WO1995022252A9

WO1995022252A9 - Hoof leveling and balancing compound, hoof patch and custom contoured hoof pad

Info

Publication number: WO1995022252A9
Application number: PCT/US1995/002144
Authority: WO
Filing date: 1995-02-21
Publication date: 1995-10-26
Anticipated expiration: 1996-08-18

Abstract

A compound for bonding to a horse's hoof is disclosed. The invention comprises a particulate compound comprising at least a first ground up polymer (12) and an adhesive compound (14) for bonding with the ground up polymer (12). The present invention is also directed to a novel method for leveling the hoof of a horse. The method comprises the following steps cleaning the bottom of the hoof to remove impurities, applying an adhesive bonding agent (14) to all voids (16) in the hoof and lowering the hoof with bonding agent (14) into a ground up polymer (12) or polymers, which ground up polymer (12) bonds to the bonding agent (14) such that the loose particles (12) with the bonding agent (14) fill all voids (16) in the hoof. A shoe (20) constructed from the inventive hoof repair compound also is disclosed.

Description

HOOF LEVELING AND BALANCING COMPOUND, HOOF PATCH AND CUSTOM CONTOURED HOOF PAD

Field of the Invention The present invention is directed to a novel hoof corrective, reconstruction, leveling, balancing, and repair compound and applications, therefor as well as a novel horseshoe constructed from the same compound.

Background of the Invention The present invention is directed to a novel hoof leveling, balancing and repair compound, and, in particular, to a novel material which can be used for corrective reconstruction and repair of all hooved animals as well as to construct a novel custom contoured rim pad or horseshoe. Shoeing a horse can be a difficult procedure. Frequently, the horse's hoof contains defects or lacks sufficient surface area and structure on which to support a horse shoe. There has been an ongoing need to provide methods and systems for building up and supporting the hoof of a horse prior to shoeing. There are a number of patents which have been directed to hoof patch materials and to the problems associated with repairing the hooves of horses, mules, burros and other hooved animals. U.S. Patent No. 4,896,727 to Busser, is directed to a medium and a method for filling or replacing the hornwall or horny parts of the coffin of the hoof of an animal, particularly a horse. The medium consists of a mixture of a plurality of materials of which one is a synthetic resin and another consists of filler particles such as wood, rubber, cork or combination of filler particles. The mixture is adapted to be cured by the addition of a hardening catalyst, and optionally by the use of an accelerator.

U.S. Patent No. 5,199,498, discloses a hoof pad comprising a polymer composition containing at least 50% by weight of high molecular weight polycaprolactone polymers wherein the composition has a melting point of from about 120° F to about

200° F.

U.S. Patent No. 5,069,289, is directed to a process for attaching a non-metallic shoe to a horse's hoof and for replacing a crack in the hoof. The process involves heating the hoof and the part to be attached, if any, to about 275 degrees Fahrenheit, and then bonding with a paste-type urethane adhesive. The adhesive undergoes a phase change from paste to liquid at the hot surface and thereby produces a highly wetting liquid film that leads to a bond many times stronger than would have otherwise occurred.

U.S. Patent No. 4,982,797, is directed to a method for securing a horseshoe to a hoof by wrapping a curable resin coated sheet material around an applied horseshoe and at least a portion of the hoof after the cure has been initiated, such that the resin coated sheet material secures the horseshoe to the hoof. An apparatus is also provided for securing a horseshoe according to the method.

U.S. Patent No. 4,917,192, discloses a method for securing a horseshoe to a hoof by wrapping a curable resin coated sheet material around an applied horseshoe and at least a portion of the hoof after the cure has been initiated, such that the cured resin coated sheet material secures the horseshoe to the hoof.

U.S. Patent No. 4,456,001, is directed to a boot removably adapted for attachment to a equine hoof and carrying a multi-turn electrical coil which effectively surrounds the bottom of the hoof.

U.S. Patent No. 4,182,340, is directed to a hoof repair system in which a horse's hoof is repaired by forming holes through the hoof on opposite sides of the crack, threading an elongated strand and filling the crack with an adhesive material.

As discussed above, most of the prior art are directed to boot attachments, or apparatus which include a heating process. Further, the prior art has been typified by the need for catalysts and accelerators. None of the prior art disclose a t system for rapidly filling the void in a horse's hoof and 5 reconstructing, leveling, balancing and reshaping the hoof without the need for heating and chemical accelerators. None of the prior art disclose a material which can be used to construct a horseshoe or rim pad.

Summary of the Invention

10 The present invention is directed to a novel hooved animal leveling, balancing and repair compound and its many applications. The present invention function is an instant medial/lateral and interior/posterior leveling and balancing compound. It may be used to add length or area of hoof in order

15 to create a uniform weight-bearing surface prior to shoeing. The present invention also performs as a superior hoof patch and repair compound, and custom contour fitted rim pad, and shoe.

The present invention may be instantly applied, shaped and rasped to the desired configuration to correct virtually any hoof

20 deficiency and can then be nailed as well. Due to its unique chemical composition, the present invention is comfortably resilient and does not impede normal flexion of the hoof. It can be removed with a rasp just as if it were the natural hoof wall.

The present invention is installed in the following manner.

25 Initially, the hoof of the animal is trimmed and rasped and examined for level, balance and structure. The bottom of the hoof and all voids are then cleaned using a brass brush. A bonding agent in accordance with the present invention is applied to all voids in the hoof and to any area requiring reconstruction

30 or repair. If constructing a rim pad or shoe, the bonding agent is applied to the entire weight bearing surface of the hoof.

? The hoof is then lowered into a box or container which is evenly covered with approximately one-half inch of a loose particulate material, preferably comprising shredded rubber and

35 ester. The hoof is permitted to stand for approximately five to ten seconds in the compound. The pressure may be increased by lifting and holding the opposite foot. The hoof is then removed from the box and all loose particles are removed with a brush. The procedure is repeated in layers until the thickness and configuration desired is achieved. The hoof is then rasped to a final shape, it sets in seconds and can be rasped or nailed immediately thereafter. A shoe can then be nailed or glued on to the reconfigured hoof.

In a first embodiment, the present invention is directed to a repair, leveling and reconstruction compound for bonding to a hoof comprising a particulate material comprising at least a first ground up polymer and an adhesive compound for bonding with the particulate compound.

In a more preferred embodiment, the present invention is directed to a compound for bonding to a hoof comprising a particulate material comprising a ground up polymer and an adhesive compound comprising a cyanoacrylate adhesive for bonding the particulate compound.

The present invention is also directed to a method for leveling the hoof comprising the following steps: (a) cleaning the bottom of the hoof of all dirt and impurities; (b) applying an adhesive bonding agent to all voids in the hoof and to any area requiring reconstruction or repair; and lowering the hoof into a particulate material which bonds to the bonding agent such that the loose particles with the bonding agent fill all voids in the hoof. In a further embodiment, the compound of the present invention can be utilized to form a rim pad or horseshoe. The rim pad or shoe comprises shredded rubber and ground estane molded in the shape of a rim pad or horseshoe and held together by a bonding agent. These and other advantages and features of the present invention will become apparent from the following detailed description.

Brief Description of the Figures Figure 1 is a perspective view of a container holding a hoof repair and leveling compound of the present invention. Figure 2 is a perspective view of a hoof entering the hoof leveling, balancing, and repair compound of the present invention. Figure 3 is a side perspective view of a repaired hoof containing the hoof leveling, balancing and repair compound of the present invention.

Figure 4 is an underside view of a repaired hoof in accordance with the present invention.

Figure 5 is a section view of the hoof leveling, balancing and repair system of the present invention along line 5-5 of Figure 4.

Figure 6 is a repaired hoof in accordance with the present invention, over which a conventional shoe has been applied.

Figure 7 is the repaired hoof of Figure 6 holding a shoe constructed from the repair compound of the present invention.

Figures 8 and 9 illustrate a method for producing a shoe from the hoof repair compound of the present invention. Detailed Description of the Present Invention

The present invention is described with reference to the enclosed Figures wherein the same numbers are utilized where applicable. The present invention is being described in the context of the leveling, balancing and repair of a hoof. It is to be appreciated that the present invention is equally applicable to a mule, burro or other hooved animal.

Referring to Figure 1, the leveling, balancing and repair compound 11 of the present invention is shown. Referring to Figure 1, a container 10 is illustrated holding a blended ground material 12. The container may have any shape or configuration but should have a sufficient size to hold the hoof of a horse or other animal.

The blended ground material 12 is particulate in structure. In a most preferred embodiment, the ground material 12 comprises shredded rubber and ground estane. Estane is manufactured commercially by the B.F. Goodrich Co. In addition to estane, the ground compound 12 may further comprise any rubber, plastic, thermoplastic, urethane, polyurethane, graphite, teflon, acrylic, fiberglass, PVC, nylon, cork or wood particles. A second component, which is mixed with the particulate compound 12, is a polymer-based adhesive 14. In a preferred embodiment, the adhesive of the present invention is a cyanoacrylate-based adhesive. The adhesive 14 may be applied by any suitable application method.

The application of the horse hoof repair compound of the present invention is now described. The compound of the present invention is utilized to reconstruct, level, balance and repair the hoof of an animal such as a horse. The compound can be used as a rim pad or supporting base for a shoe.

Referring to Figures 2 to 7, a void or crack 16 in a hoof is initially cleaned. The void 16 is then filled with the adhesive 14, which in the preferred, is a cyanoacrylate based adhesive.

The hoof is then lowered into the container 10 holding the particles 12. The particles 12 mix with the adhesive 14 and fill the void 16. The container 10 should be of a size and shape to accept a hoof and should have between 1/4 - 1/2 inches of compound therein.

The hoof is then rasped or cleaned by a wire brush. and reshaped to correct any hoof deficiency such that a shoe can be nailed or glued thereon. The process may be repeated any number of times so that the hoof of the horse can be built-up and shaped as desired. The resulting structure can conform to the hoof and can expand as needed. The built-up hoof can then have a shoe 18 attached thereto as shown in Figure 6. It is to be appreciated that the compound of the present invention may be used to construct a rim pad 19.

Figures 8 and 9 illustrate a shoe 20 constructed from the compound of the present invention. In the case of the shoe, the particulate compound 14 is placed in a mold 22 with the adhesive 16. A shoe 20 is thus formed from the particulate 12 and adhesive 14 which may be glued or nailed onto the hoof of the horse. Alternatively, the mold 22 may be pliable and receive the hoof print of the horse.

The present invention has been described with reference to the preferred embodiment, it is to be appreciated that other embodiments fulfill the spirit and scope of the present invention and that the true nature and scope of the present invention should be determined with reference to the claims appended hereto .

Claims

1. A compound for bonding to a hoof comprising: a particulate compound comprising at least a first ground up polymer; and an adhesive compound for bonding with the particulate compound.

2. A compound for bonding to a horse's hoof comprising: a particulate compound comprising at least a first ground up polymer; and an adhesive compound comprising cyanoacrylate for bonding the particulate compound.

3. A compound for bonding to a horse's hoof wherein said at least first ground up polymer comprises shredded rubber and ground estane.

4. The compound of claim 2 wherein said polymer comprises a rubber.

5. The compound of claim 2 wherein said polymer comprises a plastic.

6. The compound of claim 2 wherein said polymer comprises a thermoplastic.

7. The compound of claim 2 wherein said polymer comprises a urethane.

_, 8. The compound of claim 2 wherein said polymer comprises a polyurethane.

9. The compound of claim 2 wherein said polymer comprises a graphite.

10. The compound of claim 2 wherein said polymer comprises a teflon. - 9 -

11. The compound of claim 2 wherein said polymer comprises a acrylic.

12. The compound of claim 2 wherein said polymer comprises _j 5 a fiberglass.

13._. The compound of claim 2 wherein said polymer comprises a polyvinylchloride.

10 14. The compound of claim 2 wherein said polymer comprises polyanaline.

15. The compound of claim 2 wherein said polymer comprises wood.

15

16. A method for leveling the hoof of a horse comprising the following steps: cleaning the bottom of the hoof to remove dirt and impurities; 20 applying an adhesive bonding agent to all voids in the hoof; and lowering the hoof with bonding agent into a particulate compound which bonds to the bonding agent such that the particulate compound bonds with the bonding agent to fill all 25 voids in the hoof.

18. The method of claim 15 comprising the further step of removing all loose particles from the hoof.

30 19. The method of claim 15 comprising the further step of rasping the hoof to a final shape.

20. The method of claim 15 comprising the further step of attaching a shoe to said hoof.

35

21. A horseshoe comprising shredded rubber and ground estane molded in the shape of a horseshoe and held together by a bonding agent comprising a cyanoacrylate.