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WO1992007681A1 - Soudage de metaux - Google Patents

Soudage de metaux Download PDF

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Publication number
WO1992007681A1
WO1992007681A1 PCT/GB1991/001865 GB9101865W WO9207681A1 WO 1992007681 A1 WO1992007681 A1 WO 1992007681A1 GB 9101865 W GB9101865 W GB 9101865W WO 9207681 A1 WO9207681 A1 WO 9207681A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
liquation
bonding
bonded
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/GB1991/001865
Other languages
English (en)
Inventor
Jonathan Ball
Ricky Arthur Ricks
Peter-Juergen Winkler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rio Tinto Alcan International Ltd
Airbus Defence and Space GmbH
Original Assignee
Alcan International Ltd Canada
Messerschmitt Bolkow Blohm AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB909023182A external-priority patent/GB9023182D0/en
Priority claimed from GB919121266A external-priority patent/GB9121266D0/en
Application filed by Alcan International Ltd Canada, Messerschmitt Bolkow Blohm AG filed Critical Alcan International Ltd Canada
Publication of WO1992007681A1 publication Critical patent/WO1992007681A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/002—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of light metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas

Definitions

  • This invention relates to the bonding together of composite metal bodies by diffusion bonding whereby a bond of sufficient strength is obtained that the bonded bodies can be used to form mechanical structures, such as aircraft sub-assemblies.
  • US-A-3 , 180, 022 (Briggs et al) discloses a method of diffusion bonding an aluminium alloy with silver and other metals.
  • the disclosure contains examples of bonding plugs into the ends of cylinders.” No attempt is made to remove the oxide coating from the aluminium alloy. Such a method would produce a weak bond that may be satisfactory in the examples described where separation of the tubes and plugs would require shear forces to be exerted on the bond.
  • US-A-3 , 046, 640 (Singleton) discloses cladding aluminium alloy sheets -with a layer of zinc and subsequently soldering the zinc layers together. The resultant bond would have poor strength characteristics and between each sheet there would be two discrete layers of zinc and a layer of solder.
  • each layer is applied to its associated body by a process in which: -
  • the body and its associated layer become bonded together in metal-to-metal contact and the layer diffuses into the body over substantially the whole of said increased area and wherein the composite bodies are bonded together with at least predetermined parts of their layers in direct metal-to-metal contact with one another by a process which does not increase said surface area and is selected from diffusion bonding and transient liquid phase bonding whereby the layers diffuse into one another and further diffuse into the bodies with any excess metal from the layers being expelled from between said predetermined parts until the discrete identity of the layers has been lost and the bodies are effectively bonded directly together.
  • EP-B-0117671 Although the method of EP-B-0117671 is effective in producing strong bonding between metal bodies, a difficulty has been found to arise when trying to bond alloyed metal bodies in which, because of a high content of the alloying components, the diffusion thereinto of the bonding species is hindered. Not only are extended times required in order for satisfactory bond strengths to develop, but also the maintenance of the metal bodies at the required relatively high bonding temperatures for extended periods of time can -
  • the present invention is based upon the use of a buffer layer between the metal body and its overlying liquation layer, whose composition is such that under the bonding condition its components will diffuse more readily into its adjoining buffer layer than into the underlying metal body.
  • a metal body capable of being diffusion bonded to another metal body to form a mechanical structure, characterised in that the body carries bonded thereto two superposed layers comprising an outer liquation layer and an inner buffer layer wherein the body is capable of being diffusion bonded to the other body via its liquation layer, and wherein the compositions of the body, the buffer layer and the liquation layer are selected such that under the conditions of diffusion bonding the constituents of the liquation layer will diffuse more readily into the buffer layer than into the body.
  • a method of diffusion bonding together two bodies of the same or different metals to form a mechanical structure comprises creating from at least one of the bodies a composite body by bonding thereto a coating comprising two superposed layers on its surface to be diffusion bonded, the two layers comprising an outer liquation layer and an inner buffer layer, and bringing the bodies together under conditions of pressure and elevated temperature such that diffusion bonding occurs via the at least one liquation layer, wherein the compositions of the at least one body, the at least one buffer " layer and the at least one liquation layer are selected such that under the conditions of diffusion bonding the constituents of the at least one liquation layer will diffuse more readily into its associated buffer layer than into its associated body.
  • the method described in EP-B-0117671 - as modified by the present invention becomes a method of bonding together two bodies of the same or- different metals to form a mechanical structure, at least one of which bodies forms an oxidised coating thereon so readily as to be inherently incapable of being diffusion bonded to the other body, which method comprises creating from the at least one body a composite body by coating the body with a multi-layered metallic coating, the coatings when more than one are present being the same or different and the or each coating comprising an inner buffer layer in contact with and bonded to its corresponding body and an outer liquation layer overlying and bonded tb " its corresponding adjacent buffer layer and not in contact with its respective body, wherein the or each liquation layer is capable of being bonded to either the other liquation layer or the other body by the application of pressure at an elevated temperature lower than the melting point of either body, wherein the compositions of each body and any associated buffer and liquation layer are selected so that under the bonding conditions the constituents of the
  • At least one layer of the coating is applied to its associated body by a process in which the inherent oxidised coating on the at least one body is physically broken up, and at the same time a new metal surface of increased superficial area is formed on the body while it is in intimate contact with its associated coating layer to prevent the ingress of air therebetween and the oxidation of the new metal surface.
  • the liquation layer can be formed prior to the bonding step or be formed as a result of the elevated temperature used during the bonding step. It can consist of a single layer which is capable under the bonding condition of diffusing into an adjoining layer or of two, or possibly more, layers which are capable under the bonding conditions of alloying together and of diffusing into an adjoining layer.
  • the elevated temperature used may be between said melting points and the composite bodies may be joined by transient liquid phase bonding.
  • the liquation layer is formed from aluminium, zinc, silver, copper, silicon, magnesium or an alloy thereof which may include other constituents. It may be desirable to use an alloy for this layer if, for example, it is desired to have a particular melting point in the layer or if particular strength requirements are required from the bond.
  • alloys of zinc with copper and/or magnesium may be selected or alternatively an alloy of zinc and silver could be attractive if a layer with a melting point higher than that of zinc is required.
  • a zinc alloy may contain at least one of 0-25% Al; 0-20% Cu; 0-3%
  • an intermediate layer of a silicon- containing aluminium alloy is also used located between the copper and/or silver layer and its associated buffer layer.
  • a transient liquid phase layer of an aluminium-silicon-copper alloy of relatively low melting point will be formed as a result of the elevated temperature used in the bonding step, to act as the bonding medium.
  • the liquation layer can also be formed by surface modification, for example by ion plating, the underlying buffer layer.
  • the liquation layers on the two bodies to be bonded together may be the same or different.
  • the buffer layer is of a substantially pure metal, especially aluminium having a total alloy content of not more than 5%, preferably not more than 2.5%, and more preferably not more than 0.5% by weight.
  • a substantially pure metal especially aluminium having a total alloy content of not more than 5%, preferably not more than 2.5%, and more preferably not more than 0.5% by weight.
  • Such an alloy allows the diffusing species from the liquation layer, such as zinc or the combination of silicon and copper from the above-mentioned low melting point alloy, to be taken up substantially within the buffer layer. It will be appreciated that the more dilute the buffer layer is the more readily will the diffusing species be taken up thereby and hence the shorter will be the bonding time needed.
  • An advantage of a relatively thick buffer layer is that it will take up any species from the underlying body which may under the bonding conditions tend to diffuse into the liquation layer with perhaps deleterious effects on the resulting bonding strength and required bonding times.
  • the buffer layer must be sufficiently dilute in composition to permit rapid diffusion of the bonding species, such as copper, silicon and/or silver, but have sufficient strength not to affect adversely the mechanical properties of the bond.
  • suitable buffer layer materials are a dilute aluminium alloy of composition AA "-1050A, a dilute manganese- containing aluminium alloy, such as that of the 3,000 series of compositions, particularly AA 3003, and a dilute magnesium-containing alloy, such as that of the 5,000 series of compositions, particularly AA 5005.
  • the magnesium-containing alloy as a buffer layer where the liquation layer contains a significant proportion of silicon, such as those aluminium alloys of the 4,000 series. It has been found that, under the conditions of diffusion bonding with " the components of the liquation layer diffusing into the buffer layer, the magnesium of the buffer layer and the silicon from the liquation layer form a solid solution in the buffer layer. On cooling to room temperature and/or holding at an intermediate temperature, the magnesium and silicon can form a precipitate of Mg 2 Si in the buffer layer and the possibility then exists of precipitation hardening the buffer layer so as to improve even more the mechanical strength of the resulting diffusion bond.
  • This precipitation hardening effect can be achieved by other species diffusing into the buffer layer, either from the liquation layer or from the body itself, where the diffusing species can combine v/ith another species in the buffer layer to form a combination capable of giving a precipitation hardening effect.
  • a solution strengthening effect can be achieved by the diffusion of species from the liquation layer or from the body into the buffer layer.
  • the buffer layer can be an alloy which is inherently capable of a precipitation hardening effect, such as an alloy of the AA 6000 series of compositions, for example alloy AA 6063.
  • the buffer . layers on the two bodies to be bonded together may be the same or different and may be composed, to at least a substantial part of the same metal as the, or each of the, liquation layers.
  • the base metal is preferably of aluminium, magnesium or an alloy of either metal, such as those of the AA 2000, 6000 or 7000 series of compositions.
  • the alloy may be superplastically deformable so that an integrally stiffened structural component may be formed by selectively bonding parts of two composite bodies together and superplastically deforming the non-bonded parts of the bodies.
  • Aluminium- lithium alloys are particularly preferred and the base metals of the bodies may be the same or different.
  • the formation of the composite body may be achieved by mechanical means such as roll-bonding, explosive bonding or extrusion, particularly hydrostatic extrusion, by chemical or electrochemical methods, spluttering, or even by ion plating, or any combination thereof.
  • the said mechanical means should preferably be such as to be able to break up physically this layer.
  • the different layers that make up the buffer and liquation layers can either be applied sequentially to the body or can be pre-formed and then applied as a multi-layered coating.
  • Bonding by the TLP (transient liquid phase) technique with a rolled-on liquation layer of zinc can be achieved more satisfactorily and the resulting bond can be of higher strength if the atmosphere in which the bonding operation takes place is controlled to reduce oxygen and water vapour contents to very low levels.
  • the metal bodies may be in the form of sheets, plates, bars, or any other shape of structural component. Methods of bonding together metal bodies will now be described by way of illustration in the following Examples which include comparative data.
  • a sample of an aluminium-lithium alloy of composition AA 8090 was rolled into a sheet and cut up into three plates. Each of the three plates was then given a different surface treatment as described below and then equal sized pairs of test pieces were cut out from each plate for bonding together, treated surface to treated surface.
  • a multi-layered coating in accordance with the present invention consisting of in order:-
  • a single layer not in accordance with the invention consisting solely of a roll-bonded layer of zinc containing 1% by weight of copper.
  • Each of the three pairs of test pieces were put together, coated surface to coated surface, and heated between hot platens in a press to a temperature of 540°C and held for 60 minutes at a pressure of 5 MPa.
  • the resultant bonded test pieces were then tested to assess the strengths of the resultant bonds both for air room-temperature shear strengths and their high temperature peel strengths.
  • the peel strength tests were T-peel tests carried out according to ASTM D-1376-69 using tests pieces 15 mm wide and a head speed of 20 mm min. " . For all of the tests a deformation of about 5% was used, except for the room temperature shear strength test for coating C where the deformation was about 20%.
  • Example 2 Following the procedures described in Example 1, a number of further tests were carried out on test pieces using coatings A and B with varying degrees of deformation. The results are shown in Figures 3 and 4 and demonstrate the ability of the method according to the present invention of producing good bonding at relatively low deformations.
  • Example 3
  • a sample of an aluminium-lithium alloy of composition AA 8090 was rolled into a sheet and cut up into six plates. Each plate was coated by roll bonding with a buffer layer of AA 5005 to a thickness of approximately 180 ⁇ m overlaid with approximately 20 um of AA 4343 which was then electroplated with a layer of copper and then a layer of silver. Equal sized pairs of test pieces were then cut out from each plate and bonded together, treated surface to treated surface, oetween two 120 x 120 mm heated steel platens under normal atmospheric pressure with the application of a holding pressure using hydraulic cylinders.
  • Example 5 Samples were prepared and tested as in Example 3, except that for the buffer layer a layer of an aluminium/magnesium alloy of composition 5754 was used. Lap shear tests carried out at room temperature gave results comparable to those obtained in Example 3.
  • Example 5
  • Example 6 Samples were prepared and tested as in Example 4, except that for the buffer layer a layer of an aluminium/magnesium alloy of composition 3003 was used. Lap shear tests carried out at room temperature gave average shear strengths of approximately 80 MPa.
  • Example 6 Samples were prepared and tested as in Example 4 using bonding temperatures of between 520°C and 560°C. Surprisingly, a bond strength of about 160 MPa was obtained by bonding at 520°C, which is below the liquation level predicted from the Al-Si-Cu phase diagram. It is believed that magnesium diffusing into the liquation layer from the buffer layer lowered the liquation temperature.
  • a bond strength of about 110 MPa was achieved on spontaneous bonding.
  • a bonding time of 15 minutes resulted in bond strength of about 180 MPa which was reduced to about 160 MPa when the bonding time was increased to 30 and 60 minutes, respectively.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

L'invention concerne le soudage par diffusion de corps de métaux composites, par lequel on obtient un soudage suffisamment résistant pour que les corps soudés puissent être utilisés dans des structures mécaniques, telles que des sous-ensembles d'aéronefs. On décrit un corps métallique, pouvant être soudé par diffusion à un autre corps métallique pour former une structure mécanique, se caractérisant par le fait que ledit corps comporte deux couches superposées qui lui sont soudées, dont l'une est une couche de liquation externe et l'autre une couche tampon interne permettant audit corps d'être soudé par diffusion à l'autre corps par sa couche de liquation, la composition dudit corps, celle de la couche tampon et celle de la couche de liquation étant choisies de telle sorte que, dans les conditions de soudage par diffusion, les constituants de la couche de liquation se diffuseront plutôt dans la couche tampon que dans le corps lui-même. Le corps est de préférence un alliage d'aluminium, par exemple un alliage à déformabilité superplastique.
PCT/GB1991/001865 1990-10-24 1991-10-24 Soudage de metaux Ceased WO1992007681A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB9023182.0 1990-10-24
GB909023182A GB9023182D0 (en) 1990-10-24 1990-10-24 Bonding metals
GB9121266.2 1991-10-07
GB919121266A GB9121266D0 (en) 1991-10-07 1991-10-07 Bonding metals

Publications (1)

Publication Number Publication Date
WO1992007681A1 true WO1992007681A1 (fr) 1992-05-14

Family

ID=26297847

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1991/001865 Ceased WO1992007681A1 (fr) 1990-10-24 1991-10-24 Soudage de metaux

Country Status (2)

Country Link
AU (1) AU8750691A (fr)
WO (1) WO1992007681A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115255606A (zh) * 2022-06-21 2022-11-01 北京科技大学 一种含铝中间层的铜与石墨扩散连接方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117671A1 (fr) * 1983-02-12 1984-09-05 Alcan International Limited Assemblage de metaux
EP0155490A1 (fr) * 1984-02-23 1985-09-25 BBC Brown Boveri AG Procédé pour lier des pièces en super-alliage par diffusion
EP0383103A1 (fr) * 1989-02-17 1990-08-22 Vereinigte Schmiedewerke Gmbh Procédé pour la fabrication d'un matériau composite métallique tenace à résistance élevée

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117671A1 (fr) * 1983-02-12 1984-09-05 Alcan International Limited Assemblage de metaux
EP0155490A1 (fr) * 1984-02-23 1985-09-25 BBC Brown Boveri AG Procédé pour lier des pièces en super-alliage par diffusion
EP0383103A1 (fr) * 1989-02-17 1990-08-22 Vereinigte Schmiedewerke Gmbh Procédé pour la fabrication d'un matériau composite métallique tenace à résistance élevée

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115255606A (zh) * 2022-06-21 2022-11-01 北京科技大学 一种含铝中间层的铜与石墨扩散连接方法
CN115255606B (zh) * 2022-06-21 2023-07-25 北京科技大学 一种含铝中间层的铜与石墨扩散连接方法

Also Published As

Publication number Publication date
AU8750691A (en) 1992-05-26

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