magnet assembly
EP1566827A1 (fr) * 2004-02-18 2005-08-24 Applied Films GmbH & Co. KG Appareil de pulvérisation à magnétron
DE102009005512A1 (de) 2009-01-20 2010-07-22 Von Ardenne Anlagentechnik Gmbh Verfahren zum Betrieb einer Rohrmagnetronanordnung zum Sputtern
EP2306490A1 (fr) * 2009-10-02 2011-04-06 Applied Materials, Inc. Agencement d'aimant pour tube de support de cible et tube de support de cible le comprenant
US7993496B2 (en) 2004-07-01 2011-08-09 Cardinal Cg Company Cylindrical target with oscillating magnet for magnetron sputtering
DE102011077297A1 (de) * 2011-02-15 2012-08-16 Von Ardenne Anlagentechnik Gmbh Magnetronsputtereinrichtung
JP2014503691A (ja) * 2011-01-06 2014-02-13 スパッタリング・コンポーネンツ・インコーポレーテッド スパッタリング装置
EP2553138A4 (fr) * 2010-04-02 2014-03-19 Nuvosun Inc Amélioration de l'utilisation de la cible pour magnétrons tournants
DE102012109424A1 (de) 2012-10-04 2014-04-10 Von Ardenne Anlagentechnik Gmbh Sputtermagnetron und Verfahren zur dynamischen Magnetfeldbeeinflussung
US9761423B2 (en) 2012-07-11 2017-09-12 Canon Anelva Corporation Sputtering apparatus and magnet unit
US9758862B2 (en) 2012-09-04 2017-09-12 Sputtering Components, Inc. Sputtering apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011056581A2 (fr) * 2009-10-26 2011-05-12 General Plasma, Inc. Barreau aimanté à magnétron rotatif et appareil le contenant pour une utilisation de cible élevée
EP2407999B1 (fr) * 2010-07-16 2014-09-03 Applied Materials, Inc. Agencement d'aimant pour tube de support de cible et tube de support de cible le comprenant, ensemble formant cible cylindrique et système de pulvérisation

Citations (4)

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Publication number Priority date Publication date Assignee Title
US4525264A (en) * 1981-12-07 1985-06-25 Ford Motor Company Cylindrical post magnetron sputtering system
DE4117367A1 (de) * 1991-05-28 1992-12-03 Leybold Ag Verfahren zur erzeugung eines homogenen abtragprofils auf einem rotierenden target einer sputtervorrichtung
US5364518A (en) * 1991-05-28 1994-11-15 Leybold Aktiengesellschaft Magnetron cathode for a rotating target
US5427665A (en) * 1990-07-11 1995-06-27 Leybold Aktiengesellschaft Process and apparatus for reactive coating of a substrate

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DE2707144A1 (de) * 1976-02-19 1977-08-25 Sloan Technology Corp Kathodenzerstaeubungsvorrichtung
EP0451642B1 (fr) * 1990-03-30 1996-08-21 Applied Materials, Inc. Système de pulvérisation
WO1991020091A1 (fr) * 1990-06-16 1991-12-26 General Vacuum Equipment Limited Appareil de metallisation
FR2668171B1 (fr) * 1990-10-18 1992-12-04 Cit Alcatel Machine de depot par pulverisation cathodique.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4525264A (en) * 1981-12-07 1985-06-25 Ford Motor Company Cylindrical post magnetron sputtering system
US5427665A (en) * 1990-07-11 1995-06-27 Leybold Aktiengesellschaft Process and apparatus for reactive coating of a substrate
DE4117367A1 (de) * 1991-05-28 1992-12-03 Leybold Ag Verfahren zur erzeugung eines homogenen abtragprofils auf einem rotierenden target einer sputtervorrichtung
US5364518A (en) * 1991-05-28 1994-11-15 Leybold Aktiengesellschaft Magnetron cathode for a rotating target

Non-Patent Citations (1)

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Title
See also references of EP0805880A4 *

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999054911A1 (fr) * 1998-04-16 1999-10-28 Sinvaco N.V. Dispositif de commande d'erosion et de pulverisation de cible dans un magnetron
US6416639B1 (en) 1999-06-21 2002-07-09 Sinvaco N.V. Erosion compensated magnetron with moving magnet assembly
GB2353294A (en) * 1999-08-19 2001-02-21 Praxair Technology Inc Low permeability non-planar ferromagnetic sputter targets
EP1566827A1 (fr) * 2004-02-18 2005-08-24 Applied Films GmbH & Co. KG Appareil de pulvérisation à magnétron
US7993496B2 (en) 2004-07-01 2011-08-09 Cardinal Cg Company Cylindrical target with oscillating magnet for magnetron sputtering
DE102009005512A1 (de) 2009-01-20 2010-07-22 Von Ardenne Anlagentechnik Gmbh Verfahren zum Betrieb einer Rohrmagnetronanordnung zum Sputtern
EP2306490A1 (fr) * 2009-10-02 2011-04-06 Applied Materials, Inc. Agencement d'aimant pour tube de support de cible et tube de support de cible le comprenant
WO2011039192A1 (fr) * 2009-10-02 2011-04-07 Applied Materials, Inc. Agencement d'aimants pour un tube de cuisson cible et tube de cuisson cible le comprenant
EP2553138A4 (fr) * 2010-04-02 2014-03-19 Nuvosun Inc Amélioration de l'utilisation de la cible pour magnétrons tournants
KR20140053821A (ko) * 2011-01-06 2014-05-08 스퍼터링 컴포넌츠 인코포레이티드 스퍼터링 장치
JP2014503691A (ja) * 2011-01-06 2014-02-13 スパッタリング・コンポーネンツ・インコーポレーテッド スパッタリング装置
EP2661514A4 (fr) * 2011-01-06 2015-12-30 Sputtering Components Inc Appareil de pulvérisation
JP2017150082A (ja) * 2011-01-06 2017-08-31 スパッタリング・コンポーネンツ・インコーポレーテッド スパッタリング装置
USRE46599E1 (en) 2011-01-06 2017-11-07 Sputtering Components Inc. Sputtering apparatus
KR101959742B1 (ko) 2011-01-06 2019-03-19 스퍼터링 컴포넌츠 인코포레이티드 스퍼터링 장치
DE102011077297A1 (de) * 2011-02-15 2012-08-16 Von Ardenne Anlagentechnik Gmbh Magnetronsputtereinrichtung
US9761423B2 (en) 2012-07-11 2017-09-12 Canon Anelva Corporation Sputtering apparatus and magnet unit
US9758862B2 (en) 2012-09-04 2017-09-12 Sputtering Components, Inc. Sputtering apparatus
DE102012109424A1 (de) 2012-10-04 2014-04-10 Von Ardenne Anlagentechnik Gmbh Sputtermagnetron und Verfahren zur dynamischen Magnetfeldbeeinflussung

Also Published As

Publication number Publication date
JPH10512326A (ja) 1998-11-24
AU4855696A (en) 1996-07-31
EP0805880A4 (fr) 1998-05-06
EP0805880A1 (fr) 1997-11-12

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