WO1992005547A1 - Procede de production de matrices de moulage par injection - Google Patents
Procede de production de matrices de moulage par injection Download PDFInfo
- Publication number
- WO1992005547A1 WO1992005547A1 PCT/DE1991/000726 DE9100726W WO9205547A1 WO 1992005547 A1 WO1992005547 A1 WO 1992005547A1 DE 9100726 W DE9100726 W DE 9100726W WO 9205547 A1 WO9205547 A1 WO 9205547A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- base plate
- coated
- negative
- gekenn
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 52
- 238000002347 injection Methods 0.000 title abstract description 5
- 239000007924 injection Substances 0.000 title abstract description 5
- 238000001746 injection moulding Methods 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 20
- 238000005530 etching Methods 0.000 claims abstract description 15
- 230000005855 radiation Effects 0.000 claims abstract description 10
- 239000000969 carrier Substances 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 63
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- 238000009713 electroplating Methods 0.000 claims description 14
- 239000002344 surface layer Substances 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910052714 tellurium Inorganic materials 0.000 claims description 4
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 3
- 239000011651 chromium Substances 0.000 claims 3
- 238000010891 electric arc Methods 0.000 claims 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims 2
- 229910003481 amorphous carbon Inorganic materials 0.000 claims 2
- 229910052804 chromium Inorganic materials 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 239000010453 quartz Substances 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 2
- 238000007740 vapor deposition Methods 0.000 claims 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims 1
- 239000011358 absorbing material Substances 0.000 claims 1
- 239000010405 anode material Substances 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 238000002485 combustion reaction Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 230000008020 evaporation Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 108090000623 proteins and genes Proteins 0.000 claims 1
- XOUPWBJVJFQSLK-UHFFFAOYSA-J titanium(4+);tetranitrite Chemical compound [Ti+4].[O-]N=O.[O-]N=O.[O-]N=O.[O-]N=O XOUPWBJVJFQSLK-UHFFFAOYSA-J 0.000 claims 1
- 230000008021 deposition Effects 0.000 abstract 1
- 239000012535 impurity Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
- G11B7/263—Preparing and using a stamper, e.g. pressing or injection molding substrates
Definitions
- the invention relates to a method for producing injection-molding matrices for the production of optically scannable information carriers according to the preamble of patent claim 1.
- injection molding matrices in that a glass plate (substrate) is coated with a photoresist, which is removed in a structured manner by means of a laser beam in accordance with the desired information. Then the surfaces of the photoresist layer and the structurally exposed surface of the glass plate are vapor-deposited with an electrically conductive layer made of silver, which in turn is electrolytically reinforced with a layer made of nickel.
- This nickel plating layer can then be used as an injection molding die (working die) or further used to produce a contact copy (negative), from which, as described above, injection molding dies (working dies) can be removed again.
- the invention is therefore based on the object of creating, with little production outlay, a negative with which the greatest possible number of injection molding matrices can be produced, it being intended to ensure that the loss of information due to the sequence of work steps is reduced to a minimum .
- the base plate provided with depressions is vaporized as a negative with one of the methods specified in claims 2 to 4 with a surface layer. This process is the subject of patent DE 34 13 891.
- the evaporating material is given a particularly firm structure with a high degree of hardness, which considerably exceeds the degree of hardness of coatings produced by electroplating.
- the structurable layer which is advantageously made of aluminum
- a layer of, for example, tellurium can be applied directly to the surface of the base plate and before the aluminum layer is applied , which vaporizes particularly easily when exposed to laser light and therefore easily overlays the aluminum layer at the desired points and reliably replaces.
- the laser beam is preferably directed from the back of the base plate made of glass onto the tellurium layer, as a result of which the interference from impurities located on the surface of the base plate can be largely reduced.
- FIG. 1 shows a base plate 1 made of glass, which is coated with a structurable layer 2 consisting of a photoresist.
- This layer 2 is structured by means of laser radiation 3 in accordance with the data program.
- FIG. 2 the surface of the structured layer 2 and the surface areas of the base plate 1 exposed by the laser radiation 3 are vapor-deposited in vacuum with a galvanically conductive layer of silver.
- this process there is already a risk of the information quality being impaired by the temperature loads on the recordings being too high.
- Fig. 3 on this Layer 4 applied in an electroplating process an approximately 300 / t thick electroplating layer 5 made of nickel.
- This resulting electroplating layer is separated from the base plate 1 and provided with a galvanically conductive separating layer 6 in a further work step shown in FIG. 4.
- a further galvanic process step produces an impression 7, which is used as a negative for the duplicative production of injection molding matrices by galvanic processes.
- These injection molding matrices correspond to the electroplating layer 5 according to FIG. 3.
- FIG. 5 from the sequence of figures 5 to 9 representing the inventive method shows a base plate 11 made of homogeneous glass, onto which the structurable layer 12 made of aluminum is applied in the thickness of approx. 100 nm, which is then in the same way as is structured according to the known method with a laser beam 13.
- the structured layer 12, as can be seen from FIG. 6, serves as an etching mask for the subsequent anisotropic etching process, in which recesses (pits) 14 are etched into the base plate 11 with a slope, which on the one hand ensures good, undercut-free detachment in the further production process of prints and on the other hand on the finished product (eg video plate) ensures good signal quality when reading the data carrier.
- Anisotropic dry etching (RIE reactive ion etching), ECR plasma current etching (electron cyclotron resonance) or RIBE (reactive ion beam etching) are the anisotropic etching processes. Suitable method. After only one further work step, in which the structured layer 12 serving as an etching mask is removed, for example by wet chemical detachment, the etched base plate 11 already has the negative effect with which it is possible to produce a large number of electroplating layers 15 which represent the injection molding matrices is.
- the injection molding die can be produced as in the known method described above, in which after the application of a galvanically conductive layer 16, for example a thin layer of silver, which also functions as a separating layer, the injection molding die, as in FIG. 4 described, is formed by a galvanic coating with nickel.
- a galvanically conductive layer 16 for example a thin layer of silver, which also functions as a separating layer
- the injection molding die as in FIG. 4 described, is formed by a galvanic coating with nickel.
- the production outlay for such injection molding matrices is low because of the particularly simple manufacture of the negative, in particular the yield of negatives of perfect quality is increased.
- the hardness of the working surface of the injection molding die produced according to the above-described galvanic method is approximately 300 HV (Vickers hardness) for nickel.
- injection molding matrices The production of injection molding matrices is described below, the working surface of which has a particularly high hardness, as a result of which a significantly higher number of pressings of optical data carriers, for example video disks, is made possible.
- the surface of the negative or the base gap 11 provided with the recesses 14 is vapor-coated with a hard material, for example nickel, by a method as described in the patent claims 2 to 4 is specified and is the subject of the German patent DE 34 13 891.
- the surface layer 17 produced by this method in the thickness of approx. 5 / tm has a much greater hardness, which is approx. 450 HV (Vickers hardness) when using nickel. This when using nickel is approx. 450 HV (Vickers hardness).
- This surface layer 17 is then galvanically reinforced with the galvanic layer 15 made of the same or a different material.
- the surface layer 17 is made of a galvanically non-conductive material, such as consist of hard layers (according to patent claims 20, 21, 22), a contact layer (e.g. made of nickel) must be evaporated beforehand for the subsequent electroplating process for producing the electroplating layer 15.
- a contact layer e.g. made of nickel
- the structurable layer 12 can be directly exposed to laser radiation 13, it being advantageous, in order to improve the detachment of the layer 12 at the affected areas, under the layer 12 an auxiliary layer 18 (FIG. 9) to be applied from tellurium, which reacts explosively when exposed to laser beams and reliably removes the overlying layer 12, for example aluminum.
- auxiliary layer 18 FIG. 9
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Afin de pouvoir produire avec des coûts de fabrication réduits un négatif selon un procédé de production de matrices de moulage par injection de supports d'information optiquement explorables, avec lequel on peut produire un nombre élevé de matrices de moulage par injection sans risques de pertes d'information, une plaque de base est garnie d'une couche structurable et cette couche est structurée par des rayons laser selon le programme de données. La couche structurée est ensuite utilisée comme masque de gravure par attaque pendant un processus de gravure anisotrope postérieur qui permet de graver des dépressions dans la plaque de base. Une fois le masque de gravure enlevé, la plaque de base pourvue de dépressions forme le négatif de reproduction de matrices de moulage par injection par déposition galvanique de couches galvano-plastiques qui représentent les matrices de moulage par injection.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP4029099.9 | 1990-09-13 | ||
| DE4029099A DE4029099A1 (de) | 1990-09-13 | 1990-09-13 | Verfahren zum herstellen von spritzgussmatritzen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1992005547A1 true WO1992005547A1 (fr) | 1992-04-02 |
Family
ID=6414204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE1991/000726 WO1992005547A1 (fr) | 1990-09-13 | 1991-09-12 | Procede de production de matrices de moulage par injection |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE4029099A1 (fr) |
| WO (1) | WO1992005547A1 (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4416479A1 (de) * | 1994-05-10 | 1995-11-16 | Rauschert Gmbh & Co Kg Paul | Verfahren und Vorrichtung zur Herstellung von strukturierten Keramikoberflächen |
| DE19542810A1 (de) * | 1994-11-16 | 1996-05-23 | Mitsubishi Chem Corp | Optisches Aufzeichnungsmedium und Verfahren zur Herstellung desselben |
| US5831963A (en) * | 1994-11-16 | 1998-11-03 | Mitsubishi Chemical Corporation | Optical recording medium having zones wherein the number of sectors per track is constant and method of injection-molding the same |
| DE19510096A1 (de) * | 1995-03-20 | 1996-09-26 | Leybold Ag | Matrize zum Abformen von Schallaufzeichnungen und Verfahren zu ihrer Herstellung |
| DE19653078A1 (de) * | 1996-12-19 | 1998-06-25 | Trace Optical | Leitstrukturen in optischen Speichermedien |
| DE10154361A1 (de) * | 2001-11-06 | 2003-05-15 | Univ Albert Ludwigs Freiburg | Verfahren zum Durchführen eines Rapid-Prototyping-Prozesses zur Herstellung von Mikrostrukturen |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60187952A (ja) * | 1984-03-06 | 1985-09-25 | Fujitsu Ltd | 光デイスク用スタンパの製造方法 |
| WO1986006203A1 (fr) * | 1985-04-15 | 1986-10-23 | Eastman Kodak Company | Procede de fabrication d'outillage en verre |
| WO1988009990A1 (fr) * | 1987-06-09 | 1988-12-15 | Ibm Deutschland Gmbh | Disque de stockage optique |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2140579A1 (de) * | 1971-08-13 | 1973-02-22 | Licentia Gmbh | Verfahren zum aufzeichnen von informationen entlang einer spiralfoermig verlaufenden spur eines informationstraegers |
| DE2306702C3 (de) * | 1973-02-10 | 1979-06-07 | Ted Bildplatten Ag Aeg-Telefunken- Teldec, Zug (Schweiz) | Verfahren zum reliefartigen Aufzeichnen von Signalen durch Ätzen eines metallischen Trägers |
| EP0137697B1 (fr) * | 1983-08-31 | 1987-11-25 | Kabushiki Kaisha Toshiba | Procédé de fabrication d'un milieu d'enregistrement optique d'informations |
| DE3413891C2 (de) * | 1984-04-12 | 1987-01-08 | Horst Dipl.-Phys. Dr. 4270 Dorsten Ehrich | Verfahren und Vorrichtung zur Materialverdampfung in einem Vakuumbehälter |
| JPH0648546B2 (ja) * | 1984-07-14 | 1994-06-22 | 日本ビクター株式会社 | 情報記録担体の製造法 |
| JPS6168746A (ja) * | 1984-09-04 | 1986-04-09 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 光学記憶デイスクを製造するためのモ−ルド・インサ−トを形成する方法 |
| US4619804A (en) * | 1985-04-15 | 1986-10-28 | Eastman Kodak Company | Fabricating optical record media |
| EP0434114B1 (fr) * | 1985-08-30 | 1994-01-26 | Sharp Kabushiki Kaisha | Elément de mémoire optique et son procédé de fabrication |
| JPS62241149A (ja) * | 1986-04-11 | 1987-10-21 | Sharp Corp | 光メモリ素子用フォトマスク及びその製造方法 |
| LU86722A1 (fr) * | 1986-12-23 | 1988-07-14 | Glaverbel | Feuille en matiere vitreuse portant un dessin grave et procede pour graver un dessin sur un substrat en matiere vitreuse |
| EP0349925A1 (fr) * | 1988-07-04 | 1990-01-10 | INTERATOM Gesellschaft mit beschränkter Haftung | Procédé pour revêtir des substrats en métaux réfractaires |
-
1990
- 1990-09-13 DE DE4029099A patent/DE4029099A1/de not_active Withdrawn
-
1991
- 1991-09-12 WO PCT/DE1991/000726 patent/WO1992005547A1/fr unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60187952A (ja) * | 1984-03-06 | 1985-09-25 | Fujitsu Ltd | 光デイスク用スタンパの製造方法 |
| WO1986006203A1 (fr) * | 1985-04-15 | 1986-10-23 | Eastman Kodak Company | Procede de fabrication d'outillage en verre |
| WO1988009990A1 (fr) * | 1987-06-09 | 1988-12-15 | Ibm Deutschland Gmbh | Disque de stockage optique |
Non-Patent Citations (2)
| Title |
|---|
| FUNKSCHAU, Band 58, Nr. 15, Juli 1986, M}nchen, DE, Seiten 29-32; "MUSIK NACH DIGITALEM REINHEITSGEBOT" * |
| PATENT ABSTRACTS OF JAPAN, Band 10, Nr. 41 (P-429)[2098], 18. Februar 1986; & JP,A,60 187 952 (FUJITSU K.K.) 6. März 1984 * |
Also Published As
| Publication number | Publication date |
|---|---|
| DE4029099A1 (de) | 1992-04-09 |
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