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USD651183S1 - Light-emitting diode - Google Patents

Light-emitting diode Download PDF

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Publication number
USD651183S1
USD651183S1 US29/359,251 US35925110F USD651183S US D651183 S1 USD651183 S1 US D651183S1 US 35925110 F US35925110 F US 35925110F US D651183 S USD651183 S US D651183S
Authority
US
United States
Prior art keywords
light
emitting diode
view
elevational view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/359,251
Inventor
Chih-Ming Lai
Ming-Young Shiao
Hong-Bin Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxsemicon Integrated Technology Inc
Original Assignee
Foxsemicon Integrated Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201030302879.8F external-priority patent/CN301353856S/en
Application filed by Foxsemicon Integrated Technology Inc filed Critical Foxsemicon Integrated Technology Inc
Assigned to FOXSEMICON INTEGRATED TECHNOLOGY, INC. reassignment FOXSEMICON INTEGRATED TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAI, CHIH-MING, SHIAO, MING-YOUNG, YANG, Hong-bin
Application granted granted Critical
Publication of USD651183S1 publication Critical patent/USD651183S1/en
Anticipated expiration legal-status Critical
Active legal-status Critical Current

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Description

FIG. 1 is a perspective view of a light-emitting diode showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken line showing of the environment is for illustrative purpose only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a light-emitting diode, as shown and described.
US29/359,251 2010-02-01 2010-04-07 Light-emitting diode Active USD651183S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201030302879.8F CN301353856S (en) 2010-02-01 led
CN201030302879 2010-02-01

Publications (1)

Publication Number Publication Date
USD651183S1 true USD651183S1 (en) 2011-12-27

Family

ID=45350193

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/359,251 Active USD651183S1 (en) 2010-02-01 2010-04-07 Light-emitting diode

Country Status (1)

Country Link
US (1) USD651183S1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD664509S1 (en) * 2011-08-12 2012-07-31 Silitek Electronic (Guangzhou) Co., Ltd. Package carrier
USD664938S1 (en) * 2011-08-12 2012-08-07 Silitek Electronic (Guangzhou) Co., Ltd. Package carrier
USD664939S1 (en) * 2011-08-12 2012-08-07 Silitek Electronic (Guangzhou) Co., Ltd. Package carrier
USD665366S1 (en) * 2011-08-12 2012-08-14 Silitek Electronic (Guangzhou) Co., Ltd. Package carrier
USD665367S1 (en) * 2011-08-12 2012-08-14 Silitek Electronic (Guangzhou) Co., Ltd. Package carrier
USD1067205S1 (en) * 2022-10-19 2025-03-18 Rohm Co., Ltd. Semiconductor light emitting module

Citations (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6376902B1 (en) * 1997-07-29 2002-04-23 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelectronic structural element
US20020163001A1 (en) * 2001-05-04 2002-11-07 Shaddock David Mulford Surface mount light emitting device package and fabrication method
USD471166S1 (en) * 2001-04-06 2003-03-04 Kabushiki Kaisha Toshiba Light emitting semiconductor device
US6686609B1 (en) * 2002-10-01 2004-02-03 Ultrastar Limited Package structure of surface mounting led and method of manufacturing the same
USD488137S1 (en) * 2002-01-30 2004-04-06 Nichia Corporation Light emitting diode
USD491899S1 (en) * 2002-05-22 2004-06-22 Nichia Corporation Light emitting diode
USD494550S1 (en) * 2003-08-26 2004-08-17 Nichia Corporation Light emitting diode
USD495304S1 (en) * 2003-11-10 2004-08-31 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US20040201028A1 (en) * 1997-12-15 2004-10-14 Osram Opto Semiconductors Gmbh & Co. Ohg Surface mounting optoelectronic component and method for producing same
USD505398S1 (en) * 2003-06-24 2005-05-24 Nichia Corporation Light emitting diode
US20050127816A1 (en) * 2003-12-16 2005-06-16 Naofumi Sumitani Light emitting device and method of manufacturing the same
USD510913S1 (en) * 2003-09-09 2005-10-25 Nichia Corporation Light emitting diode
US20060163705A1 (en) * 2005-01-21 2006-07-27 Toshimi Kamikawa Surface mount semiconductor device
US7102213B2 (en) * 2002-09-17 2006-09-05 Osram Opto Semiconductors Gmbh Leadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method
US7176612B2 (en) * 2003-04-21 2007-02-13 Sharp Kabushiki Kaisha LED device and portable telephone, digital camera and LCD apparatus using the same
US20070145403A1 (en) * 2005-12-27 2007-06-28 Kabushiki Kaisha Toshiba Luminescent device and method for manufacturing the same
US20070252250A1 (en) * 2006-04-26 2007-11-01 Cotco Holdings Limited, A Hong Kong Corporation Apparatus and method for use in mounting electronic elements
USD568261S1 (en) * 2006-10-12 2008-05-06 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US7385227B2 (en) * 2005-04-12 2008-06-10 Avago Technologies Ecbu Ip Pte Ltd Compact light emitting device package with enhanced heat dissipation and method for making the package
USD576966S1 (en) * 2006-06-26 2008-09-16 Avago Technologies General Ip (Singapore) Pte Ltd. Light emitting diode
US7514724B2 (en) * 2007-03-23 2009-04-07 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Solid state light source having a variable number of dies
US7547583B2 (en) * 2006-05-01 2009-06-16 Avago Technologies General Ip (Singapore) Pte. Ltd. Light emitting diode package with direct leadframe heat dissipation
USD599749S1 (en) * 2005-12-09 2009-09-08 Nichia Corporation Light emitting diode
USD602451S1 (en) * 2008-05-20 2009-10-20 Koninklijke Philips Electronics N.V. LED module
USD611011S1 (en) * 2009-04-22 2010-03-02 Kabushiki Kaisha Toshiba Portion of light-emitting diode
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US7696526B2 (en) * 2004-01-29 2010-04-13 Dominant Opto Tech Sdn Bhd Surface mount optoelectronic component
US7719024B2 (en) * 2006-05-10 2010-05-18 Nichia Corporation Semiconductor light emitting device and a method for producing the same
USD621800S1 (en) * 2008-12-12 2010-08-17 Everlight Electronics Co., Ltd. Light-emitting diode device
USD622232S1 (en) * 2009-10-26 2010-08-24 Foxsemicon Integrated Technology, Inc. Light emitting diode

Patent Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6376902B1 (en) * 1997-07-29 2002-04-23 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelectronic structural element
US20040201028A1 (en) * 1997-12-15 2004-10-14 Osram Opto Semiconductors Gmbh & Co. Ohg Surface mounting optoelectronic component and method for producing same
USD471166S1 (en) * 2001-04-06 2003-03-04 Kabushiki Kaisha Toshiba Light emitting semiconductor device
US20020163001A1 (en) * 2001-05-04 2002-11-07 Shaddock David Mulford Surface mount light emitting device package and fabrication method
USD488137S1 (en) * 2002-01-30 2004-04-06 Nichia Corporation Light emitting diode
USD491899S1 (en) * 2002-05-22 2004-06-22 Nichia Corporation Light emitting diode
US7102213B2 (en) * 2002-09-17 2006-09-05 Osram Opto Semiconductors Gmbh Leadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method
US6686609B1 (en) * 2002-10-01 2004-02-03 Ultrastar Limited Package structure of surface mounting led and method of manufacturing the same
US7176612B2 (en) * 2003-04-21 2007-02-13 Sharp Kabushiki Kaisha LED device and portable telephone, digital camera and LCD apparatus using the same
USD505398S1 (en) * 2003-06-24 2005-05-24 Nichia Corporation Light emitting diode
USD494550S1 (en) * 2003-08-26 2004-08-17 Nichia Corporation Light emitting diode
USD510913S1 (en) * 2003-09-09 2005-10-25 Nichia Corporation Light emitting diode
USD495304S1 (en) * 2003-11-10 2004-08-31 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US20050127816A1 (en) * 2003-12-16 2005-06-16 Naofumi Sumitani Light emitting device and method of manufacturing the same
US7696526B2 (en) * 2004-01-29 2010-04-13 Dominant Opto Tech Sdn Bhd Surface mount optoelectronic component
US20060163705A1 (en) * 2005-01-21 2006-07-27 Toshimi Kamikawa Surface mount semiconductor device
US7385227B2 (en) * 2005-04-12 2008-06-10 Avago Technologies Ecbu Ip Pte Ltd Compact light emitting device package with enhanced heat dissipation and method for making the package
USD599749S1 (en) * 2005-12-09 2009-09-08 Nichia Corporation Light emitting diode
US20070145403A1 (en) * 2005-12-27 2007-06-28 Kabushiki Kaisha Toshiba Luminescent device and method for manufacturing the same
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US20070252250A1 (en) * 2006-04-26 2007-11-01 Cotco Holdings Limited, A Hong Kong Corporation Apparatus and method for use in mounting electronic elements
US7635915B2 (en) * 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US7547583B2 (en) * 2006-05-01 2009-06-16 Avago Technologies General Ip (Singapore) Pte. Ltd. Light emitting diode package with direct leadframe heat dissipation
US7719024B2 (en) * 2006-05-10 2010-05-18 Nichia Corporation Semiconductor light emitting device and a method for producing the same
USD576966S1 (en) * 2006-06-26 2008-09-16 Avago Technologies General Ip (Singapore) Pte Ltd. Light emitting diode
USD568261S1 (en) * 2006-10-12 2008-05-06 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US7514724B2 (en) * 2007-03-23 2009-04-07 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Solid state light source having a variable number of dies
USD602451S1 (en) * 2008-05-20 2009-10-20 Koninklijke Philips Electronics N.V. LED module
USD621800S1 (en) * 2008-12-12 2010-08-17 Everlight Electronics Co., Ltd. Light-emitting diode device
USD611011S1 (en) * 2009-04-22 2010-03-02 Kabushiki Kaisha Toshiba Portion of light-emitting diode
USD622232S1 (en) * 2009-10-26 2010-08-24 Foxsemicon Integrated Technology, Inc. Light emitting diode

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD664509S1 (en) * 2011-08-12 2012-07-31 Silitek Electronic (Guangzhou) Co., Ltd. Package carrier
USD664938S1 (en) * 2011-08-12 2012-08-07 Silitek Electronic (Guangzhou) Co., Ltd. Package carrier
USD664939S1 (en) * 2011-08-12 2012-08-07 Silitek Electronic (Guangzhou) Co., Ltd. Package carrier
USD665366S1 (en) * 2011-08-12 2012-08-14 Silitek Electronic (Guangzhou) Co., Ltd. Package carrier
USD665367S1 (en) * 2011-08-12 2012-08-14 Silitek Electronic (Guangzhou) Co., Ltd. Package carrier
USD1067205S1 (en) * 2022-10-19 2025-03-18 Rohm Co., Ltd. Semiconductor light emitting module

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