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UST988002I4 - Apparatus for forming a vacuum evaporating layer on a substrate - Google Patents

Apparatus for forming a vacuum evaporating layer on a substrate Download PDF

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Publication number
UST988002I4
UST988002I4 US05/931,441 US93144178A UST988002I4 US T988002 I4 UST988002 I4 US T988002I4 US 93144178 A US93144178 A US 93144178A US T988002 I4 UST988002 I4 US T988002I4
Authority
US
United States
Prior art keywords
source material
evaporator element
substrate
supply receptacle
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
US05/931,441
Inventor
Kazuo Ohta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Minolta Co Ltd
Original Assignee
Minolta Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minolta Co Ltd filed Critical Minolta Co Ltd
Priority to US05/931,441 priority Critical patent/UST988002I4/en
Application granted granted Critical
Publication of UST988002I4 publication Critical patent/UST988002I4/en
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

An evaporator element is positioned within a hermetic enclosure having therein a desired atmosphere. A supply receptacle containing a source material is located at a position higher than the evaporator element. A source material heater is positioned adjacent the supply receptacle for melting the source material. A duct is inclined from the supply receptacle to the evaporator element to substantially continuously supply molten source material from the supply receptacle to the evaporator element. An evaporation heater adjacent the evaporator element substantially momentarily evaporates the molten source material as it is supplied to the evaporator element, without any substantial accumulation of the molten source material in the evaporator element. A substrate is positioned so as to have deposited thereon a layer of source material evaporated from the evaporator element.
US05/931,441 1977-08-03 1978-08-07 Apparatus for forming a vacuum evaporating layer on a substrate Pending UST988002I4 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US05/931,441 UST988002I4 (en) 1977-08-03 1978-08-07 Apparatus for forming a vacuum evaporating layer on a substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82192977A 1977-08-03 1977-08-03
US05/931,441 UST988002I4 (en) 1977-08-03 1978-08-07 Apparatus for forming a vacuum evaporating layer on a substrate

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US82192977A Continuation-In-Part 1977-08-03 1977-08-03

Publications (1)

Publication Number Publication Date
UST988002I4 true UST988002I4 (en) 1979-11-06

Family

ID=27124604

Family Applications (1)

Application Number Title Priority Date Filing Date
US05/931,441 Pending UST988002I4 (en) 1977-08-03 1978-08-07 Apparatus for forming a vacuum evaporating layer on a substrate

Country Status (1)

Country Link
US (1) UST988002I4 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130186339A1 (en) * 2010-12-27 2013-07-25 Posco Dry Coating Apparatus
US20130276706A1 (en) * 2012-04-23 2013-10-24 Samsung Sdi Co., Ltd. Deposition apparatus
EP2937442A4 (en) * 2012-12-21 2016-01-20 Posco HEATING APPARATUS AND COATING DEVICE COMPRISING SAME
US20220349044A1 (en) * 2020-04-09 2022-11-03 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Device for vapor depositing metal
US12435414B1 (en) * 2021-03-15 2025-10-07 Heliosourcetech, Llc Remote reactant reservoirs for codeposition with variable melt area evaporant flux control

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130186339A1 (en) * 2010-12-27 2013-07-25 Posco Dry Coating Apparatus
US9732423B2 (en) * 2010-12-27 2017-08-15 Posco Dry coating apparatus
US20130276706A1 (en) * 2012-04-23 2013-10-24 Samsung Sdi Co., Ltd. Deposition apparatus
EP2937442A4 (en) * 2012-12-21 2016-01-20 Posco HEATING APPARATUS AND COATING DEVICE COMPRISING SAME
US10196736B2 (en) 2012-12-21 2019-02-05 Posco Heating apparatus, and coating device comprising same
US20220349044A1 (en) * 2020-04-09 2022-11-03 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Device for vapor depositing metal
US12435414B1 (en) * 2021-03-15 2025-10-07 Heliosourcetech, Llc Remote reactant reservoirs for codeposition with variable melt area evaporant flux control

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