USD799437S1 - Substrate retaining ring - Google Patents
Substrate retaining ring Download PDFInfo
- Publication number
- USD799437S1 USD799437S1 US29/555,718 US201629555718F USD799437S US D799437 S1 USD799437 S1 US D799437S1 US 201629555718 F US201629555718 F US 201629555718F US D799437 S USD799437 S US D799437S
- Authority
- US
- United States
- Prior art keywords
- retaining ring
- substrate retaining
- view
- substrate
- taken along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 3
Images
Description
Claims (1)
- The ornamental design for substrate retaining ring, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-018612 | 2015-02-02 | ||
| JP2015018612 | 2015-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD799437S1 true USD799437S1 (en) | 2017-10-10 |
Family
ID=59981668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/555,718 Active USD799437S1 (en) | 2015-08-25 | 2016-02-24 | Substrate retaining ring |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD799437S1 (en) |
| TW (1) | TWD179095S (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD836573S1 (en) * | 2017-01-31 | 2018-12-25 | Hitachi High-Technologies Corporation | Ring for a plasma processing apparatus |
| USD845568S1 (en) * | 2015-05-14 | 2019-04-09 | Ebara Corporation | Pad holder for polishing apparatus |
| USD861449S1 (en) * | 2018-02-05 | 2019-10-01 | QuickCinch, LLC | Wire repair and refurbishment tool |
| USD940670S1 (en) * | 2019-09-26 | 2022-01-11 | Willbe S&T Co., Ltd. | Retainer ring for chemical mechanical polishing device |
| USD947789S1 (en) * | 2020-05-22 | 2022-04-05 | Hosiden Corporation | Electric connection terminal |
| USD949116S1 (en) * | 2019-05-03 | 2022-04-19 | Lumileds Holding B.V. | Flexible circuit board with connectors |
| USD981459S1 (en) * | 2021-06-16 | 2023-03-21 | Ebara Corporation | Retaining ring for substrate |
| USD997111S1 (en) * | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD998575S1 (en) * | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD1013841S1 (en) * | 2020-04-20 | 2024-02-06 | Reliance Worldwide Corporation | Retaining ring |
| USD1040304S1 (en) * | 2018-12-17 | 2024-08-27 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| USD1062662S1 (en) * | 2023-03-30 | 2025-02-18 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1063595S1 (en) * | 2023-03-30 | 2025-02-25 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1086087S1 (en) * | 2023-03-30 | 2025-07-29 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1096675S1 (en) * | 2022-06-03 | 2025-10-07 | Ap Systems Inc. | Rotor for semiconductor manufacturing device |
Citations (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6068548A (en) * | 1997-12-17 | 2000-05-30 | Intel Corporation | Mechanically stabilized retaining ring for chemical mechanical polishing |
| US6186880B1 (en) * | 1999-09-29 | 2001-02-13 | Semiconductor Equipment Technology | Recyclable retaining ring assembly for a chemical mechanical polishing apparatus |
| US20030070757A1 (en) * | 2001-09-07 | 2003-04-17 | Demeyer Dale E. | Method and apparatus for two-part CMP retaining ring |
| US20030089697A1 (en) * | 2000-04-20 | 2003-05-15 | Yicheng Li | Thermal processing system and thermal processing method |
| US20040065412A1 (en) * | 2002-10-02 | 2004-04-08 | Ensinger Kunststofftechnologie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| US20040077167A1 (en) * | 2002-10-11 | 2004-04-22 | Willis George D. | Retaining ring for use on a carrier of a polishing apparatus |
| US20050191947A1 (en) * | 2003-11-13 | 2005-09-01 | Chen Hung C. | Retaining ring with shaped surface |
| US20050277375A1 (en) * | 2004-06-10 | 2005-12-15 | Young Richard T | Retaining ring assembly for use in chemical mechanical polishing |
| US20070224864A1 (en) * | 2005-05-24 | 2007-09-27 | John Burns | CMP retaining ring |
| US20080096467A1 (en) * | 2006-10-13 | 2008-04-24 | Shaun Van Der Veen | Stepped retaining ring |
| USD605206S1 (en) * | 2008-05-07 | 2009-12-01 | Komatsu Ltd. | Fan shroud for construction machinery |
| US20110092142A1 (en) * | 2009-10-21 | 2011-04-21 | Frank Jr George J | Retaining Rings |
| USD638951S1 (en) * | 2009-11-13 | 2011-05-31 | 3M Innovative Properties Company | Sample processing disk cover |
| USD667561S1 (en) * | 2009-11-13 | 2012-09-18 | 3M Innovative Properties Company | Sample processing disk cover |
| US8491267B2 (en) * | 2010-08-27 | 2013-07-23 | Pratt & Whitney Canada Corp. | Retaining ring arrangement for a rotary assembly |
| USD699200S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
| USD703160S1 (en) * | 2011-01-27 | 2014-04-22 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| US20140123469A1 (en) * | 2012-11-05 | 2014-05-08 | Sang Hyo Han | Method of manufacturing retainer ring for polishing wafer |
| CN302820523S (en) | 2014-05-14 | |||
| USD709536S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| US20150133038A1 (en) | 2013-11-13 | 2015-05-14 | Ebara Corporation | Substrate holder, polishing apparatus, polishing method, and retaining ring |
| US20160158910A1 (en) * | 2013-07-11 | 2016-06-09 | Will Be S & T Co., Ltd. | Retainer ring for chemical-mechanical polishing device |
| US20160256981A1 (en) * | 2015-03-03 | 2016-09-08 | Disco Corporation | Grinding wheel, grinding apparatus, and method of grinding wafer |
| USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
| USD770992S1 (en) * | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
-
2016
- 2016-02-17 TW TW105300718F patent/TWD179095S/en unknown
- 2016-02-24 US US29/555,718 patent/USD799437S1/en active Active
Patent Citations (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN302820523S (en) | 2014-05-14 | |||
| US6068548A (en) * | 1997-12-17 | 2000-05-30 | Intel Corporation | Mechanically stabilized retaining ring for chemical mechanical polishing |
| US6186880B1 (en) * | 1999-09-29 | 2001-02-13 | Semiconductor Equipment Technology | Recyclable retaining ring assembly for a chemical mechanical polishing apparatus |
| US20030089697A1 (en) * | 2000-04-20 | 2003-05-15 | Yicheng Li | Thermal processing system and thermal processing method |
| US20030070757A1 (en) * | 2001-09-07 | 2003-04-17 | Demeyer Dale E. | Method and apparatus for two-part CMP retaining ring |
| US20040065412A1 (en) * | 2002-10-02 | 2004-04-08 | Ensinger Kunststofftechnologie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| US20040077167A1 (en) * | 2002-10-11 | 2004-04-22 | Willis George D. | Retaining ring for use on a carrier of a polishing apparatus |
| US20050191947A1 (en) * | 2003-11-13 | 2005-09-01 | Chen Hung C. | Retaining ring with shaped surface |
| US20050277375A1 (en) * | 2004-06-10 | 2005-12-15 | Young Richard T | Retaining ring assembly for use in chemical mechanical polishing |
| US20070224864A1 (en) * | 2005-05-24 | 2007-09-27 | John Burns | CMP retaining ring |
| US20080096467A1 (en) * | 2006-10-13 | 2008-04-24 | Shaun Van Der Veen | Stepped retaining ring |
| USD605206S1 (en) * | 2008-05-07 | 2009-12-01 | Komatsu Ltd. | Fan shroud for construction machinery |
| US20110092142A1 (en) * | 2009-10-21 | 2011-04-21 | Frank Jr George J | Retaining Rings |
| USD638951S1 (en) * | 2009-11-13 | 2011-05-31 | 3M Innovative Properties Company | Sample processing disk cover |
| USD667561S1 (en) * | 2009-11-13 | 2012-09-18 | 3M Innovative Properties Company | Sample processing disk cover |
| US8491267B2 (en) * | 2010-08-27 | 2013-07-23 | Pratt & Whitney Canada Corp. | Retaining ring arrangement for a rotary assembly |
| USD703160S1 (en) * | 2011-01-27 | 2014-04-22 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| USD699200S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
| USD709536S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| US20140123469A1 (en) * | 2012-11-05 | 2014-05-08 | Sang Hyo Han | Method of manufacturing retainer ring for polishing wafer |
| USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
| US20160158910A1 (en) * | 2013-07-11 | 2016-06-09 | Will Be S & T Co., Ltd. | Retainer ring for chemical-mechanical polishing device |
| US20150133038A1 (en) | 2013-11-13 | 2015-05-14 | Ebara Corporation | Substrate holder, polishing apparatus, polishing method, and retaining ring |
| US20160256981A1 (en) * | 2015-03-03 | 2016-09-08 | Disco Corporation | Grinding wheel, grinding apparatus, and method of grinding wafer |
| USD770992S1 (en) * | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD845568S1 (en) * | 2015-05-14 | 2019-04-09 | Ebara Corporation | Pad holder for polishing apparatus |
| USD836573S1 (en) * | 2017-01-31 | 2018-12-25 | Hitachi High-Technologies Corporation | Ring for a plasma processing apparatus |
| USD861449S1 (en) * | 2018-02-05 | 2019-10-01 | QuickCinch, LLC | Wire repair and refurbishment tool |
| USD1040304S1 (en) * | 2018-12-17 | 2024-08-27 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| USD949116S1 (en) * | 2019-05-03 | 2022-04-19 | Lumileds Holding B.V. | Flexible circuit board with connectors |
| USD940670S1 (en) * | 2019-09-26 | 2022-01-11 | Willbe S&T Co., Ltd. | Retainer ring for chemical mechanical polishing device |
| USD998575S1 (en) * | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD1013841S1 (en) * | 2020-04-20 | 2024-02-06 | Reliance Worldwide Corporation | Retaining ring |
| USD947789S1 (en) * | 2020-05-22 | 2022-04-05 | Hosiden Corporation | Electric connection terminal |
| USD981459S1 (en) * | 2021-06-16 | 2023-03-21 | Ebara Corporation | Retaining ring for substrate |
| USD997111S1 (en) * | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD1096675S1 (en) * | 2022-06-03 | 2025-10-07 | Ap Systems Inc. | Rotor for semiconductor manufacturing device |
| USD1062662S1 (en) * | 2023-03-30 | 2025-02-18 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1063595S1 (en) * | 2023-03-30 | 2025-02-25 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
| USD1086087S1 (en) * | 2023-03-30 | 2025-07-29 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD179095S (en) | 2016-10-21 |
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