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USD615505S1 - LED package - Google Patents

LED package Download PDF

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Publication number
USD615505S1
USD615505S1 US29/340,831 US34083109F USD615505S US D615505 S1 USD615505 S1 US D615505S1 US 34083109 F US34083109 F US 34083109F US D615505 S USD615505 S US D615505S
Authority
US
United States
Prior art keywords
led package
view
package
led
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/340,831
Inventor
Mark Butterworth
Thuy Vu
Gregory W. Eng
Nicola B. Pfeffer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumileds Singapore Pte Ltd
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Priority to US29/340,831 priority Critical patent/USD615505S1/en
Assigned to KONINKLIJKE PHILIPS ELECTRONICS N.V. reassignment KONINKLIJKE PHILIPS ELECTRONICS N.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BUTTERWORTH, MARK, PFEFFER, NICOLA, VU, THUY
Priority to TW099300323F priority patent/TWD138500S/en
Assigned to KONINKLIJKE PHILIPS ELECTRONICS N.V. reassignment KONINKLIJKE PHILIPS ELECTRONICS N.V. CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA PREVIOUSLY RECORDED ON REEL 023597 FRAME 0421. ASSIGNOR(S) HEREBY CONFIRMS THE MARK BUTTERWORTH THUY VU NICOLA PFEFFER NEED TO ADD: GREGORY ENG. Assignors: ENG, GREGORY, BUTTERWORTH, MARK, PFEFFER, NICOLA, VU, THUY
Application granted granted Critical
Publication of USD615505S1 publication Critical patent/USD615505S1/en
Assigned to KONINKLIJKE PHILIPS N.V. reassignment KONINKLIJKE PHILIPS N.V. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT reassignment DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT SECURITY INTEREST Assignors: LUMILEDS LLC
Assigned to LUMILEDS HOLDING B.V. reassignment LUMILEDS HOLDING B.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KONINKLIJKE PHILIPS N.V.
Assigned to SOUND POINT AGENCY LLC reassignment SOUND POINT AGENCY LLC SECURITY INTEREST Assignors: LUMILEDS HOLDING B.V., LUMILEDS LLC
Anticipated expiration legal-status Critical
Assigned to LUMILEDS HOLDING B.V., LUMILEDS LLC reassignment LUMILEDS HOLDING B.V. RELEASE OF SECURITY INTEREST Assignors: SOUND POINT AGENCY LLC
Assigned to LUMILEDS SINGAPORE PTE. LTD. reassignment LUMILEDS SINGAPORE PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LUMILEDS HOLDING B.V.
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front perspective view of the LED package.
FIG. 2 is a top plan view of the LED package of FIG. 1.
FIG. 3 is a lower side view of the LED package of FIG. 1.
FIG. 4 is a right side view of the LED package of FIG. 1.
FIG. 5 is a bottom plan view of the LED package of FIG. 1, wherein the broken lines are shown for illustrative purposes only and forms no part of the claimed design.
FIG. 6 is an upper side view of the LED package of FIG. 1; and,
FIG. 7 is a left side view of the LED package of FIG. 1.

Claims (1)

  1. The ornamental design for a LED package, substantially as shown and described.
US29/340,831 2009-07-27 2009-07-27 LED package Expired - Lifetime USD615505S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/340,831 USD615505S1 (en) 2009-07-27 2009-07-27 LED package
TW099300323F TWD138500S (en) 2009-07-27 2010-01-26 Led package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/340,831 USD615505S1 (en) 2009-07-27 2009-07-27 LED package

Publications (1)

Publication Number Publication Date
USD615505S1 true USD615505S1 (en) 2010-05-11

Family

ID=42139756

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/340,831 Expired - Lifetime USD615505S1 (en) 2009-07-27 2009-07-27 LED package

Country Status (2)

Country Link
US (1) USD615505S1 (en)
TW (1) TWD138500S (en)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD672731S1 (en) * 2011-01-24 2012-12-18 Cree, Inc. Light emitting diode
USD675581S1 (en) * 2011-01-21 2013-02-05 Cree, Inc. Light emitting diode
USD682225S1 (en) * 2011-01-24 2013-05-14 Cree, Inc. Light emitting diode
USD686364S1 (en) * 2012-10-19 2013-07-16 So Bright Electronics Co., Ltd. LED lens
USD700394S1 (en) * 2012-12-07 2014-02-25 Ledlink Optics, Inc. Optical lens
US8698184B2 (en) 2011-01-21 2014-04-15 Cree, Inc. Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
USD727558S1 (en) * 2013-01-11 2015-04-21 Yang Zhou Ledlink Optics Co., Ltd. Optical lens
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
USD762184S1 (en) * 2014-11-13 2016-07-26 Mitsubishi Electric Corporation Light emitting diode
USD768584S1 (en) * 2014-11-13 2016-10-11 Mitsubishi Electric Corporation Light source module
USD780704S1 (en) * 2014-08-27 2017-03-07 Mitsubishi Electric Corporation Light source module
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
USD903908S1 (en) * 2019-01-22 2020-12-01 Zac Cutt Modular illumination device
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip
USD1060278S1 (en) * 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD505396S1 (en) * 2003-03-03 2005-05-24 Nichia Corporation Light emitting diode
US20050269587A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Power light emitting die package with reflecting lens and the method of making the same
USD524260S1 (en) * 2004-08-20 2006-07-04 Citizen Electronics Co., Ltd. Light emitting diode
USD528997S1 (en) * 2005-03-13 2006-09-26 Seoul Semiconductor Co. Ltd. Light emitting diode (LED)
USD534877S1 (en) * 2003-04-25 2007-01-09 Nichia Corporation Light emitting diode
US20070246715A1 (en) * 2006-04-21 2007-10-25 Samsung Electro-Mechanics Co., Ltd. Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
USD570797S1 (en) * 2006-07-14 2008-06-10 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
USD574336S1 (en) * 2007-03-02 2008-08-05 Nichia Corporation Light emitting diode
US20080258162A1 (en) * 2007-04-17 2008-10-23 Koung Chia-Yin Package for a high-power light emitting diode
USD598871S1 (en) * 2006-11-06 2009-08-25 Koninklijke Philips Electronics N.V. Et Al. LED package

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD505396S1 (en) * 2003-03-03 2005-05-24 Nichia Corporation Light emitting diode
USD534877S1 (en) * 2003-04-25 2007-01-09 Nichia Corporation Light emitting diode
US20050269587A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Power light emitting die package with reflecting lens and the method of making the same
USD524260S1 (en) * 2004-08-20 2006-07-04 Citizen Electronics Co., Ltd. Light emitting diode
USD528997S1 (en) * 2005-03-13 2006-09-26 Seoul Semiconductor Co. Ltd. Light emitting diode (LED)
US20070246715A1 (en) * 2006-04-21 2007-10-25 Samsung Electro-Mechanics Co., Ltd. Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
USD570797S1 (en) * 2006-07-14 2008-06-10 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
USD598871S1 (en) * 2006-11-06 2009-08-25 Koninklijke Philips Electronics N.V. Et Al. LED package
USD574336S1 (en) * 2007-03-02 2008-08-05 Nichia Corporation Light emitting diode
US20080258162A1 (en) * 2007-04-17 2008-10-23 Koung Chia-Yin Package for a high-power light emitting diode

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
USD675581S1 (en) * 2011-01-21 2013-02-05 Cree, Inc. Light emitting diode
USD689830S1 (en) * 2011-01-21 2013-09-17 Cree, Inc. Light emitting diode
US8698184B2 (en) 2011-01-21 2014-04-15 Cree, Inc. Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
USD682225S1 (en) * 2011-01-24 2013-05-14 Cree, Inc. Light emitting diode
USD672731S1 (en) * 2011-01-24 2012-12-18 Cree, Inc. Light emitting diode
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US11004890B2 (en) 2012-03-30 2021-05-11 Creeled, Inc. Substrate based light emitter devices, components, and related methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
USD686364S1 (en) * 2012-10-19 2013-07-16 So Bright Electronics Co., Ltd. LED lens
USD700394S1 (en) * 2012-12-07 2014-02-25 Ledlink Optics, Inc. Optical lens
USD727558S1 (en) * 2013-01-11 2015-04-21 Yang Zhou Ledlink Optics Co., Ltd. Optical lens
USD780704S1 (en) * 2014-08-27 2017-03-07 Mitsubishi Electric Corporation Light source module
USD768584S1 (en) * 2014-11-13 2016-10-11 Mitsubishi Electric Corporation Light source module
USD762184S1 (en) * 2014-11-13 2016-07-26 Mitsubishi Electric Corporation Light emitting diode
USD903908S1 (en) * 2019-01-22 2020-12-01 Zac Cutt Modular illumination device
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip
USD1060278S1 (en) * 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

Also Published As

Publication number Publication date
TWD138500S (en) 2011-01-01

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