USD976852S1 - Power module - Google Patents
Power module Download PDFInfo
- Publication number
- USD976852S1 USD976852S1 US29/738,677 US202029738677F USD976852S US D976852 S1 USD976852 S1 US D976852S1 US 202029738677 F US202029738677 F US 202029738677F US D976852 S USD976852 S US D976852S
- Authority
- US
- United States
- Prior art keywords
- power module
- view
- ornamental design
- design
- side perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines in the figures illustrate the portions of the design that form no part of the claimed design.
Claims (1)
- The ornamental design for a power module, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109302243F TWD206651S (en) | 2020-04-24 | 2020-04-24 | Power module |
| TW109302243 | 2020-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD976852S1 true USD976852S1 (en) | 2023-01-31 |
Family
ID=85025004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/738,677 Active USD976852S1 (en) | 2020-04-24 | 2020-06-18 | Power module |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD976852S1 (en) |
| TW (1) | TWD206651S (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1034492S1 (en) * | 2021-10-04 | 2024-07-09 | Transportation Ip Holdings, Llc | Housing for a full phase module gate drive |
| USD1037163S1 (en) * | 2021-11-17 | 2024-07-30 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD1039243S1 (en) * | 2021-10-08 | 2024-08-20 | Mahdi Al-Husseini | Mortarboard with electronic tube display |
| USD1078668S1 (en) * | 2023-05-22 | 2025-06-10 | Semikron Danfoss International GmbH | Semiconductor power module for vehicles |
| USD1090465S1 (en) * | 2024-03-05 | 2025-08-26 | Industrial Technology Research Institute | Power module housing |
| USD1099055S1 (en) * | 2023-08-31 | 2025-10-21 | Xpt Eds (Hefei) Co., Ltd. | Power semiconductor module |
Citations (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD466076S1 (en) | 2001-06-18 | 2002-11-26 | Kabushiki Kaisha Toshiba | Power converter |
| US6636429B2 (en) * | 2000-09-20 | 2003-10-21 | Ballard Power Systems Corporation | EMI reduction in power modules through the use of integrated capacitors on the substrate level |
| USD503149S1 (en) * | 2003-05-19 | 2005-03-22 | Kabushiki Kaisha Toshiba | Power converter |
| US20060071238A1 (en) | 2004-09-23 | 2006-04-06 | Alberto Guerra | Power module |
| USD556686S1 (en) * | 2006-04-27 | 2007-12-04 | Hitachi, Ltd. | Power module for power inverter |
| USD587662S1 (en) * | 2007-12-20 | 2009-03-03 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
| USD653633S1 (en) * | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
| USD653634S1 (en) * | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
| US20130049201A1 (en) * | 2011-08-31 | 2013-02-28 | Hitachi, Ltd. | Power Module and Manufacturing Method Thereof |
| USD686174S1 (en) * | 2011-08-12 | 2013-07-16 | Fuji Electric Co., Ltd | Semiconductor device |
| USD689446S1 (en) * | 2010-10-28 | 2013-09-10 | Fuji Electric Co., Ltd. | Semiconductor |
| US9001518B2 (en) | 2011-04-26 | 2015-04-07 | International Rectifier Corporation | Power module with press-fit clamps |
| US20150201532A1 (en) * | 2012-10-29 | 2015-07-16 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD754084S1 (en) * | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
| USD774479S1 (en) * | 2014-11-28 | 2016-12-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD775091S1 (en) * | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
| USD775593S1 (en) * | 2014-08-19 | 2017-01-03 | Infineon Technologies Ag | Power semiconductor module |
| USD776071S1 (en) * | 2014-08-19 | 2017-01-10 | Infineon Technologies Ag | Power semiconductor module |
| US20170213777A1 (en) * | 2015-04-27 | 2017-07-27 | Fuji Electric Co., Ltd. | Semiconductor device |
| US20170372977A1 (en) * | 2016-06-22 | 2017-12-28 | Fuji Electric Co., Ltd. | Semiconductor device and a method of manufacturing the same |
| TWD188003S (en) | 2017-06-14 | 2018-01-21 | 慶良電子股份有限公司 | Parts of electrical connector |
| US20180183161A1 (en) * | 2016-12-28 | 2018-06-28 | Fuji Electric Co., Ltd. | Semiconductor device and semiconductor device manufacturing method |
| US20180182678A1 (en) * | 2016-03-22 | 2018-06-28 | Fuji Electric Co., Ltd. | Case, semiconductor device and manufacturing method of case |
| US10122293B2 (en) | 2012-01-17 | 2018-11-06 | Infineon Technologies Americas Corp. | Power module package having a multi-phase inverter and power factor correction |
| USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
| US20200013703A1 (en) * | 2017-03-14 | 2020-01-09 | Rohm Co., Ltd. | Semiconductor device |
| USD903611S1 (en) * | 2019-03-29 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
| USD903612S1 (en) * | 2019-03-26 | 2020-12-01 | Fuji Electric Co., Ltd. | Semiconductor module |
| US20210134762A1 (en) * | 2017-04-20 | 2021-05-06 | Rohm Co., Ltd. | Semiconductor device |
| US20210175155A1 (en) * | 2019-12-06 | 2021-06-10 | Alpha And Omega Semiconductor (Cayman) Ltd. | Power module having interconnected base plate with molded metal and method of making the same |
| USD942405S1 (en) * | 2019-01-11 | 2022-02-01 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD942404S1 (en) * | 2019-01-11 | 2022-02-01 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD949807S1 (en) * | 2020-03-13 | 2022-04-26 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
-
2020
- 2020-04-24 TW TW109302243F patent/TWD206651S/en unknown
- 2020-06-18 US US29/738,677 patent/USD976852S1/en active Active
Patent Citations (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6636429B2 (en) * | 2000-09-20 | 2003-10-21 | Ballard Power Systems Corporation | EMI reduction in power modules through the use of integrated capacitors on the substrate level |
| USD466076S1 (en) | 2001-06-18 | 2002-11-26 | Kabushiki Kaisha Toshiba | Power converter |
| USD503149S1 (en) * | 2003-05-19 | 2005-03-22 | Kabushiki Kaisha Toshiba | Power converter |
| US20060071238A1 (en) | 2004-09-23 | 2006-04-06 | Alberto Guerra | Power module |
| USD556686S1 (en) * | 2006-04-27 | 2007-12-04 | Hitachi, Ltd. | Power module for power inverter |
| USD587662S1 (en) * | 2007-12-20 | 2009-03-03 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
| USD689446S1 (en) * | 2010-10-28 | 2013-09-10 | Fuji Electric Co., Ltd. | Semiconductor |
| USD653634S1 (en) * | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
| USD653633S1 (en) * | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
| US9001518B2 (en) | 2011-04-26 | 2015-04-07 | International Rectifier Corporation | Power module with press-fit clamps |
| USD686174S1 (en) * | 2011-08-12 | 2013-07-16 | Fuji Electric Co., Ltd | Semiconductor device |
| US20130049201A1 (en) * | 2011-08-31 | 2013-02-28 | Hitachi, Ltd. | Power Module and Manufacturing Method Thereof |
| US10122293B2 (en) | 2012-01-17 | 2018-11-06 | Infineon Technologies Americas Corp. | Power module package having a multi-phase inverter and power factor correction |
| US20150201532A1 (en) * | 2012-10-29 | 2015-07-16 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD754084S1 (en) * | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
| USD775593S1 (en) * | 2014-08-19 | 2017-01-03 | Infineon Technologies Ag | Power semiconductor module |
| USD776071S1 (en) * | 2014-08-19 | 2017-01-10 | Infineon Technologies Ag | Power semiconductor module |
| USD775091S1 (en) * | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
| USD814433S1 (en) * | 2014-11-28 | 2018-04-03 | Fuji Electric Co., Ltd | Semiconductor module |
| USD827593S1 (en) * | 2014-11-28 | 2018-09-04 | Fuji Electric Co., Ltd | Semiconductor module |
| USD774479S1 (en) * | 2014-11-28 | 2016-12-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| US20170213777A1 (en) * | 2015-04-27 | 2017-07-27 | Fuji Electric Co., Ltd. | Semiconductor device |
| US20180182678A1 (en) * | 2016-03-22 | 2018-06-28 | Fuji Electric Co., Ltd. | Case, semiconductor device and manufacturing method of case |
| US20170372977A1 (en) * | 2016-06-22 | 2017-12-28 | Fuji Electric Co., Ltd. | Semiconductor device and a method of manufacturing the same |
| US20180183161A1 (en) * | 2016-12-28 | 2018-06-28 | Fuji Electric Co., Ltd. | Semiconductor device and semiconductor device manufacturing method |
| US20200013703A1 (en) * | 2017-03-14 | 2020-01-09 | Rohm Co., Ltd. | Semiconductor device |
| US20210134762A1 (en) * | 2017-04-20 | 2021-05-06 | Rohm Co., Ltd. | Semiconductor device |
| TWD188003S (en) | 2017-06-14 | 2018-01-21 | 慶良電子股份有限公司 | Parts of electrical connector |
| USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
| USD942405S1 (en) * | 2019-01-11 | 2022-02-01 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD942404S1 (en) * | 2019-01-11 | 2022-02-01 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD903612S1 (en) * | 2019-03-26 | 2020-12-01 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD903611S1 (en) * | 2019-03-29 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
| US20210175155A1 (en) * | 2019-12-06 | 2021-06-10 | Alpha And Omega Semiconductor (Cayman) Ltd. | Power module having interconnected base plate with molded metal and method of making the same |
| USD949807S1 (en) * | 2020-03-13 | 2022-04-26 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
Non-Patent Citations (2)
| Title |
|---|
| E-scooter Power Module and Motor Drive, available in itri.org.tw, announced Year unavaible [online], [site visited Oct. 6, 2022], Internet URL: https://www.itri.org.tw/english/ListStyle.aspx?DisplayStyle=01_content&SiteID=1&MmmID=1037333532467607737&MGID=1126477372063054015 (Year: 2022). * |
| Taiwanese Notice of Allowance issued in corresponding application No. 109302243, dated Jun. 30, 2020. |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1034492S1 (en) * | 2021-10-04 | 2024-07-09 | Transportation Ip Holdings, Llc | Housing for a full phase module gate drive |
| USD1039243S1 (en) * | 2021-10-08 | 2024-08-20 | Mahdi Al-Husseini | Mortarboard with electronic tube display |
| USD1037163S1 (en) * | 2021-11-17 | 2024-07-30 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD1078668S1 (en) * | 2023-05-22 | 2025-06-10 | Semikron Danfoss International GmbH | Semiconductor power module for vehicles |
| USD1099055S1 (en) * | 2023-08-31 | 2025-10-21 | Xpt Eds (Hefei) Co., Ltd. | Power semiconductor module |
| USD1090465S1 (en) * | 2024-03-05 | 2025-08-26 | Industrial Technology Research Institute | Power module housing |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD206651S (en) | 2020-08-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |