USD621799S1 - Light emitting diode - Google Patents
Light emitting diode Download PDFInfo
- Publication number
- USD621799S1 USD621799S1 US29/330,657 US33065709F USD621799S US D621799 S1 USD621799 S1 US D621799S1 US 33065709 F US33065709 F US 33065709F US D621799 S USD621799 S US D621799S
- Authority
- US
- United States
- Prior art keywords
- light emitting
- emitting diode
- view
- design
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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Description
The broken lines shown herein are for illustrative purposes only and form no part of the claimed design. The illustrated device is not limited to the scale shown.
Claims (1)
- The ornamental design for a light emitting diode, as shown and described.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/330,657 USD621799S1 (en) | 2009-01-12 | 2009-01-12 | Light emitting diode |
| US29/353,652 USD635527S1 (en) | 2009-01-12 | 2010-01-12 | Light emitting diode |
| US12/825,075 US8598602B2 (en) | 2009-01-12 | 2010-06-28 | Light emitting device packages with improved heat transfer |
| US14/094,341 US9123874B2 (en) | 2009-01-12 | 2013-12-02 | Light emitting device packages with improved heat transfer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/330,657 USD621799S1 (en) | 2009-01-12 | 2009-01-12 | Light emitting diode |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/353,652 Continuation-In-Part USD635527S1 (en) | 2009-01-12 | 2010-01-12 | Light emitting diode |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/479,318 Continuation-In-Part US7923739B2 (en) | 2009-01-12 | 2009-06-05 | Solid state lighting device |
| US29/353,652 Continuation USD635527S1 (en) | 2009-01-12 | 2010-01-12 | Light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD621799S1 true USD621799S1 (en) | 2010-08-17 |
Family
ID=42556214
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/330,657 Expired - Lifetime USD621799S1 (en) | 2009-01-12 | 2009-01-12 | Light emitting diode |
| US29/353,652 Expired - Lifetime USD635527S1 (en) | 2009-01-12 | 2010-01-12 | Light emitting diode |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/353,652 Expired - Lifetime USD635527S1 (en) | 2009-01-12 | 2010-01-12 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| US (2) | USD621799S1 (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100133554A1 (en) * | 2009-06-05 | 2010-06-03 | Cree, Inc. | Solid state lighting device |
| US20110031865A1 (en) * | 2009-01-12 | 2011-02-10 | Hussell Christopher P | Light emitting device packages with improved heat transfer |
| USD635527S1 (en) * | 2009-01-12 | 2011-04-05 | Cree, Inc. | Light emitting diode |
| USD641719S1 (en) * | 2009-06-05 | 2011-07-19 | Cree, Inc. | Light emitting diode |
| US20110186873A1 (en) * | 2009-06-05 | 2011-08-04 | Emerson David T | Light emitting device packages, systems and methods |
| USD643819S1 (en) * | 2010-07-16 | 2011-08-23 | Cree, Inc. | Package for light emitting diode (LED) lighting |
| USD644617S1 (en) | 2010-07-20 | 2011-09-06 | Panasonic Corporation | Light emitting diode case |
| USD648687S1 (en) | 2009-06-05 | 2011-11-15 | Cree, Inc. | Light emitting device package |
| USD648686S1 (en) * | 2010-04-30 | 2011-11-15 | Cree, Inc. | Light emitting diode (LED) package |
| US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
| USD676801S1 (en) | 2011-05-16 | 2013-02-26 | Bridgestone Americas Tire Operations, Llc | Tire tread |
| USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
| US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
| US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
| US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
| US9859471B2 (en) | 2011-01-31 | 2018-01-02 | Cree, Inc. | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
| US11101408B2 (en) | 2011-02-07 | 2021-08-24 | Creeled, Inc. | Components and methods for light emitting diode (LED) lighting |
| USD1051444S1 (en) * | 2024-08-14 | 2024-11-12 | Xingcheng Wu | Light fixture |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10683971B2 (en) | 2015-04-30 | 2020-06-16 | Cree, Inc. | Solid state lighting components |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040126913A1 (en) * | 2002-12-06 | 2004-07-01 | Loh Ban P. | Composite leadframe LED package and method of making the same |
| US20060175716A1 (en) * | 2003-06-20 | 2006-08-10 | Shintaro Nakashima | Molded package and semiconductor device using molded package |
| USD573114S1 (en) * | 2007-05-04 | 2008-07-15 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
| USD573113S1 (en) * | 2005-12-09 | 2008-07-15 | Nichia Corporation | Light emitting diode |
| US20080185605A1 (en) * | 2007-01-15 | 2008-08-07 | Citizen Electronics Co., Ltd. | Light-emitting diode and method for producing it |
| USD595675S1 (en) * | 2008-09-24 | 2009-07-07 | Harvatek Corporation | Light emitting diode |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4679118A (en) | 1984-08-07 | 1987-07-07 | Aavid Engineering, Inc. | Electronic chip-carrier heat sinks |
| DE19755734A1 (en) | 1997-12-15 | 1999-06-24 | Siemens Ag | Method for producing a surface-mountable optoelectronic component |
| US6335548B1 (en) | 1999-03-15 | 2002-01-01 | Gentex Corporation | Semiconductor radiation emitter package |
| US6877780B2 (en) | 2000-06-23 | 2005-04-12 | Breeze-Torca Products, Llc | Clamp for joining tubular bodies |
| JP4211359B2 (en) | 2002-03-06 | 2009-01-21 | 日亜化学工業株式会社 | Manufacturing method of semiconductor device |
| US7244965B2 (en) | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
| US7456499B2 (en) | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
| US7224047B2 (en) | 2004-12-18 | 2007-05-29 | Lsi Corporation | Semiconductor device package with reduced leakage |
| US7564180B2 (en) | 2005-01-10 | 2009-07-21 | Cree, Inc. | Light emission device and method utilizing multiple emitters and multiple phosphors |
| US7400049B2 (en) | 2006-02-16 | 2008-07-15 | Stats Chippac Ltd. | Integrated circuit package system with heat sink |
| JP4952233B2 (en) * | 2006-04-19 | 2012-06-13 | 日亜化学工業株式会社 | Semiconductor device |
| JP4830768B2 (en) | 2006-05-10 | 2011-12-07 | 日亜化学工業株式会社 | Semiconductor light emitting device and method for manufacturing semiconductor light emitting device |
| KR100904152B1 (en) | 2006-06-30 | 2009-06-25 | 서울반도체 주식회사 | Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method |
| KR100854328B1 (en) | 2006-07-07 | 2008-08-28 | 엘지전자 주식회사 | Light emitting device package and its manufacturing method |
| USD580375S1 (en) | 2006-10-12 | 2008-11-11 | Semi-Photonics Co., Ltd. | Lead frame for a two-pin light emitting diode device |
| USD594827S1 (en) | 2006-12-07 | 2009-06-23 | Cree, Inc. | Lamp package |
| US8436371B2 (en) | 2007-05-24 | 2013-05-07 | Cree, Inc. | Microscale optoelectronic device packages |
| USD615504S1 (en) | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
| USD608307S1 (en) | 2008-08-28 | 2010-01-19 | Cree, Inc. | Light emitting diode |
| US7923739B2 (en) | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
| USD621799S1 (en) * | 2009-01-12 | 2010-08-17 | Cree, Inc. | Light emitting diode |
| US7932532B2 (en) | 2009-08-04 | 2011-04-26 | Cree, Inc. | Solid state lighting device with improved heatsink |
-
2009
- 2009-01-12 US US29/330,657 patent/USD621799S1/en not_active Expired - Lifetime
-
2010
- 2010-01-12 US US29/353,652 patent/USD635527S1/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040126913A1 (en) * | 2002-12-06 | 2004-07-01 | Loh Ban P. | Composite leadframe LED package and method of making the same |
| US20060175716A1 (en) * | 2003-06-20 | 2006-08-10 | Shintaro Nakashima | Molded package and semiconductor device using molded package |
| USD573113S1 (en) * | 2005-12-09 | 2008-07-15 | Nichia Corporation | Light emitting diode |
| US20080185605A1 (en) * | 2007-01-15 | 2008-08-07 | Citizen Electronics Co., Ltd. | Light-emitting diode and method for producing it |
| USD573114S1 (en) * | 2007-05-04 | 2008-07-15 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
| USD595675S1 (en) * | 2008-09-24 | 2009-07-07 | Harvatek Corporation | Light emitting diode |
Non-Patent Citations (2)
| Title |
|---|
| Description Model No. NS6G083 issued by Nichia Corporation— at least as early as Aug. 31, 2007. |
| Description Model No. NS6x083x issued by Nichia Corporation—at least as early as Feb. 17, 2007. |
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9123874B2 (en) | 2009-01-12 | 2015-09-01 | Cree, Inc. | Light emitting device packages with improved heat transfer |
| US20110031865A1 (en) * | 2009-01-12 | 2011-02-10 | Hussell Christopher P | Light emitting device packages with improved heat transfer |
| USD635527S1 (en) * | 2009-01-12 | 2011-04-05 | Cree, Inc. | Light emitting diode |
| US8598602B2 (en) | 2009-01-12 | 2013-12-03 | Cree, Inc. | Light emitting device packages with improved heat transfer |
| USD648687S1 (en) | 2009-06-05 | 2011-11-15 | Cree, Inc. | Light emitting device package |
| USD641719S1 (en) * | 2009-06-05 | 2011-07-19 | Cree, Inc. | Light emitting diode |
| US8866166B2 (en) | 2009-06-05 | 2014-10-21 | Cree, Inc. | Solid state lighting device |
| US8860043B2 (en) | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
| US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
| US7923739B2 (en) | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
| US8497522B2 (en) | 2009-06-05 | 2013-07-30 | Cree, Inc. | Solid state lighting device |
| USD661264S1 (en) | 2009-06-05 | 2012-06-05 | Cree, Inc. | Light emiting device package |
| US20110186873A1 (en) * | 2009-06-05 | 2011-08-04 | Emerson David T | Light emitting device packages, systems and methods |
| US20100133554A1 (en) * | 2009-06-05 | 2010-06-03 | Cree, Inc. | Solid state lighting device |
| USD659657S1 (en) | 2010-04-30 | 2012-05-15 | Cree, Inc. | Light emitting diode (LED) package |
| USD648686S1 (en) * | 2010-04-30 | 2011-11-15 | Cree, Inc. | Light emitting diode (LED) package |
| US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
| US8878217B2 (en) | 2010-06-28 | 2014-11-04 | Cree, Inc. | LED package with efficient, isolated thermal path |
| US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
| USD643819S1 (en) * | 2010-07-16 | 2011-08-23 | Cree, Inc. | Package for light emitting diode (LED) lighting |
| USD667801S1 (en) * | 2010-07-16 | 2012-09-25 | Cree, Inc. | Package for light emitting diode (LED) lighting |
| USD708156S1 (en) * | 2010-07-16 | 2014-07-01 | Cree, Inc. | Package for light emitting diode (LED) lighting |
| USD644617S1 (en) | 2010-07-20 | 2011-09-06 | Panasonic Corporation | Light emitting diode case |
| US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
| USD704358S1 (en) | 2011-01-03 | 2014-05-06 | Cree, Inc. | High brightness LED package |
| USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
| US9859471B2 (en) | 2011-01-31 | 2018-01-02 | Cree, Inc. | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
| US11101408B2 (en) | 2011-02-07 | 2021-08-24 | Creeled, Inc. | Components and methods for light emitting diode (LED) lighting |
| USD676801S1 (en) | 2011-05-16 | 2013-02-26 | Bridgestone Americas Tire Operations, Llc | Tire tread |
| USD1051444S1 (en) * | 2024-08-14 | 2024-11-12 | Xingcheng Wu | Light fixture |
Also Published As
| Publication number | Publication date |
|---|---|
| USD635527S1 (en) | 2011-04-05 |
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