[go: up one dir, main page]

WO1993020585A1 - Resines de reaction pour l'enrobage de composants electroniques sensibles a la pression - Google Patents

Resines de reaction pour l'enrobage de composants electroniques sensibles a la pression Download PDF

Info

Publication number
WO1993020585A1
WO1993020585A1 PCT/DE1993/000247 DE9300247W WO9320585A1 WO 1993020585 A1 WO1993020585 A1 WO 1993020585A1 DE 9300247 W DE9300247 W DE 9300247W WO 9320585 A1 WO9320585 A1 WO 9320585A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
percent
weight
composition according
reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1993/000247
Other languages
German (de)
English (en)
Inventor
Ernst Wipfelder
Suzanne Kober
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to EP93906430A priority Critical patent/EP0636277A1/fr
Publication of WO1993020585A1 publication Critical patent/WO1993020585A1/fr
Anticipated expiration legal-status Critical
Priority to KR1019940703476A priority patent/KR950701140A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • a versatile and simple encapsulation process is the potting of electronic components with liquid reactive resins and subsequent thermally initiated curing.
  • Envelopes for components which are operated in an environment with constant conditions with regard to temperature and atmosphere are unproblematic. However, if the components are to be suitable for larger temperature ranges, the thermal-mechanical property level of the reaction resin coating must be such that the tensile or compressive forces that necessarily occur in the temperature change do not exceed a critical size for the component gene.
  • Rubber-elasticized reactive resins are known which, with regard to their mechanical properties, would be suitable for wrapping and covering pressure-sensitive components. Because of the sensitivity of such masses to moist or chemically aggressive, in particular thermally oxidative, environments, they are therefore not suitable for encasing components which are operated under the above ambient conditions. .
  • Object of the present invention is, therefore, a Reak ⁇ tion resin composition for casting indicate that already as monolayer u hüllung an optimal low-stress property shows a high temperature range of -40 * C to 150 * C pressure sensitive elektro ⁇ tronic Components does not lead to any damage to the cast components and, moreover, is resistant to a moist and aggressive environment, as occurs in particular in the engine compartment of motor vehicles.
  • reaction resin composition which has the features of claim 1 according to the invention.
  • the reactive resin composition according to the invention combines the advantageous properties of the individual components contained therein in an inventive manner, without at the same time their Show disadvantages.
  • silicone rubber particles By incorporating the silicone rubber particles, a viscoplastic behavior of the hardened reaction resin composition with a high modulus of elasticity is achieved without being associated with a noticeable decrease in the glass transition temperature of the hardened reaction resin composition.
  • the high rate of diffusion of small molecules (for example water) within silicone rubber is also suppressed by the use of finely divided silicone rubber particles or has no effect on the (hardened) reactive resin molding material.
  • the reactive constituents of the reaction resin matrix harden into a reaction resin molding material with a high glass transition temperature of, for example, more than 170 ° C., which lies outside the desired operating temperature interval for a component to be encased and therefore shows no phase change during operation of the component.
  • the hardener system which consists of the hardener and the accelerator, is optimized for rapid hardening at a relatively high temperature.
  • a suitable reaction accelerator based on imidazole guarantees that the reaction resin composition has a sufficiently long processability of at least one hour below the curing temperature and thus enables a long machine cycle without cleaning the application devices in between.
  • the high filler content of up to 45 percent by volume is responsible for only a small thermal expansion in the operating temperature interval, which is due to the low expansion coefficient of quartz material.
  • the reactive resin composition has a sufficiently low viscosity of less than 1500 mPas for processing, which is brought about by an optimized particle size distribution of the filler. Any application equipment can be used with the reactive resin compound. be used and thus cast components that have a sophisticated geometry with undercuts and / or narrow spaces or gaps of a few microns.
  • a suitably chosen accelerator contributes to the high possible processing temperature and thus to the low viscosity at this processing temperature.
  • Imidazoles which are substituted in the 1-position with a cyanoethyl group such as, for example, l-cyanoethyl-2-phenylimidazole, are particularly suitable.
  • other substituted imidazoles are also suitable, for example 2-ethyl-4-methylimidazole.
  • These imidazoles can be used alone as accelerators, or in admixture with other accelerators, for example with a benzyl tetrahydrothiolanium salt.
  • Bisepoxides based on the diglycidyl ethers of bisphenol A and / or bisphenol F are preferably used as reactive diluents. These result in the uncured reac- tion resin composition to lower the viscosity without negatively influencing the glass transition temperature of the hardened reactive resin molding materials.
  • Glycidyl ethers based on phenol or cresol novolak are preferably used as crosslinking enhancers. This component gives the molding material a glass transition temperature and, like the bisphenol A or
  • Manufacture F-diglycidyl ether in electronic grade quality This means in particular a total chlorine content of less than 1200 pp and minimal ionic impurities, which could otherwise result in an increased susceptibility to corrosion of the electronic components encased in the mass.
  • Anhydrides are used as the hardener component for the reaction resin composition, methylnadic acid anhydride being particularly suitable.
  • the susceptibility to cracking of the crosslinked reactive resin molding materials is significantly reduced even under high temperature changes.
  • the reaction resin compositions can be provided in the form of two storage-stable components (resin and hardener components) and can be prepared into reaction resin compositions using the usual methods. They are overall at 60 "C for four hours consumption compatible and can be beneficial in the batch process without expensive mixing equipment process. On the other hand it takes is 20 minutes at 150 ⁇ C for the curing of the resin compositions.
  • the processing properties oer reaction resin compound according to the invention are thus so therefore a - Provided that electronic components can be encased in large series with relatively little technological effort and in economical production. Due to the high temperature resistance of the reaction resin composition according to the invention, this reacts in a preparatory manner 0585
  • a reaction resin matrix suitable for the reaction resin composition according to the invention is mixed together from the following constituents given in parts by weight (MT):
  • This mass contains 18 MT silicone rubber particles with a maximum particle size of less than 2 ⁇ m, which are modified for better compatibility with the reaction resin matrix surfaces, that is to say are provided with functional groups compatible with epoxy resins.
  • the proportion of filler is mixed together from commercially available quartz materials in such a way that the reaction resin composition shows the lowest possible viscosity with the same filler content.
  • splintered quartz is added in the following proportions:
  • the finished reaction resin compound has a viscosity of 1000 mPas and a service life of 75 minutes at a processing temperature of 80 ⁇ C. If all components are mixed homogeneously, the reaction resin composition can be processed with any application devices. 20 minutes at 150 * C are sufficient to harden the mass.
  • a composition consisting of the constituents mentioned Christs ⁇ resin composition was cured under the above conditions, has a glass transition temperature (temperature of the damping maximum) of 185 * C, a modulus at 25 * C of
  • a test board is cast with the reaction resin compound and then subjected to rapid temperature changes. For this purpose, cycles from -40 * C to +150 * C, each with a one-hour residence time, are selected. After 300 cycles, no impairment of the measured values can be determined.
  • the same boards are cast with a resin composition which differs from the invention only in the absence of the silicone rubber particles. These boards also function after a 300 cycle temperature change test, but clear cracks can be seen in the casing.
  • the degree of filling can be reduced, for example to 30 or 35 percent by volume.
  • the viscosity required for processing is already reached at 60 or 70 "C, which increases the service life (pot life) to 265 or 150 minutes.
  • the reaction resin composition can therefore be optimized for any application problem, the focus being on the molding material properties or, alternatively, on the processing properties of the reaction resin composition. In any case, one is compared to the state of the

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Pour l'enrobage de composants électroniques sensibles à la pression, il est proposé de modifier un système de résine de réaction époxide/anhydride à haute température de transition vitreuse en y incorporant par dispersion de fines particules de caoutchouc au silicone ainsi qu'un matériau de remplissage de silice vitreuse optimisé au niveau de la répartition granulométrique afin d'améliorer le module d'élasticité, la résistance à la craquelure et la résistance aux chocs thermiques, tout en disposant d'une forte résistance à l'humidité et aux agents chimiques.
PCT/DE1993/000247 1992-04-03 1993-03-17 Resines de reaction pour l'enrobage de composants electroniques sensibles a la pression Ceased WO1993020585A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP93906430A EP0636277A1 (fr) 1992-04-03 1993-03-17 Resines de reaction pour l'enrobage de composants electroniques sensibles a la pression
KR1019940703476A KR950701140A (ko) 1992-04-03 1994-10-04 압력-감지 전자소자를 캐스팅하는 반응성 수지(reaction resins for potting pressure-sensitive electronic domponents)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4211250.8 1992-04-03
DE4211250A DE4211250A1 (de) 1992-04-03 1992-04-03 Reaktionsharze zum Vergießen von druckempfindlichen elektronischen Bauelementen

Publications (1)

Publication Number Publication Date
WO1993020585A1 true WO1993020585A1 (fr) 1993-10-14

Family

ID=6456011

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1993/000247 Ceased WO1993020585A1 (fr) 1992-04-03 1993-03-17 Resines de reaction pour l'enrobage de composants electroniques sensibles a la pression

Country Status (4)

Country Link
EP (1) EP0636277A1 (fr)
KR (1) KR950701140A (fr)
DE (1) DE4211250A1 (fr)
WO (1) WO1993020585A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12152133B2 (en) 2020-10-22 2024-11-26 Infineon Technologies Ag Mold compounds and packages for encapsulating electronic components

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3488404A (en) * 1967-12-18 1970-01-06 Chevron Res Diepoxy alkanes as epoxy diluents for polyglycidyl ethers of polyhydric phenols or epoxidized novolacs
GB2086134A (en) * 1980-09-22 1982-05-06 Hitachi Ltd Resin encapsulated electronic devices
US4732962A (en) * 1987-02-18 1988-03-22 General Motors Corporation High temperature epoxy tooling composition of bisphenol-A epoxy, trifunctional epoxy, anhydride curing agent and an imidazole catalyst
EP0384774A2 (fr) * 1989-02-23 1990-08-29 Kabushiki Kaisha Toshiba Blindage pour un dispositif semi-conducteur
EP0386473A2 (fr) * 1989-03-08 1990-09-12 Siemens Aktiengesellschaft Pâte de recouvrement en goutte pour modules électriques et électroniques

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3488404A (en) * 1967-12-18 1970-01-06 Chevron Res Diepoxy alkanes as epoxy diluents for polyglycidyl ethers of polyhydric phenols or epoxidized novolacs
GB2086134A (en) * 1980-09-22 1982-05-06 Hitachi Ltd Resin encapsulated electronic devices
US4732962A (en) * 1987-02-18 1988-03-22 General Motors Corporation High temperature epoxy tooling composition of bisphenol-A epoxy, trifunctional epoxy, anhydride curing agent and an imidazole catalyst
EP0384774A2 (fr) * 1989-02-23 1990-08-29 Kabushiki Kaisha Toshiba Blindage pour un dispositif semi-conducteur
EP0386473A2 (fr) * 1989-03-08 1990-09-12 Siemens Aktiengesellschaft Pâte de recouvrement en goutte pour modules électriques et électroniques

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SIEMENS FORSCHUNGS UND ENTWICKLUNGSBERICTE Bd. 17, Nr. 3, 1988, BERLIN ,GERMANY Seiten 154 - 158 AULICH H.A. ET AL 'Low alpha moulding compounds' *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12152133B2 (en) 2020-10-22 2024-11-26 Infineon Technologies Ag Mold compounds and packages for encapsulating electronic components

Also Published As

Publication number Publication date
KR950701140A (ko) 1995-02-20
DE4211250A1 (de) 1993-10-07
EP0636277A1 (fr) 1995-02-01

Similar Documents

Publication Publication Date Title
DE3137480C2 (fr)
DE69501771T2 (de) Epoxidharzformmasse zur Einkapselung elektronischer Bauelemente und eingekapselte Halbleiteranordnung unter Verwendung dieser Formmasse
DE3884648T2 (de) Epoxyharz-Zusammensetzung und eine harzumhüllte Halbleiteranordnung.
EP1303567B1 (fr) Masse de remplissage a modification de volume a base de resine a matrice polymere
EP0308676A2 (fr) Enrobage sans contrainte pour composants électriques et électroniques, notamment pour circuits hybrides
EP1518889B1 (fr) Système durcissable de résine réactive
DE69508129T2 (de) Epoxydharzzusammensetzung und Formmassen daraus
DE10057111C1 (de) Wärmeleitfähige Vergußmasse
EP0386473B1 (fr) Pâte de recouvrement en goutte pour modules électriques et électroniques
DE10024439A1 (de) Verguss- oder Einbettmasse mit elektromagnetischen Abschirmeigenschaften zur Herstellung elektronischer Bauteile
EP2252641B1 (fr) Système de résine réactive durcissable
DE102007062035A1 (de) Reaktionsharzsystem
EP1337585B1 (fr) Masse de scellement a une composante modifiee a la silicone
WO1993020585A1 (fr) Resines de reaction pour l'enrobage de composants electroniques sensibles a la pression
DE19538468B4 (de) Verfahren zur flächigen Verklebung von Werkstücken, geklebter Verbund und Verwendung davon
DE10144871A1 (de) Vergußmasse mit hoher thermischer Stabilität
EP0623782A2 (fr) Réflecteur pour phare de véhicule et procédé pour sa fabrication
DE3229558A1 (de) Impraegniervergussmasse fuer elektrische bauteile
WO2009089957A1 (fr) Système de résine réactive durcissable
EP0391183A1 (fr) Isolant électrique
EP2127856B1 (fr) Procédé de fabrication d'un composant électronique muni d'un boîtier et composant électronique muni d'un boîtier
EP2283068A1 (fr) Matériau composite thermoconducteur contenant une poudre d'aluminium, procédé de fabrication et utilisation du matériau composite
DE102007012919B4 (de) Zündspule
DE102020210680A1 (de) Haftvermittlungs-Verbundwerkstoff, Verfahren zum Herstellen eines Haftvermittlungs-Verbundwerkstoffs, Elektrische Vorrichtung, Verfahren zum Herstellen einer elektrischen Vorrichtung
WO2007017307A1 (fr) Laque a la resine epoxy durcissable aux uv et thermiquement pour des ensembles electroniques dans des locaux humides

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): KR US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1993906430

Country of ref document: EP

ENP Entry into the national phase

Ref country code: US

Ref document number: 1994 313230

Date of ref document: 19941003

Kind code of ref document: A

Format of ref document f/p: F

WWP Wipo information: published in national office

Ref document number: 1993906430

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 1993906430

Country of ref document: EP