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USRE33956F1 - Inspection system for array of microcircuit dies having redundant circuit patterns - Google Patents

Inspection system for array of microcircuit dies having redundant circuit patterns Download PDF

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Publication number
USRE33956F1
USRE33956F1 US61320890A USRE33956F1 US RE33956 F1 USRE33956 F1 US RE33956F1 US 61320890 A US61320890 A US 61320890A US RE33956 F1 USRE33956 F1 US RE33956F1
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United States
Prior art keywords
array
inspection system
circuit patterns
redundant circuit
microcircuit dies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
Inventor
Lawrence H Lin
Daniel L Cavan
Robert B Howe
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Applied Materials Inc
Original Assignee
Insystems Inc
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Filing date
Publication date
Priority claimed from US07/060,090 external-priority patent/US4806774A/en
Application filed by Insystems Inc filed Critical Insystems Inc
Priority to US07613208 priority Critical patent/USRE33956F1/en
Application granted granted Critical
Publication of USRE33956E publication Critical patent/USRE33956E/en
Publication of USRE33956F1 publication Critical patent/USRE33956F1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OPTICAL SPECIALTIES, INC.
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ORBOT INSTRUMENTS, LIMITED
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ORBOT INSTRUMENTS, LIMITED
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT, PREVIOUSLY RECORDED AT REEL 10871 FRAME 0492. Assignors: ORBOT INSTRUMENTS, LIMITED
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95623—Inspecting patterns on the surface of objects using a spatial filtering method

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
US07613208 1987-06-08 1990-11-14 Inspection system for array of microcircuit dies having redundant circuit patterns Expired - Lifetime USRE33956F1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US07613208 USRE33956F1 (en) 1987-06-08 1990-11-14 Inspection system for array of microcircuit dies having redundant circuit patterns

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/060,090 US4806774A (en) 1987-06-08 1987-06-08 Inspection system for array of microcircuit dies having redundant circuit patterns
US07613208 USRE33956F1 (en) 1987-06-08 1990-11-14 Inspection system for array of microcircuit dies having redundant circuit patterns

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US07/060,090 Reissue US4806774A (en) 1987-06-08 1987-06-08 Inspection system for array of microcircuit dies having redundant circuit patterns

Publications (2)

Publication Number Publication Date
USRE33956E USRE33956E (en) 1992-06-09
USRE33956F1 true USRE33956F1 (en) 1994-06-07

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ID=26739549

Family Applications (1)

Application Number Title Priority Date Filing Date
US07613208 Expired - Lifetime USRE33956F1 (en) 1987-06-08 1990-11-14 Inspection system for array of microcircuit dies having redundant circuit patterns

Country Status (1)

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US (1) USRE33956F1 (en)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995009358A1 (en) * 1993-09-30 1995-04-06 Optical Specialties, Inc. Inspection system with in-lens, off-axis illuminator
US5442189A (en) * 1992-09-24 1995-08-15 Nikon Corporation Apparatus for inspecting defects and foreign substances having a spot illuminated focusing system
US5798831A (en) * 1991-12-19 1998-08-25 Nikon Corporation Defect inspecting apparatus and defect inspecting method
WO1998054612A1 (en) * 1997-05-29 1998-12-03 Optical Specialties, Inc. High speed, high detection sensitivity inspection of repetitive and random specimen patterns
US6175646B1 (en) 1997-09-04 2001-01-16 Texas Instruments Incorporated Apparatus for detecting defective integrated circuit dies in wafer form
US6366352B1 (en) 1999-06-10 2002-04-02 Applied Materials, Inc. Optical inspection method and apparatus utilizing a variable angle design
US6406641B1 (en) 1997-06-17 2002-06-18 Luxtron Corporation Liquid etch endpoint detection and process metrology
US6618134B2 (en) 1997-09-19 2003-09-09 Kla-Tencor Corporation Sample inspection system
US20040042002A1 (en) * 2002-08-30 2004-03-04 Kla-Tencor Technologies Corporation Optical compensation in high numerical aperture photomask inspection systems for inspecting photomasks through thick pellicles
US6720989B2 (en) * 2000-04-19 2004-04-13 K-G Devices Corp. System and method for automatically inspecting an array of periodic elements
US20040105093A1 (en) * 2002-11-29 2004-06-03 Akira Hamamatsu Inspection method and inspection apparatus
US20040263834A1 (en) * 1990-11-16 2004-12-30 Applied Materials, Inc. Optical inspection apparatus for substrate defect detection
US6867406B1 (en) 1999-03-23 2005-03-15 Kla-Tencor Corporation Confocal wafer inspection method and apparatus using fly lens arrangement
US20050099621A1 (en) * 1997-09-19 2005-05-12 Mehdi Vaez-Iravani Sample inspection system
US20050134841A1 (en) * 1998-09-18 2005-06-23 Mehdi Vacz-Iravani Sample inspection system
US20060007435A1 (en) * 1997-09-19 2006-01-12 Steve Biellak Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination
US20070103676A1 (en) * 1994-03-24 2007-05-10 Kla-Tencor Corporation Process and Assembly for Non-Destructive Surface Inspections
US7738090B1 (en) 2007-05-29 2010-06-15 Kla-Tencor Corporation Fourier filters, systems for fabricating fourier filters, and systems and methods for inspecting a specimen using fourier filters
WO2012006221A1 (en) * 2010-07-03 2012-01-12 Rudolph Technologies, Inc. Scratch detection method and apparatus
US11144778B2 (en) * 2012-08-29 2021-10-12 Micron Technology, Inc. Descriptor guided fast marching method for analyzing images and systems using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614232A (en) * 1968-11-25 1971-10-19 Ibm Pattern defect sensing using error free blocking spacial filter
US4000949A (en) * 1969-09-15 1977-01-04 Western Electric Company, Inc. Photomask inspection by optical spatial filtering
JPS55124117A (en) * 1979-03-19 1980-09-25 Toshiba Corp Pattern inspecting apparatus
US4253564A (en) * 1979-05-21 1981-03-03 Federal Paper Board Co., Inc. Bottle carrier
US4282510A (en) * 1980-01-07 1981-08-04 Rca Corporation Apparatus for discerning the noticeable presence of spatial fluctuations of intensity within a two-dimensional visual field
US4370024A (en) * 1980-05-06 1983-01-25 The United States Of America As Represented By The Secretary Of The Air Force Dynamic binary fourier filtered imaging system
DE3689279T2 (en) * 1985-09-12 1994-05-19 Insystems Inc Method and device for detecting error information in a holographic image pattern.

Cited By (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040263834A1 (en) * 1990-11-16 2004-12-30 Applied Materials, Inc. Optical inspection apparatus for substrate defect detection
US5798831A (en) * 1991-12-19 1998-08-25 Nikon Corporation Defect inspecting apparatus and defect inspecting method
US5442189A (en) * 1992-09-24 1995-08-15 Nikon Corporation Apparatus for inspecting defects and foreign substances having a spot illuminated focusing system
US5428442A (en) * 1993-09-30 1995-06-27 Optical Specialties, Inc. Inspection system with in-lens, off-axis illuminator
WO1995009358A1 (en) * 1993-09-30 1995-04-06 Optical Specialties, Inc. Inspection system with in-lens, off-axis illuminator
US20070103676A1 (en) * 1994-03-24 2007-05-10 Kla-Tencor Corporation Process and Assembly for Non-Destructive Surface Inspections
US7477371B2 (en) 1994-03-24 2009-01-13 Kla-Tencor Corporation Process and assembly for non-destructive surface inspections
WO1998054612A1 (en) * 1997-05-29 1998-12-03 Optical Specialties, Inc. High speed, high detection sensitivity inspection of repetitive and random specimen patterns
US5854674A (en) * 1997-05-29 1998-12-29 Optical Specialties, Inc. Method of high speed, high detection sensitivity inspection of repetitive and random specimen patterns
US6406641B1 (en) 1997-06-17 2002-06-18 Luxtron Corporation Liquid etch endpoint detection and process metrology
US6175646B1 (en) 1997-09-04 2001-01-16 Texas Instruments Incorporated Apparatus for detecting defective integrated circuit dies in wafer form
US6618134B2 (en) 1997-09-19 2003-09-09 Kla-Tencor Corporation Sample inspection system
US6657715B2 (en) * 1997-09-19 2003-12-02 Kla-Tencor Corporation Sample inspection system
US7218392B2 (en) 1997-09-19 2007-05-15 Kla-Tencor Technologies Corporation Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination
US6639662B2 (en) 1997-09-19 2003-10-28 Kla-Tencor Corporation Sample inspection system
US7119897B2 (en) 1997-09-19 2006-10-10 Kla-Tencor Technologies Corporation Sample inspection system
US7079238B2 (en) 1997-09-19 2006-07-18 Kla-Tencor Technologies Corporation Sample inspection system
US20050174568A1 (en) * 1997-09-19 2005-08-11 Mehdi Vaez-Iravani Sample inspection system
US7064821B2 (en) 1997-09-19 2006-06-20 Kla-Tencor Technologies Corporation Sample inspection system
US20060007435A1 (en) * 1997-09-19 2006-01-12 Steve Biellak Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination
US6891611B1 (en) 1997-09-19 2005-05-10 Kla- Tencor Corporation Sample inspection system
US20050099621A1 (en) * 1997-09-19 2005-05-12 Mehdi Vaez-Iravani Sample inspection system
US20050134841A1 (en) * 1998-09-18 2005-06-23 Mehdi Vacz-Iravani Sample inspection system
US7399950B2 (en) 1999-03-23 2008-07-15 Kla-Tencor Corporation Confocal wafer inspection method and apparatus using fly lens arrangement
US20070007429A1 (en) * 1999-03-23 2007-01-11 Kla-Tencor Corporation Confocal wafer inspection method and apparatus using fly lens arrangement
US7858911B2 (en) 1999-03-23 2010-12-28 Kla-Tencor Corporation Confocal wafer inspection system and method
US20080273196A1 (en) * 1999-03-23 2008-11-06 Kla-Tencor Corporation Confocal wafer inspection system and method
US6867406B1 (en) 1999-03-23 2005-03-15 Kla-Tencor Corporation Confocal wafer inspection method and apparatus using fly lens arrangement
US20050156098A1 (en) * 1999-03-23 2005-07-21 Fairley Christopher R. Confocal wafer inspection method and apparatus
US7109458B2 (en) 1999-03-23 2006-09-19 Kla-Tencor Corporation Confocal wafer depth scanning inspection method
US6469784B2 (en) 1999-06-10 2002-10-22 Applied Materials, Inc. Optical inspection method and apparatus utilizing a variable angle design
US6366352B1 (en) 1999-06-10 2002-04-02 Applied Materials, Inc. Optical inspection method and apparatus utilizing a variable angle design
US6720989B2 (en) * 2000-04-19 2004-04-13 K-G Devices Corp. System and method for automatically inspecting an array of periodic elements
WO2004021049A3 (en) * 2002-08-30 2005-03-31 Kla Tencor Tech Corp Optical compensation in high numerical aperture photomask inspection systems for inspecting photomasks through thick pellicles
US6952256B2 (en) * 2002-08-30 2005-10-04 Kla-Tencor Technologies Corporation Optical compensation in high numerical aperture photomask inspection systems for inspecting photomasks through thick pellicles
US20040042002A1 (en) * 2002-08-30 2004-03-04 Kla-Tencor Technologies Corporation Optical compensation in high numerical aperture photomask inspection systems for inspecting photomasks through thick pellicles
US20070247616A1 (en) * 2002-11-29 2007-10-25 Akira Hamamatsu Method for inspecting defect and apparatus for inspecting defect
US8269959B2 (en) 2002-11-29 2012-09-18 Hitachi High-Technologies Corporation Inspection method and inspection apparatus
US20040160599A1 (en) * 2002-11-29 2004-08-19 Akira Hamamatsu Method for inspecting defect and apparatus for inspecting defect
US20040105093A1 (en) * 2002-11-29 2004-06-03 Akira Hamamatsu Inspection method and inspection apparatus
US7248352B2 (en) * 2002-11-29 2007-07-24 Hitachi High-Technologies Corporation Method for inspecting defect and apparatus for inspecting defect
US7586593B2 (en) 2002-11-29 2009-09-08 Hitachi High-Tech Electronics Engineering Co., Ltd. Inspection method and inspection apparatus
US7586594B2 (en) 2002-11-29 2009-09-08 Hitachi High-Technologies Corporation Method for inspecting defect and apparatus for inspecting defect
US20090323054A1 (en) * 2002-11-29 2009-12-31 Akira Hamamatsu Method for inspecting defect and apparatus for inspecting defect
US20100002227A1 (en) * 2002-11-29 2010-01-07 Akira Hamamatsu Inspection method and inspection apparatus
US7315363B2 (en) * 2002-11-29 2008-01-01 Hitachi High-Technologies Corporation Inspection method and inspection apparatus
US20070070339A1 (en) * 2002-11-29 2007-03-29 Akira Hamamatsu Inspection method and inspection apparatus
US7903244B2 (en) 2002-11-29 2011-03-08 Hitachi High-Technologies Corporation Method for inspecting defect and apparatus for inspecting defect
US8094295B2 (en) 2002-11-29 2012-01-10 Hitachi High-Technologies Corporation Inspection method and inspection apparatus
US7738090B1 (en) 2007-05-29 2010-06-15 Kla-Tencor Corporation Fourier filters, systems for fabricating fourier filters, and systems and methods for inspecting a specimen using fourier filters
WO2012006221A1 (en) * 2010-07-03 2012-01-12 Rudolph Technologies, Inc. Scratch detection method and apparatus
US9406115B2 (en) 2010-07-03 2016-08-02 Rudolph Technologies, Inc. Scratch detection method and apparatus
US11144778B2 (en) * 2012-08-29 2021-10-12 Micron Technology, Inc. Descriptor guided fast marching method for analyzing images and systems using the same

Also Published As

Publication number Publication date
USRE33956E (en) 1992-06-09

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Legal Events

Date Code Title Description
FPAY Fee payment

Year of fee payment: 4

RR Request for reexamination filed

Effective date: 19930830

B1 Reexamination certificate first reexamination
FPAY Fee payment

Year of fee payment: 8

AS Assignment

Owner name: APPLIED MATERIALS, INC., CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:OPTICAL SPECIALTIES, INC.;REEL/FRAME:010024/0498

Effective date: 19990608

AS Assignment

Owner name: APPLIED MATERIALS, INC., CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ORBOT INSTRUMENTS, LIMITED;REEL/FRAME:010871/0492

Effective date: 20000512

AS Assignment

Owner name: APPLIED MATERIALS, INC., CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ORBOT INSTRUMENTS, LIMITED;REEL/FRAME:010927/0157

Effective date: 20000512

AS Assignment

Owner name: APPLIED MATERIALS, INC., CALIFORNIA

Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT, PREVIOUSLY RECORDED AT REEL 10871 FRAME 0492;ASSIGNOR:ORBOT INSTRUMENTS, LIMITED;REEL/FRAME:012036/0461

Effective date: 20000512