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WO1992005547A1 - Procede de production de matrices de moulage par injection - Google Patents

Procede de production de matrices de moulage par injection Download PDF

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Publication number
WO1992005547A1
WO1992005547A1 PCT/DE1991/000726 DE9100726W WO9205547A1 WO 1992005547 A1 WO1992005547 A1 WO 1992005547A1 DE 9100726 W DE9100726 W DE 9100726W WO 9205547 A1 WO9205547 A1 WO 9205547A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
base plate
coated
negative
gekenn
Prior art date
Application number
PCT/DE1991/000726
Other languages
German (de)
English (en)
Inventor
Michael Mausbach
Radim Badalec
Original Assignee
Technics Plasma Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technics Plasma Gmbh filed Critical Technics Plasma Gmbh
Publication of WO1992005547A1 publication Critical patent/WO1992005547A1/fr

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/263Preparing and using a stamper, e.g. pressing or injection molding substrates

Definitions

  • the invention relates to a method for producing injection-molding matrices for the production of optically scannable information carriers according to the preamble of patent claim 1.
  • injection molding matrices in that a glass plate (substrate) is coated with a photoresist, which is removed in a structured manner by means of a laser beam in accordance with the desired information. Then the surfaces of the photoresist layer and the structurally exposed surface of the glass plate are vapor-deposited with an electrically conductive layer made of silver, which in turn is electrolytically reinforced with a layer made of nickel.
  • This nickel plating layer can then be used as an injection molding die (working die) or further used to produce a contact copy (negative), from which, as described above, injection molding dies (working dies) can be removed again.
  • the invention is therefore based on the object of creating, with little production outlay, a negative with which the greatest possible number of injection molding matrices can be produced, it being intended to ensure that the loss of information due to the sequence of work steps is reduced to a minimum .
  • the base plate provided with depressions is vaporized as a negative with one of the methods specified in claims 2 to 4 with a surface layer. This process is the subject of patent DE 34 13 891.
  • the evaporating material is given a particularly firm structure with a high degree of hardness, which considerably exceeds the degree of hardness of coatings produced by electroplating.
  • the structurable layer which is advantageously made of aluminum
  • a layer of, for example, tellurium can be applied directly to the surface of the base plate and before the aluminum layer is applied , which vaporizes particularly easily when exposed to laser light and therefore easily overlays the aluminum layer at the desired points and reliably replaces.
  • the laser beam is preferably directed from the back of the base plate made of glass onto the tellurium layer, as a result of which the interference from impurities located on the surface of the base plate can be largely reduced.
  • FIG. 1 shows a base plate 1 made of glass, which is coated with a structurable layer 2 consisting of a photoresist.
  • This layer 2 is structured by means of laser radiation 3 in accordance with the data program.
  • FIG. 2 the surface of the structured layer 2 and the surface areas of the base plate 1 exposed by the laser radiation 3 are vapor-deposited in vacuum with a galvanically conductive layer of silver.
  • this process there is already a risk of the information quality being impaired by the temperature loads on the recordings being too high.
  • Fig. 3 on this Layer 4 applied in an electroplating process an approximately 300 / t thick electroplating layer 5 made of nickel.
  • This resulting electroplating layer is separated from the base plate 1 and provided with a galvanically conductive separating layer 6 in a further work step shown in FIG. 4.
  • a further galvanic process step produces an impression 7, which is used as a negative for the duplicative production of injection molding matrices by galvanic processes.
  • These injection molding matrices correspond to the electroplating layer 5 according to FIG. 3.
  • FIG. 5 from the sequence of figures 5 to 9 representing the inventive method shows a base plate 11 made of homogeneous glass, onto which the structurable layer 12 made of aluminum is applied in the thickness of approx. 100 nm, which is then in the same way as is structured according to the known method with a laser beam 13.
  • the structured layer 12, as can be seen from FIG. 6, serves as an etching mask for the subsequent anisotropic etching process, in which recesses (pits) 14 are etched into the base plate 11 with a slope, which on the one hand ensures good, undercut-free detachment in the further production process of prints and on the other hand on the finished product (eg video plate) ensures good signal quality when reading the data carrier.
  • Anisotropic dry etching (RIE reactive ion etching), ECR plasma current etching (electron cyclotron resonance) or RIBE (reactive ion beam etching) are the anisotropic etching processes. Suitable method. After only one further work step, in which the structured layer 12 serving as an etching mask is removed, for example by wet chemical detachment, the etched base plate 11 already has the negative effect with which it is possible to produce a large number of electroplating layers 15 which represent the injection molding matrices is.
  • the injection molding die can be produced as in the known method described above, in which after the application of a galvanically conductive layer 16, for example a thin layer of silver, which also functions as a separating layer, the injection molding die, as in FIG. 4 described, is formed by a galvanic coating with nickel.
  • a galvanically conductive layer 16 for example a thin layer of silver, which also functions as a separating layer
  • the injection molding die as in FIG. 4 described, is formed by a galvanic coating with nickel.
  • the production outlay for such injection molding matrices is low because of the particularly simple manufacture of the negative, in particular the yield of negatives of perfect quality is increased.
  • the hardness of the working surface of the injection molding die produced according to the above-described galvanic method is approximately 300 HV (Vickers hardness) for nickel.
  • injection molding matrices The production of injection molding matrices is described below, the working surface of which has a particularly high hardness, as a result of which a significantly higher number of pressings of optical data carriers, for example video disks, is made possible.
  • the surface of the negative or the base gap 11 provided with the recesses 14 is vapor-coated with a hard material, for example nickel, by a method as described in the patent claims 2 to 4 is specified and is the subject of the German patent DE 34 13 891.
  • the surface layer 17 produced by this method in the thickness of approx. 5 / tm has a much greater hardness, which is approx. 450 HV (Vickers hardness) when using nickel. This when using nickel is approx. 450 HV (Vickers hardness).
  • This surface layer 17 is then galvanically reinforced with the galvanic layer 15 made of the same or a different material.
  • the surface layer 17 is made of a galvanically non-conductive material, such as consist of hard layers (according to patent claims 20, 21, 22), a contact layer (e.g. made of nickel) must be evaporated beforehand for the subsequent electroplating process for producing the electroplating layer 15.
  • a contact layer e.g. made of nickel
  • the structurable layer 12 can be directly exposed to laser radiation 13, it being advantageous, in order to improve the detachment of the layer 12 at the affected areas, under the layer 12 an auxiliary layer 18 (FIG. 9) to be applied from tellurium, which reacts explosively when exposed to laser beams and reliably removes the overlying layer 12, for example aluminum.
  • auxiliary layer 18 FIG. 9

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

Afin de pouvoir produire avec des coûts de fabrication réduits un négatif selon un procédé de production de matrices de moulage par injection de supports d'information optiquement explorables, avec lequel on peut produire un nombre élevé de matrices de moulage par injection sans risques de pertes d'information, une plaque de base est garnie d'une couche structurable et cette couche est structurée par des rayons laser selon le programme de données. La couche structurée est ensuite utilisée comme masque de gravure par attaque pendant un processus de gravure anisotrope postérieur qui permet de graver des dépressions dans la plaque de base. Une fois le masque de gravure enlevé, la plaque de base pourvue de dépressions forme le négatif de reproduction de matrices de moulage par injection par déposition galvanique de couches galvano-plastiques qui représentent les matrices de moulage par injection.
PCT/DE1991/000726 1990-09-13 1991-09-12 Procede de production de matrices de moulage par injection WO1992005547A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4029099.9 1990-09-13
DE4029099A DE4029099A1 (de) 1990-09-13 1990-09-13 Verfahren zum herstellen von spritzgussmatritzen

Publications (1)

Publication Number Publication Date
WO1992005547A1 true WO1992005547A1 (fr) 1992-04-02

Family

ID=6414204

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1991/000726 WO1992005547A1 (fr) 1990-09-13 1991-09-12 Procede de production de matrices de moulage par injection

Country Status (2)

Country Link
DE (1) DE4029099A1 (fr)
WO (1) WO1992005547A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4416479A1 (de) * 1994-05-10 1995-11-16 Rauschert Gmbh & Co Kg Paul Verfahren und Vorrichtung zur Herstellung von strukturierten Keramikoberflächen
DE19542810A1 (de) * 1994-11-16 1996-05-23 Mitsubishi Chem Corp Optisches Aufzeichnungsmedium und Verfahren zur Herstellung desselben
US5831963A (en) * 1994-11-16 1998-11-03 Mitsubishi Chemical Corporation Optical recording medium having zones wherein the number of sectors per track is constant and method of injection-molding the same
DE19510096A1 (de) * 1995-03-20 1996-09-26 Leybold Ag Matrize zum Abformen von Schallaufzeichnungen und Verfahren zu ihrer Herstellung
DE19653078A1 (de) * 1996-12-19 1998-06-25 Trace Optical Leitstrukturen in optischen Speichermedien
DE10154361A1 (de) * 2001-11-06 2003-05-15 Univ Albert Ludwigs Freiburg Verfahren zum Durchführen eines Rapid-Prototyping-Prozesses zur Herstellung von Mikrostrukturen

Citations (3)

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JPS60187952A (ja) * 1984-03-06 1985-09-25 Fujitsu Ltd 光デイスク用スタンパの製造方法
WO1986006203A1 (fr) * 1985-04-15 1986-10-23 Eastman Kodak Company Procede de fabrication d'outillage en verre
WO1988009990A1 (fr) * 1987-06-09 1988-12-15 Ibm Deutschland Gmbh Disque de stockage optique

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DE2140579A1 (de) * 1971-08-13 1973-02-22 Licentia Gmbh Verfahren zum aufzeichnen von informationen entlang einer spiralfoermig verlaufenden spur eines informationstraegers
DE2306702C3 (de) * 1973-02-10 1979-06-07 Ted Bildplatten Ag Aeg-Telefunken- Teldec, Zug (Schweiz) Verfahren zum reliefartigen Aufzeichnen von Signalen durch Ätzen eines metallischen Trägers
EP0137697B1 (fr) * 1983-08-31 1987-11-25 Kabushiki Kaisha Toshiba Procédé de fabrication d'un milieu d'enregistrement optique d'informations
DE3413891C2 (de) * 1984-04-12 1987-01-08 Horst Dipl.-Phys. Dr. 4270 Dorsten Ehrich Verfahren und Vorrichtung zur Materialverdampfung in einem Vakuumbehälter
JPH0648546B2 (ja) * 1984-07-14 1994-06-22 日本ビクター株式会社 情報記録担体の製造法
JPS6168746A (ja) * 1984-09-04 1986-04-09 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 光学記憶デイスクを製造するためのモ−ルド・インサ−トを形成する方法
US4619804A (en) * 1985-04-15 1986-10-28 Eastman Kodak Company Fabricating optical record media
EP0434114B1 (fr) * 1985-08-30 1994-01-26 Sharp Kabushiki Kaisha Elément de mémoire optique et son procédé de fabrication
JPS62241149A (ja) * 1986-04-11 1987-10-21 Sharp Corp 光メモリ素子用フォトマスク及びその製造方法
LU86722A1 (fr) * 1986-12-23 1988-07-14 Glaverbel Feuille en matiere vitreuse portant un dessin grave et procede pour graver un dessin sur un substrat en matiere vitreuse
EP0349925A1 (fr) * 1988-07-04 1990-01-10 INTERATOM Gesellschaft mit beschränkter Haftung Procédé pour revêtir des substrats en métaux réfractaires

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60187952A (ja) * 1984-03-06 1985-09-25 Fujitsu Ltd 光デイスク用スタンパの製造方法
WO1986006203A1 (fr) * 1985-04-15 1986-10-23 Eastman Kodak Company Procede de fabrication d'outillage en verre
WO1988009990A1 (fr) * 1987-06-09 1988-12-15 Ibm Deutschland Gmbh Disque de stockage optique

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
FUNKSCHAU, Band 58, Nr. 15, Juli 1986, M}nchen, DE, Seiten 29-32; "MUSIK NACH DIGITALEM REINHEITSGEBOT" *
PATENT ABSTRACTS OF JAPAN, Band 10, Nr. 41 (P-429)[2098], 18. Februar 1986; & JP,A,60 187 952 (FUJITSU K.K.) 6. März 1984 *

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Publication number Publication date
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