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USD954005S1 - Heatsink - Google Patents

Heatsink Download PDF

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Publication number
USD954005S1
USD954005S1 US29/727,572 US202029727572F USD954005S US D954005 S1 USD954005 S1 US D954005S1 US 202029727572 F US202029727572 F US 202029727572F US D954005 S USD954005 S US D954005S
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US
United States
Prior art keywords
heatsink
shows
view
design
broken lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
US29/727,572
Inventor
Yoshikatsu INAGAKI
Shuta HIKICHI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Assigned to FURUKAWA ELECTRIC CO. reassignment FURUKAWA ELECTRIC CO. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INAGAKI, Yoshikatsu, HIKICHI, SHUTA
Assigned to FURUKAWA ELECTRIC CO., LTD reassignment FURUKAWA ELECTRIC CO., LTD CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT ASSIGNEE ADDRESS PREVIOUSLY RECORDED AT REEL: 052495 FRAME: 0153. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: INAGAKI, Yoshikatsu, HIKICHI, SHUTA
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Description

FIG. 1 shows a top isometric view of a heatsink in accordance with the present design.
FIG. 2 shows a bottom isometric view of the heatsink in FIG. 1.
FIG. 3 shows a top view of the heatsink in FIG. 1.
FIG. 4 shows a bottom view of the heatsink in FIG. 1.
FIG. 5 shows a right side view of the heatsink in FIG. 1.
FIG. 6 shows a left side view of the heatsink in FIG. 1.
FIG. 7 shows a front view of the heatsink in FIG. 1; and,
FIG. 8 shows a rear view of the heatsink in FIG. 1.
The even broken lines illustrate environment that forms no part of the claimed design. The dot-dash broken lines represent boundary lines and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a heatsink, as shown and described.
US29/727,572 2019-09-12 2020-03-11 Heatsink Active USD954005S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-20398 2019-09-12
JPD2019-20398F JP1662414S (en) 2019-09-12 2019-09-12

Publications (1)

Publication Number Publication Date
USD954005S1 true USD954005S1 (en) 2022-06-07

Family

ID=71131280

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/727,572 Active USD954005S1 (en) 2019-09-12 2020-03-11 Heatsink

Country Status (3)

Country Link
US (1) USD954005S1 (en)
JP (1) JP1662414S (en)
TW (1) TWD213392S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220136778A1 (en) * 2020-11-05 2022-05-05 Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. Heat pipe and heat dissipation structure
USD1026838S1 (en) * 2022-04-26 2024-05-14 Taiwan Microloops Corp. Heat dissipation module

Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6634800B2 (en) * 2000-04-27 2003-10-21 Furukawa Electric Co., Ltd. Ferrule for optical connector
USD541232S1 (en) * 2005-12-19 2007-04-24 Zalman Tech Co., Ltd. Radiator for electronic parts
USD561710S1 (en) * 2007-01-03 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
USD561711S1 (en) * 2006-12-08 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
USD582359S1 (en) * 2008-01-07 2008-12-09 Cooler Master Co., Ltd. Heat dissipator
USD587217S1 (en) 2007-12-30 2009-02-24 Zalman Tech Co., Ltd. Radiator for a graphics card chipset
US20100002380A1 (en) * 2008-07-03 2010-01-07 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink apparatus
US20100206521A1 (en) * 2009-02-17 2010-08-19 Aacotek Company Limited Heat dissipating fin and heat sink
US20100270007A1 (en) 2009-04-23 2010-10-28 Wen-Te Lin Heat sink
US20110192026A1 (en) 2010-02-11 2011-08-11 Shyh-Ming Chen Press fitting method for heat pipe and heat sink
USD660256S1 (en) 2011-02-25 2012-05-22 Zalman Tech Co., Ltd. Radiator for an electronic device
US20120145356A1 (en) 2010-12-10 2012-06-14 Palo Alto Research Center Incorporated Hybrid Pin-Fin Micro Heat Pipe Heat Sink and Method of Fabrication
US20130044433A1 (en) 2010-05-24 2013-02-21 Icepipe Corporation Heat-dissipating device for electronic apparatus
USD715750S1 (en) 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
US20150043869A1 (en) * 2013-08-08 2015-02-12 Hon Hai Precision Industry Co., Ltd. Optical fiber connector having detachable first body and second body
USD722573S1 (en) 2013-11-26 2015-02-17 Heatscape, Inc. U-shaped condenser heat sink for low profile modules
USD742337S1 (en) 2013-08-06 2015-11-03 Fujitsu Limited Radiator for electronic device
JP1537917S (en) * 2014-12-19 2015-11-16
US20160298909A1 (en) 2015-04-13 2016-10-13 Tai-Sol Electronics Co., Ltd. Heat Dissipation Structure with Heat Pipes Arranged in Two Spaced and Partially Overlapped Layers
US20160313067A1 (en) 2015-04-27 2016-10-27 Cooler Master Co., Ltd. Heat dissipating device and heat dissipating fin
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
US20170307299A1 (en) * 2016-04-26 2017-10-26 Tsung-Hsien Huang Combination heat sink and heat pipe assembly
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD805042S1 (en) 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes
US20180128552A1 (en) * 2015-07-14 2018-05-10 Furukawa Electric Co., Ltd. Cooling device
US20180284356A1 (en) * 2015-10-12 2018-10-04 3M Innovative Properties Company Optical waveguide positioning feature in a multiple waveguides connector
USD833988S1 (en) 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
US20190170446A1 (en) 2017-12-06 2019-06-06 Forcecon Technology Co., Ltd. Multi-tube parallel heat spreader
US20190269035A1 (en) 2018-02-27 2019-08-29 Ciena Corporation Asymmetric heat pipe coupled to a heat sink
US20200326131A1 (en) 2017-12-28 2020-10-15 Furukawa Electric Co., Ltd. Heat sink
US20200355443A1 (en) 2018-01-31 2020-11-12 Furukawa Electric Co., Ltd. Heat sink
USD905647S1 (en) 2018-07-20 2020-12-22 Heatscape.Com, Inc. Combination heat pipe and heat sink
US20210018272A1 (en) 2018-12-28 2021-01-21 Furukawa Electric Co., Ltd. Heat sink
US20210208385A1 (en) 2019-06-03 2021-07-08 Karl Storz Se & Co. Kg Device for heat dissipation from an endoscopic illumination apparatus
US20210318072A1 (en) 2015-07-14 2021-10-14 Furukawa Electric Co., Ltd. Cooling device with superimposed fin groups

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6634800B2 (en) * 2000-04-27 2003-10-21 Furukawa Electric Co., Ltd. Ferrule for optical connector
USD541232S1 (en) * 2005-12-19 2007-04-24 Zalman Tech Co., Ltd. Radiator for electronic parts
USD561711S1 (en) * 2006-12-08 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
USD561710S1 (en) * 2007-01-03 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
USD587217S1 (en) 2007-12-30 2009-02-24 Zalman Tech Co., Ltd. Radiator for a graphics card chipset
USD582359S1 (en) * 2008-01-07 2008-12-09 Cooler Master Co., Ltd. Heat dissipator
US20100002380A1 (en) * 2008-07-03 2010-01-07 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink apparatus
US20100206521A1 (en) * 2009-02-17 2010-08-19 Aacotek Company Limited Heat dissipating fin and heat sink
US20100270007A1 (en) 2009-04-23 2010-10-28 Wen-Te Lin Heat sink
US20110192026A1 (en) 2010-02-11 2011-08-11 Shyh-Ming Chen Press fitting method for heat pipe and heat sink
US20130044433A1 (en) 2010-05-24 2013-02-21 Icepipe Corporation Heat-dissipating device for electronic apparatus
US20120145356A1 (en) 2010-12-10 2012-06-14 Palo Alto Research Center Incorporated Hybrid Pin-Fin Micro Heat Pipe Heat Sink and Method of Fabrication
USD660256S1 (en) 2011-02-25 2012-05-22 Zalman Tech Co., Ltd. Radiator for an electronic device
USD742337S1 (en) 2013-08-06 2015-11-03 Fujitsu Limited Radiator for electronic device
US20150043869A1 (en) * 2013-08-08 2015-02-12 Hon Hai Precision Industry Co., Ltd. Optical fiber connector having detachable first body and second body
USD715750S1 (en) 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
USD722573S1 (en) 2013-11-26 2015-02-17 Heatscape, Inc. U-shaped condenser heat sink for low profile modules
JP1537917S (en) * 2014-12-19 2015-11-16
US20160298909A1 (en) 2015-04-13 2016-10-13 Tai-Sol Electronics Co., Ltd. Heat Dissipation Structure with Heat Pipes Arranged in Two Spaced and Partially Overlapped Layers
US20160313067A1 (en) 2015-04-27 2016-10-27 Cooler Master Co., Ltd. Heat dissipating device and heat dissipating fin
US20200191494A1 (en) 2015-07-14 2020-06-18 Furukawa Electric Co., Ltd. Cooling device with superimposed fin groups
US20180128552A1 (en) * 2015-07-14 2018-05-10 Furukawa Electric Co., Ltd. Cooling device
US11150028B2 (en) 2015-07-14 2021-10-19 Furukawa Electric Co., Ltd. Cooling device with superimposed fin groups and parallel heatpipes
US20210318072A1 (en) 2015-07-14 2021-10-14 Furukawa Electric Co., Ltd. Cooling device with superimposed fin groups
US20180284356A1 (en) * 2015-10-12 2018-10-04 3M Innovative Properties Company Optical waveguide positioning feature in a multiple waveguides connector
USD805042S1 (en) 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD829673S1 (en) * 2016-02-22 2018-10-02 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
US20170307299A1 (en) * 2016-04-26 2017-10-26 Tsung-Hsien Huang Combination heat sink and heat pipe assembly
USD833988S1 (en) 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
US20190170446A1 (en) 2017-12-06 2019-06-06 Forcecon Technology Co., Ltd. Multi-tube parallel heat spreader
US20200326131A1 (en) 2017-12-28 2020-10-15 Furukawa Electric Co., Ltd. Heat sink
US20200355443A1 (en) 2018-01-31 2020-11-12 Furukawa Electric Co., Ltd. Heat sink
US20190269035A1 (en) 2018-02-27 2019-08-29 Ciena Corporation Asymmetric heat pipe coupled to a heat sink
USD905647S1 (en) 2018-07-20 2020-12-22 Heatscape.Com, Inc. Combination heat pipe and heat sink
US20210018272A1 (en) 2018-12-28 2021-01-21 Furukawa Electric Co., Ltd. Heat sink
US20210208385A1 (en) 2019-06-03 2021-07-08 Karl Storz Se & Co. Kg Device for heat dissipation from an endoscopic illumination apparatus

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Eteknix, "Cooler Master TPC 800 Vapour Chamber CPU Cooler Review", Published "9 Years ago", at latest Nov. 8, 2012 as indicated by comment replies, (https ://www .eteknix.com/cooler-master-tpc-800-vapour-chamber-cpu-cooler-review/all/1 /) (Year: 2012).
Eteknix, "Noctua NH-D9L Dual-Tower CPU Cooler Review", Published "6 Years ago", at latest Jan. 20, 2016 as indicated by comment replies, (https://www.eteknix.eom/noctua-nh-d9l-dual-tower-cpu-cooler-review/2/) (Year: 2016).
U.S. Appl. No. 29/696,679 titled "Heatsink" filed Jun. 28, 2019.
U.S. Appl. No. 29/727,570 titled "Heat Sink" filed Mar. 11, 2020.
U.S. Appl. No. 29/727,573 titled "Heat Sink" filed Mar. 11, 2020.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220136778A1 (en) * 2020-11-05 2022-05-05 Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. Heat pipe and heat dissipation structure
US11774180B2 (en) * 2020-11-05 2023-10-03 Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. Heat pipe and heat dissipation structure
USD1026838S1 (en) * 2022-04-26 2024-05-14 Taiwan Microloops Corp. Heat dissipation module

Also Published As

Publication number Publication date
JP1662414S (en) 2020-06-29
TWD213392S (en) 2021-08-21

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