WO1992004620A3 - Procede et appareil destines a l'inspection a haute resolution de composants electroniques - Google Patents
Procede et appareil destines a l'inspection a haute resolution de composants electroniques Download PDFInfo
- Publication number
- WO1992004620A3 WO1992004620A3 PCT/US1991/006166 US9106166W WO9204620A3 WO 1992004620 A3 WO1992004620 A3 WO 1992004620A3 US 9106166 W US9106166 W US 9106166W WO 9204620 A3 WO9204620 A3 WO 9204620A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- target
- image
- rays
- vacuum chamber
- computer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G1/00—X-ray apparatus involving X-ray tubes; Circuits therefor
- H05G1/08—Electrical details
- H05G1/26—Measuring, controlling or protecting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
- G01N23/043—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using fluoroscopic examination, with visual observation or video transmission of fluoroscopic images
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
- G01N23/044—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using laminography or tomosynthesis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
Landscapes
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Système de laminographie à haute résolution (200) destiné à l'inspection de circuits intégrés dans lequel un faisceau d'électrons hautement focalisés est tracé en une configuration circulaire sur une cible plate (272) au sein d'une enceinte à vide (275). La cible (272) convertit le faisceau d'électrons en rayons X de manière à produire une source ponctuelle de rayons X qui effectue un mouvement de rotation en synchronisation avec un ensemble détecteur rotatif. Un objet (210) est placé au sein de l'enceinte à vide (274), entre la source de rayons X et le détecteur, si bien qu'un ombrogramme aux rayons X de l'objet est converti en une image optique par un écran de substance fluorescente (285) déposé sur l'intérieur d'une fenêtre qui ferme de manière étanche l'enceinte à vide. L'ensemble détecteur rotatif redresse l'image de manière à ce qu'elle s'affiche et soit intégrée dans une caméra vidéo stationnaire (300) en tant que laminographe. Un système informatique (350) et de rétroaction (320) commande un système de positionnement automatique qui dévie le faisceau d'électrons de manière à reproduire une image de zones choisies de l'objet inspecté. Afin de garder une qualité et une résolution d'image élevées, le système informatique (350) et de réaction (320) commande également la synchronisation de la déflexion du faisceau d'électrons et du système détecteur rotatif, corrigeant les inexactitudes de la mécanique du système. Le système informatique (350) peut également fonctionner sous commande de programme pour analyser automatiquement les données, mesurer les caractéristiques de l'objet inspecté et prendre des décisions concernant l'acceptabilité de la qualité de l'objet. Ladite invention emploie également des techniques de balayage au microscope électronique pour produire directement une image de la cible, si bien qu'il est possible de surveiller l'état de la cible et de compenser la dérive d'électrons au sein du système. Ladite invention convient particulièrement à l'analyse des défauts de puces de circuit intégré et autres.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/575,550 US5199054A (en) | 1990-08-30 | 1990-08-30 | Method and apparatus for high resolution inspection of electronic items |
| US575,550 | 1990-08-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO1992004620A2 WO1992004620A2 (fr) | 1992-03-19 |
| WO1992004620A3 true WO1992004620A3 (fr) | 1992-05-29 |
Family
ID=24300754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US1991/006166 Ceased WO1992004620A2 (fr) | 1990-08-30 | 1991-08-28 | Procede et appareil destines a l'inspection a haute resolution de composants electroniques |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US5199054A (fr) |
| WO (1) | WO1992004620A2 (fr) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5600734A (en) * | 1991-10-04 | 1997-02-04 | Fujitsu Limited | Electron beam tester |
| US5561696A (en) * | 1987-10-30 | 1996-10-01 | Hewlett-Packard Company | Method and apparatus for inspecting electrical connections |
| US5621811A (en) * | 1987-10-30 | 1997-04-15 | Hewlett-Packard Co. | Learning method and apparatus for detecting and controlling solder defects |
| US5463459A (en) * | 1991-04-02 | 1995-10-31 | Hitachi, Ltd. | Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process |
| US5289520A (en) * | 1991-11-27 | 1994-02-22 | Lorad Corporation | Stereotactic mammography imaging system with prone position examination table and CCD camera |
| GB9214114D0 (en) * | 1992-07-03 | 1992-08-12 | Ibm | X-ray inspection apparatus for electronic circuits |
| EP0683389A1 (fr) * | 1994-05-12 | 1995-11-22 | Kabushiki Kaisha Toshiba | Tomographe à laminographie et dispositif d'inspection et de réparation utilisant un tel tomographe |
| US5594770A (en) * | 1994-11-18 | 1997-01-14 | Thermospectra Corporation | Method and apparatus for imaging obscured areas of a test object |
| US6091796A (en) * | 1994-11-23 | 2000-07-18 | Thermotrex Corporation | Scintillator based microscope |
| US5583904A (en) * | 1995-04-11 | 1996-12-10 | Hewlett-Packard Co. | Continuous linear scan laminography system and method |
| US5687209A (en) * | 1995-04-11 | 1997-11-11 | Hewlett-Packard Co. | Automatic warp compensation for laminographic circuit board inspection |
| US5930330A (en) * | 1995-09-29 | 1999-07-27 | New Mexico Biophysics | Method and apparatus for multitaxis scanning system |
| AU1545997A (en) * | 1996-03-08 | 1997-09-22 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Process and device for radioscopically inspecting soldered points in electronic units |
| US5784430A (en) * | 1996-04-16 | 1998-07-21 | Northrop Grumman Corporation | Multiple station gamma ray absorption contraband detection system |
| US5751784A (en) * | 1996-09-27 | 1998-05-12 | Kevex X-Ray | X-ray tube |
| US6243095B1 (en) * | 1996-12-05 | 2001-06-05 | Peter E. Shile | Navigation and display system for digital radiographs |
| US6067342A (en) * | 1997-10-30 | 2000-05-23 | Analogic Corporation | Digital filmless X-ray projection imaging system and method |
| US6370487B1 (en) | 1998-04-23 | 2002-04-09 | Micron Technology, Inc. | Remote semiconductor microscopy |
| US6463124B1 (en) * | 1998-06-04 | 2002-10-08 | X-Technologies, Ltd. | Miniature energy transducer for emitting x-ray radiation including schottky cathode |
| TW402769B (en) * | 1998-06-13 | 2000-08-21 | Samsung Electronics Co Ltd | Apparatus and method for contact failure inspection in semiconductor devices |
| US7295314B1 (en) | 1998-07-10 | 2007-11-13 | Nanometrics Incorporated | Metrology/inspection positioning system |
| US6320609B1 (en) | 1998-07-10 | 2001-11-20 | Nanometrics Incorporated | System using a polar coordinate stage and continuous image rotation to compensate for stage rotation |
| US6215851B1 (en) | 1998-07-22 | 2001-04-10 | Northrop Grumman Corporation | High current proton beam target |
| US6314201B1 (en) | 1998-10-16 | 2001-11-06 | Agilent Technologies, Inc. | Automatic X-ray determination of solder joint and view delta Z values from a laser mapped reference surface for circuit board inspection using X-ray laminography |
| US6303931B1 (en) * | 1998-11-17 | 2001-10-16 | Applied Materials, Inc. | Method for determining a profile quality grade of an inspected feature |
| US6201850B1 (en) | 1999-01-26 | 2001-03-13 | Agilent Technologies, Inc. | Enhanced thickness calibration and shading correction for automatic X-ray inspection |
| SE516914C2 (sv) * | 1999-09-09 | 2002-03-19 | Micronic Laser Systems Ab | Metoder och rastrerare för högpresterande mönstergenerering |
| US6590216B1 (en) * | 2000-01-27 | 2003-07-08 | Nikon Corporation | Servo control for high emittance electron source |
| KR100435108B1 (ko) * | 2000-02-16 | 2004-06-09 | 삼성전자주식회사 | 방사선 검사시스템 및 검사방법 |
| JP4505664B2 (ja) * | 2000-03-24 | 2010-07-21 | 株式会社ニコン | X線発生装置 |
| US6628745B1 (en) * | 2000-07-01 | 2003-09-30 | Martin Annis | Imaging with digital tomography and a rapidly moving x-ray source |
| US6825856B1 (en) | 2000-07-26 | 2004-11-30 | Agilent Technologies, Inc. | Method and apparatus for extracting measurement information and setting specifications using three dimensional visualization |
| US6373917B1 (en) * | 2000-08-30 | 2002-04-16 | Agilent Technologies, Inc. | Z-axis elimination in an X-ray laminography system using image magnification for Z plane adjustment |
| US7173245B2 (en) * | 2001-01-04 | 2007-02-06 | The Regents Of The University Of California | Submicron thermal imaging method and enhanced resolution (super-resolved) AC-coupled imaging for thermal inspection of integrated circuits |
| US20020107659A1 (en) * | 2001-02-05 | 2002-08-08 | Vann Charles S. | Orientation and position sensor |
| US6324249B1 (en) | 2001-03-21 | 2001-11-27 | Agilent Technologies, Inc. | Electronic planar laminography system and method |
| US6980229B1 (en) * | 2001-10-16 | 2005-12-27 | Ebersole Jr John F | System for precise rotational and positional tracking |
| US6853744B2 (en) * | 2001-12-14 | 2005-02-08 | Agilent Technologies, Inc. | System and method for confirming electrical connection defects |
| US6847900B2 (en) * | 2001-12-17 | 2005-01-25 | Agilent Technologies, Inc. | System and method for identifying solder joint defects |
| DE10224292A1 (de) * | 2002-05-31 | 2003-12-11 | Philips Intellectual Property | Röntgenröhre |
| US6823736B1 (en) | 2002-11-20 | 2004-11-30 | The United States Of America As Represented By The Secretary Of The Navy | Nondestructive acoustic emission testing system using electromagnetic excitation and method for using same |
| US6738450B1 (en) | 2002-12-10 | 2004-05-18 | Agilent Technologies, Inc. | System and method for cost-effective classification of an object under inspection |
| DE10352334B4 (de) * | 2003-11-06 | 2010-07-29 | Comet Gmbh | Verfahren zur Regelung einer Mikrofokus-Röntgeneinrichtung |
| WO2006113839A2 (fr) * | 2005-04-20 | 2006-10-26 | Richard Albert | Appareil de laminographie |
| DE102005020149A1 (de) * | 2005-04-29 | 2006-11-09 | Yxlon International X-Ray Gmbh | Verfahren zur automatischen Fehlererkennung in Prüfteilen mittels einer Röntgenprüfanlage |
| DE102006042157B4 (de) | 2006-09-06 | 2013-03-21 | Leica Microsystems Cms Gmbh | Verfahren und Mikroskopiersystem zum Scannen einer Probe |
| JP4504344B2 (ja) * | 2006-12-04 | 2010-07-14 | 国立大学法人 東京大学 | X線源 |
| WO2008088097A1 (fr) * | 2007-01-19 | 2008-07-24 | Postech Foundation | Fabrication de microtubes creux autoportants par déposition électrochimique localisée sans modèle |
| US20080173546A1 (en) * | 2007-01-22 | 2008-07-24 | Seung Kwon Seol | Fabrication of freestanding micro hollow tubes by template-free localized electrochemical deposition |
| US7529336B2 (en) | 2007-05-31 | 2009-05-05 | Test Research, Inc. | System and method for laminography inspection |
| US8543237B2 (en) * | 2007-09-17 | 2013-09-24 | Conoptica As | Rotating part position and change finding method and apparatus |
| DE102007046927A1 (de) * | 2007-09-28 | 2009-04-02 | Carl Zeiss Smt Ag | Kalibrierung einer Positionsmesseinrichtung einer optischen Einrichtung |
| US8331525B2 (en) | 2007-10-01 | 2012-12-11 | Pratt & Whitney Rocketdyne, Inc. | Characteristic X-ray computed laminography system for home made explosives (HME) detection |
| US8080791B2 (en) | 2008-12-12 | 2011-12-20 | Fei Company | X-ray detector for electron microscope |
| US8401151B2 (en) * | 2009-12-16 | 2013-03-19 | General Electric Company | X-ray tube for microsecond X-ray intensity switching |
| US8831179B2 (en) * | 2011-04-21 | 2014-09-09 | Carl Zeiss X-ray Microscopy, Inc. | X-ray source with selective beam repositioning |
| WO2013185824A1 (fr) * | 2012-06-14 | 2013-12-19 | Siemens Aktiengesellschaft | Eclateur |
| US9224572B2 (en) | 2012-12-18 | 2015-12-29 | General Electric Company | X-ray tube with adjustable electron beam |
| US9484179B2 (en) | 2012-12-18 | 2016-11-01 | General Electric Company | X-ray tube with adjustable intensity profile |
| CN103278515A (zh) * | 2013-05-16 | 2013-09-04 | 华南理工大学 | 旋转式x射线分层摄影检测系统与方法 |
| US9443691B2 (en) | 2013-12-30 | 2016-09-13 | General Electric Company | Electron emission surface for X-ray generation |
| GB201715902D0 (en) * | 2017-09-29 | 2017-11-15 | Oxford Instr Plc | Improved system for electron diffraction analysis |
| JP6930932B2 (ja) * | 2018-01-26 | 2021-09-01 | 東芝Itコントロールシステム株式会社 | 傾斜型ct撮影装置 |
| WO2019219737A1 (fr) * | 2018-05-15 | 2019-11-21 | Xenocs Sas | Procédé et appareil d'analyse de matériau de diffusion de rayons x |
| US12213238B2 (en) * | 2022-10-18 | 2025-01-28 | Carl Zeiss X-ray Microscopy, Inc. | Reflection target X-ray source with steered beam on target |
| EP4489050A1 (fr) * | 2023-07-07 | 2025-01-08 | Excillum AB | Détection de perturbation |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB868830A (en) * | 1958-01-22 | 1961-05-25 | Foerderung Forschung Gmbh | Improvements in and relating to x-ray tubes and apparatus including such tubes |
| EP0225969A1 (fr) * | 1985-08-19 | 1987-06-24 | Kabushiki Kaisha Toshiba | Appareil et méthode pour contrôler l'irradiation par un rayon d'électrons en position fixe dans un système de test avec des rayons d'électrons |
| WO1989004477A1 (fr) * | 1987-10-30 | 1989-05-18 | Four Pi Systems Corporation | Systeme de laminographie automatise servant a l'inspection de materiels electroniques |
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| FR812792A (fr) * | 1935-11-01 | 1937-05-18 | Philips Nv | Procédé et dispositif radiographique permettant de représenter des objets en coupe à l'aide de rayons chi |
| US2677585A (en) * | 1951-03-09 | 1954-05-04 | Voy Donald G La | Garment bag |
| BE533316A (fr) * | 1953-11-14 | |||
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| JPH0676975B2 (ja) * | 1984-09-26 | 1994-09-28 | 新技術事業団 | 表面原子配列構造の観察方法 |
| US4720633A (en) * | 1986-01-17 | 1988-01-19 | Electro-Scan Corporation | Scanning electron microscope for visualization of wet samples |
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-
1990
- 1990-08-30 US US07/575,550 patent/US5199054A/en not_active Expired - Lifetime
-
1991
- 1991-08-28 WO PCT/US1991/006166 patent/WO1992004620A2/fr not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB868830A (en) * | 1958-01-22 | 1961-05-25 | Foerderung Forschung Gmbh | Improvements in and relating to x-ray tubes and apparatus including such tubes |
| EP0225969A1 (fr) * | 1985-08-19 | 1987-06-24 | Kabushiki Kaisha Toshiba | Appareil et méthode pour contrôler l'irradiation par un rayon d'électrons en position fixe dans un système de test avec des rayons d'électrons |
| WO1989004477A1 (fr) * | 1987-10-30 | 1989-05-18 | Four Pi Systems Corporation | Systeme de laminographie automatise servant a l'inspection de materiels electroniques |
Also Published As
| Publication number | Publication date |
|---|---|
| US5199054A (en) | 1993-03-30 |
| WO1992004620A2 (fr) | 1992-03-19 |
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