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USD689391S1 - Pressure sensor package - Google Patents

Pressure sensor package Download PDF

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Publication number
USD689391S1
USD689391S1 US29/434,450 US201229434450F USD689391S US D689391 S1 USD689391 S1 US D689391S1 US 201229434450 F US201229434450 F US 201229434450F US D689391 S USD689391 S US D689391S
Authority
US
United States
Prior art keywords
pressure sensor
sensor package
view
package
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/434,450
Inventor
Hisanobu Okawa
Hiroshi Ishida
Masaya Yamatani
Hideki Kamimura
Chiaki Kera
Hiroyuki Morioka
Kazuhide Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Assigned to ALPS ELECTRIC CO., LTD. reassignment ALPS ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ISHIDA, HIROSHI, KAMIMURA, HIDEKI, KERA, CHIAKI, MORIOKA, HIROYUKI, NAKAYAMA, KAZUHIDE, OKAWA, HISANOBU, YAMATANI, MASAYA
Application granted granted Critical
Publication of USD689391S1 publication Critical patent/USD689391S1/en
Assigned to ALPS ALPINE CO., LTD. reassignment ALPS ALPINE CO., LTD. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: ALPS ELECTRIC CO., LTD.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a pressure sensor package showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a front view thereof showing a transparent portion thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a pressure sensor package, as shown and described.
US29/434,450 2012-04-12 2012-10-12 Pressure sensor package Active USD689391S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012008610 2012-04-12
JP2012-008610 2012-04-12

Publications (1)

Publication Number Publication Date
USD689391S1 true USD689391S1 (en) 2013-09-10

Family

ID=49084433

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/434,450 Active USD689391S1 (en) 2012-04-12 2012-10-12 Pressure sensor package

Country Status (1)

Country Link
US (1) USD689391S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD712288S1 (en) * 2012-09-19 2014-09-02 Tanita Corporation Load cell
US20150075266A1 (en) * 2013-09-18 2015-03-19 Alps Electric Co., Ltd. Pressure detection device and intake pressure measurement apparatus using the same
US9151659B2 (en) 2012-09-25 2015-10-06 Tanita Corporation Flexure element where the gap between the first arm and the second arm or between an arm and the strain generating region are equal to or smaller than one half the thickness
USD945292S1 (en) 2019-06-25 2022-03-08 Panasonic Intellectual Property Management Co., Ltd. Flow sensor

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5465626A (en) * 1994-04-04 1995-11-14 Motorola, Inc. Pressure sensor with stress isolation platform hermetically sealed to protect sensor die
US20030214026A1 (en) * 2002-05-17 2003-11-20 Minoru Tokuhara Enhancement of wire bondability in semiconductor device package
US20040118214A1 (en) * 2002-12-23 2004-06-24 Motorola, Inc. Method and structure for fabricating sensors with a sacrificial gel dome
US7659551B2 (en) * 2003-05-27 2010-02-09 Cree, Inc. Power surface mount light emitting die package
US20100199777A1 (en) * 2009-02-10 2010-08-12 Hooper Stephen R Exposed Pad Backside Pressure Sensor Package
US8196476B2 (en) * 2009-04-14 2012-06-12 Kulite Semiconductor Products, Inc. Flat planar pressure transducer
US20120168884A1 (en) * 2011-01-05 2012-07-05 Freescale Semiconductor, Inc Pressure sensor and method of packaging same
USD669804S1 (en) * 2011-11-11 2012-10-30 Fuji Electric Co., Ltd. Pressure sensor
US8304847B2 (en) * 2005-11-01 2012-11-06 Fuji Electric Co., Ltd. Semiconductor pressure sensor
US8368112B2 (en) * 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US8405200B2 (en) * 2007-05-29 2013-03-26 Kyocera Corporation Electronic-component-housing package and electronic device
US20130127879A1 (en) * 2011-11-18 2013-05-23 Qualcomm Mems Technologies, Inc. Glass-encapsulated pressure sensor

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5465626A (en) * 1994-04-04 1995-11-14 Motorola, Inc. Pressure sensor with stress isolation platform hermetically sealed to protect sensor die
US20030214026A1 (en) * 2002-05-17 2003-11-20 Minoru Tokuhara Enhancement of wire bondability in semiconductor device package
US20040118214A1 (en) * 2002-12-23 2004-06-24 Motorola, Inc. Method and structure for fabricating sensors with a sacrificial gel dome
US7659551B2 (en) * 2003-05-27 2010-02-09 Cree, Inc. Power surface mount light emitting die package
US8304847B2 (en) * 2005-11-01 2012-11-06 Fuji Electric Co., Ltd. Semiconductor pressure sensor
US8405200B2 (en) * 2007-05-29 2013-03-26 Kyocera Corporation Electronic-component-housing package and electronic device
US8368112B2 (en) * 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US20100199777A1 (en) * 2009-02-10 2010-08-12 Hooper Stephen R Exposed Pad Backside Pressure Sensor Package
US8196476B2 (en) * 2009-04-14 2012-06-12 Kulite Semiconductor Products, Inc. Flat planar pressure transducer
US20120168884A1 (en) * 2011-01-05 2012-07-05 Freescale Semiconductor, Inc Pressure sensor and method of packaging same
USD669804S1 (en) * 2011-11-11 2012-10-30 Fuji Electric Co., Ltd. Pressure sensor
US20130127879A1 (en) * 2011-11-18 2013-05-23 Qualcomm Mems Technologies, Inc. Glass-encapsulated pressure sensor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD712288S1 (en) * 2012-09-19 2014-09-02 Tanita Corporation Load cell
US9151659B2 (en) 2012-09-25 2015-10-06 Tanita Corporation Flexure element where the gap between the first arm and the second arm or between an arm and the strain generating region are equal to or smaller than one half the thickness
US20150075266A1 (en) * 2013-09-18 2015-03-19 Alps Electric Co., Ltd. Pressure detection device and intake pressure measurement apparatus using the same
US9804049B2 (en) * 2013-09-18 2017-10-31 Alps Electric Co., Ltd. Pressure detection device and intake pressure measurement apparatus using the same
USD945292S1 (en) 2019-06-25 2022-03-08 Panasonic Intellectual Property Management Co., Ltd. Flow sensor

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