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USD622228S1 - Heat dissipation apparatus - Google Patents

Heat dissipation apparatus Download PDF

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Publication number
USD622228S1
USD622228S1 US29/346,668 US34666809F USD622228S US D622228 S1 USD622228 S1 US D622228S1 US 34666809 F US34666809 F US 34666809F US D622228 S USD622228 S US D622228S
Authority
US
United States
Prior art keywords
heat dissipation
dissipation apparatus
view
ornamental design
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/346,668
Inventor
Zheng-Jay Huang
Rong-Yih Yan
Hong-Bin Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxsemicon Integrated Technology Inc
Original Assignee
Foxsemicon Integrated Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN200930315437.4F external-priority patent/CN301292037S/en
Application filed by Foxsemicon Integrated Technology Inc filed Critical Foxsemicon Integrated Technology Inc
Assigned to FOXSEMICON INTEGRATED TECHNOLOGY, INC. reassignment FOXSEMICON INTEGRATED TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, ZHENG-JAY, YAN, RONG-YIH, YANG, Hong-bin
Application granted granted Critical
Publication of USD622228S1 publication Critical patent/USD622228S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a heat dissipation apparatus in one operational state.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a heat dissipation apparatus, as shown.
US29/346,668 2009-09-11 2009-11-04 Heat dissipation apparatus Expired - Lifetime USD622228S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200930315437 2009-09-11
CN200930315437.4F CN301292037S (en) 2009-09-11 Heat sink

Publications (1)

Publication Number Publication Date
USD622228S1 true USD622228S1 (en) 2010-08-24

Family

ID=42583734

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/346,668 Expired - Lifetime USD622228S1 (en) 2009-09-11 2009-11-04 Heat dissipation apparatus

Country Status (1)

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US (1) USD622228S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD650339S1 (en) * 2010-04-02 2011-12-13 Foxsemicon Integrated Technology, Inc Illumination device
USD672729S1 (en) * 2011-12-30 2012-12-18 Foxsemicon Integrated Technology, Inc. Heat sink
USD673124S1 (en) * 2011-12-28 2012-12-25 Foxsemicon Integrated Technology, Inc. Heat sink
USD942403S1 (en) * 2019-10-24 2022-02-01 Wolfspeed, Inc. Power module having pin fins

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899210A (en) * 1988-01-20 1990-02-06 Wakefield Engineering, Inc. Heat sink
US6025643A (en) * 1998-07-29 2000-02-15 Auger; Ronald N. Device for dissipating heat from a semiconductor element
USD471168S1 (en) * 2002-01-07 2003-03-04 Teletronics International Heat dissipating RF electronics housing
US6736204B2 (en) * 2001-12-06 2004-05-18 Sdk-Technik Gmbh Heat transfer surface with a microstructure of projections galvanized onto it
US6975511B1 (en) * 2002-07-18 2005-12-13 Rockwell Collins Ruggedized electronic module cooling system
US20080066888A1 (en) * 2006-09-08 2008-03-20 Danaher Motion Stockholm Ab Heat sink
US7371965B2 (en) * 2002-05-09 2008-05-13 Finisar Corporation Modular cage with heat sink for use with pluggable module
US7529094B2 (en) * 2006-04-28 2009-05-05 Tyco Electronics Corporation Integrated heat sink and light pipe mounting assembly
US7539018B2 (en) * 2007-10-31 2009-05-26 Tyco Electronics Corporation Heat sink retaining clip for an electrical connector assembly
US7593230B2 (en) * 2005-05-05 2009-09-22 Sensys Medical, Inc. Apparatus for absorbing and dissipating excess heat generated by a system

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899210A (en) * 1988-01-20 1990-02-06 Wakefield Engineering, Inc. Heat sink
US6025643A (en) * 1998-07-29 2000-02-15 Auger; Ronald N. Device for dissipating heat from a semiconductor element
US6736204B2 (en) * 2001-12-06 2004-05-18 Sdk-Technik Gmbh Heat transfer surface with a microstructure of projections galvanized onto it
USD471168S1 (en) * 2002-01-07 2003-03-04 Teletronics International Heat dissipating RF electronics housing
US7371965B2 (en) * 2002-05-09 2008-05-13 Finisar Corporation Modular cage with heat sink for use with pluggable module
US6975511B1 (en) * 2002-07-18 2005-12-13 Rockwell Collins Ruggedized electronic module cooling system
US7593230B2 (en) * 2005-05-05 2009-09-22 Sensys Medical, Inc. Apparatus for absorbing and dissipating excess heat generated by a system
US7529094B2 (en) * 2006-04-28 2009-05-05 Tyco Electronics Corporation Integrated heat sink and light pipe mounting assembly
US20080066888A1 (en) * 2006-09-08 2008-03-20 Danaher Motion Stockholm Ab Heat sink
US7539018B2 (en) * 2007-10-31 2009-05-26 Tyco Electronics Corporation Heat sink retaining clip for an electrical connector assembly

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD650339S1 (en) * 2010-04-02 2011-12-13 Foxsemicon Integrated Technology, Inc Illumination device
USD673124S1 (en) * 2011-12-28 2012-12-25 Foxsemicon Integrated Technology, Inc. Heat sink
USD672729S1 (en) * 2011-12-30 2012-12-18 Foxsemicon Integrated Technology, Inc. Heat sink
USD942403S1 (en) * 2019-10-24 2022-02-01 Wolfspeed, Inc. Power module having pin fins
USD985517S1 (en) 2019-10-24 2023-05-09 Wolfspeed, Inc Power module having pin fins
USD1041429S1 (en) 2019-10-24 2024-09-10 Wolfspeed, Inc. Power module having pin fins

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