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WO1990001251A1 - Electrical circuits - Google Patents

Electrical circuits Download PDF

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Publication number
WO1990001251A1
WO1990001251A1 PCT/GB1989/000830 GB8900830W WO9001251A1 WO 1990001251 A1 WO1990001251 A1 WO 1990001251A1 GB 8900830 W GB8900830 W GB 8900830W WO 9001251 A1 WO9001251 A1 WO 9001251A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
hologram
circuit paths
dimensional
electrical circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/GB1989/000830
Other languages
French (fr)
Inventor
Anthony Atkinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Hybrid Ltd
Original Assignee
General Hybrid Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Hybrid Ltd filed Critical General Hybrid Ltd
Publication of WO1990001251A1 publication Critical patent/WO1990001251A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/22—Processes or apparatus for obtaining an optical image from holograms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/26—Processes or apparatus specially adapted to produce multiple sub- holograms or to obtain images from them, e.g. multicolour technique
    • G03H1/30—Processes or apparatus specially adapted to produce multiple sub- holograms or to obtain images from them, e.g. multicolour technique discrete holograms only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/22—Processes or apparatus for obtaining an optical image from holograms
    • G03H1/2249—Holobject properties
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/0005—Adaptation of holography to specific applications
    • G03H2001/0094—Adaptation of holography to specific applications for patterning or machining using the holobject as input light distribution
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/22—Processes or apparatus for obtaining an optical image from holograms
    • G03H1/2202—Reconstruction geometries or arrangements
    • G03H1/2205—Reconstruction geometries or arrangements using downstream optical component
    • G03H2001/2213—Diffusing screen revealing the real holobject, e.g. container filed with gel to reveal the 3D holobject
    • G03H2001/2221—Screen having complex surface, e.g. a structured object
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H2210/00—Object characteristics
    • G03H2210/30—3D object
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Definitions

  • This invention relates to electrical circuits, and in particular to a method of manufacturing a three dimensional electrical circuit structure.
  • Planar electrical circuit structures are well known in the form of printed circuit boards, as are various ways of manufacturing such structures.
  • a planar base substrate of electrically insulating material with a layer of metal, typically copper, which is in turn covered by a layer of light sensitive material which when exposed to light and thus cured, is resistant to etchants used for etching away unwanted parts of the metal layer.
  • the light sensitive layer is then selectively cured as by masking and exposure to light, the uncured parts of the material and the underlying metal layer then being removed, as by etching, to leave the required circuit paths on the substrate.
  • the substrate can be coated with a light sensitive material which when exposed to light and thus cured becomes conductive, the material being selectively exposed to light as by masking to cure those parts where current paths are required, the remainder of the material being subsequently removed and circuit paths formed as by deposition of metal onto the cured parts.
  • a method of manufacturing a three dimensional electrical circuit structure including the step of defining circuit paths on a three dimensional base by projection of a hologram of the structure onto the base.
  • electrical circuit paths can be directly formed on a three dimensional base using either of the known methods of formation discussed above, the essential feature of the method of the invention being the use of a hologram to define the required circuit paths simultaneously on a three dimensional base.
  • the hologram used can be formed in conventional manner from a model of the required structure, the model comprising a three dimensional base with the circuit paths shown in contrasting colour thereon. Otherwise the hologram can be generated by computer, for example as described on pages 43 and 44 of the magazine EUREKA of November 1987 under the title "New Holograms Focus Machining Beams".
  • circuit paths can be formed on both inside and outside surfaces of a three dimensional base, a plurality of holograms being used if necessary.
  • FIGS 1 and 2 illustrate the basic principle of the method of the invention.
  • FIGS 3 and 4 illustrate two methods in accordance with the invention.
  • a hologram 1 is formed, in known manner, of a three dimensional model 2 of a required three dimensional -'electrical circuit structure, the model 2 comprising a three dimensional base 3 having the required circuit paths 4 shown thereon in contrasting colour.
  • the hologram 1 formed is then used to produce a three dimensional electrical circuit structure 5 by projection of the hologram 1, in known manner, onto a three dimensional base 6 prepared for formation of electrical circuit paths 7 thereon by either of the known methods described above.
  • the base 6 can be coated with a light sensitive material which becomes electrically conductive when cured, applied by dipping, spraying or other known operations.
  • the applied coating is then selectively cured by projection of the hologram 1 onto the base 6, and the uncured coating material then removed from the base 6 by means of a solvent, to leave the required circuit paths 7 on the base 6.
  • the circuit paths 7 can then be built up if required using conventional metal plating techniques.
  • a base 6 can be subjected to a plurality of successive treatments as described in order to build up multilayer circuit paths 7 thereon with intermediate applications of dielectric material and possibly passive circuit components between the layers.
  • the base 6 can be given an initial coating of an electrically conductive metal such as copper, as by vacuum deposition, in which case the light sensitive material used need not be electrically conductive.
  • Figure 3 illustrates a method as described above, in which a plurality of holograms 1 are projected onto a spherical base 6 to define electrical circuit paths 7 thereon.
  • Figure 4 illustrates a method in which a plurality of holograms 1 are projected onto a three dimensional base structure 6 to define electrical circuit paths 7 on inside and outside surfaces of the structure.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Holo Graphy (AREA)

Abstract

A three-dimensional electrical circuit structure is manufactured by defining circuit paths (7) on a three-dimensional base (6) by the projection of a hologram (1) of the structure onto the base (6).

Description

ELECTRICAL CIRCUITS
This invention relates to electrical circuits, and in particular to a method of manufacturing a three dimensional electrical circuit structure.
Planar electrical circuit structures are well known in the form of printed circuit boards, as are various ways of manufacturing such structures.
For example, it is known to manufacture such a structure by coating a planar base substrate of electrically insulating material with a layer of metal, typically copper, which is in turn covered by a layer of light sensitive material which when exposed to light and thus cured, is resistant to etchants used for etching away unwanted parts of the metal layer. The light sensitive layer is then selectively cured as by masking and exposure to light, the uncured parts of the material and the underlying metal layer then being removed, as by etching, to leave the required circuit paths on the substrate. Otherwise the substrate can be coated with a light sensitive material which when exposed to light and thus cured becomes conductive, the material being selectively exposed to light as by masking to cure those parts where current paths are required, the remainder of the material being subsequently removed and circuit paths formed as by deposition of metal onto the cured parts.
Difficulties arise when three dimensional electrical circuit structures are desired, and conventionally either a plurality of planar structures are used, or a planar structure is moulded to obtain a desired structure.
According to this invention there is provided a method of manufacturing a three dimensional electrical circuit structure, including the step of defining circuit paths on a three dimensional base by projection of a hologram of the structure onto the base.
With the method of this invention electrical circuit paths can be directly formed on a three dimensional base using either of the known methods of formation discussed above, the essential feature of the method of the invention being the use of a hologram to define the required circuit paths simultaneously on a three dimensional base. The hologram used can be formed in conventional manner from a model of the required structure, the model comprising a three dimensional base with the circuit paths shown in contrasting colour thereon. Otherwise the hologram can be generated by computer, for example as described on pages 43 and 44 of the magazine EUREKA of November 1987 under the title "New Holograms Focus Machining Beams".
With the method of this invention circuit paths can be formed on both inside and outside surfaces of a three dimensional base, a plurality of holograms being used if necessary.
This invention will now be described by way of example with reference to the drawings, in which:■*-
Figures 1 and 2 illustrate the basic principle of the method of the invention; and
Figures 3 and 4 illustrate two methods in accordance with the invention.
As shown in Figure 1, in the method of the invention a hologram 1 is formed, in known manner, of a three dimensional model 2 of a required three dimensional -'electrical circuit structure, the model 2 comprising a three dimensional base 3 having the required circuit paths 4 shown thereon in contrasting colour.
As shown in Figure 2, the hologram 1 formed is then used to produce a three dimensional electrical circuit structure 5 by projection of the hologram 1, in known manner, onto a three dimensional base 6 prepared for formation of electrical circuit paths 7 thereon by either of the known methods described above.
Thus, the base 6 can be coated with a light sensitive material which becomes electrically conductive when cured, applied by dipping, spraying or other known operations. The applied coating is then selectively cured by projection of the hologram 1 onto the base 6, and the uncured coating material then removed from the base 6 by means of a solvent, to leave the required circuit paths 7 on the base 6. The circuit paths 7 can then be built up if required using conventional metal plating techniques.
If required, a base 6 can be subjected to a plurality of successive treatments as described in order to build up multilayer circuit paths 7 thereon with intermediate applications of dielectric material and possibly passive circuit components between the layers.
As a modification of the method described above, the base 6 can be given an initial coating of an electrically conductive metal such as copper, as by vacuum deposition, in which case the light sensitive material used need not be electrically conductive.
Figure 3 illustrates a method as described above, in which a plurality of holograms 1 are projected onto a spherical base 6 to define electrical circuit paths 7 thereon. Figure 4 illustrates a method in which a plurality of holograms 1 are projected onto a three dimensional base structure 6 to define electrical circuit paths 7 on inside and outside surfaces of the structure.

Claims

1. A method of manufacturing a three dimensional electrical circuit structure,; including the step of defining circuit paths on a three dimensional base by projection of a hologram of the structure onto the base.
2. A method as claimed in Claim 1, in which the hologram is formed from a model of the structure.
3. A method as claimed in Claim 1, in which the hologram is generated by computer.
4. A method as claimed in any preceding claim, in which the base carries a light sensitive coating of a material which is cured by the hologram at positions where circuit paths are to be formed, to become conductive at such positions, uncured material being subsequently removed from the base and circuit paths built up on the cured material.
5. A method as claimed in Claim 1, Claim 2, or Claim 3, in which the base carries a metal coating with an overlying coating of a light sensitive etchant resistant material, the hologram serving to cure the etchant resistant material at positions where circuit paths are required, the uncured etchant resistant material and the underlying metal coating being subsequently removed to leave the required circuit paths on the base.
6. A method as claimed in any preceding claim, in which circuit paths are formed on both inside and outside surfaces of a three dimensional base.
7. A method as claimed in any preceding claim, in which a plurality of holograms are used.
8. A method of manufacturing a three dimensional electrical circuit structure, substantially as hereinbefore described with reference to the drawings.
PCT/GB1989/000830 1988-07-25 1989-07-19 Electrical circuits Ceased WO1990001251A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8817709.2 1988-07-25
GB8817709A GB2221353A (en) 1988-07-25 1988-07-25 Manufacturing electrical circuits

Publications (1)

Publication Number Publication Date
WO1990001251A1 true WO1990001251A1 (en) 1990-02-08

Family

ID=10641074

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1989/000830 Ceased WO1990001251A1 (en) 1988-07-25 1989-07-19 Electrical circuits

Country Status (2)

Country Link
GB (1) GB2221353A (en)
WO (1) WO1990001251A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5705298A (en) * 1994-12-23 1998-01-06 Lucent Technologies Inc. Holographic method for generating three dimensional conformal photo lithographic masks
DE19715898A1 (en) * 1997-04-16 1998-10-22 Polus Michael Substrate with conductor crosslinking and process for its production
US6097472A (en) * 1997-04-17 2000-08-01 Canon Kabushiki Kaisha Apparatus and method for exposing a pattern on a ball-like device material
US5955221A (en) * 1997-11-21 1999-09-21 The Regents Of The University Of California Method and apparatus for fabrication of high gradient insulators with parallel surface conductors spaced less than one millimeter apart
JP3177961B2 (en) * 1998-04-14 2001-06-18 日本電気株式会社 Pattern forming method and apparatus by atomic beam holography
WO2000003296A1 (en) * 1998-07-10 2000-01-20 Ball Semiconductor, Inc. A reflection system for imaging on a nonplanar substrate
US6730443B2 (en) * 2000-02-28 2004-05-04 University Of Tennessee Research Foundation Patterning methods and systems using reflected interference patterns
US9019468B2 (en) * 2010-09-30 2015-04-28 Georgia Tech Research Corporation Interference projection exposure system and method of using same
US20140030895A1 (en) * 2012-07-30 2014-01-30 University Of Utah Research Foundation Methods and system for generating a three-dimensional holographic mask
US20160159232A1 (en) * 2013-11-22 2016-06-09 Wasatch Photonics, Inc. Contact apparatus and charging contact unit and method for electrically connecting a vehicle to a charging station
US20160291542A1 (en) * 2013-11-22 2016-10-06 Wasatch Photonics, Inc. System and method for holography-based fabrication
EP3295257B1 (en) 2015-12-30 2019-05-15 Dualitas Ltd. Dynamic holography non-scanning printing method
CN107850867B (en) 2015-12-30 2020-11-24 杜尔利塔斯有限公司 Dynamic holographic focus depth printing device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3582176A (en) * 1968-12-26 1971-06-01 Ibm Holographic optical method and system for photoprinting three-dimensional patterns on three-dimensional objects
US3712813A (en) * 1969-12-19 1973-01-23 Siemens Ag Production of semiconductor modules by a photo-resist technique with holographic projection of etching patterns

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3582176A (en) * 1968-12-26 1971-06-01 Ibm Holographic optical method and system for photoprinting three-dimensional patterns on three-dimensional objects
US3712813A (en) * 1969-12-19 1973-01-23 Siemens Ag Production of semiconductor modules by a photo-resist technique with holographic projection of etching patterns

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
IBM Technical Disclosure Bulletin, Vol. 10, No. 10, March 1968, T.J. HARRIS et al.: "Holographic Manufacturing Apparatus", pages 1513-1515 *
IBM Technical Disclosure Bulletin, Vol. 10, No. 3, 3 August 1967, T.F. SAUNDERS: "Light Sensitive Metalorganic Chelate Polymers", page 195 *
P. HARIHARAN: "Optical Holography Principles, Techniques and Applications", pages 146-147 *

Also Published As

Publication number Publication date
GB2221353A (en) 1990-01-31
GB8817709D0 (en) 1988-09-01

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