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USD723077S1 - Chuck carrier film - Google Patents

Chuck carrier film Download PDF

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Publication number
USD723077S1
USD723077S1 US29/475,509 US201329475509F USD723077S US D723077 S1 USD723077 S1 US D723077S1 US 201329475509 F US201329475509 F US 201329475509F US D723077 S USD723077 S US D723077S
Authority
US
United States
Prior art keywords
carrier film
chuck carrier
chuck
view
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/475,509
Inventor
Clinton Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/475,509 priority Critical patent/USD723077S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAKATA, CLINTON
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAKATA, CLINTON
Priority to TW103302643F priority patent/TWD168137S/en
Application granted granted Critical
Publication of USD723077S1 publication Critical patent/USD723077S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top perspective view of a chuck carrier film.
FIG. 2 is a bottom perspective view of the chuck carrier film.
FIG. 3 is a top plan view of the chuck carrier film.
FIG. 4 is a back side view of the chuck carrier film.
FIG. 5 is a side view of the chuck carrier film, the opposite side view being a mirror image thereof; and,
FIG. 6 is a front side view of the chuck carrier film.
The broken lines in the figures form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a chuck carrier film, as shown and described.
US29/475,509 2013-12-03 2013-12-03 Chuck carrier film Active USD723077S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/475,509 USD723077S1 (en) 2013-12-03 2013-12-03 Chuck carrier film
TW103302643F TWD168137S (en) 2013-12-03 2014-05-05 Chuck carrier film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/475,509 USD723077S1 (en) 2013-12-03 2013-12-03 Chuck carrier film

Publications (1)

Publication Number Publication Date
USD723077S1 true USD723077S1 (en) 2015-02-24

Family

ID=52473496

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/475,509 Active USD723077S1 (en) 2013-12-03 2013-12-03 Chuck carrier film

Country Status (2)

Country Link
US (1) USD723077S1 (en)
TW (1) TWD168137S (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD741922S1 (en) * 2015-01-21 2015-10-27 Colgate-Palmolive Company Die cutter
USD766850S1 (en) * 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD790489S1 (en) * 2015-07-08 2017-06-27 Ebara Corporation Vacuum contact pad
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD802472S1 (en) * 2015-08-06 2017-11-14 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD803802S1 (en) * 2015-08-18 2017-11-28 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD913256S1 (en) * 2019-07-31 2021-03-16 Eryn Smith Antenna pattern for a semiconductive substrate carrier
USD931240S1 (en) * 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD984972S1 (en) * 2021-03-29 2023-05-02 Beijing Naura Microelectronics Equipment Co., Ltd. Electrostatic chuck for semiconductor manufacture
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
USD1073913S1 (en) * 2021-11-26 2025-05-06 Tomoegawa Corporation Heat exchange plate

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD420022S (en) * 1997-12-24 2000-02-01 Applied Materials, Inc. Electrostatic chuck with improved spacing and charge migration reduction mask
USD420023S (en) * 1999-01-09 2000-02-01 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
USD425919S (en) * 1997-11-14 2000-05-30 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
US20030119431A1 (en) * 2001-12-21 2003-06-26 Lam Research Corporation Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film
USD489739S1 (en) * 2002-12-20 2004-05-11 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490096S1 (en) * 2002-12-20 2004-05-18 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490827S1 (en) * 2002-12-20 2004-06-01 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD497171S1 (en) * 2002-12-20 2004-10-12 Ngk Spark Plug Co., Ltd. Electrostatic chuck
US6837774B2 (en) * 2001-03-28 2005-01-04 Taiwan Semiconductor Manufacturing Co., Ltd Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using
US7025664B2 (en) * 2000-03-31 2006-04-11 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
USD546784S1 (en) * 2005-09-29 2007-07-17 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD561206S1 (en) * 2005-11-25 2008-02-05 Momentive Performance Materials Inc. Electrostatic chuck
USD587222S1 (en) * 2006-08-01 2009-02-24 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
US8157615B2 (en) * 2008-04-12 2012-04-17 Erich Thallner Device and process for applying and/or detaching a wafer to/from a carrier
US20120168040A1 (en) * 2009-08-27 2012-07-05 Toyota School Foundation Microcrystalline alloy, method for production of the same, apparatus for production of the same, and method for production of casting of the same
USD687791S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
US20130306215A1 (en) * 2012-05-15 2013-11-21 Disco Corporation Adhesive tape ataching method
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD425919S (en) * 1997-11-14 2000-05-30 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
USD420022S (en) * 1997-12-24 2000-02-01 Applied Materials, Inc. Electrostatic chuck with improved spacing and charge migration reduction mask
USD420023S (en) * 1999-01-09 2000-02-01 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
US7025664B2 (en) * 2000-03-31 2006-04-11 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6837774B2 (en) * 2001-03-28 2005-01-04 Taiwan Semiconductor Manufacturing Co., Ltd Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using
US20030119431A1 (en) * 2001-12-21 2003-06-26 Lam Research Corporation Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film
USD489739S1 (en) * 2002-12-20 2004-05-11 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490096S1 (en) * 2002-12-20 2004-05-18 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490827S1 (en) * 2002-12-20 2004-06-01 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD497171S1 (en) * 2002-12-20 2004-10-12 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD546784S1 (en) * 2005-09-29 2007-07-17 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD561206S1 (en) * 2005-11-25 2008-02-05 Momentive Performance Materials Inc. Electrostatic chuck
USD587222S1 (en) * 2006-08-01 2009-02-24 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US8157615B2 (en) * 2008-04-12 2012-04-17 Erich Thallner Device and process for applying and/or detaching a wafer to/from a carrier
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
US20120168040A1 (en) * 2009-08-27 2012-07-05 Toyota School Foundation Microcrystalline alloy, method for production of the same, apparatus for production of the same, and method for production of casting of the same
USD687791S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
US20130306215A1 (en) * 2012-05-15 2013-11-21 Disco Corporation Adhesive tape ataching method
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD766850S1 (en) * 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
USD741922S1 (en) * 2015-01-21 2015-10-27 Colgate-Palmolive Company Die cutter
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD790489S1 (en) * 2015-07-08 2017-06-27 Ebara Corporation Vacuum contact pad
USD802472S1 (en) * 2015-08-06 2017-11-14 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD803802S1 (en) * 2015-08-18 2017-11-28 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD931240S1 (en) * 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
USD913256S1 (en) * 2019-07-31 2021-03-16 Eryn Smith Antenna pattern for a semiconductive substrate carrier
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1021832S1 (en) * 2020-09-17 2024-04-09 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD984972S1 (en) * 2021-03-29 2023-05-02 Beijing Naura Microelectronics Equipment Co., Ltd. Electrostatic chuck for semiconductor manufacture
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
USD1073913S1 (en) * 2021-11-26 2025-05-06 Tomoegawa Corporation Heat exchange plate
USD1092422S1 (en) * 2021-11-26 2025-09-09 Tomoegawa Corporation Heat exchange plate

Also Published As

Publication number Publication date
TWD168137S (en) 2015-06-01

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