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USD711332S1 - Multi-keyed spindle - Google Patents

Multi-keyed spindle Download PDF

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Publication number
USD711332S1
USD711332S1 US29/416,253 US201229416253F USD711332S US D711332 S1 USD711332 S1 US D711332S1 US 201229416253 F US201229416253 F US 201229416253F US D711332 S USD711332 S US D711332S
Authority
US
United States
Prior art keywords
keyed spindle
keyed
spindle
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/416,253
Inventor
Sandeep Krishnan
Keng Moy
Alexander I. Gurary
Matthew King
Vadim Boguslavskiy
Steven Krommenhoek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Veeco Instruments Inc
Original Assignee
Veeco Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Veeco Instruments Inc filed Critical Veeco Instruments Inc
Priority to US29/416,253 priority Critical patent/USD711332S1/en
Assigned to VEECO INSTRUMENTS INC. reassignment VEECO INSTRUMENTS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GURARY, ALEXANDER I., BOGUSLAVSKIY, VADIM, KING, MATTHEW, KRISHNAN, SANDEEP, KROMMENHOEK, STEVEN, MOY, KENG
Application granted granted Critical
Publication of USD711332S1 publication Critical patent/USD711332S1/en
Assigned to HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: VEECO INSTRUMENTS INC.
Assigned to HSBC BANK USA, NATIONAL ASSOCIATION reassignment HSBC BANK USA, NATIONAL ASSOCIATION SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: VEECO INSTRUMENTS INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top persepective view of a multi-keyed spindle showing our new design;
FIG. 2 is right side view thereof; the left side view being a mirror image thereto;
FIG. 3 is front view thereof; the rear view being a mirror image thereto; and,
FIG. 4 is top plan view thereof.
The broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a multi-keyed spindle, as shown and described.
US29/416,253 2012-03-20 2012-03-20 Multi-keyed spindle Active USD711332S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/416,253 USD711332S1 (en) 2012-03-20 2012-03-20 Multi-keyed spindle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/416,253 USD711332S1 (en) 2012-03-20 2012-03-20 Multi-keyed spindle

Publications (1)

Publication Number Publication Date
USD711332S1 true USD711332S1 (en) 2014-08-19

Family

ID=51302156

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/416,253 Active USD711332S1 (en) 2012-03-20 2012-03-20 Multi-keyed spindle

Country Status (1)

Country Link
US (1) USD711332S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD775683S1 (en) * 2014-04-08 2017-01-03 Leica Camera Ag Connector pin
USD1015384S1 (en) * 2020-09-02 2024-02-20 Bpr Engineering Pty Ltd Spindle
USD1061423S1 (en) * 2022-11-29 2025-02-11 Black & Decker Inc. Car charger
USD1089069S1 (en) * 2023-02-14 2025-08-19 Te Connectivity Solutions Gmbh Electrical charging terminal

Citations (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3731435A (en) 1971-02-09 1973-05-08 Speedfam Corp Polishing machine load plate
US3845738A (en) 1973-09-12 1974-11-05 Rca Corp Vapor deposition apparatus with pyrolytic graphite heat shield
US4165584A (en) 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
US4512113A (en) 1982-09-23 1985-04-23 Budinger William D Workpiece holder for polishing operation
US4739589A (en) 1985-07-12 1988-04-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh Process and apparatus for abrasive machining of a wafer-like workpiece
US5191738A (en) 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
US5193316A (en) 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5377451A (en) 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5422316A (en) 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
US5573448A (en) 1993-08-18 1996-11-12 Shin-Etsu Handotai Co., Ltd. Method of polishing wafers, a backing pad used therein, and method of making the backing pad
US5647789A (en) 1993-11-01 1997-07-15 Fujikoshi Kakai Kogyo Kabushiki Kaisha Polishing machine and a method of polishing a work
US5674107A (en) 1995-04-25 1997-10-07 Lucent Technologies Inc. Diamond polishing method and apparatus employing oxygen-emitting medium
US5683518A (en) 1993-01-21 1997-11-04 Moore Epitaxial, Inc. Rapid thermal processing apparatus for processing semiconductor wafers
US5788777A (en) 1997-03-06 1998-08-04 Burk, Jr.; Albert A. Susceptor for an epitaxial growth factor
US5840124A (en) 1997-06-30 1998-11-24 Emcore Corporation Wafer carrier with flexible wafer flat holder
US5865666A (en) 1997-08-20 1999-02-02 Lsi Logic Corporation Apparatus and method for polish removing a precise amount of material from a wafer
USD405430S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
US6080042A (en) 1997-10-31 2000-06-27 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
US6241825B1 (en) 1999-04-16 2001-06-05 Cutek Research Inc. Compliant wafer chuck
US20020011204A1 (en) 2000-02-28 2002-01-31 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
US6375749B1 (en) 1999-07-14 2002-04-23 Seh America, Inc. Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth
US6454635B1 (en) 2000-08-08 2002-09-24 Memc Electronic Materials, Inc. Method and apparatus for a wafer carrier having an insert
US6500059B2 (en) 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
US6514424B2 (en) 2000-05-11 2003-02-04 WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process
US20030057089A1 (en) 2000-12-01 2003-03-27 Tin Nguyen Disk carrier
US6666948B2 (en) 2001-04-23 2003-12-23 Phuong Van Nguyen Silicon wafer polisher
US6709981B2 (en) 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US6733367B1 (en) 2001-04-23 2004-05-11 Phuong Van Nguyen Method and apparatus for polishing silicon wafers
USD503385S1 (en) * 2002-11-28 2005-03-29 Kabushiki Kaisha Toshiba Optoelectronic converting connector plug for optical fibers
US7008308B2 (en) 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US20060090915A1 (en) * 2004-11-03 2006-05-04 Kim Dong-Jin Streamer discharge type lightening rod capable of generating lots of ions
US7169234B2 (en) 2004-01-30 2007-01-30 Asm America, Inc. Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
US7235139B2 (en) 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
US7252737B2 (en) 2001-08-09 2007-08-07 Applied Materials, Inc. Pedestal with integral shield
USD564462S1 (en) * 2005-12-27 2008-03-18 Tokyo Electron Limited RF electrode for a process tube of semiconductor manufacturing apparatus
US20090194026A1 (en) 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US8177993B2 (en) 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
US8182315B2 (en) 2008-03-24 2012-05-22 Phuong Van Nguyen Chemical mechanical polishing pad and dresser
CN202492576U (en) 2012-02-20 2012-10-17 中微半导体设备(上海)有限公司 Chemical vapor deposition device
US8328600B2 (en) 2010-03-12 2012-12-11 Duescher Wayne O Workpiece spindles supported floating abrasive platen
USD674759S1 (en) 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD675567S1 (en) * 2011-08-23 2013-02-05 Adamant Kogyo Co., Ltd. Ferrule for optical fiber
US8448289B2 (en) * 2006-03-24 2013-05-28 Robert Bosch Gmbh Windscreen wiper drive arrangement

Patent Citations (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3731435A (en) 1971-02-09 1973-05-08 Speedfam Corp Polishing machine load plate
US3845738A (en) 1973-09-12 1974-11-05 Rca Corp Vapor deposition apparatus with pyrolytic graphite heat shield
US4165584A (en) 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
US4512113A (en) 1982-09-23 1985-04-23 Budinger William D Workpiece holder for polishing operation
US4739589A (en) 1985-07-12 1988-04-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh Process and apparatus for abrasive machining of a wafer-like workpiece
US5191738A (en) 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
US5193316A (en) 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5683518A (en) 1993-01-21 1997-11-04 Moore Epitaxial, Inc. Rapid thermal processing apparatus for processing semiconductor wafers
US5377451A (en) 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5573448A (en) 1993-08-18 1996-11-12 Shin-Etsu Handotai Co., Ltd. Method of polishing wafers, a backing pad used therein, and method of making the backing pad
US5647789A (en) 1993-11-01 1997-07-15 Fujikoshi Kakai Kogyo Kabushiki Kaisha Polishing machine and a method of polishing a work
US5422316A (en) 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
US5674107A (en) 1995-04-25 1997-10-07 Lucent Technologies Inc. Diamond polishing method and apparatus employing oxygen-emitting medium
USD405430S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
US5788777A (en) 1997-03-06 1998-08-04 Burk, Jr.; Albert A. Susceptor for an epitaxial growth factor
US5840124A (en) 1997-06-30 1998-11-24 Emcore Corporation Wafer carrier with flexible wafer flat holder
US5865666A (en) 1997-08-20 1999-02-02 Lsi Logic Corporation Apparatus and method for polish removing a precise amount of material from a wafer
US6080042A (en) 1997-10-31 2000-06-27 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
US6241825B1 (en) 1999-04-16 2001-06-05 Cutek Research Inc. Compliant wafer chuck
US6375749B1 (en) 1999-07-14 2002-04-23 Seh America, Inc. Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth
US20020011204A1 (en) 2000-02-28 2002-01-31 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
US6514424B2 (en) 2000-05-11 2003-02-04 WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process
US6454635B1 (en) 2000-08-08 2002-09-24 Memc Electronic Materials, Inc. Method and apparatus for a wafer carrier having an insert
US6709981B2 (en) 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US6500059B2 (en) 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
US20030057089A1 (en) 2000-12-01 2003-03-27 Tin Nguyen Disk carrier
US6733367B1 (en) 2001-04-23 2004-05-11 Phuong Van Nguyen Method and apparatus for polishing silicon wafers
US6666948B2 (en) 2001-04-23 2003-12-23 Phuong Van Nguyen Silicon wafer polisher
US7252737B2 (en) 2001-08-09 2007-08-07 Applied Materials, Inc. Pedestal with integral shield
USD503385S1 (en) * 2002-11-28 2005-03-29 Kabushiki Kaisha Toshiba Optoelectronic converting connector plug for optical fibers
US7008308B2 (en) 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US7235139B2 (en) 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
US7169234B2 (en) 2004-01-30 2007-01-30 Asm America, Inc. Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
US20060090915A1 (en) * 2004-11-03 2006-05-04 Kim Dong-Jin Streamer discharge type lightening rod capable of generating lots of ions
USD564462S1 (en) * 2005-12-27 2008-03-18 Tokyo Electron Limited RF electrode for a process tube of semiconductor manufacturing apparatus
US8448289B2 (en) * 2006-03-24 2013-05-28 Robert Bosch Gmbh Windscreen wiper drive arrangement
US8177993B2 (en) 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
US20090194026A1 (en) 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
US8182315B2 (en) 2008-03-24 2012-05-22 Phuong Van Nguyen Chemical mechanical polishing pad and dresser
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US8328600B2 (en) 2010-03-12 2012-12-11 Duescher Wayne O Workpiece spindles supported floating abrasive platen
USD674759S1 (en) 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD675567S1 (en) * 2011-08-23 2013-02-05 Adamant Kogyo Co., Ltd. Ferrule for optical fiber
CN202492576U (en) 2012-02-20 2012-10-17 中微半导体设备(上海)有限公司 Chemical vapor deposition device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD775683S1 (en) * 2014-04-08 2017-01-03 Leica Camera Ag Connector pin
USD1015384S1 (en) * 2020-09-02 2024-02-20 Bpr Engineering Pty Ltd Spindle
USD1061423S1 (en) * 2022-11-29 2025-02-11 Black & Decker Inc. Car charger
USD1089069S1 (en) * 2023-02-14 2025-08-19 Te Connectivity Solutions Gmbh Electrical charging terminal

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