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WO1996003355A1 - Process for producing ceramic microstructures - Google Patents

Process for producing ceramic microstructures Download PDF

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Publication number
WO1996003355A1
WO1996003355A1 PCT/EP1995/002242 EP9502242W WO9603355A1 WO 1996003355 A1 WO1996003355 A1 WO 1996003355A1 EP 9502242 W EP9502242 W EP 9502242W WO 9603355 A1 WO9603355 A1 WO 9603355A1
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WO
WIPO (PCT)
Prior art keywords
sol
gel
ceramic
microstructures
electrically conductive
Prior art date
Application number
PCT/EP1995/002242
Other languages
German (de)
French (fr)
Inventor
Hans-Joachim Ritzhaupt-Kleissl
Jürgen Laubersheimer
Original Assignee
Forschungszentrum Karlsruhe Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forschungszentrum Karlsruhe Gmbh filed Critical Forschungszentrum Karlsruhe Gmbh
Publication of WO1996003355A1 publication Critical patent/WO1996003355A1/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/624Sol-gel processing

Definitions

  • the invention relates to a method for producing ceramic microstructures according to claim 1.
  • DE 43 10 068 C1 discloses a process for producing a plate-shaped microstructure body made of ceramic, in which a film produced according to the "Doctor-Blade M process is provided with a microstructured embossing tool with the complementary structures of the embossing tool The embossed film is sintered and transferred into a ceramic microstructure body.
  • Electrophoresis and its use in shaping ceramics are described in the "Handbook of Ceramics", edited by Dr.-Ing. Wilhelm Büke, Verlag Schmid GmbH, Freiburg i. Brg. , treated. Electrophoresis using "lyophobic" brine (eg iron (II hydroxide, clay, quartz, sulfur in water) is explained on page 16. On page 20, the use of electrophoresis for the production of articles of daily use is reported Manufacture is based, inter alia, on a slip of 50% quartz and 59% clay, and the electrophoretic deposition is carried out on a porous sintered bronze or a porous graphite or graphite cement.
  • lyophobic brine eg iron (II hydroxide, clay, quartz, sulfur in water
  • the object of the invention is, in addition to the above-mentioned impression of a film produced by the "doctor blade” process, to provide a further process by means of which ceramic microstructures can be produced.
  • the starting point of the process are liquid organometallic compounds from which a gellable sol is formed. Usually alcoholates are used for the production of sol.
  • a sol for example, the precursor for a ceramic made of lead zirconium titanium oxide [PZT ceramic, Pb (Zrn 52 ⁇ i 0 48 ) ° 3 3 can be used.
  • organic auxiliaries for example formamide, can be added to the sol.
  • the microstructure in the finished ceramic microstructures can be adjusted by adding binders and plasticizers.
  • a "lost" shape which can either consist of a metal that can be selectively dissolved with respect to the ceramic, or of a plastic that can be burned or that can be selectively dissolved by chemical means.
  • a suitable material for the shape is poly methyl methacrylate (PMMA), which can be burned without residue.
  • PMMA poly methyl methacrylate
  • the form contains the complementary structures of the microstructures to be produced from ceramic.
  • the complementary structures can in turn be obtained by deep X-ray lithography, mechanical microfabrication or by molding an embossing tool.
  • a metal mold can be produced by galvanic molding of a plastic mold.
  • the complementary structures must be provided with an electrically conductive surface, provided that the material of the mold is not electrically conductive per se.
  • the conductive surface is preferably by dusting a metal (sputtering), e.g. B. made of gold.
  • the electrically conductive surface of the complementary structures is switched as an electrode during the subsequent electrophoresis step.
  • Any inert electrode e.g. B. a platinum sheet can be used.
  • the gel particles are preferably deposited on the electrically conductive surface at constant current, preferably at 30 to 100 mA, with voltages of up to 250 V being established. Typical and particularly preferred values for current and voltage in the PZT deposition are 30 mA and 80 V.
  • the deposition rate of the PZT sol in this case is approximately 20 ⁇ m / min.
  • the components of the sol are deposited homogeneously in accordance with the stoichiometric composition of the sol.
  • the auxiliaries, binders and plasticizers are deposited in the mold together with the components.
  • the sol gels during the electrophoretic deposition.
  • the gel filling the mold is dried. Drying is preferably carried out in several steps, each lasting a few hours: B. Lucas ⁇ drying, drying at 50 to 100 ° C in air and finally at 50 to 100 ° C in a vacuum. If drying cracks cannot be completely ruled out, in this case again gel of the same composition can be deposited electrophoretically. Since the deposition preferably begins at the points closest to the electrode, drying cracks are filled in from the bottom of the crack.
  • the complementary structure of the mold can first be filled in only partially, after which it is dried and then a further electrophoresis step takes place. These steps can be repeated several times.
  • the subsequent electrophoresis step the cracks which have arisen in the layer produced by the previous electrophoresis step during drying are automatically filled in, so that finally a gel is obtained which at most shows surface cracks.
  • the shape is removed.
  • plastic molds this can be done without residue by thermal pyrolysis.
  • the plastic form can be selectively removed using chemical solvents.
  • a form made of PMMA can be detached, for example, by acetonitrile or hot ethyl acetate.
  • Metal molds with a low melting point can be removed by selective melting. Since shrinkage occurs during drying, the dried gel can in many cases be easily removed from the metal mold anyway without destroying the mold.
  • the gel is then ceramized and densely sintered in a known manner by using high temperatures.
  • the ceramization is preferably carried out at temperatures of 500 to 800 ° C.
  • the sealing sintering takes place by increasing the temperature, for example to temperatures between 1000 and 1500 ° C. at PZT ceramics, the optimal temperature is 1150 ⁇ C with a holding time of 90 to 150 min.
  • the gold layer was about 30 n thick.
  • the microstructures formed a pattern of free-standing hexagonal columns with a height of 250 ⁇ m and a thickness of 50 ⁇ m, the distances between which corresponded to the column thickness. Each column was surrounded by six neighboring columns.
  • the gelled sol produced was placed in a thermostated electrophoresis cell.
  • the electrically conductive surface of the mold (2 x 2 cm) was switched as an anode.
  • a platinum sheet (2 x 2 cm) was used as the cathode, and its distance from the mold was at least 3 cm.
  • the electrophoresis was carried out at a constant current of 30 mA and approx. 80 V. After a deposition time of approx. 2 hours, a layer thickness of 2 mm was obtained, so that the microstructures were completely covered by the gel.
  • Drying was carried out in three steps: one day in air, then several hours at 80 ° C and finally at 80 ° C in a vacuum. Drying cracks were filled in by repeating the electrophoresis step.
  • both the organic constituents in the dried gel and the PMMA-For were burned off in a suitable oven, with continuous heating from 200 ° C. to 500 ° C. slowly (1.5 ° C./min). After that there was a ceramic microstructure.
  • the ceramic structure was densely sintered by sintering at a temperature of 1150 ° C. for 90 minutes.
  • a ceramic microstructure was obtained in the form of a plate which had a hexagonal pattern of hexagonal openings. The diameter of the openings was approximately 40 ⁇ m because of the shrinkage.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

The purpose of the invention is to propose a process for producing ceramic microstructures. According to the invention, the process comprises the following steps: a) a gelling sol is made from several organo-metallic liquid components; b) a mould is prepared which bears complementary structures to the microstructures having an electrically conductive surface; c) the complementary structures of the mould are electrophoretically and uniformly filled with the sol, in which the electrically conductive surface is used as an electrode and the sol is turned into a gel; d) the gel is dried; e) the mould is removed and f) the gel is made into a ceramic by burning off the organic components.

Description

Verfahren zur Herstellung keramischer MikroStrukturenProcess for the production of ceramic microstructures
Die Erfindung betrifft ein Verfahren zur Herstellung kerami¬ scher MikroStrukturen gemäß Anspruch 1.The invention relates to a method for producing ceramic microstructures according to claim 1.
Aus der DE 43 10 068 Cl ist ein Verfahren zur Herstellung ei¬ nes plattenförmigen Mikrostrukturkörpers aus Keramik bekannt, bei dem eine nach dem "Doctor-BladeM-Verfahren hergestellte Folie mit einem mikrostrukturierten Prägewerkzeug mit den Kom¬ plementärstrukturen des Prägewerkzeugs versehen wird. Durch Sintern wird die geprägte Folie in einen keramischen Mi- krostrukturkörper überführt.DE 43 10 068 C1 discloses a process for producing a plate-shaped microstructure body made of ceramic, in which a film produced according to the "Doctor-Blade M process is provided with a microstructured embossing tool with the complementary structures of the embossing tool The embossed film is sintered and transferred into a ceramic microstructure body.
Eine Übersicht über die Verfahren zur Herstellung eines kera¬ mischen Körpers durch Abformen enthält die Veröffentlichung E. Briscoe, C. B. Ponton: "ceramics - the fabrication challenge", Materials Science and Technology, September 1986, Vol. 2, 910- 912. Angesprochen werden insbesondere verschiedene Preßverfah¬ ren, Gießverfahren, Extrudierverfahren und die Beschichtung von Metallen durch die Gasphasenabscheidung (CVD) . Die Her¬ stellung verschiedener Maschinenteile wird beschrieben.An overview of the processes for producing a ceramic body by molding is contained in the publication E. Briscoe, CB Ponton: "ceramics - the fabrication challenge", Materials Science and Technology, September 1986, Vol. 2, 910-912 in particular various pressing processes, casting processes, extrusion processes and the coating of metals by gas phase deposition (CVD). The manufacture of various machine parts is described.
Die Elektrophorese und ihr Einsatz zur Formgebung in der Kera¬ mik werden im "Handbuch der Keramik", redigiert von Dr.-Ing. Wilhelm Büke, Verlag Schmid GmbH, Freiburg i. Brg. , behan¬ delt. Auf Seite 16 wird die Elektrophorese unter Verwendung "lyophober" Sole (z. b. Eisen(IIJhydroxid, Ton, Quarz, Schwe¬ fel in Wasser) erläutert. Auf Seite 20 wird über die Ver¬ wendung der Elektrophorese zur Herstellung von Gebrauchsgegen¬ ständen berichtet. Die Herstellung geht u. a. von einem Schlicker aus 50 % Quarz und 59 % Ton aus; die elektrophoreti- sche Abscheidung erfolgt auf einer porösen Sinterbronze oder einem porösen Graphit oder Graphitzement.Electrophoresis and its use in shaping ceramics are described in the "Handbook of Ceramics", edited by Dr.-Ing. Wilhelm Büke, Verlag Schmid GmbH, Freiburg i. Brg. , treated. Electrophoresis using "lyophobic" brine (eg iron (II hydroxide, clay, quartz, sulfur in water) is explained on page 16. On page 20, the use of electrophoresis for the production of articles of daily use is reported Manufacture is based, inter alia, on a slip of 50% quartz and 59% clay, and the electrophoretic deposition is carried out on a porous sintered bronze or a porous graphite or graphite cement.
Die Grundlagen der Elektrophorese und ihre Anwendung zur Her¬ stellung von Keramikkörpern werden eingehend in "Advanced Ceramic Processing and Technology", edited by John G. P. Bin- ner, Nayes Publications (1990) beschrieben. Die theoretischen Grundlagen der Elektrophorese von in einem Lösungsmittel sus¬ pendierten Keramikgrundstoffen werden im Kapitel "Fundamentals of Electrodeposition" auf Seite 257 ff. diskutiert. Unter dem Kapitel "Applications Developed to Pilot Plant Scale" auf Seite 268 ff. wird die Herstellung einer Folie aus Ton und ei¬ nes einseitig geschlossenen Rohres aus ß-Aluminat beschrieben. Es ist angegeben, daß es nahezu unmöglich ist, vorherzusagen, ob eine Suspension elektrophoretisch einen Niederschlag bildet (Seite 263 unten) .The basics of electrophoresis and its application for the production of ceramic bodies are described in detail in "Advanced Ceramic Processing and Technology", edited by John GP Bin ner, Nayes Publications (1990). The theoretical basics of electrophoresis of ceramic base materials suspended in a solvent are discussed in the chapter "Fundamentals of Electrodeposition" on page 257 ff. The chapter "Applications Developed to Pilot Plant Scale" on page 268 ff. Describes the production of a film made of clay and a tube made of β-aluminate which is closed on one side. It is stated that it is almost impossible to predict whether a suspension will precipitate electrophoretically (page 263 below).
Aufgabe der Erfindung ist, neben der eingangs angesprochenen Abformung einer nach dem "Doctor-Blade" Verfahren hergestell¬ ten Folie ein weiteres Verfahren anzugeben, mit dessen Hilfe keramische MikroStrukturen hergestellt werden können.The object of the invention is, in addition to the above-mentioned impression of a film produced by the "doctor blade" process, to provide a further process by means of which ceramic microstructures can be produced.
Die Aufgabe wird erfindungsgemäß durch das in Anspruch 1 be¬ schriebene Verfahren gelöst. Die weiteren Ansprüche geben be¬ vorzugte Ausgestaltungen des Verfahrens an.The object is achieved according to the invention by the method described in claim 1. The further claims indicate preferred embodiments of the method.
Ausgangspunkt des Verfahrens sind flüssige metallorganische Verbindungen, aus denen ein gelierfähiges Sol entsteht. Zu¬ meist werden für die Solherstellung Alkoholate eingesetzt. Als Sol kann beispielsweise der Precursor für eine Keramik aus Blei-Zirkonium-Titan-Oxid [PZT-Keramik, Pb(Zrn 52τi 0 4833 eingesetzt werden. Zur Vermeidung von Trocknungsrissen in ei¬ nem späteren Verfahrensschritt können dem Sol organische Hilfsstoffe, z. b. Formamid, beigefügt werden. Die Einstellung der Gefügestruktur in den fertiggestellten keramischen Mi- krostrukturen kann durch Zusatz von Bindern und Plastifi- zierern erfolgen.The starting point of the process are liquid organometallic compounds from which a gellable sol is formed. Mostly alcoholates are used for the production of sol. As a sol, for example, the precursor for a ceramic made of lead zirconium titanium oxide [PZT ceramic, Pb (Zrn 52 τi 0 48 ) ° 3 3 can be used. To avoid drying cracks in a later process step, organic auxiliaries, for example formamide, can be added to the sol. The microstructure in the finished ceramic microstructures can be adjusted by adding binders and plasticizers.
Weiterhin wird zur Durchführung des Verfahrens eine "verlo¬ rene" Form benötigt, die entweder aus einem selektiv gegenüber der Keramik auflösbaren Metall oder aus einem verbrennbaren oder selektiv auf chemischem Wege auflösbaren Kunststoff be¬ stehen kann. Ein geeigneter Werkstoff für die Form ist Poly- methylmethacrylat (PMMA) , das sich rückstandsfrei verbrennen läßt. Die Form enthält die Komplementärstrukturen der herzu¬ stellenden MikroStrukturen aus Keramik. Die Komplementärstruk¬ turen lassen sich ihrerseits durch Röntgentiefenlithographie, mechanische Mikrofertigung oder durch Abformen eines Präge¬ werkzeugs erhalten. Eine Form aus Metall läßt sich durch gal¬ vanische Abformung einer Form aus Kunststoff herstellen.Furthermore, to carry out the method, a "lost" shape is required, which can either consist of a metal that can be selectively dissolved with respect to the ceramic, or of a plastic that can be burned or that can be selectively dissolved by chemical means. A suitable material for the shape is poly methyl methacrylate (PMMA), which can be burned without residue. The form contains the complementary structures of the microstructures to be produced from ceramic. The complementary structures can in turn be obtained by deep X-ray lithography, mechanical microfabrication or by molding an embossing tool. A metal mold can be produced by galvanic molding of a plastic mold.
Die Komplementärstrukturen müssen mit einer elektrisch leitfä¬ higen Oberfläche versehen sein, sofern der Werkstoff der Form nicht an sich elektrisch leitfähig ist. Bei einer Form aus elektrisch nichtleitendem Kunststoff wie z. B. PMMA wird die leitfähige Oberfläche vorzugsweise durch Abstäuben eines Me¬ talls (Sputtern) , z. B. von Gold, hergestellt.The complementary structures must be provided with an electrically conductive surface, provided that the material of the mold is not electrically conductive per se. In a form made of electrically non-conductive plastic such as. B. PMMA, the conductive surface is preferably by dusting a metal (sputtering), e.g. B. made of gold.
Die elektrisch leitfähige Oberfläche der Komplementärstruktu¬ ren wird während des folgenden Elektrophoreseschritts als Elektrode geschaltet. Als Gegenelektrode kann eine beliebige inerte Elektrode, z. B. ein Platinblech, verwendet werden. Die Abscheidung der Gelpartikel auf der elektrisch leitfähigen Oberfläche erfolgt vorzugsweise bei konstantem Strom, bevor¬ zugt bei 30 bis 100 mA, wobei sich Spannungen bis zu 250 V einstellen. Typische und besonders bevorzugte Werte für Strom¬ stärke und Spannung bei der PZT-Abscheidung sind 30 mA und 80 V. Die Abscheiderate des PZT-Sols beträgt in diesem Fall ca. 20 μm/min. Der Abstand der beiden Elektroden sollte mindestens 3 cm betragen. Die elektrophoretische Abscheidung kann so lange fortgesetzt werden, bis die KomplementärStrukturen der Form ausgefüllt und überdeckt sind.The electrically conductive surface of the complementary structures is switched as an electrode during the subsequent electrophoresis step. Any inert electrode, e.g. B. a platinum sheet can be used. The gel particles are preferably deposited on the electrically conductive surface at constant current, preferably at 30 to 100 mA, with voltages of up to 250 V being established. Typical and particularly preferred values for current and voltage in the PZT deposition are 30 mA and 80 V. The deposition rate of the PZT sol in this case is approximately 20 μm / min. The distance between the two electrodes should be at least 3 cm. Electrophoretic deposition can continue until the complementary structures of the form are filled and covered.
Überraschenderweise werden bei der Elektrophorese die Kompo¬ nenten des Sols entsprechend der stöchiometrischen Zusammen¬ setzung des Sols homogen abgeschieden. Beim Elektrophorese¬ schritt werden die Hilfsstoffe, Binder und Plastifizierer zu¬ sammen mit den Komponenten in der Form abgeschieden. Während der elektrophoretischen Abscheidung geliert das Sol. Nach der elektrophoretischen Gelabscheidung wird das die Form ausfüllende Gel getrocknet. Vorzugsweise erfolgt die Trocknung in mehreren Schritten von jeweils einigen Stunden: z. B. Luft¬ trocknung, Trocknung bei 50 bis 100 °C an Luft und schließlich bei 50 bis 100 °C im Vakuum. Sollten sich Trocknungsrisse nicht vollständig ausschließen lassen, kann in diesem Fall er¬ neut elektrophoretisch Gel derselben Zusammensetzung abge¬ schieden werden. Da die Abscheidung bevorzugt an den der Elek¬ trode am nächsten liegenden Stellen beginnt, werden Trock¬ nungsrisse vom Rißgrund her aufgefüllt.Surprisingly, in electrophoresis, the components of the sol are deposited homogeneously in accordance with the stoichiometric composition of the sol. In the electrophoresis step, the auxiliaries, binders and plasticizers are deposited in the mold together with the components. The sol gels during the electrophoretic deposition. After the electrophoretic gel separation, the gel filling the mold is dried. Drying is preferably carried out in several steps, each lasting a few hours: B. Luft¬ drying, drying at 50 to 100 ° C in air and finally at 50 to 100 ° C in a vacuum. If drying cracks cannot be completely ruled out, in this case again gel of the same composition can be deposited electrophoretically. Since the deposition preferably begins at the points closest to the electrode, drying cracks are filled in from the bottom of the crack.
Alternativ kann die Komplementärstruktur der Form zuerst nur teilweise ausgefüllt werden, wonach getrocknet wird und an¬ schließend ein weiterer Elektrophorese-Schritt erfolgt. Diese Schritte können mehrfach wiederholt werden. Beim folgenden Elektrophorese-Schritt werden hierbei selbsttätig die Risse, die in der durch den vorangegangenen Elektrophorese-Schritt hergestellten Schicht beim Trocknen entstanden sind, ausge¬ füllt, so daß schließlich ein Gel erhalten wird, daß allen¬ falls oberflächliche Risse aufweist.Alternatively, the complementary structure of the mold can first be filled in only partially, after which it is dried and then a further electrophoresis step takes place. These steps can be repeated several times. In the subsequent electrophoresis step, the cracks which have arisen in the layer produced by the previous electrophoresis step during drying are automatically filled in, so that finally a gel is obtained which at most shows surface cracks.
Danach wird die Form entfernt. Bei Kunststoff-Formen kann dies durch thermische Pyrolyse rückstandsfrei erfolgen. Alternativ läßt sich die Kunststoff-Form durch chemische Lösungsmittel selektiv entfernen. Eine Form aus PMMA läßt sich beispiels¬ weise durch Acetonitril oder heißes Ethylacetat ablösen. Me¬ tallformen mit einem niedrigen Schmelzpunkt lassen sich durch selektives Abschmelzen entfernen. Da bei der Trocknung ein Schrumpf auftritt, wird sich das getrocknete Gel in vielen Fällen ohnehin einfach aus der Metallform entfernen lassen, ohne die Form zu zerstören.Then the shape is removed. In the case of plastic molds, this can be done without residue by thermal pyrolysis. Alternatively, the plastic form can be selectively removed using chemical solvents. A form made of PMMA can be detached, for example, by acetonitrile or hot ethyl acetate. Metal molds with a low melting point can be removed by selective melting. Since shrinkage occurs during drying, the dried gel can in many cases be easily removed from the metal mold anyway without destroying the mold.
Anschließend wird das Gel in bekannter Weise durch Anwendung hoher Temperaturen keramisiert und dichtgesintert. Die Kerami- sierung erfolgt vorzugsweise bei Temperaturen von 500 bis 800 °C. Die Dichtsinterung erfolgt durch Steigerung der Temperatur beispielsweise auf Temperaturen zwischen 1000 und 1500 °C. Bei PZT-Keramiken liegt die optimale Temperatur bei 1150 βC mit einer Haltezeit von 90 bis 150 min.The gel is then ceramized and densely sintered in a known manner by using high temperatures. The ceramization is preferably carried out at temperatures of 500 to 800 ° C. The sealing sintering takes place by increasing the temperature, for example to temperatures between 1000 and 1500 ° C. at PZT ceramics, the optimal temperature is 1150 β C with a holding time of 90 to 150 min.
Die Erfindung wird im folgenden anhand eines Durchführungsbei¬ spiels näher erläutert.The invention is explained in more detail below on the basis of an implementation example.
Herstellung eines Sols für eine PZT-KeramikProduction of a sol for a PZT ceramic
In einem thermostatisierbaren Glasgefäß wurden unter Stick¬ stoff-Atmosphäre 77,4 ml Zr(n-Propylalkoholat)4 auf 95 βC er¬ wärmt, dann 51,2 ml Ti(n-Propylalkoholat)4, 14,7 ml Acetylace- ton und 99,2 g basisches Bleiacetat zugegeben und gerührt, bis eine klare, braune, leicht opaleszierende viskose Lösung ent¬ standen war. Dann wurden 239,5 ml Ethylenglykol zugegeben, wo¬ rauf die Lösung sofort gelierte. Es wurde über Nacht kräftig gerührt, wonach das Reaktionsgemisch flüssig und klar er¬ schien. Darauf wurden 10 ml Formamid als Trocknungshilfsmit¬ tel, 6,6 ml Polyethylenglykol (MG=300) als Plastifizierer, 2 g Polyethylenglykol (MG=10.000) in einigen ml Et(OH)2 gelöst als Binder zur Vermeidung von Rissen in der keramischen Oberfläche sowie 1,3 ml Tetraethylenglykol zugegeben. Dann wurden noch 17,2 ml Wasser hinzugefügt. Nach etwa einer Stunde weiterem Rühren wurde bei 95 °C und vollem Ölpumpenvakuum das Lösungs¬ mittel in eine mit flüssigem Stickstoff gekühlte Vorlage ein¬ kondensiert, worauf eine dunkelbraune, zähe Flüssigkeit zu¬ rückblieb. Der Ansatz lieferte 500,2 g Precursor.In a thermostatically controlled glass vessel atmosphere substance 77.4 ml of Zr (n-Propylalkoholat) β 4 to 95 C er¬ were Stick¬ warmed, then 51.2 ml of Ti (n-Propylalkoholat) 4, 14.7 ml Acetylace- ton and 99.2 g of basic lead acetate were added and the mixture was stirred until a clear, brown, slightly opalescent, viscous solution had formed. Then 239.5 ml of ethylene glycol were added, whereupon the solution gelled immediately. The mixture was stirred vigorously overnight, after which the reaction mixture appeared liquid and clear. Then 10 ml of formamide as drying aid, 6.6 ml of polyethylene glycol (MW = 300) as plasticizer, 2 g of polyethylene glycol (MW = 10,000) were dissolved in a few ml of Et (OH) 2 as a binder to avoid cracks in the ceramic surface and 1.3 ml of tetraethylene glycol added. Then 17.2 ml of water were added. After stirring for about an hour at 95 ° C. and a full oil pump vacuum, the solvent was condensed into a receiver cooled with liquid nitrogen, whereupon a dark brown, viscous liquid remained. The batch gave 500.2 g of precursor.
Herstellung der FormMaking the mold
Eine durch Röntgenlithographie (Bestrahlung durch eine Maske und Auflösen der bestrahlten Bereiche) hergestellte, mit Mi- krostrukturen versehene Platte aus PMMA wurde mit Gold besput- tert. Die Goldschicht war ca. 30 n dick. Die MikroStrukturen bildeten ein Muster freistehender hexagonaler Säulen mit einer Höhe von 250 μm und einer Dicke von 50 μm, deren Abstände ge¬ geneinander der Säulendicke entsprach. Jede Säule war von sechs benachbarten Säulen umgeben. ElektrophoreseA plate of PMMA provided with microstructures and produced by X-ray lithography (irradiation through a mask and dissolution of the irradiated areas) was sputtered with gold. The gold layer was about 30 n thick. The microstructures formed a pattern of free-standing hexagonal columns with a height of 250 μm and a thickness of 50 μm, the distances between which corresponded to the column thickness. Each column was surrounded by six neighboring columns. Electrophoresis
In einer thermostatisierten Elektrophoresezelle wurde das her¬ gestellte gelierfähige Sol vorgelegt. Die elektrisch leitende Oberfläche der Form (2 x 2 cm) wurde als Anode geschaltet. Als Kathode diente ein Platinblech (2 x 2 cm) , dessen Abstand zur Form mindestens 3 cm betrug. Die Elektrophorese wurde bei ei¬ nem konstanten Strom von 30 mA und ca. 80 V vorgenommen. Nach einer Abscheidezeit von ca. 2 Stunden wurde eine Schichtdicke von 2 mm erhalten, so daß die MikroStrukturen vollständig vom Gel überdeckt waren.The gelled sol produced was placed in a thermostated electrophoresis cell. The electrically conductive surface of the mold (2 x 2 cm) was switched as an anode. A platinum sheet (2 x 2 cm) was used as the cathode, and its distance from the mold was at least 3 cm. The electrophoresis was carried out at a constant current of 30 mA and approx. 80 V. After a deposition time of approx. 2 hours, a layer thickness of 2 mm was obtained, so that the microstructures were completely covered by the gel.
Trocknen des elektrophoretisch abgeschiedenen GelsDrying the electrophoretically deposited gel
Die Trocknung erfolgte in drei Schritten: einen Tag an Luft, dann mehrere Stunden bei 80 °C und schließlich bei 80 °C im Vakuum. Trocknungsrisse wurden durch Wiederholen des Elektro¬ phorese-Schritts ausgefüllt.Drying was carried out in three steps: one day in air, then several hours at 80 ° C and finally at 80 ° C in a vacuum. Drying cracks were filled in by repeating the electrophoresis step.
Keramisieren und Entfernen der FormCeramicizing and removing the form
Im nächsten Verfahrensschritt erfolgte das Abbrennen sowohl der organischen Bestandteile im getrockneten Gel als auch der PMMA-For in einem geeigneten Ofen, wobei kontinuierlich von 200 °C bis 500 °C langsam (1,5 °C/min) hochgeheizt wurde. Da¬ nach lag eine kera isierte MikroStruktur vor. Durch Sintern bei einer Temperatur von 1150 °C für 90 min wurde die kerami¬ sierte Struktur dichtgesintert. Es wurde eine keramische Mi- krostruktur in Form einer Platte erhalten, die ein hexagonales Muster hexagonaler Öffnungen aufwies. Der Durchmesser der Öff¬ nungen betrug wegen des Schrumpfs ca. 40 μm. In the next process step, both the organic constituents in the dried gel and the PMMA-For were burned off in a suitable oven, with continuous heating from 200 ° C. to 500 ° C. slowly (1.5 ° C./min). After that there was a ceramic microstructure. The ceramic structure was densely sintered by sintering at a temperature of 1150 ° C. for 90 minutes. A ceramic microstructure was obtained in the form of a plate which had a hexagonal pattern of hexagonal openings. The diameter of the openings was approximately 40 μm because of the shrinkage.

Claims

Patentansprüche: Claims:
1. Verfahren zur Herstellung von keramischen Mikrostrukturen, bei dem a) aus mehreren metallorganischen Flüssigkomponenten ein gelierfähiges Sol hergestellt wird, b) eine Form bereitgestellt wird, die1. A method for producing ceramic microstructures, in which a) a gellable sol is produced from a plurality of organometallic liquid components, b) a mold is provided which
- Komplementärstrukturen der Mikrostrukturen trägt, wel¬ che- Complementary structures of the microstructures, which carries
- mit einer elektrisch leitfähigen Oberfläche versehen sind, c) die KomplementärStrukturen der Form elektrophoretisch mit dem Sol homogen aufgefüllt werden, wobei die elek¬ trisch leitende Oberfläche als Elektrode geschaltet wird und das Sol in ein Gel umgewandelt wird, d) das Gel getrocknet, e) die Form entfernt und f) durch Verbrennen der organischen Bestandteile das Gel keramisiert wird.- are provided with an electrically conductive surface, c) the complementary structures of the form are electrophoretically filled homogeneously with the sol, the electrically conductive surface being switched as an electrode and the sol being converted into a gel, d) the gel dried, e ) the mold is removed and f) the gel is ceramized by burning the organic constituents.
2. Verfahren nach Anspruch 1, bei dem die Form aus einem Kunststoff besteht und die elektrisch leitfähige Oberfläche durch Abstäuben (Sputtern) eines Metalls erzeugt wird.2. The method according to claim 1, wherein the mold consists of a plastic and the electrically conductive surface is produced by dusting (sputtering) a metal.
3. Verfahren nach Anspruch 1 oder 2, bei dem die im getrockne¬ ten Gel entstandenen Risse elektrophoretisch mit dem Sol ausgefüllt werden. 3. The method according to claim 1 or 2, in which the cracks formed in the dried gel are electrophoretically filled with the sol.
PCT/EP1995/002242 1994-07-22 1995-06-10 Process for producing ceramic microstructures WO1996003355A1 (en)

Applications Claiming Priority (2)

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DE19944425978 DE4425978C1 (en) 1994-07-22 1994-07-22 Microstructured ceramic body prodn.

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