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USD911986S1 - Handheld semiconductor wafer handling tool - Google Patents

Handheld semiconductor wafer handling tool Download PDF

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Publication number
USD911986S1
USD911986S1 US29/690,034 US201929690034F USD911986S US D911986 S1 USD911986 S1 US D911986S1 US 201929690034 F US201929690034 F US 201929690034F US D911986 S USD911986 S US D911986S
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US
United States
Prior art keywords
semiconductor wafer
handling tool
wafer handling
handheld
handheld semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/690,034
Inventor
Heather D. Leifeste
Ron C. Stevens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to US29/690,034 priority Critical patent/USD911986S1/en
Assigned to RAYTHEON COMPANY reassignment RAYTHEON COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: STEVENS, RON C., LEIFESTE, HEATHER D.
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Publication of USD911986S1 publication Critical patent/USD911986S1/en
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Description

FIG. 1 is a top front perspective view of a handheld semiconductor wafer handling tool with a movable clip in a first position;
FIG. 2 is a front end view of the handheld semiconductor wafer handling tool of FIG. 1;
FIG. 3 is a back end view of the handheld semiconductor wafer handling tool of FIG. 1;
FIG. 4 is a right side view of the handheld semiconductor wafer handling tool of FIG. 1;
FIG. 5 is a left side view of the handheld semiconductor wafer handling tool of FIG. 1;
FIG. 6 is a top view of the handheld semiconductor wafer handling tool of FIG. 1;
FIG. 7 is a bottom view of the handheld semiconductor wafer handling tool of FIG. 1;
FIG. 8 is a bottom rear perspective view of the handheld semiconductor wafer handling tool of FIG. 1;
FIG. 9 is a top front perspective view of the handheld semiconductor wafer handling tool of FIG. 1 with the movable clip in a second position; and,
FIG. 10 is a perspective view of the handheld semiconductor wafer handling tool of FIG. 1 with a semiconductor wafer.
The broken line portions of the semiconductor wafer handling tool in FIGS. 1 through 10 are not considered part of the claimed design. Additional broken lines in FIG. 10 are provided for purposes of environment and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a handheld semiconductor wafer handling tool, as shown and described.
US29/690,034 2019-05-03 2019-05-03 Handheld semiconductor wafer handling tool Active USD911986S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/690,034 USD911986S1 (en) 2019-05-03 2019-05-03 Handheld semiconductor wafer handling tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/690,034 USD911986S1 (en) 2019-05-03 2019-05-03 Handheld semiconductor wafer handling tool

Publications (1)

Publication Number Publication Date
USD911986S1 true USD911986S1 (en) 2021-03-02

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Family Applications (1)

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US29/690,034 Active USD911986S1 (en) 2019-05-03 2019-05-03 Handheld semiconductor wafer handling tool

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US (1) USD911986S1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus
USD997892S1 (en) * 2019-11-28 2023-09-05 Kokusai Electric Corporation End effector for handling wafers
USD1023984S1 (en) * 2022-02-03 2024-04-23 Omron Corporation Gripper for wafer cassette
USD1035599S1 (en) * 2022-02-03 2024-07-16 Omron Corporation Gripper for wafer cassette
USD1036399S1 (en) * 2023-06-22 2024-07-23 Omron Corporation Gripper for wafer cassette
USD1046798S1 (en) * 2020-12-17 2024-10-15 Omron Corporation Gripper for semiconductor wafer housing cassette
USD1077046S1 (en) * 2022-12-01 2025-05-27 Koninklijke Philips N.V. Handle for nanoimprinting machine

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410209A (en) * 1982-03-11 1983-10-18 Trapani Silvio P Wafer-handling tool
US4417757A (en) * 1981-11-09 1983-11-29 Morrison Thomas R Recording disc handling device
US4639028A (en) * 1984-11-13 1987-01-27 Economic Development Corporation High temperature and acid resistant wafer pick up device
US5004399A (en) * 1987-09-04 1991-04-02 Texas Instruments Incorporated Robot slice aligning end effector
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
USD398207S (en) * 1997-06-13 1998-09-15 Nippon Light Metal Company Ltd. Disc holding tool
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
US6615113B2 (en) * 2001-07-13 2003-09-02 Tru-Si Technologies, Inc. Articles holders with sensors detecting a type of article held by the holder
US20030234548A1 (en) * 2002-06-24 2003-12-25 Ravinder Aggarwal Wafer handler
US6678581B2 (en) * 2002-01-14 2004-01-13 Taiwan Semiconductor Manufacturing Co. Ltd Method of calibrating a wafer edge gripping end effector
US20070216179A1 (en) * 2004-01-23 2007-09-20 Kawasaki Jukogyo Kabushiki Kaisha Substrate Holding Device
US8336199B2 (en) * 2010-03-19 2012-12-25 International Business Machines Corporation Tool for installation and removal of semiconductor device
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
US9349643B2 (en) * 2013-04-01 2016-05-24 Brewer Science Inc. Apparatus and method for thin wafer transfer
US10109515B2 (en) * 2016-03-31 2018-10-23 Hirata Corporation Hand unit and transfer method

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417757A (en) * 1981-11-09 1983-11-29 Morrison Thomas R Recording disc handling device
US4410209A (en) * 1982-03-11 1983-10-18 Trapani Silvio P Wafer-handling tool
US4639028A (en) * 1984-11-13 1987-01-27 Economic Development Corporation High temperature and acid resistant wafer pick up device
US5004399A (en) * 1987-09-04 1991-04-02 Texas Instruments Incorporated Robot slice aligning end effector
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
USD398207S (en) * 1997-06-13 1998-09-15 Nippon Light Metal Company Ltd. Disc holding tool
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
US6615113B2 (en) * 2001-07-13 2003-09-02 Tru-Si Technologies, Inc. Articles holders with sensors detecting a type of article held by the holder
US6678581B2 (en) * 2002-01-14 2004-01-13 Taiwan Semiconductor Manufacturing Co. Ltd Method of calibrating a wafer edge gripping end effector
US20030234548A1 (en) * 2002-06-24 2003-12-25 Ravinder Aggarwal Wafer handler
US20070216179A1 (en) * 2004-01-23 2007-09-20 Kawasaki Jukogyo Kabushiki Kaisha Substrate Holding Device
US8336199B2 (en) * 2010-03-19 2012-12-25 International Business Machines Corporation Tool for installation and removal of semiconductor device
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
US9349643B2 (en) * 2013-04-01 2016-05-24 Brewer Science Inc. Apparatus and method for thin wafer transfer
US10109515B2 (en) * 2016-03-31 2018-10-23 Hirata Corporation Hand unit and transfer method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Entegris, Inc., "Specialized Handling Products", 2013, 40 pages (see esp. p. 33).
H-Square Corp., "Antistatic Tabletop SGI Freedom Wand TM", 2018, 1 page.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus
USD997892S1 (en) * 2019-11-28 2023-09-05 Kokusai Electric Corporation End effector for handling wafers
USD1046798S1 (en) * 2020-12-17 2024-10-15 Omron Corporation Gripper for semiconductor wafer housing cassette
USD1023984S1 (en) * 2022-02-03 2024-04-23 Omron Corporation Gripper for wafer cassette
USD1035599S1 (en) * 2022-02-03 2024-07-16 Omron Corporation Gripper for wafer cassette
USD1077046S1 (en) * 2022-12-01 2025-05-27 Koninklijke Philips N.V. Handle for nanoimprinting machine
USD1036399S1 (en) * 2023-06-22 2024-07-23 Omron Corporation Gripper for wafer cassette

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