[go: up one dir, main page]

WO1989003274A1 - Method and application of laser drilling - Google Patents

Method and application of laser drilling Download PDF

Info

Publication number
WO1989003274A1
WO1989003274A1 PCT/DK1987/000124 DK8700124W WO8903274A1 WO 1989003274 A1 WO1989003274 A1 WO 1989003274A1 DK 8700124 W DK8700124 W DK 8700124W WO 8903274 A1 WO8903274 A1 WO 8903274A1
Authority
WO
WIPO (PCT)
Prior art keywords
holes
drilling
laser drilling
narrow holes
application
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DK1987/000124
Other languages
French (fr)
Inventor
Steen Erik Nielsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Danmarks Geotekniske Institut
Original Assignee
Danmarks Geotekniske Institut
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danmarks Geotekniske Institut filed Critical Danmarks Geotekniske Institut
Priority to PCT/DK1987/000124 priority Critical patent/WO1989003274A1/en
Publication of WO1989003274A1 publication Critical patent/WO1989003274A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Definitions

  • This invention relates to the Method of producing narrow holes through an object by the application of laser drilling.
  • the invention relates in particular to the perforation of solid objects of e.g. metallic, ceramic or thermoplastic materials, more particularly to the perforation of the wall of tubular objects, and most particularly to the perforation of the wall of injection need- les for medical use.
  • the invention further relates to objects perforated by one or more narrow holes by application of the invented method of laser drilling, in particular to perforated injection needles for medical use.
  • Injection needles of this kind may typically have a stainless steel wall of a thickness of 0.1 mm perforated by a number of holes of 0.05 nm diameter or less.
  • Laser drilling is normally performed by focusing an intense laser beam on the surface of the object where the perforation has to take place.
  • a gas nozzle may blow an auxiliary drilling gas against said surface of the object to remove the molten and/or evaporated material.
  • oxygen is used, but in cases where an oxidation of the object must be avoided, an inert gas, such as argon, may be used.
  • an inert gas such as argon
  • the geometry and diameter of the hole can be adjusted by adjustments in energy or focusing.
  • molten and/or evaporated material is ejected from the hole, first upwards and later downwards through the hole at the burn-through of the laser beam.
  • the geometry of the hole may vary from cylindrical to conically convergent or divergent.
  • a small flash or burr of molten material is normally formed along the edge of the hole.
  • the molten and/or evaporated spatter material and the flash or burr formation are major disadvantages of the art. This is more particularly the case in the perforation of one wall of injection needles, where the removal of spatter from the external and internal surfaces necessitates complicated cleaning operations.
  • the outside burr formation must further be reduced in order to reduce the pain at the injection of the needle, and in order to reduce damage to a surface coating, if any, e.g. a silicone coating of the needle.
  • a further serious disadvantage is the difficulty of avoiding a perforation or contamination of the opposite wall of small-diameter thin-walled objects.
  • a sluicing or flushing of the back of the object during the drilling operation with a backing fluid under pressure, preferably pure water or a pure inert gas.
  • the pressure of said backing fluid will blow the molten and/ or evaporated spatter material upwards and out through the hole at the moment of beam penetration.
  • water or a similar fluid is used, the instant heating and the sudden formation of the added pressure in a local vapour bubble at the inner surface of the object will greatly increase the cleaning effect.
  • the formation of a flash or burr along the edges of the hole will be significantly reduced due to the cooling effect of the fluid.
  • the method according to the present invention is particularly advantageous in the laser perforation of one wall of tubular objects, where the backing fluid passed through the tube will effectively prevent perforation or contamination of the opposite wall of the tubular object.
  • the cooling fluid will stabilize the drilling process as a whole, and make the laser parameters less sensitive to small variations and irregularities, a fact of great importance in a production situation.
  • the method according to the present invention is more particularly advantageous in the perforation of thin-walled injection needles for medical use, where the internal fluid will carry away any residual spatter or other impurities formed inside the needle.
  • Figure 1 is a schematic presentation of the main principles of prior art in a first method of laser drilling of narrow holes through an object
  • Figure 2 is a schematic presentation of the main principles of prior art in a second method of laser drilling of narrow holes through an object
  • Figure 3 is a schematic presentation of the main principles of prior art in laser drilling of narrow holes through the wall of tubular objects;
  • Figure 4 is a schematic presentation of the main principles of the invented method of laser drilling of narrow holes through an object.
  • Figure 5 is a schematic presentation of the main principles of the invented method of laser drilling of narrow holes through one wall of a tubular object.
  • Figure 1 shows schematically the main principles of prior art in a first method of laser drilling of narrow holes 1 through a solid object 2.
  • the object 2 may be of any solid material, e.g. metallic, ceramic or thermoplastic.
  • An intense laser beam 3 is focused by an optical lens 4 on or slightly below the surface of the object 2 where the perforation has to take place.
  • an excentric gas nozzle 5 blows an auxiliary drilling gas 6 against the surface of the object to remove the molten and/or evaporated material.
  • an inert cover gas such as argon
  • Figure 2 shows schematically the main principles of a second method of laser drilling, where a concentric nozzle 7 blows an auxiliary drilling gas 8 against the surface of the object 2.
  • Figure 3 shows schematically the main principles of prior art in laser drilling of narrow holes through the irradiated wall 9 of a tubular object 20.
  • a pulsed laser beam 3 for the focusing of a well-defined amount of energy which is just sufficient to melt and/or evaporate the material struck by the laser beam 3.
  • the geometry and diameter of the hole 1 can be adjusted by adjustments in energy or focusing.
  • molten and/or evaporated spatter material is ejected from the hole 1, first upwards 10 and later downwards 11 through the hole at the burn-through of the laser beam.
  • the geometry of the hole may vary from cylindrical to conically convergent or divergent.
  • a small flash or burr 12 is normally formed along the edges of the hole.
  • a major disadvantage of prior art is the formation of spatter material 11 inside the tubular object 20, and the difficulty of avoiding a contamination 11 or perforation 13 of the opposite wall of small-diameter tubular objects 20 such as thin-walled injection needles.
  • Figure 4 shows schematically the main principles of the invented method of laser drilling of narrow holes 14 through a solid object 2.
  • a sluicing or flushing of the back of the object during the drilling operation with a backing fluid under pressure 15, preferably pure water or a pure inert gas from a nozzle 16.
  • the pressure of said backing fluid 15 will blow the molten and/or evaporated material upwards and out through the hole 14 at the moment of beampenetration.
  • Figure 5 shows schematically the main principles of the invented method of laser drilling of narrow holes through the irradiated wall 9 of a tubular object 20.
  • a sluicing or flushing of the inside of the tube wall 9 during the drilling operation with a backing fluid under pressure 17, preferably pure water or a pure inert gas which is passed through the tubular object 20.
  • the backing fluid 17 will blow the molten and/or evaporated material 18 out through the hole at the moment of beam penetration.
  • water or a similar fluid is used, the instant heating and the sudden formation of added pressure in a local vapour bubble 19 at the inner surface of the object will greatly increase the cleaning effect.
  • the backing fluid will effectively prevent the contamination 11 or perforation 13 of the opposite wall of small-diameter objects 20 such as thin-walled injection needles.
  • the formation of a flash or burr 12 along the edges of the hole will be significantly reduced due to the cooling effect of the backing fluid 17, the internal cooling fluid 17 will stabilize the drilling process as a whole, and the internal fluid 17 will carry away any residual material spatter or other impurities formed inside the needle.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

An improved method and application of laser drilling of narrow holes (14) through solid, e.g. metallic, ceramic or thermoplastic objects (2, 20), comprises the step of sluicing or flushing the back of said object during the drilling operation with a backing fluid under pressure (15, 17), preferably pure water or a pure inert gas. In laser drilling of narrow holes (14) through the wall of tubular objects (20), said backing fluid is passed through said tubular object during the drilling operation. A particularly advantageous application of the invention is the manufacture of narrow holes (14) through small-diameter, thin-walled injection needles (20) for medical use, such needles having typically a wall thickness of 0.1 mm, perforated by a number of holes (14) of 0.05 mm diameter or less.

Description

METHOD AND APPLICATION OF LASER DRILLING
BACKGROUND OF THE INVENTION
1. Field of the invention
This invention relates to the Method of producing narrow holes through an object by the application of laser drilling. The invention relates in particular to the perforation of solid objects of e.g. metallic, ceramic or thermoplastic materials, more particularly to the perforation of the wall of tubular objects, and most particularly to the perforation of the wall of injection need- les for medical use.
The invention further relates to objects perforated by one or more narrow holes by application of the invented method of laser drilling, in particular to perforated injection needles for medical use. Injection needles of this kind may typically have a stainless steel wall of a thickness of 0.1 mm perforated by a number of holes of 0.05 nm diameter or less. 2. Background of the Prior Art
Laser drilling is normally performed by focusing an intense laser beam on the surface of the object where the perforation has to take place. At the same time, a gas nozzle may blow an auxiliary drilling gas against said surface of the object to remove the molten and/or evaporated material. Normally, oxygen is used, but in cases where an oxidation of the object must be avoided, an inert gas, such as argon, may be used. For precision drilling of narrow holes through thin-walled objects it is normal to use a pulsed laser beam for the focusing of a well-defined amount of energy which is just sufficient to melt and/or evaporate the material struck by the laser beam. The geometry and diameter of the hole can be adjusted by adjustments in energy or focusing. During the actual drilling of the hole, molten and/or evaporated material is ejected from the hole, first upwards and later downwards through the hole at the burn-through of the laser beam. The geometry of the hole may vary from cylindrical to conically convergent or divergent. A small flash or burr of molten material is normally formed along the edge of the hole. Where high precision and cleanness is required, the molten and/or evaporated spatter material and the flash or burr formation are major disadvantages of the art. This is more particularly the case in the perforation of one wall of injection needles, where the removal of spatter from the external and internal surfaces necessitates complicated cleaning operations. The outside burr formation must further be reduced in order to reduce the pain at the injection of the needle, and in order to reduce damage to a surface coating, if any, e.g. a silicone coating of the needle. A further serious disadvantage is the difficulty of avoiding a perforation or contamination of the opposite wall of small-diameter thin-walled objects. SUMMARY OF THE INVENTION The laser drilling method according to the present invention has been evolved with the general object of overcoming the disadvantages of the prior art by providing significantly improved precision in the geometry of the holes, and significantly improved cleanness of the surfaces of the perforated objects.
According to the present invention there is provided a sluicing or flushing of the back of the object during the drilling operation with a backing fluid under pressure, preferably pure water or a pure inert gas. The pressure of said backing fluid will blow the molten and/ or evaporated spatter material upwards and out through the hole at the moment of beam penetration. When water or a similar fluid is used, the instant heating and the sudden formation of the added pressure in a local vapour bubble at the inner surface of the object will greatly increase the cleaning effect. At the same time, the formation of a flash or burr along the edges of the hole will be significantly reduced due to the cooling effect of the fluid. The method according to the present invention is particularly advantageous in the laser perforation of one wall of tubular objects, where the backing fluid passed through the tube will effectively prevent perforation or contamination of the opposite wall of the tubular object. At the same time, the cooling fluid will stabilize the drilling process as a whole, and make the laser parameters less sensitive to small variations and irregularities, a fact of great importance in a production situation. The method according to the present invention is more particularly advantageous in the perforation of thin-walled injection needles for medical use, where the internal fluid will carry away any residual spatter or other impurities formed inside the needle. Other objects and advantages will be readily apparent from the following description taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF TEE DRAWINGS
Figure 1 is a schematic presentation of the main principles of prior art in a first method of laser drilling of narrow holes through an object;
Figure 2 is a schematic presentation of the main principles of prior art in a second method of laser drilling of narrow holes through an object; Figure 3 is a schematic presentation of the main principles of prior art in laser drilling of narrow holes through the wall of tubular objects;
Figure 4 is a schematic presentation of the main principles of the invented method of laser drilling of narrow holes through an object; and
Figure 5 is a schematic presentation of the main principles of the invented method of laser drilling of narrow holes through one wall of a tubular object. DETAILED DESCRIPTION OF THE INVENTED METHODS Figure 1 shows schematically the main principles of prior art in a first method of laser drilling of narrow holes 1 through a solid object 2. The object 2 may be of any solid material, e.g. metallic, ceramic or thermoplastic. An intense laser beam 3 is focused by an optical lens 4 on or slightly below the surface of the object 2 where the perforation has to take place. At the same time, an excentric gas nozzle 5 blows an auxiliary drilling gas 6 against the surface of the object to remove the molten and/or evaporated material. Normally, oxygen is used, but in cases where an oxidation of the object must be avoided, an inert cover gas, such as argon, may be used.
Figure 2 shows schematically the main principles of a second method of laser drilling, where a concentric nozzle 7 blows an auxiliary drilling gas 8 against the surface of the object 2.
Figure 3 shows schematically the main principles of prior art in laser drilling of narrow holes through the irradiated wall 9 of a tubular object 20.
For precision drilling of narrow holes it is normal to use a pulsed laser beam 3 for the focusing of a well-defined amount of energy which is just sufficient to melt and/or evaporate the material struck by the laser beam 3. The geometry and diameter of the hole 1 can be adjusted by adjustments in energy or focusing. During the actual drilling of the hole, molten and/or evaporated spatter material is ejected from the hole 1, first upwards 10 and later downwards 11 through the hole at the burn-through of the laser beam. The geometry of the hole may vary from cylindrical to conically convergent or divergent. A small flash or burr 12 is normally formed along the edges of the hole. A major disadvantage of prior art is the formation of spatter material 11 inside the tubular object 20, and the difficulty of avoiding a contamination 11 or perforation 13 of the opposite wall of small-diameter tubular objects 20 such as thin-walled injection needles.
Figure 4 shows schematically the main principles of the invented method of laser drilling of narrow holes 14 through a solid object 2. According to the invention there is provided a sluicing or flushing of the back of the object during the drilling operation with a backing fluid under pressure 15, preferably pure water or a pure inert gas from a nozzle 16. The pressure of said backing fluid 15 will blow the molten and/or evaporated material upwards and out through the hole 14 at the moment of beampenetration.
Figure 5 shows schematically the main principles of the invented method of laser drilling of narrow holes through the irradiated wall 9 of a tubular object 20. According to the invention there is provided a sluicing or flushing of the inside of the tube wall 9 during the drilling operation with a backing fluid under pressure 17, preferably pure water or a pure inert gas which is passed through the tubular object 20. The backing fluid 17 will blow the molten and/or evaporated material 18 out through the hole at the moment of beam penetration. When water or a similar fluid is used, the instant heating and the sudden formation of added pressure in a local vapour bubble 19 at the inner surface of the object will greatly increase the cleaning effect. At the same time, the backing fluid will effectively prevent the contamination 11 or perforation 13 of the opposite wall of small-diameter objects 20 such as thin-walled injection needles. The formation of a flash or burr 12 along the edges of the hole will be significantly reduced due to the cooling effect of the backing fluid 17, the internal cooling fluid 17 will stabilize the drilling process as a whole, and the internal fluid 17 will carry away any residual material spatter or other impurities formed inside the needle.
It will be readily apparent that the invented method illustrated in figures 4 and 5 may or may not be supplemented by a prior art external cover gas 6 or 8 as illustrated in figures 1 and 2. It will be understood that several modifications and variations of the described method may be effected without departing from the spirit and scope of the novel concepts of the present invention.

Claims

PATENT CLAIMS
1. An improved method of laser drilling of narrow holes (14) through an object (2, 2θ), comprising the step of sluicing the back of said object during the drilling operation with a backing fluid under pressure (15, 17).
2. The method of claim 1 for laser drilling of narrow holes (14) through the wall of a tubular object (20) wherein said backing fluid (17) is passed through said tubular object (20) during the drilling operation.
3. The method of claim 2 wherein said tubular object (20) is an injection needle for medical use.
4. The methods of claims 1, 2 or 3 wherein said backing fluid (15, 17) is pure water or a pure inert gas.
5. An object (2, 20) perforated by one or more holes (14), said holes having been drilled by application of the methods of claims 1 or 4.
6. A tubular object (20) perforated by one or more narrow holes (14), said holes having been drilled by application of the methods of claims 2 or 4.
7. An injection needle for medical use perforated by one or more narrow holes (14), said holes having been drilled by application of the methods of claims 3 or 4.
PCT/DK1987/000124 1987-10-14 1987-10-14 Method and application of laser drilling Ceased WO1989003274A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/DK1987/000124 WO1989003274A1 (en) 1987-10-14 1987-10-14 Method and application of laser drilling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DK1987/000124 WO1989003274A1 (en) 1987-10-14 1987-10-14 Method and application of laser drilling

Publications (1)

Publication Number Publication Date
WO1989003274A1 true WO1989003274A1 (en) 1989-04-20

Family

ID=8153424

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DK1987/000124 Ceased WO1989003274A1 (en) 1987-10-14 1987-10-14 Method and application of laser drilling

Country Status (1)

Country Link
WO (1) WO1989003274A1 (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2252933A (en) * 1991-02-21 1992-08-26 Synthes Method and apparatus for laser cutting a hollow metal workpiece.
FR2699844A1 (en) * 1992-12-30 1994-07-01 Snecma Method and device for laser beam machining
US5345057A (en) * 1993-03-25 1994-09-06 Lasag Ag Method of cutting an aperture in a device by means of a laser beam
GB2291371A (en) * 1994-07-21 1996-01-24 Fuji Heavy Ind Ltd Hole forming
US5749287A (en) * 1994-10-19 1998-05-12 Tebel-Mkt B.V. Perforated drainage pipe for draining whey/curd mass
US5994667A (en) * 1997-10-15 1999-11-30 Scimed Life Systems, Inc. Method and apparatus for laser cutting hollow workpieces
US6563080B2 (en) 2001-02-15 2003-05-13 Scimed Life Systems, Inc. Laser cutting of stents and other medical devices
WO2003008138A3 (en) * 2001-07-19 2003-07-03 Nsk Ltd Method for working nut screw for ball screw
WO2004002672A1 (en) * 2002-06-28 2004-01-08 3M Innovative Properties Company Manufacture of valve stems
WO2004004966A1 (en) * 2002-07-03 2004-01-15 Boston Scientific Limited Laser/fluid jet cutting process and system
US6777647B1 (en) 2003-04-16 2004-08-17 Scimed Life Systems, Inc. Combination laser cutter and cleaner
WO2005023480A1 (en) * 2003-09-05 2005-03-17 Herbert Walter Method and device for drilling holes using co2 laser pulses
EP1598141A1 (en) * 2004-05-21 2005-11-23 Hewlett-Packard Development Company, L.P. Methods for laser processing
US7067759B2 (en) 2002-04-24 2006-06-27 The Boc Group Plc Metal working
US7476034B2 (en) 2003-08-28 2009-01-13 Boston Scientific Scimed, Inc. Dynamic bushing for medical device tubing
WO2013086360A1 (en) * 2011-12-07 2013-06-13 Forsman Andrew C Methods and systems for use in laser machining
US20140076857A1 (en) * 2012-09-14 2014-03-20 General Electric Company System and method for manufacturing an airfoil
WO2015036441A3 (en) * 2013-09-11 2015-07-16 Robert Bosch Gmbh Method for laser drilling a component
CN106166644A (en) * 2015-05-21 2016-11-30 罗伯特·博世有限公司 For the laser drill of workpiece or the method for cut and for laser drill or the system of cut
CN110280915A (en) * 2019-05-24 2019-09-27 江苏大学 A kind of laser drilling device and method improving drilling quality based on underwater punching
EP3851241A1 (en) * 2020-01-17 2021-07-21 Raytheon Technologies Corporation Method and system for preventing back strikes when laser drilling hollow parts
WO2025093517A1 (en) * 2023-11-02 2025-05-08 Robert Bosch Gmbh Method for processing a substrate for an electrochemical cell

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3601576A (en) * 1967-09-25 1971-08-24 Laser Tech Sa Method for boring workpieces by laser pulses
FR2222170A1 (en) * 1973-03-22 1974-10-18 American Cyanamid Co
DE2338514A1 (en) * 1973-07-30 1975-02-20 Lks Laser Kombinationssysteme Laser-beam machining using oxygen - with concentric water-cooling jets on both sides of the part being machined
US4048464A (en) * 1975-08-22 1977-09-13 Fuji Photo Film Co., Ltd. Method of and means for cutting hose for high pressure hydraulic systems

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3601576A (en) * 1967-09-25 1971-08-24 Laser Tech Sa Method for boring workpieces by laser pulses
FR2222170A1 (en) * 1973-03-22 1974-10-18 American Cyanamid Co
DE2338514A1 (en) * 1973-07-30 1975-02-20 Lks Laser Kombinationssysteme Laser-beam machining using oxygen - with concentric water-cooling jets on both sides of the part being machined
US4048464A (en) * 1975-08-22 1977-09-13 Fuji Photo Film Co., Ltd. Method of and means for cutting hose for high pressure hydraulic systems

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2252933A (en) * 1991-02-21 1992-08-26 Synthes Method and apparatus for laser cutting a hollow metal workpiece.
FR2673132A1 (en) * 1991-02-21 1992-08-28 Synthes METHOD AND DEVICE FOR LASER CUTTING A HOLLOW METAL PART.
GB2252933B (en) * 1991-02-21 1995-01-11 Synthes Method and apparatus for laser cutting a hollow metal workpiece
FR2699844A1 (en) * 1992-12-30 1994-07-01 Snecma Method and device for laser beam machining
EP0618036A1 (en) * 1992-12-30 1994-10-05 Societe Nationale D'etude Et De Construction De Moteurs D'aviation "Snecma" Process and apparatus for machining with laser beam
US5345057A (en) * 1993-03-25 1994-09-06 Lasag Ag Method of cutting an aperture in a device by means of a laser beam
GB2291371A (en) * 1994-07-21 1996-01-24 Fuji Heavy Ind Ltd Hole forming
GB2291371B (en) * 1994-07-21 1998-04-01 Fuji Heavy Ind Ltd Hole forming method and apparatus
US5749287A (en) * 1994-10-19 1998-05-12 Tebel-Mkt B.V. Perforated drainage pipe for draining whey/curd mass
US5994667A (en) * 1997-10-15 1999-11-30 Scimed Life Systems, Inc. Method and apparatus for laser cutting hollow workpieces
US6563080B2 (en) 2001-02-15 2003-05-13 Scimed Life Systems, Inc. Laser cutting of stents and other medical devices
US6867389B2 (en) 2001-02-15 2005-03-15 Scimed Life Systems, Inc. Laser cutting of stents and other medical devices
WO2003008138A3 (en) * 2001-07-19 2003-07-03 Nsk Ltd Method for working nut screw for ball screw
US7067759B2 (en) 2002-04-24 2006-06-27 The Boc Group Plc Metal working
WO2004002672A1 (en) * 2002-06-28 2004-01-08 3M Innovative Properties Company Manufacture of valve stems
WO2004004966A1 (en) * 2002-07-03 2004-01-15 Boston Scientific Limited Laser/fluid jet cutting process and system
US6888098B1 (en) 2002-07-03 2005-05-03 Scimed Life Systems, Inc. Tubular cutting process and system
US9180032B2 (en) 2002-07-03 2015-11-10 Boston Scientific Scimed, Inc. Tubular cutting process and system
US6777647B1 (en) 2003-04-16 2004-08-17 Scimed Life Systems, Inc. Combination laser cutter and cleaner
US7476034B2 (en) 2003-08-28 2009-01-13 Boston Scientific Scimed, Inc. Dynamic bushing for medical device tubing
WO2005023480A1 (en) * 2003-09-05 2005-03-17 Herbert Walter Method and device for drilling holes using co2 laser pulses
EP1598141A1 (en) * 2004-05-21 2005-11-23 Hewlett-Packard Development Company, L.P. Methods for laser processing
US7163640B2 (en) 2004-05-21 2007-01-16 Hewlett-Packard Development Company, L.P. Methods and systems for laser processing
US7938512B2 (en) 2004-05-21 2011-05-10 Hewlett-Packard Development Company, L.P. Methods and systems for laser processing
WO2013086360A1 (en) * 2011-12-07 2013-06-13 Forsman Andrew C Methods and systems for use in laser machining
US9815141B2 (en) 2011-12-07 2017-11-14 General Atomics Methods and systems for use in laser machining
CN104254428A (en) * 2011-12-07 2014-12-31 通用原子公司 Method and system for laser manufacturing processing
CN106001945A (en) * 2011-12-07 2016-10-12 通用原子公司 Methods and systems for use in laser machining
US8969760B2 (en) * 2012-09-14 2015-03-03 General Electric Company System and method for manufacturing an airfoil
US20140076857A1 (en) * 2012-09-14 2014-03-20 General Electric Company System and method for manufacturing an airfoil
CN105899324A (en) * 2013-09-11 2016-08-24 罗伯特·博世有限公司 Method for laser drilling a component
WO2015036441A3 (en) * 2013-09-11 2015-07-16 Robert Bosch Gmbh Method for laser drilling a component
CN106166644A (en) * 2015-05-21 2016-11-30 罗伯特·博世有限公司 For the laser drill of workpiece or the method for cut and for laser drill or the system of cut
CN106166644B (en) * 2015-05-21 2021-04-27 罗伯特·博世有限公司 Method for laser drilling or laser cutting of workpieces and system for laser drilling or laser cutting
CN110280915A (en) * 2019-05-24 2019-09-27 江苏大学 A kind of laser drilling device and method improving drilling quality based on underwater punching
EP3851241A1 (en) * 2020-01-17 2021-07-21 Raytheon Technologies Corporation Method and system for preventing back strikes when laser drilling hollow parts
US12370630B2 (en) 2020-01-17 2025-07-29 Rtx Corporation Method and system for preventing back strikes when laser drilling hollow parts
WO2025093517A1 (en) * 2023-11-02 2025-05-08 Robert Bosch Gmbh Method for processing a substrate for an electrochemical cell

Similar Documents

Publication Publication Date Title
WO1989003274A1 (en) Method and application of laser drilling
JP4176016B2 (en) Formation of perforated films by laser drilling and subsequent electropolishing steps
US5345057A (en) Method of cutting an aperture in a device by means of a laser beam
Kamlage et al. Deep drilling of metals by femtosecond laser pulses
US6376797B1 (en) Laser cutting of semiconductor materials
JP5276699B2 (en) Laser processing method and laser processing apparatus for piercing
US4092515A (en) Laser method of precision hole drilling
WO1999036221A1 (en) Combined percussion and trepan laser drilling
KR20020010101A (en) High density energy beam machining method and apparatus for the same
JPH11267867A (en) Laser processing method and apparatus
US6969822B2 (en) Laser micromachining systems
EP0427737A1 (en) PROCESS FOR MICRO-MACHINING THE SURFACE OF A WORKPIECE BY MEANS OF A LASER BEAM.
AU8158487A (en) Method and application of laser drilling
JP3131357B2 (en) Laser processing method
US7977603B2 (en) Method of manufacturing an eyeless suture needle
JPH0947888A (en) Laser piercing method and apparatus thereof
US20020189632A1 (en) Method of removing deposits of material formed in laser machining
Yilbas et al. Study into the effect of beam waist position on hole formation in the laser drilling process
JP2002178180A (en) Laser processing apparatus and laser processing method
JP2006326615A (en) Laser beam machining method and apparatus
JP3110504B2 (en) Laser processing method
JP2875626B2 (en) Laser piercing method
Sharp Laser processing of medical devices
JP2618730B2 (en) Laser processing method and laser processing apparatus
SU804335A1 (en) Method of eliminating metal flaws

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AU DK FI JP KR NO SU US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE FR GB IT LU NL SE