[go: up one dir, main page]

WO1992005678A1 - Mixture and process for the treatment of metal bodies - Google Patents

Mixture and process for the treatment of metal bodies Download PDF

Info

Publication number
WO1992005678A1
WO1992005678A1 PCT/DE1991/000768 DE9100768W WO9205678A1 WO 1992005678 A1 WO1992005678 A1 WO 1992005678A1 DE 9100768 W DE9100768 W DE 9100768W WO 9205678 A1 WO9205678 A1 WO 9205678A1
Authority
WO
WIPO (PCT)
Prior art keywords
mixture
treatment
copper
metal bodies
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1991/000768
Other languages
German (de)
French (fr)
Inventor
Walter Schellander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH3099/90A external-priority patent/CH682616A5/en
Application filed by Schering AG filed Critical Schering AG
Publication of WO1992005678A1 publication Critical patent/WO1992005678A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • the invention relates to a mixture for the treatment of metal bodies and methods using the mixture and use of tragacanth for the treatment of printed circuit boards.
  • epoxy resin-glass fabric prepreg or another suitable insulator material is used as the insulating layer between the individual copper foils.
  • preg epoxy resin-glass fabric
  • the individual copper and insulator layers are processed in a heated laminating press to produce the finished multilayer printed circuit board.
  • Acid solutions for the treatment of printed circuit boards are already known from the prior art, for example from the documents US Pat. No. 4,956,035, JP 62-158 884 A and JP 63-453 95 A. These solutions have in common that they do not contain any tragacanth .
  • the object of the invention is to improve the adhesion between the metal conductors and the insulating layer, so that no delamination takes place in the area of the bore.
  • the mixture according to the invention contains at least: a) water (H 2 0) from 20 to 60 vol% b) hydrochloric acid (HCl) from 20 to 60 vol% c) iron trichloride (FeCl 3 ) 40% conc. From 5 to 30 vol% d ) Fine powdered tragacanth (DAB 7) from 0.5 to 2 g / liter
  • the new adhesion promoter is very easy to use. In order to ensure the best adhesion values, it should best be applied to the copper surfaces at room temperature using the immersion method. However, this can also be sprayed on or applied with another application method suitable for liquids.
  • the roughened copper surface can also be examined very simply qualitatively:
  • the etching removal can be measured with a beta scope or a permascope. Typical removal values are three to eight micrometers.
  • the quality of the micro roughness can be determined physically using the peel strength measurement.
  • the quality of the micro roughness can also be assessed optically under a scanning electron microscope.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A mixture for the treatment of metal bodies containing at least water, hydrochloric acid, ferrous trichloride and finely divided tragacanth. This etching mixture roughens the surface of copper layers. Better adhesion is obtained when these are laminated with insulating glass-fibre layers to form multi-layer printed circuit boards.

Description

Mischung und Verfahren zur Behandlung von Metallkörpern Mixture and method for treating metal bodies

Die Erfindung betrifft eine Mischung zur Behandlung von Metall¬ körpern und Verfahren unter Verwendung der Mischung und Verwendun von Tragant zur Behandlung von Leiterplatten.The invention relates to a mixture for the treatment of metal bodies and methods using the mixture and use of tragacanth for the treatment of printed circuit boards.

Bei mehrlagigen Leiterplatten (Multilayers) wird als Isolier¬ schicht zwischen den einzelnen Kupferfolien Epoxidharz-Glasgewebe (Prepreg) oder ein anderes geeignetes Isolatormaterial verwendet. Die einzelnen Kupfer- und Isolatorlagen werden in einer beheizten Laminierpresse zur fertigen mehrlagigen Leiterplatte verarbeitet.In the case of multilayer printed circuit boards (multilayers), epoxy resin-glass fabric (prepreg) or another suitable insulator material is used as the insulating layer between the individual copper foils. The individual copper and insulator layers are processed in a heated laminating press to produce the finished multilayer printed circuit board.

Bisher wurde die Haftung zwischen Kupfer und Epoxidharz-Glasgewebe vor allem mit Schwarzoxid verbessert. Dabei wurde Schwarzoxid als Haftvermittler auf die Kupferoberflächen gebracht und anschließend erfolgte die Laminierung mit dem Isolatormaterial. Dieses Verfah¬ ren konnte die bisherigen Anforderungen an die Haftwerte zwischen den Haftpartnern gerade noch zufriedenstellend erfüllen. Das Schwarzoxid-Verfahren weist aber einen qualitativ schwerwiegenden Nachteil auf; es ist nicht in der Lage, die nachfolgenden Verar¬ beitungsschritte der Multilayer unbeschadet zu überstehen, ohne daß außerordentliche Anstrengungen während der Fertigung unternom¬ men werden. Die nachträgliche Verarbeitung bis zur fertig bestück¬ ten Leiterplatte erfolgt mit herkömlichen und bekannten Technolo¬ gien.So far, the adhesion between copper and epoxy resin glass fabric has been improved, especially with black oxide. Black oxide was applied to the copper surfaces as an adhesion promoter and then laminated with the insulator material. This procedure could just satisfactorily meet the previous requirements for the adhesive values between the adhesive partners. However, the black oxide process has a serious disadvantage in terms of quality; it is unable to survive the subsequent processing steps of the multilayer without damage, without extraordinary efforts being made during production. Subsequent processing up to the finished printed circuit board is carried out using conventional and known technologies.

Dabei zeigt sich immer wieder, daß während des Lötens der Multi¬ layer dazu neigt, sich zu delaminieren, das heißt, die einzelnen Lagen aus Kupfer und Isolatormaterial trennen sich an einzelnen Stellen voneinander. Außerdem greifen die Prozeßchemikalien der verschiedensten Arbeitsschritte über die Bohrungen die Schwarz¬ oxidschicht an, die ja zwischen dem Kupfer und dem Isolator liegt. Im Inneren von Bohrungen, welche die Lötanschlüsse der elektroni¬ schen Bauelemente aufnehmen, liegt pro Kupferlage eine Schwarzo¬ xidschicht frei. Wenn nun die Prozeßchemikalien diese freiliegen¬ den Schwarzoxidschichten auflösen, spricht man vom sogenannten "Pink-Ring"- oder "Red-Ring"-Effekt. Das bewirkt eine schlechte Haftung zwischen dem Kupfer und dem Isolator im Bereich der Boh¬ rung.This shows again and again that during the soldering the multilayer tends to delaminate, that is to say the individual layers of copper and insulator material separate from one another at individual points. In addition, the process chemicals of the most varied of working steps attack the black oxide layer, which lies between the copper and the insulator, via the holes. In the interior of bores which receive the solder connections of the electronic components, a black oxide layer is exposed for each copper layer. If the process chemicals now dissolve these exposed black oxide layers, one speaks of the so-called "pink ring" or "red ring" effect. This causes poor adhesion between the copper and the insulator in the area of the bore.

Saure Lösungen zur Behandlung von Leiterplatten sind bereits aus dem Stand der Technik bekannt, beispielsweise aus den Schriften US-PS 4,956,035, JP 62-158 884 A und JP 63-453 95 A. Diesen Lö¬ sungen ist gemeinsam, daß diese kein Tragant enthalten.Acid solutions for the treatment of printed circuit boards are already known from the prior art, for example from the documents US Pat. No. 4,956,035, JP 62-158 884 A and JP 63-453 95 A. These solutions have in common that they do not contain any tragacanth .

Aufgabe der Erfindung ist die Verbesserung der Haftung zwischen den Metalleitern und der Isolierschicht, so daß keine Delaminie- rung im Bereich der Bohrung stattfindet.The object of the invention is to improve the adhesion between the metal conductors and the insulating layer, so that no delamination takes place in the area of the bore.

Diese Aufgabe wird gemäß den Patentansprüchen mit einer Mischung gelöst, die ein saures Ätzmittel ist und Tragant enthält.This object is achieved according to the claims with a mixture that is an acidic etchant and contains tragacanth.

Die erfindungsgemäße Mischung enthält mindestens: a) Wasser (H20) von 20 bis 60 Vol % b) Salzsäure (HCl) von 20 bis 60 Vol % c) Eisentrichlorid (FeCl3) 40% Konz. von 5 bis 30 Vol % d) Feinpulvrigen Tragant (DAB 7) von 0,5 bis 2 g/LiterThe mixture according to the invention contains at least: a) water (H 2 0) from 20 to 60 vol% b) hydrochloric acid (HCl) from 20 to 60 vol% c) iron trichloride (FeCl 3 ) 40% conc. From 5 to 30 vol% d ) Fine powdered tragacanth (DAB 7) from 0.5 to 2 g / liter

Besonders vorteilhaft ist eine die Mischung der folgenden Zusam¬ mensetzung:A mixture of the following composition is particularly advantageous:

a) Wasser (H20) 40 Vol % b) Salzsäure (HCl) 40 Vol % c) Eisentrichlorid (FeCl3) 40 % Konz. 20 Vol % d) Feinpulvrigen Tragant (DAB 7) 1 g/Litera) Water (H 2 0) 40 vol% b) Hydrochloric acid (HCl) 40 vol% c) Iron trichloride (FeCl 3 ) 40% conc. 20 vol% d) Fine powdered tragacanth (DAB 7) 1 g / liter

Tragant wird als zusätzliche Komponente beigemischt, um eine op¬ timale Mikrorauhigkeit zu gewährleisten. Es wurde festgestellt, daß Multilayer-Leiterplatten, die mit dem neuen Haftverbesserer heiß laminiert wurden, Adhäsiosnwerte auf¬ weisen, die bis zu doppelt so hohe Werte erreichen, welche die nach bisherigen Methoden gefertigten Multilayer kennzeichnen (Schwarzoxid-Verfahren) .Tragacanth is added as an additional component in order to ensure optimum microroughness. It was found that multilayer printed circuit boards, which were hot-laminated with the new adhesion promoter, have adhesive values which reach up to twice the values which characterize the multilayers produced by previous methods (black oxide process).

Der neue Haftverbesserer ist sehr einfach anzuwenden. Um beste Haftwerte zu gewährleisten, sollte er am besten bei Raumtemperatur im Tauchverfahren auf die Kupferoberflächen gebracht werden. Die¬ ser kann aber auch aufgesprüht oder mit einem anderen für Flüssig¬ keiten geeigneten Auftragsverfahren aufgebracht werden.The new adhesion promoter is very easy to use. In order to ensure the best adhesion values, it should best be applied to the copper surfaces at room temperature using the immersion method. However, this can also be sprayed on or applied with another application method suitable for liquids.

Die aufgerauhte Kupferoberfläche kann ferner sehr einfach quali¬ tativ untersucht werden:The roughened copper surface can also be examined very simply qualitatively:

- Hält man die Stichprobe geneigt gegen das Licht, dürfen keine Reflexionen sichtbar sein, die Oberfläche muß völlig matt er¬ scheinen.- If the sample is tilted against the light, no reflections must be visible, the surface must appear completely matt.

- Der Ätzabtrag kann mit einem Betaskop oder einem Permaskop ge¬ messen werden. Übliche Abtragwerte betragen drei bis acht Mikro¬ meter .- The etching removal can be measured with a beta scope or a permascope. Typical removal values are three to eight micrometers.

- Die Qualität der Mikrorauhigkeit läßt sich physiklisch mit Hilfe der Abziehfestigkeitsmessung ermitteln.- The quality of the micro roughness can be determined physically using the peel strength measurement.

- Die Qualität der Mikrorauhigkeit kann auch optisch unter einem Rasterelektronenmikroskop beurteilt werden.- The quality of the micro roughness can also be assessed optically under a scanning electron microscope.

Aus den erwähnten Qualitätsuntersuchungen läßt sich ein weiterer Vorteil ableiten: Die stichprobenweise Voruntersuchung der Kup¬ feroberflächen vor dem Laminieren gibt die Gewissheit, daß der fertige Multilayer von höchtser Qualität sein wird. Die Prozeß- • Chemikalien finden keine lösliche Zwischenschichten mehr vor, was böse Überraschungen erspart.A further advantage can be derived from the quality examinations mentioned: the random pre-examination of the copper surfaces before lamination gives the certainty that the finished multilayer will be of the highest quality. The Process • chemicals found no soluble intermediate layers more, which saves nasty surprises.

Die immer größer werdende Packungsdichte der elektronischen Bau¬ teile auf Leiterplatten verlangt nach hohen Speiseströmen, für die jedoch ausreichende Querschnitte zur Verfügung sein müssen, damit diese den Speisestrom führenden Leiterbahnen oder Leiterebenen sich nicht übermäßig erwärmen. Zu diesem Zweck können jetzt dank dem neuen Haftverbesserer vollflächige Kupferkerne (Dicke 0,1 bis 0,5 Millimeter) problemlos in einen Multilayer integriert werden. ohne daß es beim Löten von Multilayern zu Delamination kommt. Aber auf auch auf anderen Gebieten führt der neue Haftverbesserer zu Weiterentwicklungen. Zum Beispiel können Kupferrohre von Warmwas¬ ser-Sonnenkollektoren mit dem neuen Haftverbesserer außen aufge¬ rauht werden. Damit lassen sich Reflexionen stark reduzieren, was einen größeren Wirkungsgrad bedeutet. The ever increasing packing density of the electronic components on printed circuit boards requires high feed currents, for which, however, sufficient cross sections must be available so that these conductors or conductor levels carrying the feed current do not heat up excessively. For this purpose, thanks to the new adhesion promoter, full-surface copper cores (thickness 0.1 to 0.5 millimeters) can now be easily integrated into a multilayer. without delamination occurring when multilayer soldering. But the new adhesion improver is also leading to further developments in other areas. For example, copper pipes from hot water solar collectors can be roughened on the outside with the new adhesion promoter. This greatly reduces reflections, which means greater efficiency.

Claims

PATENTANSPRÜCHE PATENT CLAIMS 1. Mischung zur Behandlung von Metallkörpern, enthaltend minde¬ stens a) Wasser, b) Salzsäure, c) Eisentrichlorid und d) Feinpulvrigen Tragant1. Mixture for the treatment of metal bodies, comprising at least a) water, b) hydrochloric acid, c) iron trichloride and d) fine powdered tragacanth 2. Mischung nach Anspruch 1, dadurch gekennzeichnet, daß die Mi¬ schung folgendes enthält: a) Wasser, 40 Vol %; b) Salzsäure, 40 Vol %; c) Eisentrichlorid, 40 % Konz. 20 Vol %; d) Feinpulvrigen Tragant (DAB /) 1 g/Liter.2. Mixture according to claim 1, characterized in that the mixture contains the following: a) water, 40 vol%; b) hydrochloric acid, 40 vol%; c) iron trichloride, 40% conc. 20 vol%; d) Fine powdered tragacanth (DAB /) 1 g / liter. 3. Verfahren zur Behandlung von Metallkörpern mit der Mischung nach einem der Ansprüche 1 und 2, dadurch gekennzeichnet, daß die Metalloberflächen mit der Mischung teilweise in Berührung kommen, vorzugsweise durch Eintauchen oder durch Zerstäuben bei Raumtempe¬ ratur.3. Process for the treatment of metal bodies with the mixture according to one of claims 1 and 2, characterized in that the metal surfaces come partially into contact with the mixture, preferably by immersion or atomization at room temperature. 4. Verfahren nach Anspruch 3 unter Verwendung der Mischung gemäß den Ansprüchen 1 bis 2 für elektrotechnische oder elektronische Bauteile, im besonderen bei Packungen, die aus mehrlagigen Leiter¬ bahnen beziehungsweise Leiterebenen und dazwischen liegeden Iso¬ lierschichten bestehen, dadurch gekennzeichnet, daß wenigstens ein Teil der Oberfläche von oben genannten Leiterbahnen beziehungs¬ weise Leiterebenen mit der Mischung behandelt worden sind, wobei die Leiterkörper aus Kupfer beziehungsweise aus Kupferlegierungen bestehen.4. The method according to claim 3 using the mixture according to claims 1 to 2 for electrotechnical or electronic components, in particular in packs consisting of multilayer conductor tracks or conductor levels and insulating layers therebetween, characterized in that at least part the surface of the above-mentioned conductor tracks or conductor planes have been treated with the mixture, the conductor bodies being made of copper or copper alloys. 5. Verfahren nach den Ansprüchen 3 und 4 zur Behandlung von ge¬ druckten Schaltungen oder mehrlagigen Leiterplatten, dadurch ge¬ kennzeichnet, daß es keine Haftvermittler braucht. 5. The method according to claims 3 and 4 for the treatment of printed circuits or multilayer printed circuit boards, characterized in that there is no need for an adhesion promoter. 6. Verfahren nach den Ansprüchen 3, 4 und 5 zur Behandlung von mehrlagigen Leiterplatten aus Metallkörpern, wobei die behandelten Metallkörper aus Kupfer oder Kupferlegierungen bestehen, dadurch gekennzeichnet, daß in den Metallkörpern Metallkerne aus Kupfer beziehungsweise Kupferlegierungen integriert sind und daß die ge¬ nannten Metallkerne eine Dicke von 0,05 bis 1 mm, vorzugsweise 0,1 bis 0,5 m, aufweisen.6. The method according to claims 3, 4 and 5 for the treatment of multilayer printed circuit boards made of metal bodies, the treated metal bodies made of copper or copper alloys, characterized in that metal cores made of copper or copper alloys are integrated in the metal bodies and that the metal cores mentioned have a thickness of 0.05 to 1 mm, preferably 0.1 to 0.5 m. 7. Verwendung von Tragant zur Behandlung von Leiterplatten, ge¬ druckten Schaltungen oder Multilayern. 7. Use of tragacanth for the treatment of printed circuit boards, printed circuits or multilayers.
PCT/DE1991/000768 1990-09-26 1991-09-26 Mixture and process for the treatment of metal bodies Ceased WO1992005678A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH3099/90-1 1990-09-26
CH3099/90A CH682616A5 (en) 1990-09-26 1990-09-26 Metal surface roughening mixt.
DE4106632 1991-02-28
DEP4106632.4 1991-02-28

Publications (1)

Publication Number Publication Date
WO1992005678A1 true WO1992005678A1 (en) 1992-04-02

Family

ID=25692175

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1991/000768 Ceased WO1992005678A1 (en) 1990-09-26 1991-09-26 Mixture and process for the treatment of metal bodies

Country Status (1)

Country Link
WO (1) WO1992005678A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2562292B1 (en) * 2011-08-26 2017-03-01 United Technologies Corporation Chemical stripping composition and method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956035A (en) * 1989-08-01 1990-09-11 Rd Chemical Company Composition and process for promoting adhesion on metal surfaces

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956035A (en) * 1989-08-01 1990-09-11 Rd Chemical Company Composition and process for promoting adhesion on metal surfaces

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, Volume 11, No. 398, (C-466), 25 December 1987; & JP,A,62 158 884, (MITSUBISHI CHEM. IND. LTD.), 14 July 1987. *
WORLD PATENTS INDEX, Week 7809, DERWENT PUBLICATIONS LTD, LONDON GB, AN 78-16352A; & JP,A,50 148 254, (HODOGAYA CHEM. IND. KK), 27 November 1975. *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2562292B1 (en) * 2011-08-26 2017-03-01 United Technologies Corporation Chemical stripping composition and method

Similar Documents

Publication Publication Date Title
DE3786600T2 (en) MULTILAYER PRINTED CIRCUIT AND METHOD FOR THEIR PRODUCTION.
DE2847356C2 (en) Process for the production of a printed circuit with resistance elements
DE3330068C2 (en)
DE69030260T2 (en) CAPACITOR LAMINATE FOR SEMICONDUCTOR CARD
DE69528938T2 (en) Inductance and manufacturing process
DE69529185T2 (en) Process for the production of metal-bonded ceramic material or component and its use as a substrate for an electronic circuit
DE69005214T2 (en) Polyimide substrate with a textured surface and metal coating of such a substrate.
DE68924734T2 (en) Method for producing a composite article containing a copper element.
DE19645854A1 (en) High structure density circuit board production
DE3137105A1 (en) "METAL-PLATED LAMINATE AND METHOD FOR THE PRODUCTION THEREOF
EP0016925A1 (en) Method of depositing metal on metal patterns on dielectric substrates
CH631587A5 (en) METHOD FOR PRODUCING ELECTRIC CIRCUIT BOARDS AND BASE MATERIAL FOR IMPLEMENTING THE METHOD.
EP0168509B1 (en) Manufacture of connection holes in plastic plates and application of the method
DE69935333T2 (en) IMPROVED METHOD FOR MAKING LEADING TRACKS AND PRINTED PCBS MANUFACTURED THEREFOR
DE3700912C2 (en)
DE3800890A1 (en) MULTI-LAYER CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF
EP0549791A1 (en) Multilayer printed circuit board and method of manufacture
DE3907004A1 (en) METHOD FOR PRODUCING THICK FILM CIRCUITS
DE69424535T2 (en) DRUM SIDE TREATED METAL FILM AND LAMINATE FOR USE IN CIRCUIT BOARDS AND METHOD FOR THE PRODUCTION THEREOF
DE69027530T2 (en) METHOD FOR INCREASING THE INSULATION RESISTANCE OF PCB
EP3210951B1 (en) Copper ceramic composite
DE3325133A1 (en) MICROWAVE CIRCUIT BOARD AND METHOD FOR THEIR PRODUCTION
WO1992005678A1 (en) Mixture and process for the treatment of metal bodies
DE2428498C3 (en) Process for the mechanical peeling off of an aluminum foil from a copper layer of a copper-coated insulating base
DE2104735A1 (en) On a ceramic substrate applied circuit with high good factor and method for manufacturing the same ben

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CA JP KR US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IT LU NL SE

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: CA