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USD976852S1 - Power module - Google Patents

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Publication number
USD976852S1
USD976852S1 US29/738,677 US202029738677F USD976852S US D976852 S1 USD976852 S1 US D976852S1 US 202029738677 F US202029738677 F US 202029738677F US D976852 S USD976852 S US D976852S
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US
United States
Prior art keywords
power module
view
ornamental design
design
side perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/738,677
Inventor
Sheng-Tsai Wu
Hsin-Han Lin
Yuan-Yin Lo
Kuo-Shu Kao
Tai-Jyun Yu
Han-Lin Wu
Yen-Ting Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Industrial Technology Research Institute ITRI
Original Assignee
Industrial Technology Research Institute ITRI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Industrial Technology Research Institute ITRI filed Critical Industrial Technology Research Institute ITRI
Assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE reassignment INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, HSIN-HAN, LIN, YEN-TING, WU, Han-lin, KAO, KUO-SHU, LO, YUAN-YIN, WU, SHENG-TSAI, YU, TAI-JYUN
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Publication of USD976852S1 publication Critical patent/USD976852S1/en
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Description

FIG. 1 is a top, front, and right side perspective view of a power module, showing our new design;
FIG. 2 is a bottom, front, and left side perspective view thereof;
FIG. 3 is a top rear, and right side perspective view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a right side view thereof;
FIG. 8 is a top view thereof; and,
FIG. 9 is a bottom view thereof.
The broken lines in the figures illustrate the portions of the design that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a power module, as shown and described.
US29/738,677 2020-04-24 2020-06-18 Power module Active USD976852S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW109302243F TWD206651S (en) 2020-04-24 2020-04-24 Power module
TW109302243 2020-04-24

Publications (1)

Publication Number Publication Date
USD976852S1 true USD976852S1 (en) 2023-01-31

Family

ID=85025004

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/738,677 Active USD976852S1 (en) 2020-04-24 2020-06-18 Power module

Country Status (2)

Country Link
US (1) USD976852S1 (en)
TW (1) TWD206651S (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1034492S1 (en) * 2021-10-04 2024-07-09 Transportation Ip Holdings, Llc Housing for a full phase module gate drive
USD1037163S1 (en) * 2021-11-17 2024-07-30 Fuji Electric Co., Ltd. Semiconductor module
USD1039243S1 (en) * 2021-10-08 2024-08-20 Mahdi Al-Husseini Mortarboard with electronic tube display
USD1078668S1 (en) * 2023-05-22 2025-06-10 Semikron Danfoss International GmbH Semiconductor power module for vehicles
USD1090465S1 (en) * 2024-03-05 2025-08-26 Industrial Technology Research Institute Power module housing
USD1099055S1 (en) * 2023-08-31 2025-10-21 Xpt Eds (Hefei) Co., Ltd. Power semiconductor module

Citations (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD466076S1 (en) 2001-06-18 2002-11-26 Kabushiki Kaisha Toshiba Power converter
US6636429B2 (en) * 2000-09-20 2003-10-21 Ballard Power Systems Corporation EMI reduction in power modules through the use of integrated capacitors on the substrate level
USD503149S1 (en) * 2003-05-19 2005-03-22 Kabushiki Kaisha Toshiba Power converter
US20060071238A1 (en) 2004-09-23 2006-04-06 Alberto Guerra Power module
USD556686S1 (en) * 2006-04-27 2007-12-04 Hitachi, Ltd. Power module for power inverter
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
US20130049201A1 (en) * 2011-08-31 2013-02-28 Hitachi, Ltd. Power Module and Manufacturing Method Thereof
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD689446S1 (en) * 2010-10-28 2013-09-10 Fuji Electric Co., Ltd. Semiconductor
US9001518B2 (en) 2011-04-26 2015-04-07 International Rectifier Corporation Power module with press-fit clamps
US20150201532A1 (en) * 2012-10-29 2015-07-16 Fuji Electric Co., Ltd. Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
US20170213777A1 (en) * 2015-04-27 2017-07-27 Fuji Electric Co., Ltd. Semiconductor device
US20170372977A1 (en) * 2016-06-22 2017-12-28 Fuji Electric Co., Ltd. Semiconductor device and a method of manufacturing the same
TWD188003S (en) 2017-06-14 2018-01-21 慶良電子股份有限公司 Parts of electrical connector
US20180183161A1 (en) * 2016-12-28 2018-06-28 Fuji Electric Co., Ltd. Semiconductor device and semiconductor device manufacturing method
US20180182678A1 (en) * 2016-03-22 2018-06-28 Fuji Electric Co., Ltd. Case, semiconductor device and manufacturing method of case
US10122293B2 (en) 2012-01-17 2018-11-06 Infineon Technologies Americas Corp. Power module package having a multi-phase inverter and power factor correction
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
US20200013703A1 (en) * 2017-03-14 2020-01-09 Rohm Co., Ltd. Semiconductor device
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD903612S1 (en) * 2019-03-26 2020-12-01 Fuji Electric Co., Ltd. Semiconductor module
US20210134762A1 (en) * 2017-04-20 2021-05-06 Rohm Co., Ltd. Semiconductor device
US20210175155A1 (en) * 2019-12-06 2021-06-10 Alpha And Omega Semiconductor (Cayman) Ltd. Power module having interconnected base plate with molded metal and method of making the same
USD942405S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD942404S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD949807S1 (en) * 2020-03-13 2022-04-26 Sansha Electric Manufacturing Company, Limited Semiconductor module

Patent Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6636429B2 (en) * 2000-09-20 2003-10-21 Ballard Power Systems Corporation EMI reduction in power modules through the use of integrated capacitors on the substrate level
USD466076S1 (en) 2001-06-18 2002-11-26 Kabushiki Kaisha Toshiba Power converter
USD503149S1 (en) * 2003-05-19 2005-03-22 Kabushiki Kaisha Toshiba Power converter
US20060071238A1 (en) 2004-09-23 2006-04-06 Alberto Guerra Power module
USD556686S1 (en) * 2006-04-27 2007-12-04 Hitachi, Ltd. Power module for power inverter
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD689446S1 (en) * 2010-10-28 2013-09-10 Fuji Electric Co., Ltd. Semiconductor
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
US9001518B2 (en) 2011-04-26 2015-04-07 International Rectifier Corporation Power module with press-fit clamps
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
US20130049201A1 (en) * 2011-08-31 2013-02-28 Hitachi, Ltd. Power Module and Manufacturing Method Thereof
US10122293B2 (en) 2012-01-17 2018-11-06 Infineon Technologies Americas Corp. Power module package having a multi-phase inverter and power factor correction
US20150201532A1 (en) * 2012-10-29 2015-07-16 Fuji Electric Co., Ltd. Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD827593S1 (en) * 2014-11-28 2018-09-04 Fuji Electric Co., Ltd Semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
US20170213777A1 (en) * 2015-04-27 2017-07-27 Fuji Electric Co., Ltd. Semiconductor device
US20180182678A1 (en) * 2016-03-22 2018-06-28 Fuji Electric Co., Ltd. Case, semiconductor device and manufacturing method of case
US20170372977A1 (en) * 2016-06-22 2017-12-28 Fuji Electric Co., Ltd. Semiconductor device and a method of manufacturing the same
US20180183161A1 (en) * 2016-12-28 2018-06-28 Fuji Electric Co., Ltd. Semiconductor device and semiconductor device manufacturing method
US20200013703A1 (en) * 2017-03-14 2020-01-09 Rohm Co., Ltd. Semiconductor device
US20210134762A1 (en) * 2017-04-20 2021-05-06 Rohm Co., Ltd. Semiconductor device
TWD188003S (en) 2017-06-14 2018-01-21 慶良電子股份有限公司 Parts of electrical connector
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD942405S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD942404S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD903612S1 (en) * 2019-03-26 2020-12-01 Fuji Electric Co., Ltd. Semiconductor module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
US20210175155A1 (en) * 2019-12-06 2021-06-10 Alpha And Omega Semiconductor (Cayman) Ltd. Power module having interconnected base plate with molded metal and method of making the same
USD949807S1 (en) * 2020-03-13 2022-04-26 Sansha Electric Manufacturing Company, Limited Semiconductor module

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
E-scooter Power Module and Motor Drive, available in itri.org.tw, announced Year unavaible [online], [site visited Oct. 6, 2022], Internet URL: https://www.itri.org.tw/english/ListStyle.aspx?DisplayStyle=01_content&SiteID=1&MmmID=1037333532467607737&MGID=1126477372063054015 (Year: 2022). *
Taiwanese Notice of Allowance issued in corresponding application No. 109302243, dated Jun. 30, 2020.

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1034492S1 (en) * 2021-10-04 2024-07-09 Transportation Ip Holdings, Llc Housing for a full phase module gate drive
USD1039243S1 (en) * 2021-10-08 2024-08-20 Mahdi Al-Husseini Mortarboard with electronic tube display
USD1037163S1 (en) * 2021-11-17 2024-07-30 Fuji Electric Co., Ltd. Semiconductor module
USD1078668S1 (en) * 2023-05-22 2025-06-10 Semikron Danfoss International GmbH Semiconductor power module for vehicles
USD1099055S1 (en) * 2023-08-31 2025-10-21 Xpt Eds (Hefei) Co., Ltd. Power semiconductor module
USD1090465S1 (en) * 2024-03-05 2025-08-26 Industrial Technology Research Institute Power module housing

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