[go: up one dir, main page]

WO1990012769A3 - Structures de puits thermiques avec capacite accrue de dissipation de la chaleur et procedes de production de telles structures - Google Patents

Structures de puits thermiques avec capacite accrue de dissipation de la chaleur et procedes de production de telles structures Download PDF

Info

Publication number
WO1990012769A3
WO1990012769A3 PCT/EP1990/000731 EP9000731W WO9012769A3 WO 1990012769 A3 WO1990012769 A3 WO 1990012769A3 EP 9000731 W EP9000731 W EP 9000731W WO 9012769 A3 WO9012769 A3 WO 9012769A3
Authority
WO
WIPO (PCT)
Prior art keywords
structures
heat
production
methods
dissipation capacity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP1990/000731
Other languages
English (en)
Other versions
WO1990012769A2 (fr
Inventor
Herbert Schachner
Dominique Richon
Jean-Paul Issartel
Heinz Tippmann
Gerard Horlaville
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Battelle Memorial Institute Inc
Original Assignee
Battelle Memorial Institute Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH1610/89A external-priority patent/CH678525A5/fr
Application filed by Battelle Memorial Institute Inc filed Critical Battelle Memorial Institute Inc
Publication of WO1990012769A2 publication Critical patent/WO1990012769A2/fr
Publication of WO1990012769A3 publication Critical patent/WO1990012769A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
    • C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
    • C04B35/571—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide obtained from Si-containing polymer precursors or organosilicon monomers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/71—Ceramic products containing macroscopic reinforcing agents
    • C04B35/78—Ceramic products containing macroscopic reinforcing agents containing non-metallic materials
    • C04B35/80—Fibres, filaments, whiskers, platelets, or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Products (AREA)
  • Chemical Vapour Deposition (AREA)
  • Porous Artificial Stone Or Porous Ceramic Products (AREA)

Abstract

L'invention concerne une structure poreuse ou non tissée de particules céramiques à conductivité thermique élevée, qui est enfouie dans une matrice de céramique thermoconductrice, afin de former un substrat de puits thermique. L'invention s'applique en particulier à des puits thermiques à base de nitrure d'aluminium (AlN). L'opération d'enfouissement est effectuée par infiltration au moyen de céramique dense dans des conditions de déposition en phase vapeur par procédé chimique. Dans un mode de réalisation, les particules sont constituées par des barbes recouvertes d'une couche de diamant.
PCT/EP1990/000731 1989-04-27 1990-04-26 Structures de puits thermiques avec capacite accrue de dissipation de la chaleur et procedes de production de telles structures Ceased WO1990012769A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH1610/89-1 1989-04-27
CH1610/89A CH678525A5 (en) 1989-04-27 1989-04-27 Heat-sink structures with increased heat dissipation capacity
EP89810833 1989-11-03
EP89810833.7 1989-11-03

Publications (2)

Publication Number Publication Date
WO1990012769A2 WO1990012769A2 (fr) 1990-11-01
WO1990012769A3 true WO1990012769A3 (fr) 1990-12-13

Family

ID=25688155

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1990/000731 Ceased WO1990012769A2 (fr) 1989-04-27 1990-04-26 Structures de puits thermiques avec capacite accrue de dissipation de la chaleur et procedes de production de telles structures

Country Status (2)

Country Link
EP (1) EP0426800A1 (fr)
WO (1) WO1990012769A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5783877A (en) * 1996-04-12 1998-07-21 Anorad Corporation Linear motor with improved cooling
US6191944B1 (en) * 1998-11-05 2001-02-20 Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.B.H. Heat sink for electric and/or electronic devices
US9120985B2 (en) 2010-05-26 2015-09-01 Exxonmobil Research And Engineering Company Corrosion resistant gasifier components

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2014148A1 (fr) * 1968-05-31 1970-04-17 Varian Associates
US3653830A (en) * 1969-05-08 1972-04-04 Tokyo Shibaura Electric Co Method for manufacturing aluminum nitride fibers
US3833389A (en) * 1970-12-23 1974-09-03 Tokyo Shibaura Electric Co Heat resistant and strengthened composite materials and method for producing same
US4256792A (en) * 1980-01-25 1981-03-17 Honeywell Inc. Composite electronic substrate of alumina uniformly needled through with aluminum nitride
EP0046605A2 (fr) * 1980-08-23 1982-03-03 BBC Aktiengesellschaft Brown, Boveri & Cie. Arrangement pour la dissipation de chaleur indépendante d'un potentiel
US4725456A (en) * 1985-03-28 1988-02-16 Agency Of Industrial Science And Technology Method for preparing mixture to be used for production of composite material
US4777155A (en) * 1985-09-30 1988-10-11 Nkg Spark Plug Co., Ltd. Sintered member of aluminum nitride base reinforced composite material
EP0312419A1 (fr) * 1987-10-14 1989-04-19 Association Pour La Recherche Et Le Developpement Des Methodes Et Processus Industriels (Armines) Matériau céramique à haute conductivité thermique, son procédé de fabrication, et ses applications, notamment dans l'industrie électronique

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2014148A1 (fr) * 1968-05-31 1970-04-17 Varian Associates
US3653830A (en) * 1969-05-08 1972-04-04 Tokyo Shibaura Electric Co Method for manufacturing aluminum nitride fibers
US3833389A (en) * 1970-12-23 1974-09-03 Tokyo Shibaura Electric Co Heat resistant and strengthened composite materials and method for producing same
US4256792A (en) * 1980-01-25 1981-03-17 Honeywell Inc. Composite electronic substrate of alumina uniformly needled through with aluminum nitride
EP0046605A2 (fr) * 1980-08-23 1982-03-03 BBC Aktiengesellschaft Brown, Boveri & Cie. Arrangement pour la dissipation de chaleur indépendante d'un potentiel
US4725456A (en) * 1985-03-28 1988-02-16 Agency Of Industrial Science And Technology Method for preparing mixture to be used for production of composite material
US4777155A (en) * 1985-09-30 1988-10-11 Nkg Spark Plug Co., Ltd. Sintered member of aluminum nitride base reinforced composite material
EP0312419A1 (fr) * 1987-10-14 1989-04-19 Association Pour La Recherche Et Le Developpement Des Methodes Et Processus Industriels (Armines) Matériau céramique à haute conductivité thermique, son procédé de fabrication, et ses applications, notamment dans l'industrie électronique

Also Published As

Publication number Publication date
EP0426800A1 (fr) 1991-05-15
WO1990012769A2 (fr) 1990-11-01

Similar Documents

Publication Publication Date Title
US4882455A (en) Electronic circuit substrates
SE8403429D0 (sv) Kropp med superhard beleggning
EP1701381A3 (fr) Panneau circuit en céramique
DE69729867D1 (de) Elktrolumineszentes system in einer monolithischen struktur
EP0364155A3 (fr) Refroidisseur composé à diamant pour l'utilisation dans des dispositifs semi-conducteurs
MY128398A (en) Electronic assembly with high capacity thermal interface and methods manufacturing
CA2051606A1 (fr) Tableau de connexions multicouches
EP0859408A3 (fr) Matériau pour un dissipateur de chaleur d'un dispositif semi-conducteur et procédé pour sa fabrication
MY140232A (en) Organic chip carriers for wire bond-type chips
KR920700306A (ko) 다이아몬드 피복부재 및 그 제조방법
KR950034652A (ko) 정전척
NO166342C (no) Halvstiv beskyttelsesplate.
DE68904877D1 (de) Koerper hoher dichte aus mit siliciumcarbidpulvern gefuellten vorkeramischen polysilazanen.
JPH10114827A5 (ja) シラザンポリマーの架橋方法、プレプレグの製造方法、セラミックマトリックス複合体の形成方法および多孔質セラミックの緻密化方法
WO1990012769A3 (fr) Structures de puits thermiques avec capacite accrue de dissipation de la chaleur et procedes de production de telles structures
NO895094L (no) Elektronikkpakke inneholdende aluminumnitrid og aluminiumnitrid-borsilikat glasskompositt.
ES2006499A6 (es) Metodo para la realizacion de una baldosa ceramica vitrificada o esmaltada
EP1038853A3 (fr) Corps céramique fritté et son utilisation comme élément anti-usure et composant électronique
US5139852A (en) Low dielectric composite substrate
ES2135666T3 (es) Elemento deslizante y procedimiento para su fabricacion.
Schachner et al. Heat-Sink Structures With Increased Heat Dissipation Capacity and Methods for the Production of Such Structures
JPH0582760B2 (fr)
IE822329L (en) Cubic boron nitride compact
GB8308751D0 (en) Mounting of semiconductor devices
DE3473958D1 (en) Magnetic disc and process for producing it

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): CA US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH DE DK ES FR GB IT LU NL SE

AK Designated states

Kind code of ref document: A3

Designated state(s): CA US

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH DE DK ES FR GB IT LU NL SE

WWE Wipo information: entry into national phase

Ref document number: 1990906925

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1990906925

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: CA

WWW Wipo information: withdrawn in national office

Ref document number: 1990906925

Country of ref document: EP