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USD612817S1 - Light emitting diode - Google Patents

Light emitting diode Download PDF

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Publication number
USD612817S1
USD612817S1 US29/304,551 US30455108F USD612817S US D612817 S1 USD612817 S1 US D612817S1 US 30455108 F US30455108 F US 30455108F US D612817 S USD612817 S US D612817S
Authority
US
United States
Prior art keywords
light emitting
emitting diode
accordance
new design
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/304,551
Inventor
Keisuke Tokuda
Daisuke KISHIKAWA
Naoki Nishiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to US29/304,551 priority Critical patent/USD612817S1/en
Assigned to NICHIA CORPORATION reassignment NICHIA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KISHIKAWA, DAISUKE, NISHIUCHI, NAOKI, TOKUDA, KEISUKE
Priority to US29/355,627 priority patent/USD662901S1/en
Application granted granted Critical
Publication of USD612817S1 publication Critical patent/USD612817S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)

Description

FIG. 1 is a front top side perspective view of a light emitting diode in accordance with a first embodiment of our new design;
FIG. 2 is a top plan view of the light emitting diode in accordance with the first embodiment of our new design;
FIG. 3 is a vertical cross sectional view of the light emitting diode in accordance with the first embodiment of our new design as seen along section line 3—3 of FIG. 2;
FIG. 4 is a vertical cross sectional view of the light emitting diode in accordance with the first embodiment of our new design as seen along section line 4—4 of FIG. 2;
FIG. 5 is an enlarged view of an encircled portion 5 of FIG. 3 of the light emitting diode in accordance with the first embodiment of our new design;
FIG. 6 is a front top side perspective view of a light emitting diode in accordance with a second embodiment of our new design;
FIG. 7 is a top plan view of the light emitting diode in accordance with the second embodiment of our new design;
FIG. 8 is a vertical cross sectional view of the light emitting diode in accordance with the second embodiment of our new design as seen along section line 8—8 of FIG. 7;
FIG. 9 is a vertical cross sectional view of the light emitting diode in accordance with the second embodiment of our new design as seen along section line 9—9 of FIG. 7; and,
FIG. 10 is an enlarged view of an encircled portion 10 of FIG. 9 of the light emitting diode in accordance with the second embodiment of our new design.
The broken line showing of environment (the remaining structure of the light emitting diode) in the FIGS. 1–10 is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

  1. The ornamental design for a light emitting diode, as shown and described.
US29/304,551 2006-09-11 2008-03-04 Light emitting diode Expired - Lifetime USD612817S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/304,551 USD612817S1 (en) 2006-09-11 2008-03-04 Light emitting diode
US29/355,627 USD662901S1 (en) 2006-09-11 2010-02-11 Light emitting diode

Applications Claiming Priority (26)

Application Number Priority Date Filing Date Title
JP2006-024199 2006-02-01
JP2006-024203 2006-09-11
JP2006-024184 2006-09-11
JP2006024205 2006-09-11
JP2006-024201 2006-09-11
JP2006-024205 2006-09-11
JP2006024207 2006-09-11
JP2006-024202 2006-09-11
JP2006-024206 2006-09-11
JP2006-024204 2006-09-11
JP2006024200 2006-09-11
JP2006024150 2006-09-11
JP2006-024207 2006-09-11
JP2006-024200 2006-09-11
JP2006024206 2006-09-11
JP2006024199 2006-09-11
JP2006024203 2006-09-11
JP2006-024150 2006-09-11
JP2006024201 2006-09-11
JP2006024198 2006-09-11
JP2006024204 2006-09-11
JP2006-024198 2006-09-11
JP2006024202 2006-09-11
JP2006024184 2006-09-11
US29/273,595 USD569353S1 (en) 2006-09-11 2007-03-09 Light emitting diode
US29/304,551 USD612817S1 (en) 2006-09-11 2008-03-04 Light emitting diode

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/273,595 Division USD569353S1 (en) 2006-09-11 2007-03-09 Light emitting diode

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/355,627 Division USD662901S1 (en) 2006-09-11 2010-02-11 Light emitting diode

Publications (1)

Publication Number Publication Date
USD612817S1 true USD612817S1 (en) 2010-03-30

Family

ID=39388043

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/273,595 Expired - Lifetime USD569353S1 (en) 2006-09-11 2007-03-09 Light emitting diode
US29/304,551 Expired - Lifetime USD612817S1 (en) 2006-09-11 2008-03-04 Light emitting diode
US29/355,627 Active USD662901S1 (en) 2006-09-11 2010-02-11 Light emitting diode

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/273,595 Expired - Lifetime USD569353S1 (en) 2006-09-11 2007-03-09 Light emitting diode

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/355,627 Active USD662901S1 (en) 2006-09-11 2010-02-11 Light emitting diode

Country Status (1)

Country Link
US (3) USD569353S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD662901S1 (en) * 2006-09-11 2012-07-03 Nichia Corporation Light emitting diode

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100631903B1 (en) * 2005-02-17 2006-10-11 삼성전기주식회사 High power LED housing and its manufacturing method
USD737499S1 (en) * 2012-07-13 2015-08-25 Asahi Rubber Inc. Lens for light-emitting diode

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Publication number Priority date Publication date Assignee Title
US3764862A (en) * 1972-10-19 1973-10-09 Fairchild Camera Instr Co Lead frame for light-emitting diodes
US4255688A (en) * 1977-12-15 1981-03-10 Tokyo Shibaura Denki Kabushiki Kaisha Light emitter mounted on reflector formed on end of lead
US5585695A (en) * 1995-06-02 1996-12-17 Adrian Kitai Thin film electroluminescent display module
USRE36614E (en) 1988-01-15 2000-03-14 Infineon Technologies Corporation Modular surface mount component for an electrical device or LED's
US20020008325A1 (en) * 2000-05-11 2002-01-24 Mitutoyo Corporation Functional device unit and method of producing the same
US6445011B1 (en) * 1999-01-29 2002-09-03 Toyoda Gosei Co., Ltd. Light-emitting diode
US6476549B2 (en) * 2000-10-26 2002-11-05 Mu-Chin Yu Light emitting diode with improved heat dissipation
USD477580S1 (en) 2002-01-30 2003-07-22 Nichia Corporation Light emitting diode
US6617786B1 (en) * 1996-12-10 2003-09-09 Itt Industries Electronic device encapsulated directly on a substrate
USD503690S1 (en) 2003-04-25 2005-04-05 Nichia Corporation Light emitting diode
US20050269589A1 (en) 2004-06-04 2005-12-08 Lite-On It Technology Corporation Power LED package module
USD523826S1 (en) 2003-04-25 2006-06-27 Nichia Corporation Light emitting diode
US20060267036A1 (en) 2005-05-30 2006-11-30 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package and fabrication method thereof
US20070029563A1 (en) 2005-08-05 2007-02-08 Koito Manufacturing Co., Ltd. Light-emitting diode and vehicular lamp
US20070063321A1 (en) 2003-05-28 2007-03-22 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting diode system having at least two heat sinks
US7213945B2 (en) * 2002-05-17 2007-05-08 Ccs, Inc. Light emitting diode and method for fabricating the same
US20070114559A1 (en) 2005-11-23 2007-05-24 Visteon Global Technologies, Inc. Light emitting diode device having a shield and/or filter
US20070126020A1 (en) 2005-12-03 2007-06-07 Cheng Lin High-power LED chip packaging structure and fabrication method thereof
US20070171664A1 (en) 2006-01-25 2007-07-26 Tonic Fitness Technology, Inc. Rotary wheel with a rowed-lights displaying device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266817A (en) * 1992-05-18 1993-11-30 Lin Paul Y S Package structure of multi-chip light emitting diode
US6144500A (en) * 1997-03-05 2000-11-07 Asahi Kogaku Kogyo Kabushiki Kaisha Plastic lens
JP2002071909A (en) * 2000-09-04 2002-03-12 Pioneer Electronic Corp Lens, and method for producing the same
US6765732B2 (en) * 2001-08-03 2004-07-20 Konica Corporation Optical pickup lens, molded optical component, handling method, and mold for optical component
JP4645071B2 (en) * 2003-06-20 2011-03-09 日亜化学工業株式会社 Package molded body and semiconductor device using the same
US7326583B2 (en) * 2004-03-31 2008-02-05 Cree, Inc. Methods for packaging of a semiconductor light emitting device
TWI261539B (en) * 2005-10-07 2006-09-11 Asia Optical Co Inc Optical elements
TWI266441B (en) * 2005-10-26 2006-11-11 Lustrous Technology Ltd COB-typed LED package with phosphor
USD569353S1 (en) * 2006-09-11 2008-05-20 Nichia Corporation Light emitting diode
US20080265274A1 (en) * 2007-04-30 2008-10-30 Cheng-Sheng Yang Light emitting diode element having a voltage regulating capability

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3764862A (en) * 1972-10-19 1973-10-09 Fairchild Camera Instr Co Lead frame for light-emitting diodes
US4255688A (en) * 1977-12-15 1981-03-10 Tokyo Shibaura Denki Kabushiki Kaisha Light emitter mounted on reflector formed on end of lead
USRE36614E (en) 1988-01-15 2000-03-14 Infineon Technologies Corporation Modular surface mount component for an electrical device or LED's
US5585695A (en) * 1995-06-02 1996-12-17 Adrian Kitai Thin film electroluminescent display module
US6617786B1 (en) * 1996-12-10 2003-09-09 Itt Industries Electronic device encapsulated directly on a substrate
US6445011B1 (en) * 1999-01-29 2002-09-03 Toyoda Gosei Co., Ltd. Light-emitting diode
US20020008325A1 (en) * 2000-05-11 2002-01-24 Mitutoyo Corporation Functional device unit and method of producing the same
US6476549B2 (en) * 2000-10-26 2002-11-05 Mu-Chin Yu Light emitting diode with improved heat dissipation
USD477580S1 (en) 2002-01-30 2003-07-22 Nichia Corporation Light emitting diode
US7213945B2 (en) * 2002-05-17 2007-05-08 Ccs, Inc. Light emitting diode and method for fabricating the same
USD503690S1 (en) 2003-04-25 2005-04-05 Nichia Corporation Light emitting diode
USD523826S1 (en) 2003-04-25 2006-06-27 Nichia Corporation Light emitting diode
US20070063321A1 (en) 2003-05-28 2007-03-22 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting diode system having at least two heat sinks
US20050269589A1 (en) 2004-06-04 2005-12-08 Lite-On It Technology Corporation Power LED package module
US20060267036A1 (en) 2005-05-30 2006-11-30 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package and fabrication method thereof
US20070029563A1 (en) 2005-08-05 2007-02-08 Koito Manufacturing Co., Ltd. Light-emitting diode and vehicular lamp
US20070114559A1 (en) 2005-11-23 2007-05-24 Visteon Global Technologies, Inc. Light emitting diode device having a shield and/or filter
US20070126020A1 (en) 2005-12-03 2007-06-07 Cheng Lin High-power LED chip packaging structure and fabrication method thereof
US20070171664A1 (en) 2006-01-25 2007-07-26 Tonic Fitness Technology, Inc. Rotary wheel with a rowed-lights displaying device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD662901S1 (en) * 2006-09-11 2012-07-03 Nichia Corporation Light emitting diode

Also Published As

Publication number Publication date
USD569353S1 (en) 2008-05-20
USD662901S1 (en) 2012-07-03

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