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USD580892S1 - Lead terminals of light emitting diode module - Google Patents

Lead terminals of light emitting diode module Download PDF

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Publication number
USD580892S1
USD580892S1 US29/292,087 US29208707F USD580892S US D580892 S1 USD580892 S1 US D580892S1 US 29208707 F US29208707 F US 29208707F US D580892 S USD580892 S US D580892S
Authority
US
United States
Prior art keywords
lead terminals
light emitting
emitting diode
diode module
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/292,087
Inventor
Masahiko Kobayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOBAYAKAWA, MASAHIKO
Application granted granted Critical
Publication of USD580892S1 publication Critical patent/USD580892S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view showing lead terminals of a light emitting diode module according to my new design, the portions indicated by dotted lines forming no part of my design;
FIG. 2 is a front view of the same lead terminals;
FIG. 3 is a rear view of the same lead terminals;
FIG. 4 is a top plan view of the same lead terminals;
FIG. 5 is a bottom view of the same lead terminals;
FIG. 6 is a right side view of the same lead terminals; and,
FIG. 7 is a left side view of the same lead terminals.

Claims (1)

    CLAIM
  1. I claim the ornamental design for lead terminals of a light emitting diode module, as shown and described.
US29/292,087 2007-03-30 2007-09-27 Lead terminals of light emitting diode module Expired - Lifetime USD580892S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007008193 2007-03-30
JP2007-008193 2007-03-30

Publications (1)

Publication Number Publication Date
USD580892S1 true USD580892S1 (en) 2008-11-18

Family

ID=40001142

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/292,087 Expired - Lifetime USD580892S1 (en) 2007-03-30 2007-09-27 Lead terminals of light emitting diode module

Country Status (1)

Country Link
US (1) USD580892S1 (en)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501103B1 (en) * 2001-10-23 2002-12-31 Lite-On Electronics, Inc. Light emitting diode assembly with low thermal resistance
US20030025117A1 (en) * 2001-07-19 2003-02-06 Shinji Isokawa Semiconductor light-emitting device having a reflective case
US6924514B2 (en) * 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
US20060198162A1 (en) * 2003-03-18 2006-09-07 Sumitomo Electric Industries, Ltd. Light emitting element mounting member, and semiconductor device using the same
US20060292747A1 (en) * 2005-06-27 2006-12-28 Loh Ban P Top-surface-mount power light emitter with integral heat sink
US20070080354A1 (en) * 2005-10-07 2007-04-12 Industrial Technology Research Institute Power package and fabrication method thereof
US20070120135A1 (en) * 2002-08-30 2007-05-31 Soules Thomas F Coated led with improved efficiency
US20070241342A1 (en) * 2006-04-07 2007-10-18 Kabushiki Kaisha Toshiba Semiconductor Light Emitting Device
USD555114S1 (en) * 2006-04-12 2007-11-13 Semi-Photonics Co., Ltd. Light emitting diode
USD555113S1 (en) * 2006-04-12 2007-11-13 Semi-Photonics Co., Ltd. Opto-electronic device
US20070262328A1 (en) * 2006-05-10 2007-11-15 Nichia Corporation Semiconductor light emitting device and a method for producing the same
US20080001160A1 (en) * 2006-06-29 2008-01-03 Cree, Inc. LED package with flexible polyimid circuit and method of manufacturing LED package
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
US20080044934A1 (en) * 2006-08-21 2008-02-21 Loh Ban P Methods of forming semiconductor light emitting device packages by liquid injection molding and molded semiconductor light emitting device strips

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030025117A1 (en) * 2001-07-19 2003-02-06 Shinji Isokawa Semiconductor light-emitting device having a reflective case
US6501103B1 (en) * 2001-10-23 2002-12-31 Lite-On Electronics, Inc. Light emitting diode assembly with low thermal resistance
US6924514B2 (en) * 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
US20070120135A1 (en) * 2002-08-30 2007-05-31 Soules Thomas F Coated led with improved efficiency
US20060198162A1 (en) * 2003-03-18 2006-09-07 Sumitomo Electric Industries, Ltd. Light emitting element mounting member, and semiconductor device using the same
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
US20060292747A1 (en) * 2005-06-27 2006-12-28 Loh Ban P Top-surface-mount power light emitter with integral heat sink
US20070080354A1 (en) * 2005-10-07 2007-04-12 Industrial Technology Research Institute Power package and fabrication method thereof
US20070241342A1 (en) * 2006-04-07 2007-10-18 Kabushiki Kaisha Toshiba Semiconductor Light Emitting Device
USD555114S1 (en) * 2006-04-12 2007-11-13 Semi-Photonics Co., Ltd. Light emitting diode
USD555113S1 (en) * 2006-04-12 2007-11-13 Semi-Photonics Co., Ltd. Opto-electronic device
US20070262328A1 (en) * 2006-05-10 2007-11-15 Nichia Corporation Semiconductor light emitting device and a method for producing the same
US20080001160A1 (en) * 2006-06-29 2008-01-03 Cree, Inc. LED package with flexible polyimid circuit and method of manufacturing LED package
US20080044934A1 (en) * 2006-08-21 2008-02-21 Loh Ban P Methods of forming semiconductor light emitting device packages by liquid injection molding and molded semiconductor light emitting device strips

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