WO1995009591A1

WO1995009591A1 - Adhesive plaster incorporating metallic copper

Info

Publication number: WO1995009591A1
Application number: PCT/GB1994/002159
Authority: WO
Inventors: Allan Victor Large
Original assignee: Robinson and Sons Ltd
Current assignee: Robinson and Sons Ltd
Priority date: 1993-10-04
Filing date: 1994-10-04
Publication date: 1995-04-13
Anticipated expiration: 1996-04-04
Also published as: AU7816994A; GB9320407D0

Abstract

An adhesive plaster for providing relief from discomfort for suffers from rheumatism, arthritis and similar complaints comprises a backing (1) of adhesive coated non-woven or woven stretch fabric material and a zone of metallic copper (2) positioned to be held against the skin of a wearer by the adhesive backing. The copper is preferably in the form of a copper foil.

Description

ADHESIVE PLASTER INCORPORATING METALLIC COPPER

This invention relates to an adhesive plaster incorporating metallic copper, the plaster being intended for application to the skin of a person suffering from arthritis, rheumatism or a similar condition to provide relief from the discomfort of the condition.

Many people suffering from arthritis, rheumatism and similar conditions find that they obtain relief from the discomfort of their condition by wearing a copper bracelet. Studies conducted in Australia in 1975 by .R. Walker et al indicated that wearers of copper- bracelets appear to experience less pain when wearing their bracelets.

The present invention provides a device for topical application of metallic copper to the skin of a wearer to provide relief in a manner similar to that which is provided by the wearing of a copper bracelet. The relatively small size, discreet appearance and ease of application of embodiments of the invention mean that metallic copper can be applied to areas of the body where conventional bracelets cannot be worn.

According to one aspect of the present invention there is provided an adhesive plaster incorporating metallic copper, the metallic copper being positioned to be maintained adjacent the skin of a user by an adhesive portion of the plaster. The metallic copper may be in the form of a copper foil or expanded or woven copper mesh, or in the form of a copper coating applied to a suitable substrate, for example a foil or plastics film. In the alternative, the metallic copper may be provided by particles of copper or copper coated particles applied to a suitable substrate, e.g. a convention adhesive coated non-woven fabric or stretch fabric wound dressing base.

In a particularly preferred embodiment of the invention the metallic copper is positioned such that it is, in use, in contact with the skin of the wearer. Under these conditions it is believed that the metallic copper can be dissolved by the moisture produced by the skin of the wearer and that copper will, as a result, pass into the blood stream of the wearer. It is believed that this transfer of copper is material to the benefits derived from wearing of the proposed plaster.

It is believed that the optimum absorption rate of copper is in the range of 2 to 10 mg/week and is preferably approximately 4 mg/week. The form of the metallic copper is preferably chosen to achieve the desired rate of copper transfer into the blood stream.

In a particularly preferred embodiment of the invention the metallic copper is provided by a copper foil of between 0.00025 inches and 0.003 inches (between 6.35x10^~6m and 7.62x10^~5m) thick and preferably approximately 0.001 inches (2.54x10^~5m) thick. If the metallic copper is in the form of a coating deposited on a substrate, e.g. of polymeric film a deposition thickness of up to approximately 0.001 inches (2.54x10^~^m) is preferable.

Preferably, in addition to the metallic copper the plaster comprises a base material of stretch fabric or non-woven fabric coated with a suitable adhesive compatible with both the metallic copper and the skin of a wearer. The use of a stretch fabric or non-woven fabric base is preferred to a waterproof film base in order to reduce so far as possible maceration and/or irritation of the underlying skin.

It has been found, as a practical matter that the invention is best embodied as a "window dressing" that is to say a dressing in which a continuous area of adhesive surrounds the copper so that when the dressing is applied to the skin there is a continuous zone surrounding the copper where the base material is adhered to the skin. The width of the margin is not critical and will, to an extent, be determined by the nature of the adhesive used and the nature of the backing material. In general terms, however, a margin of between 1mm and 20mm is satisfactory with the preferred width being between 8mm and 10mm.

As an alternative to sheet metallic copper material a perforated strip of copper or a strip of copper which has been formed with slits and then expanded may be used. Provided that such material provides the necessary surface area of copper it may well be preferred to plain copper foil since the perforations will lead .to improved permeability reducing still further the effects of maceration and skin irritation referred to above.

If the metallic copper is in the form of particles or granules of or coated with copper the material may be located on the surface of the adhesive which is applied to the plaster substrate, or it may be distributed throughout the body of the adhesive. Under these circumstances the adhesive is preferably permeable to moisture although if sufficient density of copper is present at the surface of the adhesive permeability may not be a necessary characteristic.

The invention will be better understood from the following description of a preferred embodiment thereof, given by way of example only, reference being had to the accompanying drawing wherein:

Figure 1 illustrates schematically an embodiment of the invention; and

Figure 2 is a cross-section on the line II-II of Figure 1.

Referring to the drawing the illustrated embodiment of the invention comprises a base 1 on which is mounted a square of copper foil 2. The base 1 comprises a non-woven fabric or woven stretch fabric backing 3 having an adhesive coating 4 on one side thereof. The adhesive coating extends over the entire area of the backing and is used to secure the copper foil 2 in position. The backing 3 and adhesive 4 are of a type compatible with use on human skin and are conveniently of the type conventionally used for adhesive wound dressings. A wide range of suitable backing materials and adhesives will be well known to those skilled in the art.

The copper foil 2 is preferably a foil of high purity (99.9% pure copper) and may be in the form of a hard conditioned copper sheet. Alternatively, in place of a copper foil there may be used a piece of polymeric or other film on which metallic copper has been deposited under vacuum or by an electrolytic process. Alternatively, metallic copper particles either alone or mixed with other therapeutic agents or mixed with a binding agent may be positioned to replace the copper foil 2.

The actual thickness of copper present is believed not to be critical to the present invention. If pure copper foil is used it is believed that a foil thickness of 0.001 inches (2.54x10^~5m) is believed to be suitable. In whatever form the copper is present it is preferable that it is exposed to moisture produced by the skin of a wearer such that between 2 and 10 and preferably about 4 mg of copper per week are dissolved and absorbed into the blood stream. In order to reduce maceration of the skin beneath the plaster the backing 3 and adhesive 4 are preferably moisture vapour permeable. Also, the copper foil 2 or, if used, the copper coated polymeric film are preferably perforated to permit passage of moisture from the skin therethrough.

After manufacture the adhesive 4 and copper area

2 will be covered by removable release strips, as is conventional in the art, to facilitate packing of the plaster and easy application thereof to the skin of a wearer.

It will be noted from Figure 1 that the width of the copper foil 2 is somewhat less than that of the backing

3 so that a continuous zone of adhesive 4 exists around the periphery of the copper 2. The continuous zone of adhesive ensures that the copper is maintained in intimate contact with the skin over substantially the entire area thereof and prevents the edges of the copper from curling following contact with clothing.

The dimensions of the plaster can, of course, be varied to suit the particular application and. wishes of the user. Typically, it is envisaged that plasters according to the invention will be manufactured in sizes ranging from 19mm x 38mm up to 50mm x 75mm. Circular plasters of various sizes may also be produced.

Claims

1. An adhesive plaster incorporating metallic copper, the metallic copper being positioned to be maintained adjacent the skin of a user by an adhesive portion of the plaster.

2. An adhesive plaster according to claim 1 comprising a base having an adhesive coating, the adhesive coating acting to maintain the metallic copper in position and including areas adjacent the metallic copper to facilitate adhesively securing the plaster to the skin of a wearer.

3. An adhesive plaster according to claim 2 wherein the base comprises a non-woven or woven stretch fabric backing and an adhesive coating on one side thereof.

4. An adhesive plaster according to any preceding claim wherein the metallic copper is in the form of a copper foil.

5. An adhesive plaster according to claim 4 wherein the copper foil is between 0.00025 inches and 0.003 inches thick and is preferably approximately 0.001 inches thick.

6. An adhesive plaster according to any of claims 1- 3 wherein the copper is in the form of a copper coating provided on a foil or film or is in the form of particles of copper.

7. An adhesive plaster according to any preceding claim wherein a continuous zone of adhesive surrounds the metallic copper.

8. An adhesive plaster according to any preceding claim wherein the copper is present in an amount to provide for dissolving of the copper under the influence of moisture from the skin at a rate of between 2mg/week and 1 Omg/week and is preferably present in an amount to provide dissolving at a rate of 4mg/week.