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WO1994014213A3 - Ensemble multicouche de connexion de modules de circuit integre a onde courte - Google Patents

Ensemble multicouche de connexion de modules de circuit integre a onde courte Download PDF

Info

Publication number
WO1994014213A3
WO1994014213A3 PCT/US1993/011757 US9311757W WO9414213A3 WO 1994014213 A3 WO1994014213 A3 WO 1994014213A3 US 9311757 W US9311757 W US 9311757W WO 9414213 A3 WO9414213 A3 WO 9414213A3
Authority
WO
WIPO (PCT)
Prior art keywords
modules
pins
connector assembly
power
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1993/011757
Other languages
English (en)
Other versions
WO1994014213A2 (fr
Inventor
Richard Fanucchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Priority to DE69316877T priority Critical patent/DE69316877T2/de
Priority to JP6514276A priority patent/JP2758081B2/ja
Priority to EP94912145A priority patent/EP0625287B1/fr
Publication of WO1994014213A2 publication Critical patent/WO1994014213A2/fr
Publication of WO1994014213A3 publication Critical patent/WO1994014213A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H01R13/6595—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members with separate members fixing the shield to the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

Ensemble de connexion permettant d'interconnecter des modules de circuit intégré à onde courte où chacun des modules comporte au moins une fiche d'interconnexion onde courte et une fiche d'alimentation en courant continu. Un plan de projection horizontal (28) accueille les faces d'appui (32) des modules (10) et comporte une série d'orifices (38, 40) destinés à recevoir les fiches d'interconnexion (18) et les fiches d'alimentation en courant continu (22) des modules. Une couche conductrice (78) opposée à la face d'accueil du plan de projection reçoit les signaux en onde courte des fiches d'interconnexion la traversant et communique ces signaux entre les différents modules. Des soufflets souples et un guide d'ondes à ruban servent à garantir l'harmonie des impédances et des connexions en onde courte. Les fiches d'alimentation en courant continu traversent la couche conductrice et le plan de projection isolant (87) ainsi qu'un quadrillage pour le courant continu (88) où s'effectue la connexion électrique avec chacune des fiches d'alimentation en courant continu. Ces dernières sont maintenues en place dans le quadrillage à l'aide de prises à ressort de sorte que les modules sont installés sur l'ensemble de connexion simplement en insérant les fiches dans les trous respectifs et, inversement, ils sont enlevés en les retirant simplement de l'ensemble de connexion.
PCT/US1993/011757 1992-12-03 1993-12-03 Ensemble multicouche de connexion de modules de circuit integre a onde courte Ceased WO1994014213A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE69316877T DE69316877T2 (de) 1992-12-03 1993-12-03 Mehrschichtiger verbinder für integrierte mikrowellenschaltungsmodule
JP6514276A JP2758081B2 (ja) 1992-12-03 1993-12-03 多重層のマイクロ波集積回路モジュールコネクタ装置
EP94912145A EP0625287B1 (fr) 1992-12-03 1993-12-03 Ensemble multicouche de connexion de modules de circuit integre a onde courte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/985,054 US5363075A (en) 1992-12-03 1992-12-03 Multiple layer microwave integrated circuit module connector assembly
US07/895,054 1992-12-03

Publications (2)

Publication Number Publication Date
WO1994014213A2 WO1994014213A2 (fr) 1994-06-23
WO1994014213A3 true WO1994014213A3 (fr) 1994-08-18

Family

ID=25531148

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1993/011757 Ceased WO1994014213A2 (fr) 1992-12-03 1993-12-03 Ensemble multicouche de connexion de modules de circuit integre a onde courte

Country Status (5)

Country Link
US (1) US5363075A (fr)
EP (1) EP0625287B1 (fr)
JP (1) JP2758081B2 (fr)
DE (1) DE69316877T2 (fr)
WO (1) WO1994014213A2 (fr)

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US6465743B1 (en) 1994-12-05 2002-10-15 Motorola, Inc. Multi-strand substrate for ball-grid array assemblies and method
EP0905829A1 (fr) * 1997-09-29 1999-03-31 Ivan Cyphelly Système de connexion étanche pour câblage parallèle et série
US6064286A (en) * 1998-07-31 2000-05-16 The Whitaker Corporation Millimeter wave module with an interconnect from an interior cavity
US6512431B2 (en) 2001-02-28 2003-01-28 Lockheed Martin Corporation Millimeterwave module compact interconnect
USD453152S1 (en) 2001-07-16 2002-01-29 Endwave Corporation Shaped reflector surface of a microwave antenna
USD453927S1 (en) 2001-07-16 2002-02-26 Endwave Corporation Shaped reflector surface of a microwave antenna
US6690252B2 (en) 2001-11-19 2004-02-10 The Boeing Company RF circuit assembly
US7107034B2 (en) * 2003-06-27 2006-09-12 The Boeing Company High frequency and low noise interconnect system
US6998944B2 (en) * 2003-11-14 2006-02-14 Itt Manufacturing Enterprises, Inc. Method and apparatus for microwave interconnection
US7603097B2 (en) 2004-12-30 2009-10-13 Valeo Radar Systems, Inc. Vehicle radar sensor assembly
US7680464B2 (en) * 2004-12-30 2010-03-16 Valeo Radar Systems, Inc. Waveguide—printed wiring board (PWB) interconnection
US20060160500A1 (en) * 2005-01-14 2006-07-20 Xytrans, Inc. VSAT block up converter (BUC) chip
CN101174737B (zh) * 2006-10-31 2010-08-25 英业达股份有限公司 电信号连接结构
US7688237B2 (en) * 2006-12-21 2010-03-30 Broadcom Corporation Apparatus and method for analog-to-digital converter calibration
US7753740B2 (en) * 2007-07-20 2010-07-13 Numatics, Incorporated Modular electrical bus system
US8074680B2 (en) * 2008-03-28 2011-12-13 Numatics, Incorporated Modular electrical bus system with built in ground circuit
US8295788B2 (en) * 2009-06-09 2012-10-23 Broadcom Corporation Method and system for an N-phase transmitter utilizing a leaky wave antenna
US8320856B2 (en) * 2009-06-09 2012-11-27 Broadcom Corporation Method and system for a leaky wave antenna as a load on a power amplifier
US8588686B2 (en) 2009-06-09 2013-11-19 Broadcom Corporation Method and system for remote power distribution and networking for passive devices
US8508422B2 (en) * 2009-06-09 2013-08-13 Broadcom Corporation Method and system for converting RF power to DC power utilizing a leaky wave antenna
US9570420B2 (en) 2011-09-29 2017-02-14 Broadcom Corporation Wireless communicating among vertically arranged integrated circuits (ICs) in a semiconductor package
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USRE48963E1 (en) 2012-03-02 2022-03-08 Microsoft Technology Licensing, Llc Connection device for computing devices
US8873227B2 (en) 2012-03-02 2014-10-28 Microsoft Corporation Flexible hinge support layer
US9426905B2 (en) 2012-03-02 2016-08-23 Microsoft Technology Licensing, Llc Connection device for computing devices
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US9870066B2 (en) * 2012-03-02 2018-01-16 Microsoft Technology Licensing, Llc Method of manufacturing an input device
US9075566B2 (en) 2012-03-02 2015-07-07 Microsoft Technoogy Licensing, LLC Flexible hinge spine
US9298236B2 (en) 2012-03-02 2016-03-29 Microsoft Technology Licensing, Llc Multi-stage power adapter configured to provide a first power level upon initial connection of the power adapter to the host device and a second power level thereafter upon notification from the host device to the power adapter
US9360893B2 (en) 2012-03-02 2016-06-07 Microsoft Technology Licensing, Llc Input device writing surface
US9064654B2 (en) 2012-03-02 2015-06-23 Microsoft Technology Licensing, Llc Method of manufacturing an input device
US20130300590A1 (en) 2012-05-14 2013-11-14 Paul Henry Dietz Audio Feedback
US10031556B2 (en) 2012-06-08 2018-07-24 Microsoft Technology Licensing, Llc User experience adaptation
US9019615B2 (en) 2012-06-12 2015-04-28 Microsoft Technology Licensing, Llc Wide field-of-view virtual image projector
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US8654030B1 (en) 2012-10-16 2014-02-18 Microsoft Corporation Antenna placement
EP2908971B1 (fr) 2012-10-17 2018-01-03 Microsoft Technology Licensing, LLC Écoulements de moulage par injection d'alliage métallique
WO2014059618A1 (fr) 2012-10-17 2014-04-24 Microsoft Corporation Formation de graphique par ablation de matériau
CN104870123B (zh) 2012-10-17 2016-12-14 微软技术许可有限责任公司 金属合金注射成型突起
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US9735491B2 (en) 2015-07-15 2017-08-15 Dynomax Inc. Easily removable contacts for micro connectors
US9842813B2 (en) 2015-09-21 2017-12-12 Altera Corporation Tranmission line bridge interconnects
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CN113787475B (zh) * 2021-09-16 2023-01-24 无锡华测电子系统有限公司 固定工装
CN119943795A (zh) * 2025-01-14 2025-05-06 中国电子科技集团公司第十研究所 一种高频集成器件板级弹性互联结构及加工方法

Citations (4)

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US3681738A (en) * 1971-02-02 1972-08-01 Berg Electronics Inc Circuit board socket
EP0164293A2 (fr) * 1984-05-31 1985-12-11 Fujitsu Limited Borne flexible d'alimentation en courant
EP0222188A2 (fr) * 1985-10-14 1987-05-20 Nec Corporation Connecteur pour dispositif à micro-ondes pouvant être connecté facilement aux composants du circuit à micro-ondes
GB2193848A (en) * 1986-07-31 1988-02-17 Raytheon Co Microwave circuit package connector

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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3681738A (en) * 1971-02-02 1972-08-01 Berg Electronics Inc Circuit board socket
EP0164293A2 (fr) * 1984-05-31 1985-12-11 Fujitsu Limited Borne flexible d'alimentation en courant
EP0222188A2 (fr) * 1985-10-14 1987-05-20 Nec Corporation Connecteur pour dispositif à micro-ondes pouvant être connecté facilement aux composants du circuit à micro-ondes
GB2193848A (en) * 1986-07-31 1988-02-17 Raytheon Co Microwave circuit package connector

Also Published As

Publication number Publication date
JP2758081B2 (ja) 1998-05-25
WO1994014213A2 (fr) 1994-06-23
EP0625287A1 (fr) 1994-11-23
DE69316877T2 (de) 1998-05-28
DE69316877D1 (de) 1998-03-12
EP0625287B1 (fr) 1998-02-04
JPH07503576A (ja) 1995-04-13
US5363075A (en) 1994-11-08

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