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WO1992004620A3 - Procede et appareil destines a l'inspection a haute resolution de composants electroniques - Google Patents

Procede et appareil destines a l'inspection a haute resolution de composants electroniques Download PDF

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Publication number
WO1992004620A3
WO1992004620A3 PCT/US1991/006166 US9106166W WO9204620A3 WO 1992004620 A3 WO1992004620 A3 WO 1992004620A3 US 9106166 W US9106166 W US 9106166W WO 9204620 A3 WO9204620 A3 WO 9204620A3
Authority
WO
WIPO (PCT)
Prior art keywords
target
image
rays
vacuum chamber
computer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1991/006166
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English (en)
Other versions
WO1992004620A2 (fr
Inventor
John A Adams
Bruce D Baker
Kerry L Brown
Robert L Corey
Brian L Ganz
David C Reynolds
Edward W Ross
Gerald S Russell
Christoper S Sexton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Four PI Systems Corp
Original Assignee
Four PI Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Four PI Systems Corp filed Critical Four PI Systems Corp
Publication of WO1992004620A2 publication Critical patent/WO1992004620A2/fr
Publication of WO1992004620A3 publication Critical patent/WO1992004620A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05GX-RAY TECHNIQUE
    • H05G1/00X-ray apparatus involving X-ray tubes; Circuits therefor
    • H05G1/08Electrical details
    • H05G1/26Measuring, controlling or protecting
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/043Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using fluoroscopic examination, with visual observation or video transmission of fluoroscopic images
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/044Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using laminography or tomosynthesis
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing

Landscapes

  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Système de laminographie à haute résolution (200) destiné à l'inspection de circuits intégrés dans lequel un faisceau d'électrons hautement focalisés est tracé en une configuration circulaire sur une cible plate (272) au sein d'une enceinte à vide (275). La cible (272) convertit le faisceau d'électrons en rayons X de manière à produire une source ponctuelle de rayons X qui effectue un mouvement de rotation en synchronisation avec un ensemble détecteur rotatif. Un objet (210) est placé au sein de l'enceinte à vide (274), entre la source de rayons X et le détecteur, si bien qu'un ombrogramme aux rayons X de l'objet est converti en une image optique par un écran de substance fluorescente (285) déposé sur l'intérieur d'une fenêtre qui ferme de manière étanche l'enceinte à vide. L'ensemble détecteur rotatif redresse l'image de manière à ce qu'elle s'affiche et soit intégrée dans une caméra vidéo stationnaire (300) en tant que laminographe. Un système informatique (350) et de rétroaction (320) commande un système de positionnement automatique qui dévie le faisceau d'électrons de manière à reproduire une image de zones choisies de l'objet inspecté. Afin de garder une qualité et une résolution d'image élevées, le système informatique (350) et de réaction (320) commande également la synchronisation de la déflexion du faisceau d'électrons et du système détecteur rotatif, corrigeant les inexactitudes de la mécanique du système. Le système informatique (350) peut également fonctionner sous commande de programme pour analyser automatiquement les données, mesurer les caractéristiques de l'objet inspecté et prendre des décisions concernant l'acceptabilité de la qualité de l'objet. Ladite invention emploie également des techniques de balayage au microscope électronique pour produire directement une image de la cible, si bien qu'il est possible de surveiller l'état de la cible et de compenser la dérive d'électrons au sein du système. Ladite invention convient particulièrement à l'analyse des défauts de puces de circuit intégré et autres.
PCT/US1991/006166 1990-08-30 1991-08-28 Procede et appareil destines a l'inspection a haute resolution de composants electroniques Ceased WO1992004620A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/575,550 US5199054A (en) 1990-08-30 1990-08-30 Method and apparatus for high resolution inspection of electronic items
US575,550 1990-08-30

Publications (2)

Publication Number Publication Date
WO1992004620A2 WO1992004620A2 (fr) 1992-03-19
WO1992004620A3 true WO1992004620A3 (fr) 1992-05-29

Family

ID=24300754

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1991/006166 Ceased WO1992004620A2 (fr) 1990-08-30 1991-08-28 Procede et appareil destines a l'inspection a haute resolution de composants electroniques

Country Status (2)

Country Link
US (1) US5199054A (fr)
WO (1) WO1992004620A2 (fr)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5600734A (en) * 1991-10-04 1997-02-04 Fujitsu Limited Electron beam tester
US5561696A (en) * 1987-10-30 1996-10-01 Hewlett-Packard Company Method and apparatus for inspecting electrical connections
US5621811A (en) * 1987-10-30 1997-04-15 Hewlett-Packard Co. Learning method and apparatus for detecting and controlling solder defects
US5463459A (en) * 1991-04-02 1995-10-31 Hitachi, Ltd. Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process
US5289520A (en) * 1991-11-27 1994-02-22 Lorad Corporation Stereotactic mammography imaging system with prone position examination table and CCD camera
GB9214114D0 (en) * 1992-07-03 1992-08-12 Ibm X-ray inspection apparatus for electronic circuits
EP0683389A1 (fr) * 1994-05-12 1995-11-22 Kabushiki Kaisha Toshiba Tomographe à laminographie et dispositif d'inspection et de réparation utilisant un tel tomographe
US5594770A (en) * 1994-11-18 1997-01-14 Thermospectra Corporation Method and apparatus for imaging obscured areas of a test object
US6091796A (en) * 1994-11-23 2000-07-18 Thermotrex Corporation Scintillator based microscope
US5583904A (en) * 1995-04-11 1996-12-10 Hewlett-Packard Co. Continuous linear scan laminography system and method
US5687209A (en) * 1995-04-11 1997-11-11 Hewlett-Packard Co. Automatic warp compensation for laminographic circuit board inspection
US5930330A (en) * 1995-09-29 1999-07-27 New Mexico Biophysics Method and apparatus for multitaxis scanning system
AU1545997A (en) * 1996-03-08 1997-09-22 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Process and device for radioscopically inspecting soldered points in electronic units
US5784430A (en) * 1996-04-16 1998-07-21 Northrop Grumman Corporation Multiple station gamma ray absorption contraband detection system
US5751784A (en) * 1996-09-27 1998-05-12 Kevex X-Ray X-ray tube
US6243095B1 (en) * 1996-12-05 2001-06-05 Peter E. Shile Navigation and display system for digital radiographs
US6067342A (en) * 1997-10-30 2000-05-23 Analogic Corporation Digital filmless X-ray projection imaging system and method
US6370487B1 (en) 1998-04-23 2002-04-09 Micron Technology, Inc. Remote semiconductor microscopy
US6463124B1 (en) * 1998-06-04 2002-10-08 X-Technologies, Ltd. Miniature energy transducer for emitting x-ray radiation including schottky cathode
TW402769B (en) * 1998-06-13 2000-08-21 Samsung Electronics Co Ltd Apparatus and method for contact failure inspection in semiconductor devices
US7295314B1 (en) 1998-07-10 2007-11-13 Nanometrics Incorporated Metrology/inspection positioning system
US6320609B1 (en) 1998-07-10 2001-11-20 Nanometrics Incorporated System using a polar coordinate stage and continuous image rotation to compensate for stage rotation
US6215851B1 (en) 1998-07-22 2001-04-10 Northrop Grumman Corporation High current proton beam target
US6314201B1 (en) 1998-10-16 2001-11-06 Agilent Technologies, Inc. Automatic X-ray determination of solder joint and view delta Z values from a laser mapped reference surface for circuit board inspection using X-ray laminography
US6303931B1 (en) * 1998-11-17 2001-10-16 Applied Materials, Inc. Method for determining a profile quality grade of an inspected feature
US6201850B1 (en) 1999-01-26 2001-03-13 Agilent Technologies, Inc. Enhanced thickness calibration and shading correction for automatic X-ray inspection
SE516914C2 (sv) * 1999-09-09 2002-03-19 Micronic Laser Systems Ab Metoder och rastrerare för högpresterande mönstergenerering
US6590216B1 (en) * 2000-01-27 2003-07-08 Nikon Corporation Servo control for high emittance electron source
KR100435108B1 (ko) * 2000-02-16 2004-06-09 삼성전자주식회사 방사선 검사시스템 및 검사방법
JP4505664B2 (ja) * 2000-03-24 2010-07-21 株式会社ニコン X線発生装置
US6628745B1 (en) * 2000-07-01 2003-09-30 Martin Annis Imaging with digital tomography and a rapidly moving x-ray source
US6825856B1 (en) 2000-07-26 2004-11-30 Agilent Technologies, Inc. Method and apparatus for extracting measurement information and setting specifications using three dimensional visualization
US6373917B1 (en) * 2000-08-30 2002-04-16 Agilent Technologies, Inc. Z-axis elimination in an X-ray laminography system using image magnification for Z plane adjustment
US7173245B2 (en) * 2001-01-04 2007-02-06 The Regents Of The University Of California Submicron thermal imaging method and enhanced resolution (super-resolved) AC-coupled imaging for thermal inspection of integrated circuits
US20020107659A1 (en) * 2001-02-05 2002-08-08 Vann Charles S. Orientation and position sensor
US6324249B1 (en) 2001-03-21 2001-11-27 Agilent Technologies, Inc. Electronic planar laminography system and method
US6980229B1 (en) * 2001-10-16 2005-12-27 Ebersole Jr John F System for precise rotational and positional tracking
US6853744B2 (en) * 2001-12-14 2005-02-08 Agilent Technologies, Inc. System and method for confirming electrical connection defects
US6847900B2 (en) * 2001-12-17 2005-01-25 Agilent Technologies, Inc. System and method for identifying solder joint defects
DE10224292A1 (de) * 2002-05-31 2003-12-11 Philips Intellectual Property Röntgenröhre
US6823736B1 (en) 2002-11-20 2004-11-30 The United States Of America As Represented By The Secretary Of The Navy Nondestructive acoustic emission testing system using electromagnetic excitation and method for using same
US6738450B1 (en) 2002-12-10 2004-05-18 Agilent Technologies, Inc. System and method for cost-effective classification of an object under inspection
DE10352334B4 (de) * 2003-11-06 2010-07-29 Comet Gmbh Verfahren zur Regelung einer Mikrofokus-Röntgeneinrichtung
WO2006113839A2 (fr) * 2005-04-20 2006-10-26 Richard Albert Appareil de laminographie
DE102005020149A1 (de) * 2005-04-29 2006-11-09 Yxlon International X-Ray Gmbh Verfahren zur automatischen Fehlererkennung in Prüfteilen mittels einer Röntgenprüfanlage
DE102006042157B4 (de) 2006-09-06 2013-03-21 Leica Microsystems Cms Gmbh Verfahren und Mikroskopiersystem zum Scannen einer Probe
JP4504344B2 (ja) * 2006-12-04 2010-07-14 国立大学法人 東京大学 X線源
WO2008088097A1 (fr) * 2007-01-19 2008-07-24 Postech Foundation Fabrication de microtubes creux autoportants par déposition électrochimique localisée sans modèle
US20080173546A1 (en) * 2007-01-22 2008-07-24 Seung Kwon Seol Fabrication of freestanding micro hollow tubes by template-free localized electrochemical deposition
US7529336B2 (en) 2007-05-31 2009-05-05 Test Research, Inc. System and method for laminography inspection
US8543237B2 (en) * 2007-09-17 2013-09-24 Conoptica As Rotating part position and change finding method and apparatus
DE102007046927A1 (de) * 2007-09-28 2009-04-02 Carl Zeiss Smt Ag Kalibrierung einer Positionsmesseinrichtung einer optischen Einrichtung
US8331525B2 (en) 2007-10-01 2012-12-11 Pratt & Whitney Rocketdyne, Inc. Characteristic X-ray computed laminography system for home made explosives (HME) detection
US8080791B2 (en) 2008-12-12 2011-12-20 Fei Company X-ray detector for electron microscope
US8401151B2 (en) * 2009-12-16 2013-03-19 General Electric Company X-ray tube for microsecond X-ray intensity switching
US8831179B2 (en) * 2011-04-21 2014-09-09 Carl Zeiss X-ray Microscopy, Inc. X-ray source with selective beam repositioning
WO2013185824A1 (fr) * 2012-06-14 2013-12-19 Siemens Aktiengesellschaft Eclateur
US9224572B2 (en) 2012-12-18 2015-12-29 General Electric Company X-ray tube with adjustable electron beam
US9484179B2 (en) 2012-12-18 2016-11-01 General Electric Company X-ray tube with adjustable intensity profile
CN103278515A (zh) * 2013-05-16 2013-09-04 华南理工大学 旋转式x射线分层摄影检测系统与方法
US9443691B2 (en) 2013-12-30 2016-09-13 General Electric Company Electron emission surface for X-ray generation
GB201715902D0 (en) * 2017-09-29 2017-11-15 Oxford Instr Plc Improved system for electron diffraction analysis
JP6930932B2 (ja) * 2018-01-26 2021-09-01 東芝Itコントロールシステム株式会社 傾斜型ct撮影装置
WO2019219737A1 (fr) * 2018-05-15 2019-11-21 Xenocs Sas Procédé et appareil d'analyse de matériau de diffusion de rayons x
US12213238B2 (en) * 2022-10-18 2025-01-28 Carl Zeiss X-ray Microscopy, Inc. Reflection target X-ray source with steered beam on target
EP4489050A1 (fr) * 2023-07-07 2025-01-08 Excillum AB Détection de perturbation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB868830A (en) * 1958-01-22 1961-05-25 Foerderung Forschung Gmbh Improvements in and relating to x-ray tubes and apparatus including such tubes
EP0225969A1 (fr) * 1985-08-19 1987-06-24 Kabushiki Kaisha Toshiba Appareil et méthode pour contrôler l'irradiation par un rayon d'électrons en position fixe dans un système de test avec des rayons d'électrons
WO1989004477A1 (fr) * 1987-10-30 1989-05-18 Four Pi Systems Corporation Systeme de laminographie automatise servant a l'inspection de materiels electroniques

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR812792A (fr) * 1935-11-01 1937-05-18 Philips Nv Procédé et dispositif radiographique permettant de représenter des objets en coupe à l'aide de rayons chi
US2677585A (en) * 1951-03-09 1954-05-04 Voy Donald G La Garment bag
BE533316A (fr) * 1953-11-14
NL207028A (fr) * 1956-05-09
DE1138617B (de) * 1960-01-22 1962-10-25 Zuder Di G Zurli & Dr A De Reg Vorrichtung zur Durchfuehrung von Roentgenaufnahmen, insbesondere von Schichtaufnahmen
US3812288A (en) * 1972-11-21 1974-05-21 Edax Int Inc Television display system
GB1581526A (en) * 1976-08-12 1980-12-17 Emi Ltd X-ray tube arrangements
DE2647167C2 (de) * 1976-10-19 1987-01-29 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur Herstellung von Schichtaufnahmen mit Röntgen- oder ähnlich durchdringenden Strahlen
US4075489A (en) * 1977-01-21 1978-02-21 Simulation Physics Method and apparatus involving the generation of x-rays
US4139776A (en) * 1977-09-22 1979-02-13 Cgr Medical Corporation System for circular and complex tomography
DE2946443A1 (de) * 1979-11-17 1981-05-27 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren und vorrichtung zur erzeugung von schichtbildern eines dreidimensionalen objektes
US4352021A (en) * 1980-01-07 1982-09-28 The Regents Of The University Of California X-Ray transmission scanning system and method and electron beam X-ray scan tube for use therewith
DE3134076A1 (de) * 1981-08-28 1983-03-10 Philips Patentverwaltung Gmbh, 2000 Hamburg "vorrichtung zur schichtweisen darstellung eines koerpers"
US4521902A (en) * 1983-07-05 1985-06-04 Ridge, Inc. Microfocus X-ray system
US5020086A (en) * 1983-07-05 1991-05-28 Ridge, Inc. Microfocus X-ray system
US4688241A (en) * 1984-03-26 1987-08-18 Ridge, Inc. Microfocus X-ray system
FR2565451B1 (fr) * 1984-05-30 1986-08-22 Thomson Cgr Procede de controle de la position du foyer d'un tube radiogene et dispositif de controle mettant en oeuvre ce procede
JPH0676975B2 (ja) * 1984-09-26 1994-09-28 新技術事業団 表面原子配列構造の観察方法
US4720633A (en) * 1986-01-17 1988-01-19 Electro-Scan Corporation Scanning electron microscope for visualization of wet samples
US4809308A (en) * 1986-02-20 1989-02-28 Irt Corporation Method and apparatus for performing automated circuit board solder quality inspections
US4730350A (en) * 1986-04-21 1988-03-08 Albert Richard D Method and apparatus for scanning X-ray tomography
US4852131A (en) * 1988-05-13 1989-07-25 Advanced Research & Applications Corporation Computed tomography inspection of electronic devices
JPH0258221A (ja) * 1988-08-23 1990-02-27 Semiconductor Energy Lab Co Ltd 炭素または炭素を主成分とするマスクを用いたエッチング方法
US4977328A (en) * 1989-03-02 1990-12-11 U.S. Philips Corporation Method of detecting a marker provided on a specimen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB868830A (en) * 1958-01-22 1961-05-25 Foerderung Forschung Gmbh Improvements in and relating to x-ray tubes and apparatus including such tubes
EP0225969A1 (fr) * 1985-08-19 1987-06-24 Kabushiki Kaisha Toshiba Appareil et méthode pour contrôler l'irradiation par un rayon d'électrons en position fixe dans un système de test avec des rayons d'électrons
WO1989004477A1 (fr) * 1987-10-30 1989-05-18 Four Pi Systems Corporation Systeme de laminographie automatise servant a l'inspection de materiels electroniques

Also Published As

Publication number Publication date
US5199054A (en) 1993-03-30
WO1992004620A2 (fr) 1992-03-19

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