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WO1989001732A1 - Element de suspension d'un bras de manutention - Google Patents

Element de suspension d'un bras de manutention Download PDF

Info

Publication number
WO1989001732A1
WO1989001732A1 PCT/CH1988/000139 CH8800139W WO8901732A1 WO 1989001732 A1 WO1989001732 A1 WO 1989001732A1 CH 8800139 W CH8800139 W CH 8800139W WO 8901732 A1 WO8901732 A1 WO 8901732A1
Authority
WO
WIPO (PCT)
Prior art keywords
arm
spring
receiving
bond
bearing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CH1988/000139
Other languages
German (de)
English (en)
Inventor
Franz Jutrzenka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASEM GmbH
Original Assignee
ASEM GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASEM GmbH filed Critical ASEM GmbH
Publication of WO1989001732A1 publication Critical patent/WO1989001732A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • the invention relates to a bearing element for a bond arm, in particular for receiving semiconductor elements, e.g. Chips, by means of a receiving arm from a carrier element and for the transmission thereof to a fastening point on a carrier substrate, the receiving arm being fastened to a transducer holder and being deflectable relative to the latter, a lifting device being provided for raising the receiving arm at its receiving end; it also relates to a bond arm, in particular for using such a bearing element.
  • semiconductor elements e.g. Chips
  • Such bond arms or bond rotors are used in practice in various embodiments. They are primarily used to remove chips from a carrier film and transfer them to a carrier substrate. There they are e.g. glued or soldered. In known bonding arms, axis or bushing arrangements are generally provided for storage. Stepper motors, which can be provided both for controlling the rotational movement of a bond arm and for lifting the pick-up tip of the bond arm, are mostly used for deflection.
  • the various bearing clearances have a disadvantage, both in the drive and in the bearing elements.
  • the relatively high accelerations in mass - a chip is removed from the carrier film in less than one second, positioned and transferred by rotating the bond arm and then lowering the bond arm - lead to high maintenance costs.
  • the speed of most known designs the chip transmission is limited both by the bearing element and by the drive device, in particular the lifting device.
  • the invention has for its object to avoid the disadvantages of the known. According to the invention, this is achieved in particular in that the receiving arm is connected to the holder by at least one spring element with at least two springs crossing at an angle of less than 90 °, and in that the point of intersection of the springs acts approximately as a fulcrum for the receiving arm is provided for lifting movements.
  • a bearing element can be constructed with practically no play, with low weight and practically complete freedom from maintenance being additionally achievable.
  • the spring elements have leaf springs, optimum torsional and bending stability can be achieved transversely to the leaf spring, i.e. reach across the receiving arm and across the direction of rotation. This ensures high acceleration without play and wear.
  • a low pivot point of the bond arm can also be achieved by the spring elements, which is advantageous with regard to various fields of application.
  • the spring elements can also be designed as spring bars.
  • the spring elements can be made of different metallic or non-metallic materials. Spring steel has proven particularly useful for most applications. If the springs on both sides of the "pivot point" are clamped in at least one bearing block each, the bearing element can be designed particularly advantageously as a complete, possibly also interchangeable component.
  • the springs ie, for example, the crossing leaf springs or spring bars, can be fixed in the bearing blocks in a positive or non-positive manner. Screw, soft solder and clamp connections have proven particularly useful. If the bearing element is to be designed to be particularly flat in order to achieve lower pivot points, the crossing springs can advantageously be arranged at an angle of less than 45 ° or even at an angle of 30 ° to one another.
  • the bearing blocks By dividing the bearing blocks into individual sections, it can be achieved that different components of the receiving arm are attached to the same bearing element and that these can be deflected differently if necessary. With regard to optimizing security stability, especially in the case of rapid rotational movements, it is particularly advantageous if the outer bearing blocks are used for holding. of the receiving arm itself are provided.
  • the bending characteristics, in particular the bending stability and the damping property of the bearing element can be improved if the springs are at least partially surrounded by an elastic body, in particular are cast into it. This can e.g. easily realized with rubber or polyurethane materials in a known manner.
  • the lifting device has an eccentric drive
  • the force transmission by means of a shear-resistant and kink-resistant spring in particular a leaf spring
  • a shear-resistant and kink-resistant spring in particular a leaf spring
  • the elasticity of the spring causing the lifting device ie the eccentric drive and thus keeps the drive motor free from external moments.
  • this release of external moments and sudden accelerations ensures exact positioning.
  • the “skipping” or “overturning” of positioning steps is avoided and an increase in drive speed is also possible.
  • a compensating spring element is provided to reduce contact pressures.
  • the compensating spring element can be provided practically at any point of power transmission between the lifting device and the bond arm tip.
  • An arrangement has proven particularly useful in which a pivotally mounted lever arm is provided for the transmission of force and thrust from the lifting device to the receiving arm, on which the lifting device engages on the one hand, and which is non-positively and / or positively connected to the receiving arm on the other hand .
  • the power transmission for generating lifting movements thus runs from the lifting device via the lever arm to the receiving arm. This makes it possible to connect the lever arm to the receiving arm by means of the compensating spring element. Excessive contact pressures are taken over by the compensating spring element which, according to its spring force, has a relative movement of Allows lever arm and receiving arm.
  • the lever arm and the receiving arm are each pivotably mounted on different bearing blocks of the spring element.
  • FIG. 1 shows the schematic arrangement of a bond arm according to the invention with the new bearing element
  • FIG. 2 shows a top view of the arrangement according to FIG. 1,
  • FIG. 3 shows a bearing element according to FIG. 1 on an enlarged scale
  • FIG. 3a shows a side view of the bearing element according to FIG. 3,
  • FIG. 4 ⁇ the side view of a cast-in bearing element
  • FIG. 5 shows the side view of a further modified bearing element with a single leaf spring
  • FIG. 6 shows the schematic representation of a modified exemplary embodiment of a bond arm
  • Figure 7 is a plan view of the bearing element used in Figure 6, and
  • FIG. 8 shows the perspective illustration of a further modified bond arm with the features of the invention.
  • the receiving arm 1 of a schematically illustrated bonding arm 2 is fastened to a bearing holder 5 at its bearing end 3 by a spring element 4.
  • the spring element 4 consists of two bearing blocks 6 and 7, which receive leaf springs 8 in longitudinal slots.
  • the leaf springs 8 are alternately arranged obliquely at an angle oc such that a crossing point 9 results.
  • a lifting device 11 exerts a pull or push on a lever 12, which in turn is rigidly connected to the receiving arm 1.
  • the lifting device 11 is connected to the sensor holder 5 by an axis 16. Each deflection of the lever 12 leads to a pivoting of the receiving arm 1 about the crossing point 9 of the spring element 4.
  • the crossing arrangement of the leaf springs 8 results in each Swiveling the receiving arm 1 in the leaf springs a train, while the leaf springs 8 of the other inclined position are subjected to pressure. This supports the desired effect that at small deflection angles of the receiving arm 1, the crossing point 9 remains practically stationary as the fulcrum for the receiving arm 1. Such small deflection angles of the receiving ear 1 are the rule in the conventional bond arm constructions.
  • a second leaf spring arrangement 13 is provided for power transmission between see the lifting device 11 and the lever 12.
  • the leaf spring 13 is resistant to shear and buckling against shear forces and lateral forces of the lever 12. In contrast, each time the lever arm 12 is deflected to raise the receiving end 10, the spring 13 can bend elastically.
  • a stepping motor serves to extend or retract a push rod 11a of the lifting device 11.
  • other drive devices such as Use hydraulic or electromechanical type.
  • the bracket 5 is attached via an axis 15 to a stationary rotary drive 14.
  • the holder 5 and the holding arm 1 fastened to it by means of the spring element 4 can be rotated and placed, the connection of the holder 5 and the lifting device 11, which is indicated by dashed lines at 16, also rotating the latter.
  • the lifting arm 1 can be raised or lowered by the lifting device 11, so that the rotary movement and the lifting movement can be superimposed to save cycle times.
  • the leaf spring arrangement 13 arranged approximately perpendicular to the plane of the axis 15 is rigid in the direction of rotation. This applies to an increased extent to the leaf springs 8 of the spring element 4, which ensure a play-free and rigid connection.
  • Figure 4 shows a modified embodiment of a spring element 4, in which the crossing springs 8a or 8b are cast in a polyurethane block 17, which is connected both to the springs 8 and to the bearing blocks 6 and 7.
  • the polyurethane block 17 dampens the spring characteristic and also holds the leaf springs 8a and 8b together at the crossing point 9.
  • FIG. 5 shows, instead of the intersecting leaf springs 8, a leaf spring 8c connecting the bearing blocks 6 and 7 in a straight line. Such an arrangement is conceivable if the lifting movement of the receiving arm 1 is extremely small.
  • the same parts are designated with the same reference numerals as in the exemplary embodiment according to FIGS. 1 and 2.
  • the main difference is evidently that the lever 12 is not rigidly connected to the receiving arm 1.
  • the receiving arm 1 is fork-shaped at its bearing end, the lever 12 being provided in the middle space thus created on the arm 1.
  • the bearing block 7 is divided into three sections, the receiving arm 1 being fastened to the sections 7a and the lever 12 to the section 7b. Obviously, lever 12 and receiving arm 1 can thereby be pivoted relative to one another about pivot point 9 of spring element 4.
  • the lever 12 abuts a stop screw 19, on the one hand, with which the relative position of the lever 12 and the receiving arm 1 can be adjusted to one another.
  • the lever 12 is pressed non-positively against the stop screw 19 by a compensating spring element designed as a tension spring 20.
  • the bias of the tension spring 20 is adjustable in a known manner by means of an adjusting screw 20a.
  • the separate pivotability of the lever 12 on the bearing block 7b serves " in connection with the tension spring 20 and the stop screw 19 for a multiple purpose: if in the course of operation when a schematically represented chip 21 is picked up, it is released from a carrier element 22 and is pressed against the receiving end 10 from below in the direction of arrow 23 (FIG. 6), so after overcoming the presettable force of the tension spring 20 it can be lifted and can be pivoted upwards around the bearing blocks 7a.
  • the stop screw 19 is released from the lever 12 so that no pivoting or displacement of the lever 12, the leaf spring arrangement 13 or the lifting device 11 is required.
  • both the rest position of the receiving arm 1 can be easily adjusted by the stop screw 19, the pretensioning force with which the receiving end 10 is held down against the pressing force of the chip 21 separately by means of the adjustment screw 20a and / or the dimensioning the tension spring 20 is adjustable.
  • FIG. 8 shows an embodiment which is somewhat modified in construction compared to FIGS. 6 and 7, in which the same parts are otherwise provided with the same reference numbers.
  • the receiving arm 1 is designed like a fork, so that the lever 12 is arranged in the free intermediate part and fastened to the bearing block 7b can be.
  • the receiving arm 1 itself is attached to the bearing blocks 7a, so that a relative movement to the lever 12 is made possible.
  • the stop screw 19 serves to adjust the rest position of the lever 12 and the receiving arm 1.
  • the tension spring 20 connects the lever 12 and the receiving arm 1 until the compensating spring force is reached. This enables the receiving end 10 to be raised relative to the lever 12 when the chip is received.
  • the receiving end 10 is lowered, the force which can be exerted by the lifting device 11 is limited by the tension spring 20 - the receiving end 10 is stopped when the predetermined contact pressure is reached, while the lever 12 can be deflected further.
  • the drive device for the rotary drive 14 and the lifting device 11 are each indicated schematically by toothed wheels and toothed belt arrangements.
  • the lifting device 11 is designed in a particularly advantageous manner as an eccentric drive 24.
  • a disk 26 is arranged eccentrically on a drive axle 25.
  • the disk 26 is in turn held in a bearing 27, which holds the second leaf spring 13 via a clip 28, which serves for the push-resistant and kink-resistant transmission of stroke deflections to the lever 12.
  • the forced coupling of the receiving arm 1 and the lifting device 11 is achieved without attacking external moments, which is of particular benefit to the fact that it is free of maintenance and wear and prevents the drive motor, particularly a stepping motor, from braking or over-rotating.
  • the spring element guarantees a high degree of rigidity when turning, while at the same time being maintenance and wear-free. As a result, the cycle times of the bond arm can be reduced and, at the same time, the ease of maintenance and the placement accuracy can be drastically increased.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)

Abstract

L'élément de suspension est prévu pour un bras de manutention muni d'un moyen de prise (1) pour des puces électroniques disposées sur un support. Le moyen de prise est suspendu à un dispositif de support (5) au moyen d'au moins un élément élastique (4) et au moyen d'au moins deux ressorts croisés (8) formant entre eux un angle inférieur à 90°. Les élément élastiques (4, 8) sont constitués de preférence en acier à ressort. La transmission de la force de déplacement s'effectue de préférence au moyen d'un second élément élastique (13) en forme de ressort plat.
PCT/CH1988/000139 1987-08-14 1988-08-15 Element de suspension d'un bras de manutention Ceased WO1989001732A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH3146/87-9 1987-08-14
CH314687 1987-08-14

Publications (1)

Publication Number Publication Date
WO1989001732A1 true WO1989001732A1 (fr) 1989-02-23

Family

ID=4249606

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH1988/000139 Ceased WO1989001732A1 (fr) 1987-08-14 1988-08-15 Element de suspension d'un bras de manutention

Country Status (1)

Country Link
WO (1) WO1989001732A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2007186A1 (fr) * 2007-06-19 2008-12-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Dispositif de positionnement de composants, dispositif d'assemblage et procédé de calcul d'une caractéristique choisie d'un dispositif de positionnement
US8651542B2 (en) 2007-06-19 2014-02-18 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Placement device for assembling components in electronic devices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2027984A1 (de) * 1969-06-19 1970-12-23 International Business Machines Corp., Armonk, N.Y. (V.St.A.) Pneumatische Haltevorrichtung für kleine Werkstücke
EP0013979A1 (fr) * 1979-01-25 1980-08-06 Matsushita Electric Industrial Co., Ltd. Appareil pour monter des parties électroniques

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2027984A1 (de) * 1969-06-19 1970-12-23 International Business Machines Corp., Armonk, N.Y. (V.St.A.) Pneumatische Haltevorrichtung für kleine Werkstücke
EP0013979A1 (fr) * 1979-01-25 1980-08-06 Matsushita Electric Industrial Co., Ltd. Appareil pour monter des parties électroniques

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2007186A1 (fr) * 2007-06-19 2008-12-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Dispositif de positionnement de composants, dispositif d'assemblage et procédé de calcul d'une caractéristique choisie d'un dispositif de positionnement
US8651542B2 (en) 2007-06-19 2014-02-18 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Placement device for assembling components in electronic devices

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