[go: up one dir, main page]

WO1993008491A1 - Production de structures definies sur des materiaux au moyen de techniques optiques combinees pour transformer le faisceau de traitement - Google Patents

Production de structures definies sur des materiaux au moyen de techniques optiques combinees pour transformer le faisceau de traitement Download PDF

Info

Publication number
WO1993008491A1
WO1993008491A1 PCT/US1992/008515 US9208515W WO9308491A1 WO 1993008491 A1 WO1993008491 A1 WO 1993008491A1 US 9208515 W US9208515 W US 9208515W WO 9308491 A1 WO9308491 A1 WO 9308491A1
Authority
WO
WIPO (PCT)
Prior art keywords
energy
altering
laser
energy distribution
lasers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1992/008515
Other languages
English (en)
Inventor
Aaron Lewis
Ilan Pinevsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO1993008491A1 publication Critical patent/WO1993008491A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0933—Systems for active beam shaping by rapid movement of an element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0025—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration
    • G02B27/0037—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration with diffracting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0944—Diffractive optical elements, e.g. gratings, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0988—Diaphragms, spatial filters, masks for removing or filtering a part of the beam
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/32—Holograms used as optical elements

Definitions

  • Field of Invention A method for transforming processing beams in order to produce a desired energy profile on a target which is to be processed by the beam.
  • the object of the invention is to provide a method of getting reproducible, stable, and reliable energy profiles on a desired surface on which the material to be processed is placed.
  • material processing by light does not depend on the phase of the beam profile, i.e. its spatial coherence and thus, our invention is restricted to those cases in which the phases of the I(x,y,z) are not a relevant factor.
  • I(x,y,z) distribution we apply a combination of technologies based on geometrical optical and physical optical principles. 3. State of Prior Art
  • One of the conventional approaches for material processing is to scan a beam across the area of the material to be processed.
  • Another approach keeps the laser and the sample stationary and uses either a laser with a uniform beam profile or improves an existing laser beam profile in conjunction with a set of apertures (or other masks) which are changed during the material processing.
  • An alternate to the use of a set of apertures in this method is the possibility of using a set of rotating- scanning slits.
  • the improvement of the beam uniformity is achieved by rotating the beam which produces a time average.
  • a rotating set of mirrors or a dove prism can be used.
  • refractive optics such as a Fly's eye lens can be used and other possibilities include using an incoherent fiber bundle or biprisms to get beam folding etc.
  • the rotation of the beam is problematic because of problems with the laser beam pointing stability, high sensitivity to misalignments during the rotation and other mechanical constraints. But mainly, it cannot fully resolve the problem of hot/cold spots in the initial beam profile which will appear as tracks of high or low energy in the rotated average beam profile.
  • the refractive methods have low throughput (Fly's eye lens) and are often not suitable for high power lasers in a specific wavelength. In some cases even the improvement is not enough for the desired materials processing application. For example bipris s can make a good beam better but cannot turn a bad beam into a good beam.
  • This invention is different from the conventional methods which were described in the "State of Prior Art", because they modulate the material processing in space using modulated energy pro iles rather than changing the number of pulses in a local area.
  • This is based on the fact that processes such as photochemical ablation have typical response of etching depth (or other changes of the material) per pulse as a function of energy, therefore one may work in the linear or the nonlinear regime with the condition that for a given processing the responsivity of the specific material with a specific wavelength, energy and pulse width are known previously. See, for example, G.M. Davis et al, J. Phys. D: Appl. Phys.
  • the next step after getting the uniform plane of energy is to transform it according to the desired structure in the processed material. This is described in the net subsections under the Geometrical Optical Techniques. 6.1.1.1. Transformations by masks which are based on partial absorption and/or reflection.
  • holographic filters It is possible to reshape the energy profile of a collimated laser beam to another desirable beam profile by holographic filters.
  • These holograms may be recorded optically (analog recording on a photo sensitive material) or generated by computer.
  • 6.1.2.1. Analog Holograms A mask with the desirable energy profile is illuminated with the object beam and using a reference beam the hologram is recorded. By illumination with a reconstructing reference beam which is an exact phase conjugate of the recording reference beam the image of the mask is reconstructed, therefore it is possible to get a desirable energy profile in the reconstructing process.
  • holographic arrangements There is a wide variety of possible holographic arrangements.
  • a significant advantage of this approach may be the possibility of getting the distributed energy profile on any desired surface with any curvature, together with high reliability and flexibility which are characteristic of computer designed elements.
  • a mask is fabricated.
  • the appropriate method for fabrication of the relief pattern should be chosen to meet the requirements for the energy profile resolution, place, image fidelity, etc. on the target.
  • Lasers with unstable resonators may be used in schemes which require higher spatial coherence and in addition, line narrowing of the laser beam to improve the temporal coherence may be achieved by using of external diffraction gratings and/or intracavity line narrowing by dispersive optical components or other approaches.
  • Lasers systems using an Injection-Locked Oscillator Amplifier may be used in schemes which require highly spatially and temporally coherent light.
  • CGH Multi Holographic Optical Element
  • This increase in the divergence will decrease the performance of a given hologram in a given image plane distance in terms of the energy profile resolution and accuracy on the target. This can be improved by decreasing the distance of the hologram (13 in Figure 3) from the target. This requires decreasing of the typical pixels sizes in at least the same factor as an increase in the diffraction angle.
  • commercial beam homogenizers for excimer lasers have less than 15mrad divergence for the exit uniform energy plane, and use of electron beams for the hologram fabrication will be able to get relief patterns with submicron pixel sizes.
  • the object in this approach for beam transformation is to provide methods of controlling the material processing by light as function of place by using different numbers of pulses (or exposure times in CW lasers) with the same energy as a function of place.
  • the first step is to compute the number of pulses (or exposure times) that the material should be exposed to as a function of x,y,z which are arbitrary spatial coordinates.
  • N is the number of pulses or exposure time. Therefore when the relation between P and E is known, N can be easily derived [See, for example, A. Fuxbruner et al., Appl. Opt., Vol. 29, No. 36, (1990), 5380- 5385] . We suggest two basic approaches to implement N(x,y,z) on the target surface. 6.2.1.
  • the N profile will be like 14 in Figure 4, 15 for a closed aperture, 16 for an aperture which is closed or opened in a constant velocity, and for a variable velocity it is possible to get arbitrary profiles like 17 (which is a Gaussian profile) . Stops that are closing towards the edges (as 18 in Figure 4) will implement N profiles that have higher values on the edges.
  • the beam homogenizer decreases the spatial coherence and therefore may smooth the image of the aperture-stop on the target (28 in Figure 5) .
  • a simple scheme is described, for example, in Figure 5 in which the output of the laser (29) is monitored by a photodiode (19) and this is used to control the laser energy and its stability in short and long term operation (power supply control unit, 20 in Figure 5) .
  • the energy per pulse changes during the laser medium aging and this can be compensated by changing the current-voltage control of the laser. But this may cause changes in the beam profile structure and its finger print, therefore it is a problematic point in material processing unless homogenization is done as in this scheme.
  • the computer controlled aperture (or stop) is placed in the plane of uniform energy (23) after the beam homogenizer and the field lens (21 and 22 in Figure 5) . It is controlled by a computer (26) which may control the momentary velocity of the opening/closing or the total time that the aperture/stop remains in each position-dimensions (if a step motor controls the opening or closing) .
  • the aperture (or stop) is imaged by one or more imaging lenses (24) which are placed on a motorized stage to change its position in the x direction to achieve a desirable image plane distance and demagnification/ magnification of the aperture.
  • the imaging elements may include, for example, a cylindrical lens (25) which is mounted on a rotation stage controlled by the computer to achieve images of the aperture with cylindrical distortions in any angle in cases where it is needed to get a desirable structure on the target.
  • 25 may also be placed on a translation stage (z direction) to control the cylindrical correction.
  • the system may include a VCR camera (27 in Figure 5) that follows the process and is connected to the computer or any other element and/or device.
  • This embodiment of the method uses masks with an inhomogeneous thickness which is the negative of N(x,y) .
  • This should be fabricated from a material which is not transparent to the processing light and is etched by the processing light in a known measure.
  • the material can be organic or inorganic and the mask may be placed on the target or elsewhere. If the depth of etching for a given pulse energy density is known, the minimum thickness of the mask in a local point x,y can be derived easily. By subtracting the number of desired pulses in this point, N(x,y) , from the maximal N on any place on the target and by multiplying it by the depth of etching per pulse gives the minimal thickness
  • D the etching depth per pulse
  • T the local thickness (31 in Figure 6) .

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention se rapporte à un procédé qui, pour traiter un matériau (7) afin de lui donner une forme désirée quelconque, consiste à modifier la distribution d'énergie du faisceau de l'appareil laser de traitement (1), pour que le substrat (7) puisse être traité avec la structure spatiale désirée en parallèle, même avec les lasers (1) ayant une faible qualité de faisceau due par exemple à un manque de cohérence spatiale ou temporelle ou à une structure multimode non reproductible ou à une faible stabilité de pointage du faisceau, en utilisant une technique d'homogénéisation de faisceau (3) ayant recours par exemple à un intégrateur de canaux et en modifiant le profil du faisceau au moyen d'éléments optiques appropriés (2, 4, 5, 6) fondés sur les principes de l'optique géométrique, tels que des lentilles asphériques ou des miroirs dont les surfaces sont dérivées par des solutions mathématiques qui sont rapportées à la redistribution d'énergie désirée, et en travaillant dans une région où l'on connaît quel est le niveau de dépendance de l'interaction matériau/laser (1) par rapport à l'énergie utilisée.
PCT/US1992/008515 1991-10-13 1992-10-13 Production de structures definies sur des materiaux au moyen de techniques optiques combinees pour transformer le faisceau de traitement Ceased WO1993008491A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL99727A IL99727A0 (en) 1991-10-13 1991-10-13 Generating defined structures on materials using combined optical technologies for transforming the processing beam
IL99727 1991-10-13

Publications (1)

Publication Number Publication Date
WO1993008491A1 true WO1993008491A1 (fr) 1993-04-29

Family

ID=11062958

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1992/008515 Ceased WO1993008491A1 (fr) 1991-10-13 1992-10-13 Production de structures definies sur des materiaux au moyen de techniques optiques combinees pour transformer le faisceau de traitement

Country Status (2)

Country Link
IL (1) IL99727A0 (fr)
WO (1) WO1993008491A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2286900A (en) * 1994-02-22 1995-08-30 Mitsubishi Electric Corp Laser optical transmission system and radiating method
WO1996015742A1 (fr) * 1994-11-22 1996-05-30 G. Rodenstock Instrumente Gmbh Dispositif de façonnage de la cornee
WO2002034452A1 (fr) * 2000-10-25 2002-05-02 Optek Limited Procede et appareil de coupe au laser pour fibres ou guides d'ondes optiques

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3617702A (en) * 1969-06-10 1971-11-02 Du Pont Apparatus and method for perforating sheet material
US4306763A (en) * 1978-07-10 1981-12-22 Thomson-Csf Optical source comprising a semiconductor laser and optical means for the anamorphosis of the beam emitted by said laser
US4733944A (en) * 1986-01-24 1988-03-29 Xmr, Inc. Optical beam integration system
US4910739A (en) * 1988-03-21 1990-03-20 Spectra-Physics Adjustable aperture
US4940308A (en) * 1988-06-27 1990-07-10 Eastman Kodak Company Laser beam stop
US5059013A (en) * 1988-08-29 1991-10-22 Kantilal Jain Illumination system to produce self-luminous light beam of selected cross-section, uniform intensity and selected numerical aperture
US5109465A (en) * 1990-01-16 1992-04-28 Summit Technology, Inc. Beam homogenizer

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3617702A (en) * 1969-06-10 1971-11-02 Du Pont Apparatus and method for perforating sheet material
US4306763A (en) * 1978-07-10 1981-12-22 Thomson-Csf Optical source comprising a semiconductor laser and optical means for the anamorphosis of the beam emitted by said laser
US4733944A (en) * 1986-01-24 1988-03-29 Xmr, Inc. Optical beam integration system
US4910739A (en) * 1988-03-21 1990-03-20 Spectra-Physics Adjustable aperture
US4940308A (en) * 1988-06-27 1990-07-10 Eastman Kodak Company Laser beam stop
US5059013A (en) * 1988-08-29 1991-10-22 Kantilal Jain Illumination system to produce self-luminous light beam of selected cross-section, uniform intensity and selected numerical aperture
US5109465A (en) * 1990-01-16 1992-04-28 Summit Technology, Inc. Beam homogenizer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2286900A (en) * 1994-02-22 1995-08-30 Mitsubishi Electric Corp Laser optical transmission system and radiating method
GB2286900B (en) * 1994-02-22 1998-08-26 Mitsubishi Electric Corp Laser optical transmission system and radiating method
WO1996015742A1 (fr) * 1994-11-22 1996-05-30 G. Rodenstock Instrumente Gmbh Dispositif de façonnage de la cornee
WO2002034452A1 (fr) * 2000-10-25 2002-05-02 Optek Limited Procede et appareil de coupe au laser pour fibres ou guides d'ondes optiques
US7142741B2 (en) 2000-10-25 2006-11-28 Iruvis Limited Laser cutting method and apparatus for optical fibres or waveguides
CN100537112C (zh) * 2000-10-25 2009-09-09 伊鲁维斯有限公司 用于光纤或光波导的激光切割方法和装置

Also Published As

Publication number Publication date
IL99727A0 (en) 1992-08-18

Similar Documents

Publication Publication Date Title
US5657138A (en) Generating defined structures on materials using combined optical technologies for transforming the processing beam
DE3852744T2 (de) Hoch auflösendes abbildendes System.
JP7104828B2 (ja) エキシマ光源におけるスペックルの低減
US5610733A (en) Beam-homogenizer
EP0265917B1 (fr) Appareil d'illumination pour exposition
US20250356237A1 (en) Parallel local control of optically addressed qubits
US11768362B2 (en) Laser radiation system and method for manufacturing electronic device
CA1324274C (fr) Methode de fabrication de lentilles holographiques a elements multiples
WO1993008491A1 (fr) Production de structures definies sur des materiaux au moyen de techniques optiques combinees pour transformer le faisceau de traitement
WO2019221787A1 (fr) Système et procédé de projection de feuille légère incurvée pendant une polymérisation à deux photons
US20230266711A1 (en) Holographic Light Detection and Ranging
US6884961B1 (en) Intravolume diffractive optical elements
Danziger et al. Multilevel diffractive elements for generalized wavefront shaping
US5670280A (en) Optically controlled imaging phase mask element
Cohn et al. Fully complex diffractive optics by means of patterned diffuser arrays: encoding concept and implications for fabrication
US20010012138A1 (en) Grating processing unit
Vasil'ev et al. Computer-controlled wavefront corrector
US9052608B2 (en) Method and device for imaging a radiation-sensitive substrate
US20040057118A1 (en) Systems and methods for correction of spatial cross-talk and pattern frame effects in imaging systems
Douet et al. Digital micromirror device for holographic and Fourier optics applications
Hasman et al. Diffractive optics: design, realization, and applications
CN115793265B (zh) 基于空间光调制器的超短激光脉冲任意时空整形系统及方法
Korolkov et al. Development of methods for the formation and control of a given distribution of the photoresist thickness for conformal correctors fabrication
Laskin et al. Refractive beam shaping optics to improve operation of spatial light modulators
Redmond et al. High performance holographic optics for the visible and near infra-red

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
ENP Entry into the national phase

Ref country code: US

Ref document number: 1994 211705

Date of ref document: 19940428

Kind code of ref document: A

Format of ref document f/p: F

122 Ep: pct application non-entry in european phase