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USD836565S1 - Solid state relay - Google Patents

Solid state relay Download PDF

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Publication number
USD836565S1
USD836565S1 US29/640,569 US201829640569F USD836565S US D836565 S1 USD836565 S1 US D836565S1 US 201829640569 F US201829640569 F US 201829640569F US D836565 S USD836565 S US D836565S
Authority
US
United States
Prior art keywords
solid state
state relay
view
relay
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/640,569
Inventor
Mitsumasa Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to US29/640,569 priority Critical patent/USD836565S1/en
Application granted granted Critical
Publication of USD836565S1 publication Critical patent/USD836565S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front, top, left-side perspective view of the solid state relay;
FIG. 2 is a front elevational view thereof, the rear elevational view (not provided) being a mirror image thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a right-side elevational view thereof, the left-side elevational view (not provided) being a mirror image thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a rear, bottom, left-side perspective view thereof.
The broken lines in the drawings illustrate portions of the solid state relay that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a solid state relay, as shown and described.
US29/640,569 2017-01-25 2018-03-15 Solid state relay Active USD836565S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/640,569 USD836565S1 (en) 2017-01-25 2018-03-15 Solid state relay

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/591,940 USD836073S1 (en) 2017-01-25 2017-01-25 Solid state relay
US29/640,569 USD836565S1 (en) 2017-01-25 2018-03-15 Solid state relay

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/591,940 Division USD836073S1 (en) 2017-01-25 2017-01-25 Solid state relay

Publications (1)

Publication Number Publication Date
USD836565S1 true USD836565S1 (en) 2018-12-25

Family

ID=64605290

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/591,940 Active USD836073S1 (en) 2017-01-25 2017-01-25 Solid state relay
US29/640,569 Active USD836565S1 (en) 2017-01-25 2018-03-15 Solid state relay

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/591,940 Active USD836073S1 (en) 2017-01-25 2017-01-25 Solid state relay

Country Status (1)

Country Link
US (2) USD836073S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1086905S1 (en) * 2022-09-07 2025-08-05 Asahi Kasei Microdevices Corporation Electrical current measurement module

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4361371A (en) * 1980-12-08 1982-11-30 Amf Incorporated Packaging of solid state relay
US5229739A (en) * 1992-02-21 1993-07-20 Littelfuse, Inc. Automotive high current fuse
USD357462S (en) * 1993-09-16 1995-04-18 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US20050194552A1 (en) * 2004-03-03 2005-09-08 Sharp Kabushiki Kaisha Solid state relay
USD518792S1 (en) * 2005-04-08 2006-04-11 Pacific Engineering Corp. Fuse
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
US20080128889A1 (en) * 2006-12-01 2008-06-05 Samsung Electronics Co., Ltd. Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof
US20130286594A1 (en) * 2010-11-04 2013-10-31 On Semiconductor Trading Ltd Circuit device and method for manufacturing same
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
JP1587425S (en) * 2016-12-27 2017-10-02
US20180160569A1 (en) * 2015-09-01 2018-06-07 Rohm Co., Ltd. Power module, thermal dissipation structure of the power module and contact method of the power module

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD305642S (en) * 1986-10-06 1990-01-23 Satori Switch Industry Co., Ltd. Electrical switch assembly

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4361371A (en) * 1980-12-08 1982-11-30 Amf Incorporated Packaging of solid state relay
US5229739A (en) * 1992-02-21 1993-07-20 Littelfuse, Inc. Automotive high current fuse
USD357462S (en) * 1993-09-16 1995-04-18 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US20050194552A1 (en) * 2004-03-03 2005-09-08 Sharp Kabushiki Kaisha Solid state relay
USD518792S1 (en) * 2005-04-08 2006-04-11 Pacific Engineering Corp. Fuse
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
US20080128889A1 (en) * 2006-12-01 2008-06-05 Samsung Electronics Co., Ltd. Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof
US20130286594A1 (en) * 2010-11-04 2013-10-31 On Semiconductor Trading Ltd Circuit device and method for manufacturing same
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
US20180160569A1 (en) * 2015-09-01 2018-06-07 Rohm Co., Ltd. Power module, thermal dissipation structure of the power module and contact method of the power module
JP1587425S (en) * 2016-12-27 2017-10-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1086905S1 (en) * 2022-09-07 2025-08-05 Asahi Kasei Microdevices Corporation Electrical current measurement module

Also Published As

Publication number Publication date
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