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USD695241S1 - Wafer carrier having pockets - Google Patents

Wafer carrier having pockets Download PDF

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Publication number
USD695241S1
USD695241S1 US29/416,240 US201229416240F USD695241S US D695241 S1 USD695241 S1 US D695241S1 US 201229416240 F US201229416240 F US 201229416240F US D695241 S USD695241 S US D695241S
Authority
US
United States
Prior art keywords
pockets
wafer carrier
view
design
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/416,240
Inventor
Alexander I. Gurary
Keng Moy
Chenghung Paul Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Veeco Instruments Inc
Original Assignee
Veeco Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Veeco Instruments Inc filed Critical Veeco Instruments Inc
Priority to US29/416,240 priority Critical patent/USD695241S1/en
Assigned to VEECO INSTRUMENTS INC. reassignment VEECO INSTRUMENTS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GURARY, ALEXANDER I., CHANG, CHENGHUNG PAUL, MOY, KENG
Application granted granted Critical
Publication of USD695241S1 publication Critical patent/USD695241S1/en
Assigned to HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: VEECO INSTRUMENTS INC.
Assigned to HSBC BANK USA, NATIONAL ASSOCIATION reassignment HSBC BANK USA, NATIONAL ASSOCIATION SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: VEECO INSTRUMENTS INC.
Active legal-status Critical Current
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Description

FIG. 1 is a top perspective view of a wafer carrier having pockets showing our new design;
FIG. 2 is an enlarged view of a portion of FIG. 1;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom perspective view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is an enlarged view of a portion of FIG. 4; and,
FIG. 7 is a right side view thereof, the left side, front, and rear views being the same as the right side view.
The broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.
The dash-dot broken lines define the area corresponding to the enlarged portion shown in FIGS. 2 and 6 and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a wafer carrier having pockets, as shown and described.
US29/416,240 2012-03-20 2012-03-20 Wafer carrier having pockets Active USD695241S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/416,240 USD695241S1 (en) 2012-03-20 2012-03-20 Wafer carrier having pockets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/416,240 USD695241S1 (en) 2012-03-20 2012-03-20 Wafer carrier having pockets

Publications (1)

Publication Number Publication Date
USD695241S1 true USD695241S1 (en) 2013-12-10

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Family Applications (1)

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US29/416,240 Active USD695241S1 (en) 2012-03-20 2012-03-20 Wafer carrier having pockets

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Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130125820A1 (en) * 2011-11-23 2013-05-23 Gerald Zheyao Yin Chemical vapor deposition or epitaxial-layer growth reactor and supporter thereof
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
US9478697B2 (en) * 2014-11-11 2016-10-25 Applied Materials, Inc. Reusable substrate carrier
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) * 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD1009816S1 (en) * 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD1026297S1 (en) * 2022-07-15 2024-05-07 Dandan Tan Set of lenses
USD1035598S1 (en) * 2020-09-02 2024-07-16 Applied Materials, Inc. Gas distribution plate for a semiconductor processing chamber

Citations (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3731435A (en) * 1971-02-09 1973-05-08 Speedfam Corp Polishing machine load plate
US3845738A (en) * 1973-09-12 1974-11-05 Rca Corp Vapor deposition apparatus with pyrolytic graphite heat shield
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
US4512113A (en) * 1982-09-23 1985-04-23 Budinger William D Workpiece holder for polishing operation
US4739589A (en) * 1985-07-12 1988-04-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh Process and apparatus for abrasive machining of a wafer-like workpiece
US5191738A (en) * 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
US5193316A (en) * 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5377451A (en) * 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5422316A (en) * 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
US5573448A (en) * 1993-08-18 1996-11-12 Shin-Etsu Handotai Co., Ltd. Method of polishing wafers, a backing pad used therein, and method of making the backing pad
US5647789A (en) * 1993-11-01 1997-07-15 Fujikoshi Kakai Kogyo Kabushiki Kaisha Polishing machine and a method of polishing a work
US5674107A (en) * 1995-04-25 1997-10-07 Lucent Technologies Inc. Diamond polishing method and apparatus employing oxygen-emitting medium
US5683518A (en) * 1993-01-21 1997-11-04 Moore Epitaxial, Inc. Rapid thermal processing apparatus for processing semiconductor wafers
US5788777A (en) * 1997-03-06 1998-08-04 Burk, Jr.; Albert A. Susceptor for an epitaxial growth factor
US5840124A (en) * 1997-06-30 1998-11-24 Emcore Corporation Wafer carrier with flexible wafer flat holder
US5865666A (en) * 1997-08-20 1999-02-02 Lsi Logic Corporation Apparatus and method for polish removing a precise amount of material from a wafer
US6080042A (en) * 1997-10-31 2000-06-27 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
US6241825B1 (en) * 1999-04-16 2001-06-05 Cutek Research Inc. Compliant wafer chuck
US20020011204A1 (en) * 2000-02-28 2002-01-31 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
US6375749B1 (en) * 1999-07-14 2002-04-23 Seh America, Inc. Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth
US6454635B1 (en) * 2000-08-08 2002-09-24 Memc Electronic Materials, Inc. Method and apparatus for a wafer carrier having an insert
US6500059B2 (en) * 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
US6514424B2 (en) * 2000-05-11 2003-02-04 WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process
US20030057089A1 (en) * 2000-12-01 2003-03-27 Tin Nguyen Disk carrier
US6666948B2 (en) * 2001-04-23 2003-12-23 Phuong Van Nguyen Silicon wafer polisher
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US6733367B1 (en) * 2001-04-23 2004-05-11 Phuong Van Nguyen Method and apparatus for polishing silicon wafers
US7008308B2 (en) * 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US7169234B2 (en) * 2004-01-30 2007-01-30 Asm America, Inc. Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
US7235139B2 (en) * 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
US7252737B2 (en) * 2001-08-09 2007-08-07 Applied Materials, Inc. Pedestal with integral shield
US20090194026A1 (en) * 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US8177993B2 (en) * 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
US8182315B2 (en) * 2008-03-24 2012-05-22 Phuong Van Nguyen Chemical mechanical polishing pad and dresser
US8328600B2 (en) * 2010-03-12 2012-12-11 Duescher Wayne O Workpiece spindles supported floating abrasive platen
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier

Patent Citations (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3731435A (en) * 1971-02-09 1973-05-08 Speedfam Corp Polishing machine load plate
US3845738A (en) * 1973-09-12 1974-11-05 Rca Corp Vapor deposition apparatus with pyrolytic graphite heat shield
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
US4512113A (en) * 1982-09-23 1985-04-23 Budinger William D Workpiece holder for polishing operation
US4739589A (en) * 1985-07-12 1988-04-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh Process and apparatus for abrasive machining of a wafer-like workpiece
US5191738A (en) * 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
US5193316A (en) * 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5683518A (en) * 1993-01-21 1997-11-04 Moore Epitaxial, Inc. Rapid thermal processing apparatus for processing semiconductor wafers
US5377451A (en) * 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5573448A (en) * 1993-08-18 1996-11-12 Shin-Etsu Handotai Co., Ltd. Method of polishing wafers, a backing pad used therein, and method of making the backing pad
US5647789A (en) * 1993-11-01 1997-07-15 Fujikoshi Kakai Kogyo Kabushiki Kaisha Polishing machine and a method of polishing a work
US5422316A (en) * 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
US5674107A (en) * 1995-04-25 1997-10-07 Lucent Technologies Inc. Diamond polishing method and apparatus employing oxygen-emitting medium
US5788777A (en) * 1997-03-06 1998-08-04 Burk, Jr.; Albert A. Susceptor for an epitaxial growth factor
US5840124A (en) * 1997-06-30 1998-11-24 Emcore Corporation Wafer carrier with flexible wafer flat holder
US5865666A (en) * 1997-08-20 1999-02-02 Lsi Logic Corporation Apparatus and method for polish removing a precise amount of material from a wafer
US6080042A (en) * 1997-10-31 2000-06-27 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
US6241825B1 (en) * 1999-04-16 2001-06-05 Cutek Research Inc. Compliant wafer chuck
US6375749B1 (en) * 1999-07-14 2002-04-23 Seh America, Inc. Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth
US20020011204A1 (en) * 2000-02-28 2002-01-31 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
US6514424B2 (en) * 2000-05-11 2003-02-04 WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process
US6454635B1 (en) * 2000-08-08 2002-09-24 Memc Electronic Materials, Inc. Method and apparatus for a wafer carrier having an insert
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US6500059B2 (en) * 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
US20030057089A1 (en) * 2000-12-01 2003-03-27 Tin Nguyen Disk carrier
US6666948B2 (en) * 2001-04-23 2003-12-23 Phuong Van Nguyen Silicon wafer polisher
US6733367B1 (en) * 2001-04-23 2004-05-11 Phuong Van Nguyen Method and apparatus for polishing silicon wafers
US7252737B2 (en) * 2001-08-09 2007-08-07 Applied Materials, Inc. Pedestal with integral shield
US7008308B2 (en) * 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US7235139B2 (en) * 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
US7169234B2 (en) * 2004-01-30 2007-01-30 Asm America, Inc. Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
US8177993B2 (en) * 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
US20090194026A1 (en) * 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
US8182315B2 (en) * 2008-03-24 2012-05-22 Phuong Van Nguyen Chemical mechanical polishing pad and dresser
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US8328600B2 (en) * 2010-03-12 2012-12-11 Duescher Wayne O Workpiece spindles supported floating abrasive platen
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130125820A1 (en) * 2011-11-23 2013-05-23 Gerald Zheyao Yin Chemical vapor deposition or epitaxial-layer growth reactor and supporter thereof
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
US9478697B2 (en) * 2014-11-11 2016-10-25 Applied Materials, Inc. Reusable substrate carrier
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) * 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD1035598S1 (en) * 2020-09-02 2024-07-16 Applied Materials, Inc. Gas distribution plate for a semiconductor processing chamber
USD1009816S1 (en) * 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD1026297S1 (en) * 2022-07-15 2024-05-07 Dandan Tan Set of lenses

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