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WO1987007196A3 - Aplanisseur de soudure - Google Patents

Aplanisseur de soudure Download PDF

Info

Publication number
WO1987007196A3
WO1987007196A3 PCT/GB1987/000367 GB8700367W WO8707196A3 WO 1987007196 A3 WO1987007196 A3 WO 1987007196A3 GB 8700367 W GB8700367 W GB 8700367W WO 8707196 A3 WO8707196 A3 WO 8707196A3
Authority
WO
WIPO (PCT)
Prior art keywords
rollers
bath
bearings
beams
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/GB1987/000367
Other languages
English (en)
Other versions
WO1987007196A2 (fr
Inventor
Peter Philip Andrew Lymn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP62503353A priority Critical patent/JPH0810787B2/ja
Publication of WO1987007196A2 publication Critical patent/WO1987007196A2/fr
Publication of WO1987007196A3 publication Critical patent/WO1987007196A3/fr
Priority to GB8826389A priority patent/GB2209493B/en
Anticipated expiration legal-status Critical
Priority to SG528/90A priority patent/SG52890G/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Coating With Molten Metal (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Un aplanisseur de soudure comprend un bain (1) de soudure en fusion (53), des couteaux pneumatiques (5) à une extrémité aval du bain (1), trois paires de rouleaux (10u, 101; 11u, 111; 12u, 121) de préhension des cartes de circuit agencés en travers du bain (1) pour définir une partie (60) incurvée de trajet de la carte de circuit au-dessous d'une surface libre (54) de la soudure (53) dans le bain (1), deux traverses (8, 15) dont l'une s'étend le long d'un côté du bain (1) et l'autre le long de l'autre côté pour supporter les rouleaux (10, 11, 12), des paliers inférieurs (131) fixés aux traverses (8, 15) pour tourillonner les rouleaux inférieurs (101, 111, 121), des paliers supérieurs (13u) pouvant monter et descendre sur les traverses (8, 15) pour tourillonner les paliers supérieurs (10u, 11u, 12u), des ressorts (28) agissant sur les paliers supérieurs (13u) pour solliciter les rouleaux supérieurs (10u, 11u, 12u) de manière à les amener en contact de préhension de carte de circuit avec les rouleaux inférieurs (101, 111, 121), des liaisons (21) pour relier les rouleaux supérieurs (10u, 12u) d'amont et d'aval au palier supérieur central (11u) qui est retenu contre le mouvement dans le sens longitudinal du bain (1), un moteur d'entraînement (44) pour entraîner en rotation le palier supérieur central (11u), et des pignons (42) et des chaînes (43) pour entraîner les rouleaux supérieurs (10u, 12u) d'amont et d'aval en rotation à partir du rouleau supérieur central (11u).
PCT/GB1987/000367 1986-05-29 1987-05-27 Aplanisseur de soudure Ceased WO1987007196A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP62503353A JPH0810787B2 (ja) 1986-05-29 1987-05-27 半田付け装置
GB8826389A GB2209493B (en) 1986-05-29 1988-11-11 Solder leveller
SG528/90A SG52890G (en) 1986-05-29 1990-07-05 Solder leveller

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB868613105A GB8613105D0 (en) 1986-05-29 1986-05-29 Solder leveller
GB8613105 1986-05-29

Publications (2)

Publication Number Publication Date
WO1987007196A2 WO1987007196A2 (fr) 1987-12-03
WO1987007196A3 true WO1987007196A3 (fr) 1988-02-11

Family

ID=10598645

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1987/000367 Ceased WO1987007196A2 (fr) 1986-05-29 1987-05-27 Aplanisseur de soudure

Country Status (8)

Country Link
US (1) US4928869A (fr)
EP (1) EP0307407B1 (fr)
JP (1) JPH0810787B2 (fr)
DE (1) DE3787021T2 (fr)
GB (2) GB8613105D0 (fr)
HK (1) HK101690A (fr)
SG (1) SG52890G (fr)
WO (1) WO1987007196A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8924870D0 (en) * 1989-11-03 1989-12-20 Lymn Peter P A Solder leveller
GB9109899D0 (en) * 1991-05-08 1991-07-03 Lymn Peter P A Solder leveller
US5876499A (en) * 1991-05-08 1999-03-02 Lymn; Peter P. Solder spray leveller
JP3410639B2 (ja) * 1997-07-23 2003-05-26 株式会社日立製作所 ペースト充填方法及びはんだ付け方法及びペースト印刷機
US20060186183A1 (en) * 2005-02-18 2006-08-24 Speedline Technologies, Inc. Wave solder nozzle

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4099194A (en) * 1975-10-20 1978-07-04 Durst Ag. Fabrik Fototechnischer Apparate Device for the wet processing of photosensitive materials
GB2063925A (en) * 1979-11-13 1981-06-10 Gyrex Corp Solder coating printed circuit boards
US4563974A (en) * 1983-09-16 1986-01-14 Monitrol, Inc. Apparatus for the application of solder to workpieces
US4608941A (en) * 1985-01-10 1986-09-02 Teledyne Electro-Mechanisms Apparatus for soldering printed circuit panels

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618841A (en) * 1982-08-12 1986-10-21 Siemens Aktiengesellschaft Electronic component functioning with reflected acoustic waves

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4099194A (en) * 1975-10-20 1978-07-04 Durst Ag. Fabrik Fototechnischer Apparate Device for the wet processing of photosensitive materials
GB2063925A (en) * 1979-11-13 1981-06-10 Gyrex Corp Solder coating printed circuit boards
US4563974A (en) * 1983-09-16 1986-01-14 Monitrol, Inc. Apparatus for the application of solder to workpieces
US4608941A (en) * 1985-01-10 1986-09-02 Teledyne Electro-Mechanisms Apparatus for soldering printed circuit panels

Also Published As

Publication number Publication date
GB2209493B (en) 1990-05-02
DE3787021D1 (de) 1993-09-16
HK101690A (en) 1990-12-14
GB8613105D0 (en) 1986-07-02
JPH0810787B2 (ja) 1996-01-31
DE3787021T2 (de) 1994-01-05
SG52890G (en) 1990-10-26
GB2209493A (en) 1989-05-17
EP0307407B1 (fr) 1993-08-11
US4928869A (en) 1990-05-29
WO1987007196A2 (fr) 1987-12-03
JPH01500337A (ja) 1989-02-09
EP0307407A1 (fr) 1989-03-22

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