WO1996000629B1 - Thermode solder blade - Google Patents
Thermode solder bladeInfo
- Publication number
- WO1996000629B1 WO1996000629B1 PCT/US1995/008290 US9508290W WO9600629B1 WO 1996000629 B1 WO1996000629 B1 WO 1996000629B1 US 9508290 W US9508290 W US 9508290W WO 9600629 B1 WO9600629 B1 WO 9600629B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- profile
- recited
- cited art
- obstacle
- profile comprises
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Abstract
A thermode solder blade (10) for soldering small components in industrial soldering equipment comprises a shaped body (12) formed from an electrically-insulating and heat-conducting material having an electrically-conductive heating element (18, 20) formed thereon and spaced away from a solder contacting surface thereof. The electrically-conductive heating element (18, 20) has an electrical resistance greater than about 4 ohms and preferably greater than about 5 ohms.
Claims
AMENDED CLAIMS
[received by the International Bureau on 3 January 1996 (03.01.96); original claims 13 and 14 added; remaining claims unchanged (1 page)]
13. A thermode solder blade as in any of claims 2-5 or 9, wherein said profile
comprises a notch.
14. A thermode solder blade as in any of claims 2-5 or 9, wherein said profile
comprises a shape formed to match said obstacle to be encountered on a soldering surface.
Statement Under Article 19
New claims 13-14 depend from any of original claims 2-5 or 9, and recite additional limitations which are not shown in the cited art and which involve an inventive step over the prior art.
Claims 13-14 inherit the limitation recited in claim 2 that the solder contacting surface has a profile shaped to provide clearance for an obstacle. Claim 13 recites that the profile comprises a notch. Claim 14 recites that the profile comprises a shape formed to match the obstacle.
The cited art (US A 5,010,227 and US A 3,943,323) do not show the profile recited in claim 2, nor does the cited art show the particular forms of that profile recited in claims 13-14, nor does the cited art make any suggestion of any such profiles recited in the claims.
Accordingly, the claims recite subject matter which involves an inventive step over the cited art.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8503460A JPH10502297A (en) | 1994-06-29 | 1995-06-29 | Thermode solder blade |
| EP95926615A EP0771242A2 (en) | 1994-06-29 | 1995-06-29 | Thermode solder blade |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/269,164 US5650081A (en) | 1994-06-29 | 1994-06-29 | Thermode solder blade with electric heater greater than four ohms |
| US08/269,164 | 1994-06-29 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| WO1996000629A1 WO1996000629A1 (en) | 1996-01-11 |
| WO1996000629B1 true WO1996000629B1 (en) | 1996-02-08 |
| WO1996000629A9 WO1996000629A9 (en) | 1996-02-29 |
Family
ID=23026071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US1995/008290 Ceased WO1996000629A1 (en) | 1994-06-29 | 1995-06-29 | Thermode solder blade |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5650081A (en) |
| EP (1) | EP0771242A2 (en) |
| JP (1) | JPH10502297A (en) |
| WO (1) | WO1996000629A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0186084B1 (en) * | 1995-09-02 | 1999-04-15 | 문정환 | Wedge tool with heating equipment |
| US6157870A (en) * | 1997-02-18 | 2000-12-05 | Zevatech Trading Ag | Apparatus supplying components to a placement machine with splice sensor |
| US6077022A (en) * | 1997-02-18 | 2000-06-20 | Zevatech Trading Ag | Placement machine and a method to control a placement machine |
| EP0901155B1 (en) * | 1997-09-05 | 2004-08-18 | ESEC Trading SA | Semiconductor mounting assembly for applying an adhesive on a substrate |
| DE59711263D1 (en) | 1997-10-30 | 2004-03-04 | Esec Trading Sa | Method and device for adjusting the bonding head of a machine for bonding semiconductor chips to a carrier material |
| ATE361549T1 (en) | 1997-12-07 | 2007-05-15 | Oerlikon Assembly Equipment Ag | SEMICONDUCTOR ASSEMBLY DEVICE HAVING A RECITAL CHIP GRIPPER |
| US6031242A (en) * | 1998-01-23 | 2000-02-29 | Zevatech, Inc. | Semiconductor die in-flight registration and orientation method and apparatus |
| SG71189A1 (en) * | 1998-01-26 | 2000-03-21 | Esec Sa | Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder |
| US6657165B1 (en) * | 2000-11-03 | 2003-12-02 | R. A. Jones & Co. Inc. | Sealing system for forming thermal seals and method of operation thereof |
| JP4598620B2 (en) * | 2005-07-22 | 2010-12-15 | 富士通株式会社 | Removal method of target parts and removal jig |
| FR3066937B1 (en) * | 2017-05-30 | 2019-07-12 | Continental Automotive France | HEATING DEVICE |
| GB2576524B (en) | 2018-08-22 | 2022-08-03 | Pragmatic Printing Ltd | Profiled Thermode |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US912765A (en) * | 1908-12-01 | 1909-02-16 | Economy Electric Company | Electrically-heated tool. |
| US1238671A (en) * | 1917-05-02 | 1917-08-28 | Lafayette Holcomb | Electrically-heated soldering-tool. |
| US2116562A (en) * | 1935-07-02 | 1938-05-10 | Bell Telephone Labor Inc | Soldering iron |
| US2336904A (en) * | 1941-07-18 | 1943-12-14 | Int Standard Electric Corp | Electrically heated soldering apparatus |
| US3651306A (en) * | 1969-04-28 | 1972-03-21 | Nicholas D Glyptis | Electric soldering gun and tip therefor |
| US3632036A (en) * | 1969-09-30 | 1972-01-04 | William M Halstead | Electrical component desoldering and extracting tool |
| US3654427A (en) * | 1970-09-28 | 1972-04-04 | Alexander Schoenwald | Electric heated soldering tool |
| US3943323A (en) * | 1974-08-23 | 1976-03-09 | The Bendix Corporation | Bonding apparatus |
| US4315128A (en) * | 1978-04-07 | 1982-02-09 | Kulicke And Soffa Industries Inc. | Electrically heated bonding tool for the manufacture of semiconductor devices |
| US4804129A (en) * | 1985-06-07 | 1989-02-14 | Pace Incorporated | In-line solder extractor and heater assembly for use therewith |
| US4752670A (en) * | 1985-06-25 | 1988-06-21 | Pace Incorporated | Bobbin assembly for a soldering/desoldering device using an etched foil heater |
| US4871899A (en) * | 1986-02-24 | 1989-10-03 | Unitek Corporation | Titiable electric thermode for multiple connection reflow soldering |
| US5010227A (en) * | 1989-02-15 | 1991-04-23 | Todd Thomas W | Soldering apparatus and method of using the same |
| US5025973A (en) * | 1989-12-27 | 1991-06-25 | Cooper Industries | Surface mount soldering tip holder |
| ATE120678T1 (en) * | 1990-07-13 | 1995-04-15 | Siemens Ag | CERAMIC SOLDER IG. |
-
1994
- 1994-06-29 US US08/269,164 patent/US5650081A/en not_active Expired - Fee Related
-
1995
- 1995-06-29 JP JP8503460A patent/JPH10502297A/en active Pending
- 1995-06-29 EP EP95926615A patent/EP0771242A2/en not_active Withdrawn
- 1995-06-29 WO PCT/US1995/008290 patent/WO1996000629A1/en not_active Ceased
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