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WO1995026237A1 - Buse permettant l'application dosee de gouttes de colle - Google Patents

Buse permettant l'application dosee de gouttes de colle Download PDF

Info

Publication number
WO1995026237A1
WO1995026237A1 PCT/DE1995/000387 DE9500387W WO9526237A1 WO 1995026237 A1 WO1995026237 A1 WO 1995026237A1 DE 9500387 W DE9500387 W DE 9500387W WO 9526237 A1 WO9526237 A1 WO 9526237A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
nozzle
coating
nozzle according
drops
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1995/000387
Other languages
German (de)
English (en)
Inventor
Johann Melf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE59504226T priority Critical patent/DE59504226D1/de
Priority to EP95913854A priority patent/EP0754095B1/fr
Publication of WO1995026237A1 publication Critical patent/WO1995026237A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter

Definitions

  • adhesive doses are first applied by means of a metering device arranged in a positioning unit, onto which the SD modules are then placed.
  • the adhesive then hardens through exposure to temperature or UV radiation.
  • the SMD-blocks are then fixed in the correct position as determined on the circuit board, 'that the electrical connection in the wave soldering, vapor phase can be produced by reflow soldering or soldering in.
  • the metering devices used for applying the adhesive essentially consist of an adhesive cartridge which is arranged in a resilient holder and can be pressurized with compressed air, a metering nozzle inserted into the adhesive cartridge and a spacer assigned to the metering nozzle.
  • this metering device which is arranged in the positioning unit of the SMD placement machine, is lowered until the spacer is seated on the printed circuit board, the impact caused thereby being absorbed by the adhesive cartridge being deflected.
  • an adhesive drop is then pressed onto the circuit board by pressurized air with the adhesive cartridge, the amount of adhesive metered in depending on the metering time and the pressure applied to the adhesive cartridge by depends on the nozzle geometry and the viscosity of the adhesive. The dynamic viscosity in turn depends on the temperature of the adhesive.
  • a cooling and / or heating device for temperature stabilization of the adhesive passed through can therefore also be assigned to the dosing nozzle (cf. EP-A-0 282 748).
  • the influence of the nozzle geometry on the metered amount of adhesive is deliberately exploited by using nozzles of different sizes. However, if there are changes in the nozzle geometry due to the deposition of adhesive residues, this leads to an undesirable reduction in the amount of adhesive added.
  • the dosing nozzles must therefore be cleaned or replaced at regular intervals. In order to avoid the difficult and time-consuming cleaning of the metering nozzles, plastic nozzles are also used, which after being contaminated by adhesive residues simply being thrown away and replaced by new nozzles.
  • the problem specified in the invention is based on the problem of creating a nozzle for the metered application of drops of adhesive to a substrate, which can be more easily freed of adhesive residues and also enables the cleaning intervals to be extended.
  • the advantages achieved by the invention are, in particular, that the anti-adhesive coating of the nozzle is not or only slightly wetted by the adhesive and that, in addition to improved dosing accuracy, a considerable extension of the cleaning intervals can also be achieved. It is to be regarded as surprising that with the small outlet-side inner diameters of the nozzles, which for example are 0.3 mm, 0.44 mm and 0.6 mm in an adhesive application station of an SMD production line, an anti-adhesive coating achieving the desired effect is applied at all can be.
  • the extension of the anti-adhesive coating over the end face in the outlet area of the nozzle according to claim 2 facilitates the detachment of the adhesive drops from the nozzle. Because the entire drop of glue comes off and no glue gets stuck, this leads to a further increase in dosing accuracy.
  • the embodiment according to claim 3 facilitates the temperature stabilization of the adhesive passed through the nozzle with the aid of a cooling and / or heating device due to the good heat conduction of the metal.
  • the use of aluminum or aluminum alloys according to claim 4 has proven to be a particularly economical solution with a very good thermal conductivity of the metal.
  • the development according to claim 5 is characterized by the particularly good antiadhesive properties of the coating consisting of polytetrafluoroethylene.
  • the embodiment according to claim 6 enables the Ar-matching of an anti-adhesive surface layer to a material of the nozzle body that is otherwise not or only difficult to coat.
  • nickel or nickel alloys have proven particularly useful.
  • the embodiment according to claim 9 enables a permanent anti-adhesive coating which is still fully effective even after several cleaning processes.
  • a layer thickness of the entire coating of approximately 10 ⁇ m has been found to be optimal.
  • Figure 1 is a side view of a nozzle for the metered application of adhesive drops on a substrate and
  • FIG. 2 shows a partial longitudinal section through the outlet area of the nozzle shown in FIG. 1.
  • FIG. 1 shows a dosing nozzle labeled DD, which is used as a replaceable nozzle in the adhesive application station of an SMD production line.
  • the dosing nozzle DD consisting of AlMgSilF28, for example, has an inner diameter in the inlet area of 4.2 mm.
  • the inside diameter at the outlet end of the dosing nozzle DD is 0.44 mm. It is a medium-sized metering nozzle.
  • the other two dosing nozzles used in the same adhesive application station have inside diameters of 0.3 mm and 0.6 mm at the outlet end.
  • a coating B This is an antiadhesive, adhesive-repellent coating B, which is shown in FIG. 2 only in those areas in which they are required to improve the function and to simplify maintenance of the dosing nozzles DD. In fact, the coating B is applied over the entire surface inside and outside to the dosing nozzle DD.
  • a coating B having a total layer thickness of approximately 10 ⁇ m consists of a base layer, which cannot be identified in more detail, and an anti-adhesive, adhesive-repellent surface layer.
  • the base layer consists of a chemically applied nickel-phosphorus alloy, while polytetrafluoroethylene, which is usually referred to as PTFE for short, is applied as the surface layer.
  • PTFE polytetrafluoroethylene

Landscapes

  • Coating Apparatus (AREA)
  • Materials For Medical Uses (AREA)

Abstract

L'invention concerne une buse (DD) permettant d'appliquer des gouttes de colle sur un substrat. La paroi intérieure de cette buse comporte, au moins dans sa zone de sortie, un revêtement (B) anti-adhésif qui repousse la colle. Ce revêtement anti-adhésif (B) se présente de préférence sous forme d'une série de couches comprenant une couche de base constituée d'un alliage de nickel et de phosphore déposée par voie chimique et une couche supérieure de polytétrafluoroéthylène. Les buses (DD) produites selon l'invention s'utilisent de préférence dans le poste d'application de colle d'une chaîne de montage de composants montés en surface. Le revêtement anti-adhésif (B) facilite le nettoyage des buses (DD) et permet d'espacer les opérations de nettoyage.
PCT/DE1995/000387 1994-03-29 1995-03-22 Buse permettant l'application dosee de gouttes de colle Ceased WO1995026237A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE59504226T DE59504226D1 (de) 1994-03-29 1995-03-22 Düse zum dosierten auftragen von klebstofftropfen
EP95913854A EP0754095B1 (fr) 1994-03-29 1995-03-22 Buse permettant l'application dosee de gouttes de colle

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEG9405332.4U 1994-03-29
DE9405332U DE9405332U1 (de) 1994-03-29 1994-03-29 Düse zum dosierten Auftragen von Klebstofftropfen

Publications (1)

Publication Number Publication Date
WO1995026237A1 true WO1995026237A1 (fr) 1995-10-05

Family

ID=6906693

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1995/000387 Ceased WO1995026237A1 (fr) 1994-03-29 1995-03-22 Buse permettant l'application dosee de gouttes de colle

Country Status (3)

Country Link
EP (1) EP0754095B1 (fr)
DE (2) DE9405332U1 (fr)
WO (1) WO1995026237A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0920920A3 (fr) * 1997-12-04 2000-12-27 Fuji Photo Film Co., Ltd. Appareil de revêtement par centrifugation pour le revêtement de disques optiques
US20120164325A1 (en) * 2010-12-27 2012-06-28 Nhk Spring Co., Ltd. Method of forming lubricative plated layer on viscous liquid feed nozzle and viscous liquid feed nozzle

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020127868A1 (de) 2020-10-22 2022-04-28 Baumer Hhs Gmbh Klebstoffauftragsvorrichtung mit verbesserter Düse

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2129776A (en) * 1982-11-15 1984-05-23 Usm Corp Adhesive dispenser
DE3903897A1 (de) * 1989-02-10 1990-08-16 Continental Ag Vorrichtung zum herstellen, ver- und/oder bearbeiten von kautschukmischungen
WO1991012921A1 (fr) * 1990-03-02 1991-09-05 Qenico Ab Dispositif d'application de pastilles de pate a souder, de colle ou similaires sur un substrat

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2129776A (en) * 1982-11-15 1984-05-23 Usm Corp Adhesive dispenser
DE3903897A1 (de) * 1989-02-10 1990-08-16 Continental Ag Vorrichtung zum herstellen, ver- und/oder bearbeiten von kautschukmischungen
WO1991012921A1 (fr) * 1990-03-02 1991-09-05 Qenico Ab Dispositif d'application de pastilles de pate a souder, de colle ou similaires sur un substrat

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 16, no. 300 (E - 1227) 2 July 1992 (1992-07-02) *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0920920A3 (fr) * 1997-12-04 2000-12-27 Fuji Photo Film Co., Ltd. Appareil de revêtement par centrifugation pour le revêtement de disques optiques
US20120164325A1 (en) * 2010-12-27 2012-06-28 Nhk Spring Co., Ltd. Method of forming lubricative plated layer on viscous liquid feed nozzle and viscous liquid feed nozzle
US20140124545A1 (en) * 2010-12-27 2014-05-08 Nhk Spring Co., Ltd. Method of forming lubricative plated layer on viscous liquid feed nozzle and viscous liquid feed nozzle
US8859039B2 (en) * 2010-12-27 2014-10-14 Nhk Spring Co., Ltd. Method of forming lubricative plated layer on viscous liquid feed nozzle and viscous liquid feed nozzle
US9844789B2 (en) 2010-12-27 2017-12-19 Nhk Spring Co., Ltd. Method of forming lubricative plated layer on viscous liquid feed nozzle and viscous liquid feed nozzle

Also Published As

Publication number Publication date
DE59504226D1 (de) 1998-12-17
EP0754095B1 (fr) 1998-11-11
DE9405332U1 (de) 1994-07-28
EP0754095A1 (fr) 1997-01-22

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