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USD693318S1 - Semiconductor module for power conversion - Google Patents

Semiconductor module for power conversion Download PDF

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Publication number
USD693318S1
USD693318S1 US29/416,998 US201229416998F USD693318S US D693318 S1 USD693318 S1 US D693318S1 US 201229416998 F US201229416998 F US 201229416998F US D693318 S USD693318 S US D693318S
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US
United States
Prior art keywords
power conversion
semiconductor module
view
configuration
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/416,998
Inventor
Jiro Shinkai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHINKAI, JIRO
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Abstract

The industrial design consists of the shape and configuration of the Semiconductor Module for Power Conversion as shown in the drawings.

Description

FIG. 1 is a front view of a first embodiment of a semiconductor module for power conversion showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a front, right, top perspective view thereof;
FIG. 8 is a cross sectional view of the semiconductor module for power conversion of FIG. 1 taken along lines 8-8 of FIG. 1;
FIG. 9 is a front, right, top perspective view of the semiconductor module for power conversion of FIG. 1 shown in a used condition;
FIG. 10 a front view of a second embodiment of a semiconductor module for power conversion showing my new design;
FIG. 11 is a rear view thereof;
FIG. 12 is a top view thereof;
FIG. 13 is a bottom view thereof;
FIG. 14 is a right side view thereof;
FIG. 15 is a left side view thereof;
FIG. 16 is a front, right, top perspective view thereof;
FIG. 17 is a cross sectional view of the semiconductor module for power conversion of FIG. 1 taken along lines 17-17 of FIG. 10; and,
FIG. 18 is a front, right, top perspective view of the semiconductor module for power conversion of FIG. 10 shown in a used condition.
The broken lines shown in the drawings represent portions of the semiconductor module for power conversion that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor module for power conversion, as shown and described.
US29/416,998 2011-10-27 2012-03-29 Semiconductor module for power conversion Active USD693318S1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011024803 2011-10-27
JP2011024804 2011-10-27
JPD2011-024804 2011-10-27
JPD2011-024803 2011-10-27

Publications (1)

Publication Number Publication Date
USD693318S1 true USD693318S1 (en) 2013-11-12

Family

ID=48144390

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/416,998 Active USD693318S1 (en) 2011-10-27 2012-03-29 Semiconductor module for power conversion

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US (1) USD693318S1 (en)
CA (1) CA144822S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD724554S1 (en) * 2014-02-19 2015-03-17 Fuji Electric Co., Ltd. Semiconductor module
USD755186S1 (en) * 2015-02-20 2016-05-03 Katun Corporation Toner container memory chip

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD357672S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357671S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357901S (en) * 1993-09-27 1995-05-02 Telefonaktiebolaget Lm Ericsson Power supply unit
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US5956231A (en) * 1994-10-07 1999-09-21 Hitachi, Ltd. Semiconductor device having power semiconductor elements
US6078501A (en) * 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
USD471524S1 (en) * 2001-04-27 2003-03-11 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
US20070294889A1 (en) * 2001-12-06 2007-12-27 Reinhold Schmitt Electronic circuit module and method for its assembly
USD576577S1 (en) * 2006-11-30 2008-09-09 Kabushiki Kaisha Toshiba Portion of a printed circuit board
US7425757B2 (en) * 2003-12-22 2008-09-16 Fuji Electric Device Technology Co., Ltd. Semiconductor power module
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD597504S1 (en) * 2006-11-30 2009-08-04 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
USD615506S1 (en) * 2009-06-23 2010-05-11 Dbg Group Investments, Llc Integrated energy management system
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD357672S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357671S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357901S (en) * 1993-09-27 1995-05-02 Telefonaktiebolaget Lm Ericsson Power supply unit
US5956231A (en) * 1994-10-07 1999-09-21 Hitachi, Ltd. Semiconductor device having power semiconductor elements
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6078501A (en) * 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD471167S1 (en) * 2001-04-27 2003-03-04 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
USD471524S1 (en) * 2001-04-27 2003-03-11 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
US20070294889A1 (en) * 2001-12-06 2007-12-27 Reinhold Schmitt Electronic circuit module and method for its assembly
US7425757B2 (en) * 2003-12-22 2008-09-16 Fuji Electric Device Technology Co., Ltd. Semiconductor power module
USD576577S1 (en) * 2006-11-30 2008-09-09 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD597504S1 (en) * 2006-11-30 2009-08-04 Kabushiki Kaisha Toshiba Portion of a printed circuit board
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
USD615506S1 (en) * 2009-06-23 2010-05-11 Dbg Group Investments, Llc Integrated energy management system
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Notice of Allowance in Taiwan Design Patent Application No. 101301952 dated Jan. 23, 2013.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD724554S1 (en) * 2014-02-19 2015-03-17 Fuji Electric Co., Ltd. Semiconductor module
USD755186S1 (en) * 2015-02-20 2016-05-03 Katun Corporation Toner container memory chip
USD755793S1 (en) * 2015-02-20 2016-05-10 Katun Corporation Toner container memory chip

Also Published As

Publication number Publication date
CA144822S (en) 2012-11-15

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